CN106292961A - A kind of memory bar radiator structure - Google Patents

A kind of memory bar radiator structure Download PDF

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Publication number
CN106292961A
CN106292961A CN201610681804.1A CN201610681804A CN106292961A CN 106292961 A CN106292961 A CN 106292961A CN 201610681804 A CN201610681804 A CN 201610681804A CN 106292961 A CN106292961 A CN 106292961A
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CN
China
Prior art keywords
metal fin
fin
fixing
memory bar
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201610681804.1A
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Chinese (zh)
Inventor
陈玮彤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201610681804.1A priority Critical patent/CN106292961A/en
Publication of CN106292961A publication Critical patent/CN106292961A/en
Withdrawn legal-status Critical Current

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a kind of memory bar radiator structure, including mainboard and the memory bank being arranged on mainboard, memory bank two sides are rotatably connected to the first metal fin and the second metal fin respectively;First metal fin side is fixedly installed the first silica gel radiating fin, and upper end is rotatably connected to fixing bar, and fixing boom end is connected with L-type and fixes buckle;Second metal fin side is fixedly installed the second silica gel radiating fin, and upper end is provided with and the fixing bayonet socket being clasped;When needing to dispel the heat memory bar, rotating the first metal fin and the second metal fin so that the first silica gel radiating fin and the second silica gel radiating fin are fitted with memory bar, then rotate fixing bar, fixing buckle buckles with bayonet socket, reaches memory bar radiating effect;Overall structure is simple, low cost.

Description

A kind of memory bar radiator structure
Technical field
The present invention relates to field of computer technology, more particularly, it relates to a kind of memory bar radiator structure.
Background technology
Memory bar is the requisite ingredient of computer, does not mostly install and dissipate memory bar in currently used computer The structure of heat, internal memory easily produces unstable factor after running in hotter cabinet for a long time, affects computer and uses simultaneously Affect the memory bar life-span.
Summary of the invention
The technical problem to be solved in the present invention is, for the drawbacks described above of prior art, it is provided that a kind of memory bar heat radiation Structure.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of memory bar radiator structure of structure, including mainboard and the memory bank being arranged on described mainboard;Wherein, described Memory bank two sides are rotatably connected to the first metal fin and the second metal fin respectively;Described first metal fin Side is fixedly installed the first silica gel radiating fin, and upper end is rotatably connected to fixing bar, and described fixing boom end is connected with L-type Fixing buckle;Described second metal fin side is fixedly installed the second silica gel radiating fin, and upper end is provided with fixing with described The bayonet socket being clasped.
Memory bar radiator structure of the present invention, wherein, described memory bank two side is respectively arranged with and described The first cavity that one metal fin coordinates and the second cavity of coordinating with described second metal fin.
Memory bar radiator structure of the present invention, wherein, described first metal fin and described second heat dissipation metal Sheet surface is provided with multiple louvre.
Memory bar radiator structure of the present invention, wherein, described first metal fin and described second heat dissipation metal Sheet surface is provided with multiple heat sink strip.
The beneficial effects of the present invention is: when needing memory bar is dispelled the heat, rotate the first metal fin and second Metal fin so that the first silica gel radiating fin and the second silica gel radiating fin are fitted with memory bar, then rotates fixing bar, fixing Buckle buckles with bayonet socket, reaches memory bar radiating effect;Overall structure is simple, low cost.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below in conjunction with accompanying drawing and reality The invention will be further described to execute example, and the accompanying drawing in describing below is only the section Example of the present invention, for this area From the point of view of those of ordinary skill, on the premise of not paying creative work, it is also possible to obtain other accompanying drawings according to these accompanying drawings:
Fig. 1 is the memory bar radiator structure structural representation of present pre-ferred embodiments.
Detailed description of the invention
In order to make the purpose of the embodiment of the present invention, technical scheme and advantage clearer, implement below in conjunction with the present invention Technical scheme in example carries out clear, complete description, it is clear that described embodiment is the section Example of the present invention, and It is not all of embodiment.Based on embodiments of the invention, those of ordinary skill in the art are not before paying creative work Put the every other embodiment obtained, broadly fall into protection scope of the present invention.
The memory bar radiator structure of present pre-ferred embodiments is as it is shown in figure 1, include mainboard 1 and be arranged on mainboard 1 Memory bank 10, memory bank 10 two sides are rotatably connected to the first metal fin 100 and the second metal fin respectively 101;First metal fin 100 side is fixedly installed the first silica gel radiating fin 102, and upper end is rotatably connected to fixing bar 103, Fixing bar 103 end is connected with L-type and fixes buckle 104;Second metal fin 101 side is fixedly installed the second silica gel Fin 105, upper end is provided with and fixes the bayonet socket 106 that buckle 104 coordinates;When needing memory bar 2 is dispelled the heat, rotate the One metal fin 100 and the second metal fin 101 so that the first silica gel radiating fin 102 and the second silica gel radiating fin 105 with Memory bar 2 is fitted, and then rotates fixing bar 103, and fixing buckle 104 buckles with bayonet socket 106, reaches memory bar 2 radiating effect; Overall structure is simple, low cost.
As it is shown in figure 1, memory bank 10 two side is respectively arranged with the first cavity coordinated with the first metal fin 100 107 and the second cavity 108 of coordinating with the second metal fin 101, occupy little space.
As it is shown in figure 1, the first metal fin 100 and the second metal fin 101 surface are provided with multiple louvre (not shown), good heat dissipation effect.
As it is shown in figure 1, the first metal fin and the second metal fin surface are provided with multiple heat sink strip 109, dissipate Thermal effect is good.
It should be appreciated that for those of ordinary skills, can be improved according to the above description or be converted, And all these modifications and variations all should belong to the protection domain of claims of the present invention.

