US20140116656A1 - Heat dissipation module and electronic device with the same - Google Patents

Heat dissipation module and electronic device with the same Download PDF

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Publication number
US20140116656A1
US20140116656A1 US13/690,683 US201213690683A US2014116656A1 US 20140116656 A1 US20140116656 A1 US 20140116656A1 US 201213690683 A US201213690683 A US 201213690683A US 2014116656 A1 US2014116656 A1 US 2014116656A1
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United States
Prior art keywords
fins
fin assembly
case
heat dissipation
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/690,683
Inventor
Shun-Chi Yang
Wei-Huan Chou
Kun-Huang Hsu
Chang-Hung CHEN
Ching-Yen Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INHON INTERNATIONAL CO Ltd
Original Assignee
INHON INTERNATIONAL CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US201261718540P priority Critical
Application filed by INHON INTERNATIONAL CO Ltd filed Critical INHON INTERNATIONAL CO Ltd
Priority to US13/690,683 priority patent/US20140116656A1/en
Assigned to INHON INTERNATIONAL CO., LTD reassignment INHON INTERNATIONAL CO., LTD ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHANG-HUNG, CHOU, WEI-HUAN, HSU, KUN-HUANG, HUANG, CHING-YEN, YANG, SHUN-CHI
Priority claimed from TW102209777U external-priority patent/TWM466294U/en
Publication of US20140116656A1 publication Critical patent/US20140116656A1/en
Abandoned legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/14Arrangements for modifying heat-transfer, e.g. increasing, decreasing by endowing the walls of conduits with zones of different degrees of conduction of heat
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0017Casings, cabinets or drawers for electric apparatus with display or control units
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029Heat sinks

