CN102073358A - Radiation device and electronic calculation system - Google Patents
Radiation device and electronic calculation system Download PDFInfo
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- CN102073358A CN102073358A CN200910224249XA CN200910224249A CN102073358A CN 102073358 A CN102073358 A CN 102073358A CN 200910224249X A CN200910224249X A CN 200910224249XA CN 200910224249 A CN200910224249 A CN 200910224249A CN 102073358 A CN102073358 A CN 102073358A
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- plate body
- heat
- supporting seat
- housing
- memory module
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Abstract
The invention provides a radiation device, which is provided with a first plate body and a second plate body, wherein the first plate body is connected with the first surface of a heating source; at least one first support seat is arranged on the first lateral surface of the first plate body; the second plate body is connected with the second lateral surface of the first plate body by a connecting plate, so that the second plate body forms a radiation space with the first plate body above the at least one support seat; and at least one permanent seat and at least one second support seat are further extended on the second plate body. In another embodiment, the invention further provides an electronic calculation processing system. The radiation device is connected with a memory module capable of producing heat in an electronic calculation device so as to absorb the heat produced by the memory module to further maintain the normal running of the electronic calculation processing system.
Description
Technical field
The present invention is relevant a kind of radiator structure, refers in particular to a kind of heat abstractor and electronic operation system thereof that reduces the memory module temperature in the finite space.
Background technology
Along with the progress of science and technology, and commercial demand, small-sized portable electronic arithmetic unit, for example: 10 inches notebook computer or Thin Client (thin client), maturation gradually is with universal.Especially for the user that needs are often gone on business, showed or impart knowledge to students, the indispensable especially helper of electronic operation device that volume is little and easy to carry.
Yet, at small-sized portable electronic arithmetic unit, for example: notebook computer or Thin Client (thin client), because the restriction in space, and can't use any heat abstractor to dispel the heat with fan.Especially as Thin Client, its characteristic be what does not recognize moving element in system, so its radiating mode can not comprise fan (Fan less), so main radiating mode is exactly to add a heat abstractor (Heat sink on chip in thin client, Heat plate.... etc.) effect in collocation natural convection is discharged to the external world with heat by system), because the volume size of each Thin Client is all different, be the comparison difficulty sometimes so under the limited condition in space, will satisfy the radiating requirements of all elements in the system.At present for small-sized portable electronic arithmetic unit internal storage module, for example: binary channels (Double Data Rate, DDR) Xi Lie memory module, the heat radiation way use heat sink (thermal pad) that heat is conducted to circuit substrate (the print circuit board that is connected with described memory module telecommunication by DDR below usually, PCB) on, too high but this mode is subject to the heatproof specification of the size of pcb board and pcb board and the power of DDR own all is the condition that is unfavorable for this kind solution.
In addition, for example: the open disclosed a kind of storer heat dissipation technology of case US2008/0043436 of the U.S., it is to utilize two heat radiator to be connected in two surfaces of memory module, to absorb the heat that memory module was produced.But this way, though heat radiator can absorb the heat that memory module produces, but how the heat that heat radiator absorbed is effectively transmitted, keeping good radiating efficiency to keep the suitable temperature difference of heat radiator and memory module is the problem that described technology is faced.
Comprehensively above-mentioned, therefore need a kind of heat abstractor badly and the electronic operation system solves the deficiencies in the prior art.
Summary of the invention
The invention provides a kind of heat abstractor, it is to utilize to have parallel plate body structure, more be provided with supporting construction on the plate body to keep the distance between plate body, utilize a plate body wherein to be connected again thermal conductance to be gone out, can in limited space, reach the effect that removes used heat by heat conducting mode with pyrotoxin.
The invention provides a kind of electronic operation system, it is the block that utilizes relative low temperature in the system, for example: the part of the shell that refers to, the used heat that is produced when DDR is operated utilizes a heat abstractor respectively heat to be delivered to shell by both direction up and down, do heat interchange via the larger area shell and the external world, in limited space, increasing the effect of heat radiation.
