CN201638130U - Radiator and electronic arithmetic system applying same - Google Patents

Radiator and electronic arithmetic system applying same Download PDF

Info

Publication number
CN201638130U
CN201638130U CN2009202710654U CN200920271065U CN201638130U CN 201638130 U CN201638130 U CN 201638130U CN 2009202710654 U CN2009202710654 U CN 2009202710654U CN 200920271065 U CN200920271065 U CN 200920271065U CN 201638130 U CN201638130 U CN 201638130U
Authority
CN
China
Prior art keywords
plate body
heat
heat abstractor
processing unit
fixed part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009202710654U
Other languages
Chinese (zh)
Inventor
王锋谷
许圣杰
黄庭强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inventec Corp
Original Assignee
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Corp filed Critical Inventec Corp
Priority to CN2009202710654U priority Critical patent/CN201638130U/en
Application granted granted Critical
Publication of CN201638130U publication Critical patent/CN201638130U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model provides a radiator, comprising a first plate body and a second plate body, wherein the first plate body is connected with a heating source; the second body is connected with the first plate body by a connecting plate; and a radiating space is arranged between the second plate body and the first plate body. The radiator can prevent the heat source from being deposited at the bottom, and fast dissipate the heat source into air by natural convection in the radiating space. In another embodiment, the utility model further provides an electronic arithmetic system, which is used for connecting the radiator with an arithmetic processing unit capable of generating heat in an electronic arithmetic device so as to absorb the heat generated by the arithmetic processing unit and further maintain the normal operation of the arithmetic processing system.