Abstract

A heat dissipation module comprises a radiator. The radiator comprises a first fin assembly and a second fin assembly. The first fin assembly comprises a plurality of first fins arranged abreast of each other, and the first fin assembly has a first average distribution density. The second fin assembly comprises a plurality of second fins arranged abreast of each other, and the second fin assembly has a second average distribution density. The second average distribution density is larger than the first average distribution density.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This non-provisional application claims priority under 35 U.S.C. §119(e) on Patent Application No(s). 61/718,540 filed in the United States on Oct. 25, 2012, the entire contents of which are hereby incorporated by reference.
  • BACKGROUND
  • 1. Technical Field
  • The disclosure relates to a heat dissipation module and an electronic device with the heat dissipation module, and more particularly to a heat dissipation module having heat dissipation fins and an electronic device with the heat dissipation module having heat dissipation fins.
  • 2. Related Art
  • Ultra thin laptop is becoming a popular portable electronic device. Due to the blooming of touchscreen monitor technology, it is not easy to distinguish laptop and tablet apart. Diverse usages to portable electronic devices strongly affect the structures of portable electronic devices. To match the different users' needs in utilizing portable electronic devices, adjustable structures are introduced into the market to switch functions and structures of laptop and tablet. Generally speaking, the portable electronic device allows its monitor module and mainframe module to operate with different angles for reaching the most comfortable viewpoint to the user. For example, when operating under a tablet mode, the monitor module and the mainframe module are next to each other in parallel for carrying the portable electronic device conveniently and operating the portable electronic device. When operating under a laptop mode, the monitor module is moved or rotated to form a larger angle between the monitor module and the mainframe module, so that the monitor module is erected on the mainframe module.
  • However, the performance requirements of the portable electronic device under the tablet mode and the laptop mode are different. The portable electronic device under the tablet mode is usually for running programs making the portable electronic device generate less heat energy. The portable electronic device under the laptop usage mode is usually for running programs making the portable electronic device generate more heat energy
  • Therefore, the heat dissipation efficiency for portable electronic devices has to be enhanced for ensuring the system stability of portable electronic devices under different usage modes.
  • SUMMARY
  • The heat dissipation module disclosed by the disclosure comprises a radiator. The radiator comprises a first fin assembly and a second fin assembly. The first fin assembly comprises a plurality of first fins arranged abreast of each other, and the first fin assembly has a first average distribution density. The second fin assembly comprises a plurality of second fins arranged abreast of each other, and the second fin assembly has a second average distribution density. The second average distribution density is larger than the first average distribution density.
  • The electronic device disclosed by the disclosure comprises a first case, a heat source, a radiator, a fan and a heat conduction pipe. The first case has a plurality of heat dissipation holes. The heat source is disposed inside the first case. The radiator is disposed inside the first case and corresponds to the heat dissipation holes. The radiator comprises a first fin assembly and a second fin assembly. The first fin assembly comprises a plurality of first fins arranged abreast of each other, and the first fin assembly has a first average distribution density. The second fin assembly comprises a plurality of second fins arranged abreast of each other, and the second fin assembly has a second average distribution density. The second average distribution density is larger than the first average distribution density. An air exhaust outlet of the fan faces toward the second fin assembly. The heat conduction pipe is in thermal contact with the first fins of the first fin assembly, the second fins of the second fin assembly and the heat source.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The disclosure will become more fully understood from the detailed description given herein below for illustration only, and thus does not limit the disclosure, wherein:
  • FIG. 1 is a perspective view of an electronic device being used under a tablet computer mode according to an embodiment of the disclosure;
  • FIG. 2 is a perspective view of the electronic device in FIG. 1 being used under a laptop mode;
  • FIG. 3 is a top structural view of FIG. 2;
  • FIG. 4 is an upward structural view of FIG. 2;
  • FIG. 5 is a perspective structural view of FIG. 3; and
  • FIG. 6 is a perspective structural view of an enlarged part of FIG. 4.
  • DETAILED DESCRIPTION
  • In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
  • Please refer to FIGS. 1 and 2. FIG. 1 is a perspective view of an electronic device being used under a tablet computer mode according to an embodiment of the disclosure; and FIG. 2 is a perspective view of the electronic device in FIG. 1 being switched to a laptop mode.
  • An electronic device 10 of this embodiment comprises a first case 11, a second case 12 pivotally connected to the first case 11 and a display module 13. A computing processor is, for example, disposed inside the first case 11 so that the first case 11 is a mainframe case of the electronic device 10. A plurality of heat dissipation holes 114 is, for example, disposed on a surface of the first case 11. The display module 13 is disposed in the second case 12 so that the second case 12 is a monitor case of the electronic device 10. The display module 13 is, for example, a touchscreen monitor.
  • The second case 12 can be turned relatively to the first case 11 to be at a folded position, overlapping the first case 11 as shown in FIG. 1. In the folded position, the display module 13 is disposed on a side of the second case 12 away from the first case 11, so that the electronic device 10 is in a tablet mode.