In one embodiment, the invention provides a kind of heat abstractor, it includes: one first plate body, and it provides absorption heat energy, has at least one first supporting seat on first side of described first plate body; And one second plate body, it is to be connected with second side of described first plate body by a plate, make described second plate body above described at least one first supporting seat and and have a heat-dissipating space between described first plate body, more be extended with at least one first holder and at least one second supporting seat on described second plate body.
In another embodiment, the invention provides a kind of electronic operation system, it includes: an electronic operation device, and it is to have a housing, is equipped with a circuit substrate and a memory module in it, it is to be connected with described circuit substrate telecommunication; And a heat abstractor, it has more: one first plate body, and it is to be connected with one first face of described memory module, has at least one first supporting seat on first side of described first plate body; And one second plate body, it is to be connected with second side of described first plate body by a plate, make described second plate body in the top of described at least one first supporting seat and and have a heat-dissipating space between described first plate body, more be extended with at least one first holder and at least one second supporting seat on described second plate body, described at least one first holder is to be connected with the inwall of described housing, described at least one second supporting seat is to lean with described inner walls, makes described second plate body and described inner walls keep a distance.
Description of drawings
Fig. 1 is a heat abstractor of the present invention solid side decomposing schematic representation;
Fig. 2 is another embodiment synoptic diagram of the 3rd plate body of the present invention;
Fig. 3 is a heat abstractor heat radiation synoptic diagram of the present invention;
Fig. 4 is an electronic operation system schematic of the present invention;
Fig. 5 is the heat abstractor and the memory module diagrammatic cross-section of electronic operation of the present invention system.
Description of reference numerals: 2-heat abstractor; 20-first plate body; 200-first side; 201-first supporting seat; 202--second side; 21-second plate body; 210-first holder; The 2100-through hole; 211-second supporting seat; The 212-louvre; The 22-pyrotoxin; First of 220-; Second of 221-; The 23-web joint; 230-the 3rd supporting seat; The 24-heat-dissipating space; 25,25a-the 3rd plate body; 250-second holder; The 251-through hole; The 252-connecting wall; The 26-thermal conductive metal plate; The 27-retaining element; 28,29-Insulating frame; 280,290-opening; 281,291-heat absorption material; 30-assists Connection Block; 31,32-structure; 4-electronic operation system; 40-electronic operation device; The 41-housing; 410-first housing; 4100-first non-metal shell; 4101-first betal can; The 4102-louvre; 411-second housing; 4110-second non-metal shell; 4111-second betal can; The 4112-louvre; The 42-circuit substrate; The 43-memory module; First of 430-; Second of 431-; 44-electrically connects seat; 45-assists Connection Block.
Embodiment
For making your juror further cognitive and understanding be arranged to feature of the present invention, purpose and function, hereinafter the spy describes the relevant thin portion structure of device of the present invention and the theory reason of design, so that the juror can understand characteristics of the present invention, detailed description is presented below:
See also shown in Figure 1ly, this figure is a heat abstractor of the present invention solid side decomposing schematic representation.Described heat abstractor 2 includes one first plate body 20 and one second plate body 21.It is to absorb heat energy for described first plate body 20.In the present embodiment, described first plate body 20 can be connected with one first 220 an of pyrotoxin 22, and in the present embodiment, 22 of this first plate body and this pyrotoxins more are provided with an Insulating frame 28, and it is to can be a mylar (mylar) material.This Insulating frame 28 offers a plurality of openings 280 in it.Can filling heat absorption material 281 in each opening 280, be connected by this heat absorption material 281 first 220 with this pyrotoxin 22.Has at least one first supporting seat 201 on first side 200 of described first plate body 20.In the present embodiment, described first supporting seat 201 has three, and the quantity that is noted that described first supporting seat 201 is to decide as required, does not exceed with embodiments of the invention quantity.In the present embodiment each first supporting seat 201 is perpendicular to described first plate body 20.Kind as for described pyrotoxin 22 there is no certain limitation, generally can produce the chipset of heat for meeting in the running, for example: the central processing unit in the computer (CPU), north and south bridge chip or memory module etc.Described pyrotoxin 22 among Fig. 1 is to be a memory module, for example: the memory module of DDR series.