Description

Heat abstractor and use its electronic operation system
Technical field
The relevant a kind of heat abstractor of the utility model is used its electronic operation system, refers in particular to a kind of electronic operation system that reduces the heat abstractor of pyrotoxin temperature in the finite space and use it that is arranged on.
Background technology
Along with the progress of science and technology, and commercial demand, small-sized portable electronic arithmetic unit, for example: 10 o'clock notebook computer or Thin Client (thin client), maturation gradually is with universal.Especially for the user that needs are often gone on business, showed or impart knowledge to students, the indispensable especially helper of electronic operation device that volume is little and easy to carry.In small-sized portable electronic arithmetic unit, the calculation process speed of electronic component is accompanied by the generation of high heat in the process of running up, for the heat of avoiding electronic component to produce can not in time be discharged from, will influence the stability of electronic component operation, will cause electronic component to burn when serious, considerable role is played the part of in the design of heat radiation.
Yet, at small-sized portable electronic arithmetic unit, for example: notebook computer or Thin Client (thin client), because the restriction in space, and can't use any heat abstractor to dispel the heat with fan.Therefore, how to utilize the structure of no fan (fan less), the mode of utilizing natural convection is with in the system, for example: the thermal conductance that central processing unit (CPU) or north and south bridge chip are produced goes out, and to reduce the temperature of system, is an important problem.
Yet for small-sized portable electronic arithmetic unit, because the space is limited, therefore, just essential become littler of the size of heating radiator is to meet the specification of present use.In order to overcome above-mentioned problem, in the prior art, for example: the disclosed a kind of heat radiator that can form according to the space size combinations of the novel patent M267823 in tw Taiwan, combine by a plurality of radiating fins, each radiating fin is by forming at least one joint fastener on two relative edge's edge, joint fastener is formed with extension at least one end, when adjacent radiating fin in regular turn side by side the time, its joint fastener is butt and form suitable spacing in regular turn also, extension on the joint fastener of radiating fin will bend to the inside again, and place on the relative dorsal part of adjacent radiating fin, and adjacent radiating fin is spliced in regular turn.
Yet such technology, the complexity of the structure that the mode that utilization is piled up increases virtually, therefore as how simple structural design and have the effect of good heat radiating and satisfy the restriction of the finite space having increased production cost in the middle of invisible,, is present stage problem to be solved.
Summary of the invention
The purpose of this utility model is to provide a kind of heat abstractor, it forms a heat-dissipating space between two flat boards, utilize the wherein dull and stereotyped absorption heat that pyrotoxin produced, the heat that utilizes the dual cooling mechanism of heat conduction and thermal natural convection to absorb pyrotoxin effectively again to be produced, and then the temperature of reduction pyrotoxin, described heat abstractor simple structure is fit to be arranged in the space of all size, has therefore improved usability and convenience greatly.
The purpose of this utility model also is to provide a kind of electronic operation system, it is provided with the heat abstractor that can absorb the chip heating above chip, described heat abstractor is in the limited space of described electronic operation system, utilize and form a heat-dissipating space between two flat boards, utilize wherein dull and stereotyped being connected with chip to absorb the heat that chip was produced, the heat that utilizes the dual cooling mechanism of heat conduction and thermal natural convection to absorb chip effectively again to be produced, avoid the heat energy accumulation, and then the temperature of reduction chip, operate normally to keep the electronic operation system.
In one embodiment, the utility model provides a kind of heat abstractor, and it includes one first plate body, and it provides absorption heat energy; And one second plate body, it is connected with described first plate body by a plate, and described second plate body is parallel to first plate body, therefore has a heat-dissipating space between described second plate body and described first plate body.
During enforcement, described second plate body has more a plurality of louvres.
During enforcement, described first plate body is parallel to described second plate body.
During enforcement, heat abstractor described in the utility model, more comprise at least one fixed part, each fixed part has more a flexible member and a lock member, wherein said flexible member is sheathed on the described lock member, described second plate body more comprises at least one through hole, and this at least one through hole is corresponding with described at least one fixed part respectively, passes through so that described at least one fixed part to be provided.
During enforcement, described heat abstractor more comprises a framework, described framework has a recess space and a plurality of lockhole, have at least one opening and at least one heat absorption material on the described framework, each described heat absorption material fills up corresponding described opening makes described first plate body be connected by described at least one heat absorption material with a pyrotoxin, the perforate of corresponding described first plate body of described a plurality of lockhole, described lock member passes the perforate of described first plate body and the lockhole of described framework, and is fixed on the base material.
In another embodiment, the utility model more provides a kind of electronic operation system, and it includes an electronic operation device, and it has a circuit substrate and a plurality of operation processing unit; An and heat abstractor, it has one first plate body and is connected with described a plurality of operation processing unit, and one second plate body be connected with described first plate body by a plate, and described second plate body is parallel to first plate body, therefore has a heat-dissipating space between described second plate body and described first plate body.