  • The second case 12 can be turned relatively to the first case 11 to be at an unfolded position to form an included angle with the first case 11 as shown in FIG. 2, so that the electronic device 10 is at a laptop mode. In the unfolded position, the second case 12 does not overlap the first case 11, so that the plurality of heat dissipation holes 114 on the surface of the first case 11 originally covered by the second case 12 are exposed, and therefore, the heat dissipation efficiency of the electronic device 10 under the laptop usage mode is enhanced.
  • Please refer to FIGS. 3 to 6. FIG. 3 is a top structural view of FIG. 2; FIG. 4 is an upward structural view of FIG. 2; FIG. 5 is a perspective structural view of FIG. 3; and FIG. 6 is a perspective structural view of an enlarged part of FIG. 4.
  • More specifically, the electronic device 10 further comprises a motherboard 16, a heat source 15 and a heat dissipation module 14.
  • The motherboard 16 is disposed inside the first case 11. The heat source 15 is disposed inside the first case 11 and on the motherboard 16. The heat source 15 is, but is not limited to, a processing chip, for example a central processing unit (CPU) of the electronic device 10. The first case 11 has an upper surface 111, a lower surface 113 and a lateral surface 112 connected to the upper surface 111 and the lower surface 113. The heat dissipation holes 114 are distributed on a part of the upper surface 111, a part of the lateral surface 112 and a part of the lower surface 113. The heat dissipation module 14 is disposed inside the first case 11, and corresponds to the heat dissipation holes 114 on the first case 11.
  • The heat dissipation module 14 comprises a radiator 140, a fan 144 and a heat conduction pipe 143 (i.e. a heat pipe).
  • The radiator 140 is disposed adjacent to the lateral surface 112 of the first case 11. The radiator 140 comprises a first fin assembly 141 and a second fin assembly 142. The first fin assembly 141 comprises a plurality of first fins 1411 arranged abreast of each other, and the first fins 1411 have a first average distribution density. The first average distribution density of the first fins 1411 refers to a quantity of the first fins 1411 within a unit length of the first fin assembly 141. The second fin assembly 142 comprises a plurality of second fins 1421 arranged abreast of each other, and the second fins 1421 have a second average distribution density. The second average distribution density of the second fins 1421 refers to a quantity of the second fins 1421 within a unit length of the second fin assembly 142. More specifically, in this embodiment, the first fins 1411 are disposed at regular intervals. Every two of the adjacent first fins 1411 are separated by a first distance D1. The second fins 1421 are also disposed at regular intervals. Every two of the adjacent second fins 1421 are separated by a second distance D2 smaller than the first distance D1. In other words, the second fins 1421 are arranged with a higher density, and the first fins 1411 are arranged with a lower density. Furthermore, the first fins 1411 and the second fins 1421 of this embodiment are arranged abreast of each other.
  • An air exhaust outlet 1441 of the fan 144 faces the second fins 1421 of the second fin assembly 142, and the second fins 1421 of the second fin assembly 142 are disposed between the heat dissipation holes 114 on the lateral surface 112 and the fan 144.
  • The heat conduction pipe 143 is roughly in an L shape and the heat conduction pipe 143 has a first end 1431 and a second end 1432 opposite to the first end 1431. The shape of the heat conduction pipe 143 is taken as an example in this embodiment, and it should not be construed as a limitation to the disclosure. In some embodiments, the heat conduction pipe 143 is in a U shape or other shapes.
  • The electronic device 10 further comprises a heat conduction element 145 contacting on the heat source 15. The first end 1431 of the heat conduction pipe 143 is contacted on the heat conduction element 145 (i.e. the heat conduction element 145 is disposed between the heat conduction pipe 143 and the heat source 15) so that the first end 1431 of the heat conduction pipe 143 is in thermal contact with the heat source 15 through the heat conduction element 145. The second end 1432 of the heat conduction pipe 143 is in thermal contact with the second fins 1421 of the second fin assembly 142. A central part of the heat conduction pipe 143 between the first end 1431 and the second end 1432 is in thermal contact with the first fins 1411 of the first fin assembly 141 so that the first fin assembly 141 is between the first end 1431 and the second end 1432 of the heat conduction pipe 143.
  • The heat energy produced by the heated heat source 15 is transferred to the heat conduction pipe 143 through the heat conduction element 145. Then, the heat conduction pipe 143 transfers the heat energy evenly to the first fins 1411 of the first fin assembly 141 and the second fins 1421 of the second fin assembly 142. Because the first fins 1411 are arranged with a lower density, the air resistance can be reduced in favor of a natural convection current flowing through air passages between the first fins 1411. Accordingly, the heat energy absorbed by the first fin assembly 141 can be dissipated more efficiently.
  • Because the second fins 1421 are arranged with a higher density, the overall heat dissipation surface of the second fin assembly 142 can be enhanced. With a forced convection produced by the fan 144, the heat energy absorbed by the second fin assembly 142 can be dissipated efficiently.
  • Because the fins of conventional heat dissipation fin assembly are arranged at regular intervals, the conventional heat dissipation fin assembly cannot dissipate heat by using both natural convection and forced convection at the same time. The radiator 140 in this embodiment includes the two fin assemblies with different fin densities for dissipating heat dissipation by using both natural convection and forced convection at the same time. Therefore, the heat dissipation efficiency of the overall heat dissipation module 14 is enhanced.
  • According to the electronic device and its heat dissipation module of the above embodiment, the first fins of the first fin assembly are arranged with a lower density for reducing the air resistance in favor of dissipating heat by natural convection. Furthermore, the second fins of the second fin assembly are arranged with a higher density for increasing the heat dissipation surface in favor of dissipating heat by forced convection formed by the fan. Therefore, the electronic device and its heat dissipation module of the disclosure can dissipate heat by using both natural convection and forced convection at the same time for enhancing the overall heat dissipation efficiency of the electronic device and its heat dissipation module.