Described second plate body 21, it is to be connected with second side 202 of described first plate body 20 by a plate 23, make described second plate body 21 be positioned at described at least one supporting seat 201 the top and and 20 of described first plate bodys have a heat-dissipating space 24.In the present embodiment, described first plate body 20 is to be parallel to each other with described second plate body 21.Owing to have first supporting seat 201 on described first plate body 20, therefore can avoid described second plate body 21 because gravity so sagging, and then be compressed to the size of heat-dissipating space 24.More be extended with at least one first holder 210 and at least one second supporting seat 211 on described second plate body 21.The purpose of wherein said second supporting seat 211 is to guarantee the distance between the object of second plate body 21 and top, makes described second plate body 21 tops to have living space and produces thermal convection to increase radiating effect.In addition, described joint face 23 also is extended with one the 3rd supporting seat 230, its objective is identical with described second supporting seat 211.In the present embodiment, have through hole 2100 on described first holder 210, retaining element can be provided, for example: screw, by, described second plate body 21 is fixed on the structure on every side.Be noted that the quantity and the form of described first holder 210 and described second supporting seat 211 and the 3rd supporting seat 230, there is no specific restriction, can difform design be arranged according to the needs that use.In addition, in order to increase the effect of heat radiation, on described second plate body 21, more can offer a plurality of louvres 212 that connect described second plate body 21.The shape of louvre 212 there is no certain limitation, and it is to be circle, polygon, ellipse or aforesaid combination of shapes.
The structure that described first plate body 20, second plate body 21, first, second and the 3rd supporting seat 201,211 and 230, first holder 210 are formed in one, and constituted by metal material, generally speaking, metal material can be radiating effect good metal or alloy material, for example: materials such as copper, silver, aldary can, but not as restriction.The people who is familiar with this technology can consider with cost as required and select the proper metal material.Described pyrotoxin 22 with described first 220 corresponding second 221 on, have more one the 3rd plate body 25, it is that with described pyrotoxin 22 second 221 is connected, in the present embodiment, second 221 of described the 3rd plate body 25 and described pyrotoxin 22 more are provided with an Insulating frame 29, and it can be a mylar (mylar) material.Offer a plurality of openings 290 in the described Insulating frame 29.Can filling heat absorption material 291 in each opening 290, be connected by described heat absorption material 291 second 221 with described pyrotoxin 22.The quantity of described opening 290 is to decide according to the number of positions of meeting heating on the pyrotoxin 22, is not restriction with diagram quantity of the present invention.One side of described the 3rd plate body 25 is extended with second holder 250 and is connected with on every side structure.Described second holder 250 of present embodiment equally also is to have through hole 251 to provide retaining element by on the structure around described the 3rd plate body 25 is locked in.The purpose of described the 3rd plate body 25 can increase outside the efficient of heat absorption on the one hand, more can support described pyrotoxin 22 on the other hand described pyrotoxin 22 is maintained on the location.See also shown in Figure 2ly, this figure is another embodiment synoptic diagram of the 3rd plate body of the present invention.In the present embodiment, the side of described the 3rd plate body 25a has a connecting wall 252, and it is to lean with a thermal conductive metal plate 26 or to be connected, and by described thermal conductive metal plate 26 thermal conductance that the 3rd plate body 25a is absorbed is gone out.Similarly, described the 3rd plate body 25a has through hole 251 to provide retaining element by on the structure around described the 3rd plate body 25a is locked in.