Claims (4)

1. a memory bar radiator structure, including mainboard and the memory bank being arranged on described mainboard;It is characterized in that, described Memory bank two sides are rotatably connected to the first metal fin and the second metal fin respectively;Described first metal fin Side is fixedly installed the first silica gel radiating fin, and upper end is rotatably connected to fixing bar, and described fixing boom end is connected with L-type Fixing buckle;Described second metal fin side is fixedly installed the second silica gel radiating fin, and upper end is provided with fixing with described The bayonet socket being clasped.
Memory bar radiator structure the most according to claim 1, it is characterised in that described memory bank two side is respectively provided with There are the first cavity coordinated with described first metal fin and the second cavity coordinated with described second metal fin.
Memory bar radiator structure the most according to claim 1, it is characterised in that described first metal fin and described the Two metal fin surfaces are provided with multiple louvre.
Memory bar radiator structure the most according to claim 1, it is characterised in that described first metal fin and described the Two metal fin surfaces are provided with multiple heat sink strip.
CN201610681804.1A 2016-08-17 2016-08-17 A kind of memory bar radiator structure Withdrawn CN106292961A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610681804.1A CN106292961A (en) 2016-08-17 2016-08-17 A kind of memory bar radiator structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610681804.1A CN106292961A (en) 2016-08-17 2016-08-17 A kind of memory bar radiator structure

Publications (1)

Publication Number Publication Date
CN106292961A true CN106292961A (en) 2017-01-04

Family

ID=57679704

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610681804.1A Withdrawn CN106292961A (en) 2016-08-17 2016-08-17 A kind of memory bar radiator structure

Country Status (1)

Country Link
CN (1) CN106292961A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018032393A1 (en) * 2016-08-17 2018-02-22 陈玮彤 Heat dissipation structure for memory bank

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2409346A (en) * 2003-12-10 2005-06-22 Kingpak Tech Inc Stacked memory card
CN101414206A (en) * 2007-10-18 2009-04-22 鸿富锦精密工业(深圳)有限公司 Heat radiating device of memory
CN101655730A (en) * 2009-08-07 2010-02-24 昆山联德精密机械有限公司 Radiation device of internal memory
CN102262424A (en) * 2010-05-25 2011-11-30 鸿富锦精密工业(深圳)有限公司 Radiating device of memory bank
CN205247266U (en) * 2015-11-23 2016-05-18 西安工程大学 Computer motherboard structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2409346A (en) * 2003-12-10 2005-06-22 Kingpak Tech Inc Stacked memory card
CN101414206A (en) * 2007-10-18 2009-04-22 鸿富锦精密工业(深圳)有限公司 Heat radiating device of memory
CN101655730A (en) * 2009-08-07 2010-02-24 昆山联德精密机械有限公司 Radiation device of internal memory
CN102262424A (en) * 2010-05-25 2011-11-30 鸿富锦精密工业(深圳)有限公司 Radiating device of memory bank
CN205247266U (en) * 2015-11-23 2016-05-18 西安工程大学 Computer motherboard structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018032393A1 (en) * 2016-08-17 2018-02-22 陈玮彤 Heat dissipation structure for memory bank

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Application publication date: 20170104

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