Claims (12)

What is claimed is:
1. A heat dissipation module, comprising a radiator, the radiator comprising:
a first fin assembly comprising a plurality of first fins arranged abreast of each other, the first fins having a first average distribution density; and
a second fin assembly comprising a plurality of second fins arranged abreast of each other, the second fins having a second average distribution density, the second average distribution density being larger than the first average distribution density.
2. The heat dissipation module as claimed in claim 1, further comprising a fan, an air exhaust outlet of the fan facing the second fin assembly.
3. The heat dissipation module as claimed in claim 1, further comprising a heat conduction pipe in thermal contact with the first fins of the first fin assembly and the second fins of the second fin assembly.
4. The heat dissipation module as claimed in claim 1, wherein the first fins and the second fins are arranged abreast of each other.
5. The heat dissipation module as claimed in claim 1, wherein every two of the adjacent first fins are spaced by a first distance, every two of the adjacent second fins are spaced by a second distance, and the second distance is smaller than the first distance.
6. An electronic device, comprising:
a first case having a plurality of heat dissipation holes;
a heat source disposed inside the first case;
a radiator disposed inside the first case and corresponding to the heat dissipation holes, the radiator comprising:
a first fin assembly comprising a plurality of first fins arranged abreast of each other, the first fins having a first average distribution density; and
a second fin assembly comprising a plurality of second fins arranged abreast of each other, the second fins having a second average distribution density, the second average distribution density being larger than the first average distribution density;
a fan, an air exhaust outlet of the fan facing the second fin assembly; and
a heat conduction pipe in thermal contact with the first fins of the first fin assembly, the second fins of the second fin assembly and the heat source.
7. The electronic device as claimed in claim 6, wherein the heat conduction pipe has a first end and a second end opposite to the first end, the first end is in thermal contact with the heat source, the second end is in thermal contact with the second fin assembly, the first fin assembly is disposed between the first end and the second end.
8. The electronic device as claimed in claim 6, wherein the first case has an upper surface, a lower surface and a lateral surface connected to the upper surface and the lower surface, the second fin assembly is disposed between the heat dissipation holes on the lateral surface and the fan.
9. The electronic device as claimed in claim 6, further comprising a heat conduction element disposed between the heat conduction pipe and the heat source.
10. The electronic device as claimed in claim 6, wherein the first fins and the second fins are arranged abreast of each other.
11. The electronic device as claimed in claim 6, further comprising a second case and a display module, the second case pivotally connected to the first case for being turned between an unfolded position and a folded position relative to the first case, the second case overlapping the first case at the folded position, and the display module disposing on a side of the second case away from the first case.
12. The electronic device as claimed in claim 6, wherein every two of the adjacent first fins are spaced by a first distance, every two of the adjacent second fins are spaced by a second distance, and the second distance is smaller than the first distance.
US13/690,683 2012-10-25 2012-11-30 Heat dissipation module and electronic device with the same Abandoned US20140116656A1 (en)

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US201261718540P true 2012-10-25 2012-10-25
US13/690,683 US20140116656A1 (en) 2012-10-25 2012-11-30 Heat dissipation module and electronic device with the same

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US13/690,683 US20140116656A1 (en) 2012-10-25 2012-11-30 Heat dissipation module and electronic device with the same
TW102209777U TWM466294U (en) 2012-11-30 2013-01-16 Electronic device and heat-dissipating module thereof
CN 201320298725 CN203279450U (en) 2012-11-30 2013-05-28 Electronic device and heat radiation module thereof

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US13/690,726 Expired - Fee Related US9223364B2 (en) 2012-10-25 2012-11-30 Heat dissipation control system for portable electrical device and control method thereof
US13/690,683 Abandoned US20140116656A1 (en) 2012-10-25 2012-11-30 Heat dissipation module and electronic device with the same
US13/691,503 Abandoned US20140118944A1 (en) 2012-10-25 2012-11-30 Electronic device
US13/705,846 Abandoned US20140118897A1 (en) 2012-10-25 2012-12-05 Electronic device