See also shown in Figure 3ly, this figure is a heat abstractor of the present invention heat radiation synoptic diagram.In the present embodiment, because described heat abstractor 2 is to be connected with 32 with heat abstractor structure 31 on every side by retaining element 27 and auxiliary Connection Block 30 respectively.Described heat abstractor 2 utilizes first plate body 21 to be connected with pyrotoxin 22, when described pyrotoxin 22 sends high when hot, described heat abstractor 2 can absorb the heat that described pyrotoxin 22 is produced by first plate body 20, because metal has good thermal conduction effect, therefore first plate body 20 is with heat process web joint 23, and on heat conduction to the second plate body 21, utilize the mode of thermal convection again by second plate body 21, heat is distributed in the air.In addition, because described first plate body 20 and 21 of described second plate bodys have heat-dissipating space 24, therefore, after first plate body 20 is absorbing the heat that pyrotoxin 22 produced, can be by the air-flow in the heat-dissipating space 24, in the mode of thermal natural convection, the heat that first plate body 20 is absorbed is passed in the airflow in the heat-dissipating space 24, because the effect of natural convection in the heat-dissipating space 24, thermal current is thrown in the air via the louvre 212 of second plate body 21.The structure of utilizing heat abstractor 2 of the present invention to simplify can utilize thermal convection and heat conducting radiating mode to reduce the heat of pyrotoxin 22 simultaneously.
See also shown in Figure 4ly, this figure is an electronic operation system schematic of the present invention.Described electronic operation system 4, it is to include an electronic operation device 40 and a heat abstractor 2.Described electronic operation device 40 can be the computer with calculation process ability, for example: workstation, servomechanism, desktop computer, notebook computer or Thin Client (thin client).In the present embodiment, described electronic operation device 40 is to be Thin Client.Described electronic operation device 40 is to have a housing 41, is equipped with a circuit substrate 42 and a memory module 43 in it.Have one on the described circuit substrate 42 and electrically connect seat 44, it is to be connected with described memory module 43 telecommunications.The memory module that the memory module 43 of present embodiment plugs for level.
See also shown in Figure 5ly, this figure is the heat abstractor and the memory module diagrammatic cross-section of electronic operation of the present invention system.Described heat abstractor 2 thin portion structures are as previously mentioned, only describe the annexation of described heat abstractor 2 and electronic operation device 40 at this.One first plate body 20 of described heat abstractor 2, it is to be connected with first 430 (upper surface) of described memory module 43.Described second plate body 21 is that first holder 210 with both sides is connected with the inwall of described housing 41.Second 431 (lower surface) of described memory module 43 more is provided with one the 3rd plate body 25, and it is to be connected with described housing 41 with one second holder 250.Though the 3rd plate body 25 structures of the embodiment of this Fig. 5 are the structure of Fig. 1, can also utilize the 3rd plate body 25a shown in Figure 2 to replace.
In Fig. 5, described housing 41 has more one first housing 410 and one second housing 411.Wherein, described first housing 410, it is to have one first non-metal shell 4100, its inwall frame is provided with one first betal can 4101.Described first betal can 4101, it is to be connected with described first holder 210 by retaining element 27.Be noted that described first non-metal shell 4100, can be constituted that first non-metal shell 4100 of present embodiment can be all or locally coated described first metal shell 4101 by plastic cement or other macromolecule materials.Described second housing 411, it is to be connected with described first housing 410, and described second housing 411 has one second non-metal shell 4110, and its inwall frame is provided with one second betal can 4111.Described second betal can 4111 is to be connected with second holder 250 of described the 3rd plate body 25 by a retaining element 27 and an auxiliary Connection Block 45.Be noted that auxiliary Connection Block 45 and non-essential element, the user can select whether to use as required.Owing to all have supporting seat 201,210 and 230 on described first plate body 20 and described second plate body 21, it is hereby ensured the distance of described second plate body 21 and first housing 410; The distance that described second plate body 21 and described first plate body are 20; And described first plate body 20 is contacted with described memory module 43 maintenance levels.
Because the heat abstractor 2 among the present invention is to be connected with 4111 with metal shell 4101, so the heat that absorbed of heat abstractor 2 can be by conducting heat on first and second metal shell 4101 and 4111 with position that first and second metal shell 4101 is connected with 4111.Contact with external environment condition is large-area with 4111 by first and second metal shell 4101, more can increase good heat and pass effect.In addition, offer louvre 4102 and 4112 more respectively on first metal shell 4101 and second metal shell 4111, to increase the effect of heat radiation.