During enforcement, described second plate body has more a plurality of louvres.
During enforcement, described first plate body is parallel to described second plate body.
During enforcement, electronic operation described in the utility model system, more comprise at least one fixed part, each fixed part has more a flexible member and a lock member, described flexible member is sheathed on the described lock member, and described lock member passes described first plate body and described heat abstractor is fixed on the described circuit substrate, and described second plate body more comprises at least one through hole, this at least one through hole is corresponding with described at least one fixed part respectively, passes through so that described at least one fixed part to be provided.
During enforcement, described heat abstractor more comprises a framework, described framework has a recess space and a plurality of lockhole, have at least one opening and at least one heat absorption material on the described framework, each described heat absorption material fills up corresponding described opening makes described first plate body be connected by described at least one heat absorption material with described at least one operation processing unit, the perforate of corresponding described first plate body of described a plurality of lockhole, described lock member passes the perforate of described first plate body and the lockhole of described framework, and described heat abstractor is fixed on the described circuit substrate.
During enforcement, described electronic operation device is a Thin Client.
During enforcement, described at least one operation processing unit can be the combination of central processing unit, South Bridge chip, north bridge chips or aforementioned components.
Compared with prior art, heat abstractor described in the utility model and use its electronic operation system can be arranged on and reduce the pyrotoxin temperature in the finite space.
Description of drawings
Figure 1A and Figure 1B are heat abstractor embodiment solid of the present utility model and decomposing schematic representation;
Fig. 2 is a heat radiation synoptic diagram of the present utility model;
Fig. 3 A and Fig. 3 B are that electronic operation system of the present utility model and heat abstractor concern synoptic diagram;
Fig. 4 is electronic operation device of the present utility model and circuit substrate connection diagram.
Description of reference numerals: 1-electronic operation system; The 2-heat abstractor; 21-first plate body;-lockhole; 22-second plate body; 221,222-louvre; The 223-through hole; The 23-heat-dissipating space; The 24-fixed part; The 241-flexible member; The 242-lock member; 243-rivets end; The 25-web joint; The 26-pyrotoxin; The 27-framework; The 270-opening; 271-recess space; The 272-lockhole; The 273-material that absorbs heat; The 28-base material; 3-electronic operation device; The 31-circuit substrate; The 310-lockhole; 32,33-operation processing unit,
Embodiment
For making your auditor further cognitive and understanding be arranged to feature of the present utility model, purpose and function, hereinafter the spy describes the relevant thin portion structure of device of the present utility model and the theory reason of design, so that the juror can understand characteristics of the present utility model, detailed description is presented below:
See also shown in Figure 1A, described figure is a heat abstractor embodiment schematic perspective view of the present utility model.In the present embodiment, described heat abstractor 2 has one first plate body 21, and one second plate body 22.Described first plate body 21 is connected with a pyrotoxin 26.Described pyrotoxin 26, for meeting produces hot element, for example: central processing unit in the computer (CPU) or control chip elements such as (as: South Bridge chip or north bridge chips), but not as limit.Described second plate body 22 is connected with first plate body 21 by a plate 25, makes 21 of described second plate body 22 and first plate bodys form a heat-dissipating space 23.The angle that described second plate body 22 and described first plate body are 21 there is no specific limited, can decide as required.In the present embodiment, described second plate body 22 is parallel to first plate body 21, makes described heat abstractor 2 form the structure of ㄈ font.Described heat abstractor 2 is constituted by the good material of heat conduction efficiency, and generally speaking, the good material of heat conduction efficiency can be metal, for example: and materials such as copper, aluminium or its alloy, but not as limit.Be familiar with the people of this technology, can select suitable material to process according to the needs of heat radiation to form heat abstractor of the present utility model.In addition, described first plate body 21, described web joint 25 can be integrated structure with described second plate body 22.
For the effect of strengthening dispelling the heat, more offer a plurality of louvres 221 and 222 on described second plate body 22.Described louvre can have the perforate that curve and straight line make up for oval, circular, polygon or other.In the present embodiment, described louvre 221 and 222 has two kinds of shapes, and one of them is for being provided with the louvre 222 of a plurality of rectangles on described second plate body 22; Another kind of on described second plate body 22, more can lay a plurality of circular louvres 221.Utilize the circular louvre 221 and the combination of rectangle louvre 222 to increase the effect of second plate body, 22 heat radiations.In addition, see also shown in Figure 1B, described figure is a heat abstractor embodiment perspective exploded view of the present utility model.Have more at least one fixed part 24 on the described heat abstractor 2, described fixed part 24 includes a flexible member 241 and a lock member 242.Described flexible member 241 is sheathed on the described lock member 242.Install described fixed part 24 for convenience, more offer a plurality of through holes 223 on described first plate body 21, pass through so that fixed part 24 to be provided.Described heat abstractor 2 has a framework 27, and described framework 27 is an Insulating