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US13/691,503 Abandoned US20140118944A1 (en) 2012-10-25 2012-11-30 Electronic device
US13/705,846 Abandoned US20140118897A1 (en) 2012-10-25 2012-12-05 Electronic device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9535470B2 (en) 2014-07-02 2017-01-03 Asia Vital Components Co., Ltd. Electronic substrate with heat dissipation structure

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9261889B1 (en) * 2014-10-29 2016-02-16 Getac Technology Corporation Method for controlling the system power and electronic device for controlling the system power
WO2016122482A1 (en) * 2015-01-28 2016-08-04 Hewlett-Packard Development Company, L.P. Fan control based on measured heat flux
TW201630510A (en) * 2015-02-09 2016-08-16 鴻海精密工業股份有限公司 Protect case
CN105718008B (en) * 2016-01-20 2020-03-31 合肥联宝信息技术有限公司 Heat radiator for notebook computer
TWI616128B (en) * 2017-01-23 2018-02-21 華碩電腦股份有限公司 Flexible case
TWI650630B (en) 2018-04-03 2019-02-11 和碩聯合科技股份有限公司 Electronic device and frequency reduction method thereof

Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5818694A (en) * 1996-02-16 1998-10-06 Hitachi, Ltd. Cooling apparatus for electronic devices
US6118656A (en) * 1998-06-23 2000-09-12 Dell Usa, Lp Heat sink having a pressure gradient
US6354367B1 (en) * 2001-02-12 2002-03-12 Rheem Manufacturing Company Air conditioning unit having coil portion with non-uniform fin arrangement
US20020048147A1 (en) * 2000-10-19 2002-04-25 Masaharu Miyahara Heat sink unit and electronic apparatus using the same
US6543522B1 (en) * 2001-10-31 2003-04-08 Hewlett-Packard Development Company, L.P. Arrayed fin cooler
US6590770B1 (en) * 2002-03-14 2003-07-08 Modine Manufacturing Company Serpentine, slit fin heat sink device
US20040160732A1 (en) * 2003-02-14 2004-08-19 Prosenjit Ghosh Lightweight robust enclosure design for a mobile computing system
US20050243510A1 (en) * 2004-04-28 2005-11-03 Kentaro Tomioka Electronic apparatus with liquid cooling device
US20060120044A1 (en) * 2004-12-04 2006-06-08 Foxconn Technology Co., Ltd Heat dissipating apparatus
US7143816B1 (en) * 2005-09-09 2006-12-05 Delphi Technologies, Inc. Heat sink for an electronic device
US20080068797A1 (en) * 2006-09-15 2008-03-20 Takashi Iikubo Mounting assembly and electronic device with the mounting assembly
US20080105410A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation apparatus
US20080298011A1 (en) * 2007-05-31 2008-12-04 Kabushiki Kaisha Toshiba Electronic apparatus and cooling unit
US20090000768A1 (en) * 2007-06-27 2009-01-01 Foxconn Technology Co., Ltd. Heat dissipation device
US20090021913A1 (en) * 2007-07-20 2009-01-22 Foxconn Technology Co., Ltd. Heat dissipation device
US20090052131A1 (en) * 2007-08-24 2009-02-26 Kabushiki Kaisha Toshiba Electronic apparatus
US20090168331A1 (en) * 2006-05-19 2009-07-02 Kabushiki Kaisha Toshiba Electronic apparatus
US20090175003A1 (en) * 2008-01-04 2009-07-09 Apple Inc. Systems and methods for cooling electronic devices using airflow dividers
US7623348B2 (en) * 2006-10-02 2009-11-24 Nidec Corporation Heat sink and cooling apparatus
US20100018669A1 (en) * 2008-07-28 2010-01-28 Foxconn Technology Co., Ltd. Heat dissipation device
US7667967B1 (en) * 2008-08-06 2010-02-23 Sun Microsystems, Inc. Liquid-cooled rack with optimized rack heat exchanger design for non-uniform power dissipation
US20100142142A1 (en) * 2008-12-05 2010-06-10 Sinitec Vertriebsgesellschaft Mbh Method and device for cooling heat-generating computer components
US7808781B2 (en) * 2008-05-13 2010-10-05 International Business Machines Corporation Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements
US20100328878A1 (en) * 2009-06-30 2010-12-30 Kabushiki Kaisha Toshiba Electronic apparatus
US7952872B1 (en) * 2009-12-25 2011-05-31 Kabushiki Kaisha Toshiba Cooling device and electronic apparatus
US20110157824A1 (en) * 2009-12-25 2011-06-30 Nobuto Fujiwara Centrifugal fan and electronic apparatus
US20110249401A1 (en) * 2010-04-09 2011-10-13 Kabushiki Kaisha Toshiba Electronic apparatus
US8670237B2 (en) * 2010-12-28 2014-03-11 Mitsubishi Electric Corporation Power conversion apparatus

