CN203369024U - Multiple-heat-radiation-assembly structure - Google Patents
Multiple-heat-radiation-assembly structure Download PDFInfo
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- CN203369024U CN203369024U CN 201320373493 CN201320373493U CN203369024U CN 203369024 U CN203369024 U CN 203369024U CN 201320373493 CN201320373493 CN 201320373493 CN 201320373493 U CN201320373493 U CN 201320373493U CN 203369024 U CN203369024 U CN 203369024U
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- heat
- conducting strip
- heat dissipation
- samming
- thermal source
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Abstract
A multiple-heat-radiation-assembly structure is suitable for satisfying direct heat radiation requirement of a preset heat source. The multiple-heat-radiation-assembly mainly comprises the following components: a heat guiding sheet set which is composed of a plurality of conductive heat guiding sheets and is provided with a contact surface that abuts against the heat source; and a uniform-temperature sheet set which is composed of a plurality of uniform-temperature sheets that have quick transverse heat guiding characteristic, wherein the uniform-temperature sheets contact with and are arranged among the heat guiding sheets, and each uniform-temperature sheet is provided with a near-heat-source part which is next to the heat source and a far-heat-source part that extends along a direction away from the heat source. Through matching between the heat guiding sheet set and the uniform-temperature sheet set, multiple conduction and diffusion in different direction for the heat of the heat source can be formed, so that the heat is uniformly arranged on each heat guiding sheet and is quickly radiated to outside, thereby effectively preventing abnormal temperature increase caused by heat aggregation.
Description
Technical field
The relevant a kind of multiple heat dissipation modular construction of the utility model, espespecially a kind of Combination Design of utilizing low cost and easy structure, can reach the heat Quick uniform diffusion that default thermal source is produced, to avoid heat build-up in the radiator structure of regional area.
Background technology
The demands such as the sound and light program complexity along with modern electronic product when operation is used and sophistication, the electronic building bricks such as required operational analysis, light source and power amplification (central processing unit, luminescence component, power crystal or other similar assembly) are also used widely, and in use, above-mentioned each electronic building brick all is difficult to can produce a large amount of heat energy with avoiding, if make this heat energy directly spread, produce heat build-up near can causing thermal source, except the excess Temperature that causes casing surface local position, also easily form the bad disappearance of heat radiation; For this kind of situation, more common settling mode, be to utilize a heat transfer efficiency preferably heat-conductive assembly is (for example: heat pipe) be contacted with on this thermal source with its part, and other position on this heat-conductive assembly is provided with the radiating subassembly (for example: fin, fan) that increases radiating effect, utilize this heat-conductive assembly that the heat of thermal source is transferred to this radiating subassembly and dispersed, but like this retarding heat concentrations and cause the situation of local location excess Temperature.
Yet, above-mentioned heat-conductive assembly (heat pipe) and radiating subassembly (fin, fan) itself all have structural complexity to a certain degree, and it also has fixing cost, if be applied in simple in structure and electronic product that price is cheap, value-for-money not; Therefore, how can be with more easy structure and lower cost, solve the heat concentrations and cause the disappearance of local location excess Temperature, be for each relevant dealer the problem of effort urgently.
Because seen that it is the road for these shortcoming Improvements that heat-conductive assembly and radiating subassembly have above-mentioned shortcoming, designer when application, has the utility model to produce finally.
Summary of the invention
The utility model main purpose is to provide a kind of multiple heat dissipation modular construction, and it can outwards transmit the heat of presetting thermal source to disperse rapidly, causes overheating to avoid the heat concentrations near thermal source.
Another purpose of the utility model is to provide a kind of multiple heat dissipation modular construction, and it can utilize less expensive heat-conductive assembly, reaches default heat conduction and heat radiation effect, has preferably economic benefit.
For reaching above-mentioned purpose and effect, the utility model multiple heat dissipation modular construction at least comprises: a conducting strip group, the stacked composition of conducting strip that is had conductivity by majority; One samming sheet group, by most, can be formed by the quick samming sheet along surface direction guiding heat, each samming sheet is arranged at intervals between each conducting strip, and each samming sheet has respectively the near-thermal source section close to a thermal source, and the thermal source far away section of extending towards the direction away from this thermal source; At least one of them is contacted with this thermal source for this conducting strip group and this samming sheet group.
According to said structure, wherein each conducting strip has respectively the samming sheet of an adjacent correspondence, and each samming sheet is arranged at respectively the side of the conducting strip of adjacent correspondence towards thermal source.