frame, for example can be a mylar (mylar) material, and framework 27 contacts with first plate body 21 and web joint 25 for the design of L type in the present embodiment.In addition, described framework 27 also can be that a planar design contacts with first plate body 21 and is parallel with pyrotoxin 26.In the present embodiment, described through hole 223 is opened in described second plate body, 22 center positions and 22 liang of opposite side diagonal angles of described second plate body edge.Described framework 27 has a recess space 271 and a plurality of lockholes 272.Described first plate body 21 is placed in the described recess space 271.Have at least one opening 270 and at least one heat absorption material 273 on the position corresponding with described pyrotoxin 26 on the described framework 27, each described heat absorption material 273 fills up corresponding described opening 270 makes described first plate body 21 be connected by described heat absorption material 273 with described pyrotoxin 26.Described heat absorption material 273 there is no certain restriction with the quantity of described opening 270, is to decide as required, is not restriction with illustrated quantity.Lockhole 211 positions of described a plurality of lockhole 272 corresponding described first plate bodys 21.Described lock member 242 passes the lockhole 211 of described first plate body 21 and the lockhole 272 of described framework 27, makes fixed part 24 described heat abstractor 2 can be fixed on the base material 28.
See also shown in Figure 2ly, described figure is a heat abstractor of the present utility model heat radiation synoptic diagram.In the present embodiment, because described heat abstractor 2 utilizes first plate body 21 to be connected with pyrotoxin 26, when described pyrotoxin 26 sends high when hot, described heat abstractor 2 can absorb the heat that described pyrotoxin 26 is produced by first plate body 21, because metal has good thermal conduction effect, therefore first plate body 21 passes through web joint 25 with heat, and on heat conduction to the second plate body 22, utilize the mode of thermal convection again by second plate body 22, heat is distributed in the air.In addition, because described first plate body 21 and 22 of described second plate bodys have heat-dissipating space 23, therefore, after first plate body 21 is absorbing the heat that pyrotoxin 26 produced, can be by the air-flow in the heat-dissipating space 23, in the mode of thermal natural convection, the heat that first plate body 21 is absorbed is passed in the airflow in the heat-dissipating space 23, because the effect of natural convection in the heat-dissipating space 23, thermal current is thrown in the air via the louvre 221 and 222 of second plate body 22.The structure of utilizing the utility model heat abstractor 2 to simplify can utilize thermal convection and heat conducting radiating mode to reduce the heat of pyrotoxin 26 simultaneously.
See also shown in Fig. 3 A and Fig. 3 B, described figure is that electronic operation system of the present utility model and heat abstractor concern synoptic diagram.In the present embodiment, described electronic operation system 1 has an electronic operation device 3 and a heat abstractor 2.Described electronic operation system 1 can be Thin Client (thin client) for being notebook computer or desktop computer in the present embodiment, but not as limit.Described electronic operation device 3 comprises a circuit substrate 31 and at least one operation processing unit 32.Described at least one operation processing unit 32 and 33 can be central processing unit (CPU), control chip element or the aforesaid combinations such as (as: South Bridge chip or north bridge chips) in the computer, but not as limit.Operation processing unit described in the present embodiment 32 and 33 is respectively central processing unit and north bridge chips.Described heat abstractor 2 comprises one first plate body 21 and one second plate body 22.Described first plate body 21 is connected with described a plurality of operation processing unit 32, and in the present embodiment, described first plate body 21 is the processing unit of concatenation operation simultaneously 32 and 33.Described second plate body 22 is connected with described first plate body 21 by a plate 25, makes 21 of described second plate body 22 and described first plate bodys form a heat-dissipating space 23.Because first plate body of the present utility model, 21 designs can be connected with a plurality of operation processing unit 32 simultaneously, therefore can carry out radiating treatment to a plurality of pyrotoxins simultaneously in limited space, not only can improve the space utilization rate, more can reduce cost.The structure of described heat abstractor 2 is not done at this and to be given unnecessary details as previously mentioned.
See also shown in Figure 4ly, described figure is electronic operation device of the present utility model and circuit substrate connection diagram.Described heat abstractor 2 locks on circuit substrate 31 by fixed part 24.In the present embodiment, offer on the circuit substrate 31 a plurality of respectively with described fixed part 24 corresponding lockholes 310, because lock member 242 front ends have riveted joint end 243, therefore can be embedded in lockhole 310 corresponding on the circuit substrate 31, make the entire heat dissipation device to be locked on the circuit substrate admittedly.Because described heat abstractor 2 utilizes first plate body 21 to be connected with operation processing unit 32, when described operation processing unit 32 is sent high when hot, described heat abstractor 2 can absorb the heat that described operation processing unit 32 is produced by first plate body 21, and utilizes the conduction and the mode of natural convection that the heat that operation processing unit 32 is produced is spread out of.As for conduction and convective principles, as previously mentioned, do not do at this and to give unnecessary details.
But the above only is embodiment of the present utility model, when can not with restriction the utility model scope.Promptly the equalization of being done according to the utility model claim generally changes and modifies, and will not lose main idea of the present utility model place, does not also break away from spirit and scope of the present utility model, therefore all should be considered as further enforcement situation of the present utility model.