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PT1738753E (en) * 1993-06-28 2008-06-19 Wyeth Corp New treatments using phenethylamine derivatives
US5568360A (en) * 1995-03-29 1996-10-22 Dell Usa, L.P. Heat pipe device and method for attaching same to a computer keyboard
US6256193B1 (en) * 1998-09-22 2001-07-03 Speck Product Design, Inc. Vertical docking and positioning apparatus for a portable computer
US6453378B1 (en) * 1998-12-16 2002-09-17 Gateway, Inc. Portable computer with enhanced performance management
US6430038B1 (en) * 2000-04-18 2002-08-06 Hewlett-Packard Company Computer with articulated mechanism
TW577578U (en) * 2001-08-24 2004-02-21 Uniwill Comp Corp Heat dissipation device of low flow resistance for notebook computer
US6752201B2 (en) * 2002-11-27 2004-06-22 International Business Machines Corporation Cooling mechanism for an electronic device
EP1593853A4 (en) * 2002-12-25 2007-06-27 Toshiba Kk Fan with case having air supplying opening, cooling unit and electronic apparatus comprising fan
US7079394B2 (en) * 2003-01-08 2006-07-18 Lenovo (Singapore) Pte. Ltd. Compact cooling device
US20050030171A1 (en) * 2003-08-06 2005-02-10 Tse-Hung Liu Cooling system for computing device
US7352565B2 (en) * 2004-09-28 2008-04-01 Hewlett-Packard Development Company, L.P. Portable computer system
TWI260966B (en) * 2004-10-28 2006-08-21 Quanta Comp Inc Heat dissipation device
TW200622564A (en) * 2004-12-27 2006-07-01 First Internation Computer Inc Fan control system, method and heat dissipation system for electronic device
US7233488B2 (en) * 2005-01-03 2007-06-19 Hannspree, Inc. Display device having a retractable supporting unit
TWM271355U (en) * 2005-02-04 2005-07-21 Chen Source Inc Carrying device
JP2007172328A (en) * 2005-12-22 2007-07-05 Toshiba Corp Electronic device
US8567740B2 (en) * 2006-03-23 2013-10-29 Byron Richard Tarnutzer Deployable support unit for reading material
JP2009015385A (en) * 2007-06-29 2009-01-22 Fujitsu Ltd Electronic equipment
TWI346281B (en) * 2007-12-03 2011-08-01 Wistron Corp Method and apparatus for controlling operating mode of a portable electronic device
TWI375146B (en) * 2009-04-08 2012-10-21 Wistron Corp Electronic device
TWI372332B (en) * 2009-08-11 2012-09-11 Acer Inc
TW201109907A (en) * 2009-09-04 2011-03-16 Hon Hai Prec Ind Co Ltd Notebook computer
US8390997B1 (en) * 2009-10-06 2013-03-05 Brenda Dominy Portable computer with adjustable monitor
TW201122778A (en) * 2009-12-31 2011-07-01 Compal Electronics Inc Notebook computer and hinge module with angle detector thereof
TW201223418A (en) * 2010-11-19 2012-06-01 Inventec Corp An electronic apparatus with heat improvement
TWI467354B (en) * 2011-09-30 2015-01-01 Quanta Comp Inc Electronic device and temperature modulation method