More than explanation is just illustrative for the purpose of the present invention, and nonrestrictive, those of ordinary skills understand; under the situation of the spirit and scope that do not break away from following claims and limited, can make many modifications, change; or equivalence, but all will fall within the scope of protection of the present invention.
Claims (10)
1. a heat abstractor is characterized in that, includes:
One first plate body is applicable to absorption heat energy, has at least one first supporting seat on first side of described first plate body; And
One second plate body, be connected with second side of described first plate body by a plate, make described second plate body be disposed at described at least one first supporting seat the top and and form a heat-dissipating space between described first plate body, described second plate body has at least one first holder and at least one second supporting seat.
2. heat abstractor as claimed in claim 1 is characterized in that, it has more one the 3rd plate body, and a side of described the 3rd plate body has one second holder.
3. heat abstractor as claimed in claim 2 is characterized in that, has an Insulating frame more respectively on described first plate body and described the 3rd plate body, has at least one opening on each Insulating frame, has a heat absorption material in each opening.
4. heat abstractor as claimed in claim 1 is characterized in that, more offers a plurality of louvres on described second plate body.
5. electronic operation system is characterized in that it includes:
One electronic operation device, it is to have a housing, and it is equipped with a circuit substrate and a memory module in being applicable to described housing, and described memory module is connected with described circuit substrate telecommunication; And
One heat abstractor, it has more:
One first plate body, it is to be connected with one first face of described memory module, has at least one first supporting seat on first side of described first plate body; And
One second plate body, it is to be connected with second side of described first plate body by a plate, make described second plate body be disposed at described at least one first supporting seat the top and and form a heat-dissipating space between described first plate body, have at least one first holder and at least one second supporting seat on described second plate body, described at least one first holder is to be connected with the inwall of described housing, described at least one second supporting seat is to lean with described inner walls, makes described second plate body and described inner walls keep a distance.
6. electronic operation as claimed in claim 5 system is characterized in that it has more one the 3rd plate body, and it is to be connected with second face of described memory module, and a side of described the 3rd plate body has one second holder, and it is to be connected with described housing.
7. electronic operation as claimed in claim 5 system is characterized in that described housing has more:
One first housing, its inwall frame is provided with one first betal can, and it is to be connected with described at least one first holder; And
One second housing, it is to be connected with described first housing, described second housing has one second betal can.
8. electronic operation as claimed in claim 7 system is characterized in that it has more one the 3rd plate body that is connected with second face of described memory module, and a side of described the 3rd plate body has one second holder, and it is to be connected with described second betal can.
9. as claim 6 or 8 described electronic operation systems, it is characterized in that having an Insulating frame more respectively on described first plate body and described the 3rd plate body, have at least one opening on each Insulating frame, have a heat absorption material in each opening.
10. electronic operation as claimed in claim 5 system is characterized in that, more offers a plurality of louvres on described second plate body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910224249XA CN102073358A (en) | 2009-11-25 | 2009-11-25 | Radiation device and electronic calculation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910224249XA CN102073358A (en) | 2009-11-25 | 2009-11-25 | Radiation device and electronic calculation system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102073358A true CN102073358A (en) | 2011-05-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910224249XA Pending CN102073358A (en) | 2009-11-25 | 2009-11-25 | Radiation device and electronic calculation system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103034289A (en) * | 2011-09-30 | 2013-04-10 | 英业达股份有限公司 | Motherboard module |
| CN114073011A (en) * | 2019-12-02 | 2022-02-18 | 华为技术有限公司 | Device for transferring heat between a first module and a second module |
-
2009
- 2009-11-25 CN CN200910224249XA patent/CN102073358A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103034289A (en) * | 2011-09-30 | 2013-04-10 | 英业达股份有限公司 | Motherboard module |
| CN114073011A (en) * | 2019-12-02 | 2022-02-18 | 华为技术有限公司 | Device for transferring heat between a first module and a second module |
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Application publication date: 20110525 |