Claims (10)

1. heat abstractor is characterized in that it includes:
One first plate body, it provides absorption heat energy; And
One second plate body, it is connected with described first plate body by a plate, makes between described second plate body and described first plate body to have a heat-dissipating space.
2. heat abstractor as claimed in claim 1 is characterized in that, described second plate body has more a plurality of louvres, and described first plate body is parallel to described second plate body.
3. heat abstractor as claimed in claim 1, it is characterized in that, it more comprises at least one fixed part, each fixed part has more a flexible member and a lock member, wherein said flexible member is sheathed on the described lock member, described second plate body more comprises at least one through hole, and this at least one through hole is corresponding with described at least one fixed part respectively, passes through so that described at least one fixed part to be provided.
4. heat abstractor as claimed in claim 3, it is characterized in that, described heat abstractor more comprises a framework, described framework has a recess space and a plurality of lockhole, have at least one opening and at least one heat absorption material on the described framework, each described heat absorption material fills up corresponding described opening makes described first plate body be connected by described at least one heat absorption material with a pyrotoxin, the perforate of corresponding described first plate body of described a plurality of lockhole, described lock member passes the perforate of described first plate body and the lockhole of described framework, and is fixed on the base material.
5. electronic operation system is characterized in that it includes:
One electronic operation device, it has a circuit substrate and a plurality of operation processing unit; And
One heat abstractor, it has more one first plate body and one second plate body, wherein:
Described first plate body, it is connected with described a plurality of operation processing unit, to absorb the heat that described a plurality of operation processing unit produces; And
Described second plate body, it is connected with described first plate body by a plate, makes between described second plate body and described first plate body to have a heat-dissipating space.
6. electronic operation as claimed in claim 5 system is characterized in that described second plate body has more a plurality of louvres, and described first plate body is parallel to described second plate body.
7. electronic operation as claimed in claim 5 system, it is characterized in that, it more comprises at least one fixed part, each fixed part has more a flexible member and a lock member, described flexible member is sheathed on the described lock member, and described lock member passes described first plate body and described heat abstractor is fixed on the described circuit substrate, and described second plate body more comprises at least one through hole, this at least one through hole is corresponding with described at least one fixed part respectively, passes through so that described at least one fixed part to be provided.
8. electronic operation as claimed in claim 7 system, it is characterized in that, described heat abstractor more comprises a framework, described framework has a recess space and a plurality of lockhole, have at least one opening and at least one heat absorption material on the described framework, each described heat absorption material fills up corresponding described opening makes described first plate body be connected by described at least one heat absorption material with described at least one operation processing unit, the perforate of corresponding described first plate body of described a plurality of lockhole, described lock member passes the perforate of described first plate body and the lockhole of described framework, and described heat abstractor is fixed on the described circuit substrate.
9. electronic operation as claimed in claim 5 system is characterized in that described electronic operation device is a Thin Client.
10. electronic operation as claimed in claim 5 system is characterized in that described at least one operation processing unit is the combination of central processing unit, South Bridge chip, north bridge chips or aforementioned components.
CN2009202710654U 2009-11-25 2009-11-25 Radiator and electronic arithmetic system applying same Expired - Fee Related CN201638130U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009202710654U CN201638130U (en) 2009-11-25 2009-11-25 Radiator and electronic arithmetic system applying same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009202710654U CN201638130U (en) 2009-11-25 2009-11-25 Radiator and electronic arithmetic system applying same

Publications (1)

Publication Number Publication Date
CN201638130U true CN201638130U (en) 2010-11-17

Family

ID=43082634

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009202710654U Expired - Fee Related CN201638130U (en) 2009-11-25 2009-11-25 Radiator and electronic arithmetic system applying same

Country Status (1)

Country Link
CN (1) CN201638130U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104216477A (en) * 2013-05-29 2014-12-17 英业达科技有限公司 Fixing assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104216477A (en) * 2013-05-29 2014-12-17 英业达科技有限公司 Fixing assembly

Similar Documents

Publication Publication Date Title
JP3214262U (en) Interface card heat dissipation structure
CN101566869A (en) Notebook PC with heat dissipating device
TW200823644A (en) Heat-sink backing plate module, circuit board, and electronic apparatus having the same
CN201601889U (en) Circuit board combination
US20060185821A1 (en) Thermal dissipation device
CN100361045C (en) Extended radiating device
CN201766794U (en) Heat sink and electronic arithmetic system adopting same
CN201638130U (en) Radiator and electronic arithmetic system applying same
CN201557358U (en) Radiating device and electronic computing system thereof
CN105120631A (en) CPU cooling device with graphene thermal silicone grease cooling layer
CN205563435U (en) Heat radiating part
CN201226637Y (en) Radiating device structure
CN100391324C (en) Heat elimination mechanism of electronic equipment
CN201654666U (en) Terminal, radiating module thereof and radiator
JP3113683U (en) Heat dissipation device for computer motherboard
CN206021179U (en) A kind of Novel sound-silencing formula computer CPU radiating module
CN201252710Y (en) Heat radiator
TW201325420A (en) Heat dissipation device
CN102073358A (en) Radiation device and electronic calculation system
CN201142813Y (en) Heat pipe side direction extending heat radiating device
CN2864984Y (en) Radiator structure
CN205266099U (en) Integral aluminum alloy radiator
JP2009193463A (en) Electronic appliance
TWM341249U (en) Heat dissipation structure
TWM376807U (en) Heat dissipating device and electrical computing system using the same

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101117

Termination date: 20161125

CF01 Termination of patent right due to non-payment of annual fee