Patent Citations (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5818694A (en) * 1996-02-16 1998-10-06 Hitachi, Ltd. Cooling apparatus for electronic devices
US6118656A (en) * 1998-06-23 2000-09-12 Dell Usa, Lp Heat sink having a pressure gradient
US20020048147A1 (en) * 2000-10-19 2002-04-25 Masaharu Miyahara Heat sink unit and electronic apparatus using the same
US6354367B1 (en) * 2001-02-12 2002-03-12 Rheem Manufacturing Company Air conditioning unit having coil portion with non-uniform fin arrangement
US6543522B1 (en) * 2001-10-31 2003-04-08 Hewlett-Packard Development Company, L.P. Arrayed fin cooler
US6590770B1 (en) * 2002-03-14 2003-07-08 Modine Manufacturing Company Serpentine, slit fin heat sink device
US20040160732A1 (en) * 2003-02-14 2004-08-19 Prosenjit Ghosh Lightweight robust enclosure design for a mobile computing system
US20050243510A1 (en) * 2004-04-28 2005-11-03 Kentaro Tomioka Electronic apparatus with liquid cooling device
US20060120044A1 (en) * 2004-12-04 2006-06-08 Foxconn Technology Co., Ltd Heat dissipating apparatus
US7143816B1 (en) * 2005-09-09 2006-12-05 Delphi Technologies, Inc. Heat sink for an electronic device
US20090168331A1 (en) * 2006-05-19 2009-07-02 Kabushiki Kaisha Toshiba Electronic apparatus
US20080068797A1 (en) * 2006-09-15 2008-03-20 Takashi Iikubo Mounting assembly and electronic device with the mounting assembly
US7623348B2 (en) * 2006-10-02 2009-11-24 Nidec Corporation Heat sink and cooling apparatus
US20080105410A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation apparatus
US20080298011A1 (en) * 2007-05-31 2008-12-04 Kabushiki Kaisha Toshiba Electronic apparatus and cooling unit
US20090000768A1 (en) * 2007-06-27 2009-01-01 Foxconn Technology Co., Ltd. Heat dissipation device
US20090021913A1 (en) * 2007-07-20 2009-01-22 Foxconn Technology Co., Ltd. Heat dissipation device
US20090052131A1 (en) * 2007-08-24 2009-02-26 Kabushiki Kaisha Toshiba Electronic apparatus
US20090175003A1 (en) * 2008-01-04 2009-07-09 Apple Inc. Systems and methods for cooling electronic devices using airflow dividers
US7808781B2 (en) * 2008-05-13 2010-10-05 International Business Machines Corporation Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements
US20100018669A1 (en) * 2008-07-28 2010-01-28 Foxconn Technology Co., Ltd. Heat dissipation device
US8205665B2 (en) * 2008-07-28 2012-06-26 Foxconn Technology Co., Ltd. Heat dissipation device
US7667967B1 (en) * 2008-08-06 2010-02-23 Sun Microsystems, Inc. Liquid-cooled rack with optimized rack heat exchanger design for non-uniform power dissipation
US20100142142A1 (en) * 2008-12-05 2010-06-10 Sinitec Vertriebsgesellschaft Mbh Method and device for cooling heat-generating computer components
US8154869B2 (en) * 2008-12-05 2012-04-10 Fujitsu Technology Solutions Intellectual Property Gmbh Method and device for cooling heat-generating computer components
US20100328878A1 (en) * 2009-06-30 2010-12-30 Kabushiki Kaisha Toshiba Electronic apparatus
US7952872B1 (en) * 2009-12-25 2011-05-31 Kabushiki Kaisha Toshiba Cooling device and electronic apparatus
US20110157824A1 (en) * 2009-12-25 2011-06-30 Nobuto Fujiwara Centrifugal fan and electronic apparatus
US20110249401A1 (en) * 2010-04-09 2011-10-13 Kabushiki Kaisha Toshiba Electronic apparatus
US8670237B2 (en) * 2010-12-28 2014-03-11 Mitsubishi Electric Corporation Power conversion apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9535470B2 (en) 2014-07-02 2017-01-03 Asia Vital Components Co., Ltd. Electronic substrate with heat dissipation structure

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US20140118897A1 (en) 2014-05-01
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