According to said structure, wherein this conducting strip group and this samming sheet group are contacted with this thermal source simultaneously.
According to said structure, wherein between at least one of this conducting strip group, samming sheet group and this thermal source, be provided with heat-conducting glue.
According to said structure, wherein each conducting strip has respectively the samming sheet of an adjacent correspondence, and each samming sheet is arranged at respectively a side of the conducting strip stow away from heat of adjacent correspondence.This conducting strip group is contacted with this thermal source, and is provided with heat-conducting glue between this conducting strip group and thermal source.
According to said structure, wherein the area of this samming sheet is less than contacted conducting strip area.The plates that this samming sheet is a strip.This samming sheet has the main extension of a strip, is provided with the branching portion of at least one oblique extension in this main extension one side.This branching portion is towards the oblique extension of the direction of stow away from heat and main extension.
According to said structure, wherein this samming sheet has the main extension of a strip, is respectively equipped with the branching portion of at least one oblique extension in these main extension two sides.
According to said structure, wherein this branching portion is towards the oblique extension of the direction of stow away from heat and main extension.
According to said structure, wherein the area of this samming sheet is same as contacted conducting strip area.
According to said structure, wherein between each conducting strip and each samming sheet, be respectively equipped with a conductive adhesive layer that has thermal conductivity concurrently.
According to said structure, wherein this conducting strip group is comprised of most conducting strips of formed objects, shape.
Compared with prior art, the beneficial effect that the utility model has is: the utility model is by the characteristic of the horizontal MULTIPLE DIFFUSION heat of samming sheet, the characteristic that coordinates each conducting strip directly externally to disperse heat fast, can effectively avoid heat accumulation near the position approached thermal source, produce the disappearance of abnormal high temperature to reduce local location.
Understand for above-mentioned purpose of the present utility model, effect and feature can be obtained more specifically, hereby be described as follows according to following accompanying drawing.
The accompanying drawing explanation
The structure decomposition map that Fig. 1 is the utility model the first embodiment.
The structure decomposition map that Fig. 2 A is the utility model the second embodiment.
The combination outward appearance that Fig. 2 B is the utility model the second embodiment and application scenarios schematic diagram.
The combination section that Fig. 3 is the utility model the second embodiment.
The structure decomposition map that Fig. 4 is the utility model the 3rd embodiment.
Combination outward appearance and application scenarios schematic diagram that Fig. 5 is the utility model the 3rd embodiment.
The structure decomposition map that Fig. 6 is the utility model the 4th embodiment.
Combination outward appearance and application scenarios schematic diagram that Fig. 7 is the utility model the 4th embodiment.
label declaration:
1..... conducting strip group;
11,12,13..... conducting strip;
111.... contact-making surface;
2,5,6,7...... samming sheet group;
21,22,23,51,52,53,61,62,63,71,72,73..... samming sheet;
211,221,231,512,522,532,612,622,632,711,721,731.... near-thermal source section;
212,222,232,513,523,533,613,623,633,712,722,732.... thermal source far away section;
3,3a, 3b.... conductive adhesive layer;
30..... heat-conducting glue;
4...... circuit board;
40..... thermal source;
511,521,531,611,621,631.... master's extension;
514,524,534,614,615,624,625,634,635.... branching portion.
Embodiment
Shown in please refer to the drawing 1, the structure of known the utility model the first embodiment mainly comprises: the parts such as conducting strip group 1 and samming sheet group 7, the conducting strip 11,12,13 that wherein conducting strip group 1 has conductivity (can be metal material) by majority sequentially stacked combination forms, and a wherein outermost surfaces of this conducting strip group 1 is defined as a contact-making surface 111, samming sheet group 7 is interted and is arranged at each conducting strip 11 respectively by majority, 12, samming sheet 71 between 13, 72, 73 institutes form, these samming sheets 71, 72, 73 are same as conducting strip 11 for area, 12, 13 and there is the sheet-like structure (can be graphite or other similar material) of guiding fast thermal properties along surface direction (laterally), in the structure disclosed in the present embodiment, this samming sheet 71, 72, 73 have respectively a near- thermal source section 711, 721, 731 and one thermal source far away section 721, 722, 732, and each samming sheet 71, 72, 73 and each conducting strip 11, 12, but the conductive adhesive layer 3 via a heat conduction between 13 forms a combination with conductivity.
Shown in please refer to the drawing 2A, 2B and Fig. 3, the structure of known the utility model the second embodiment mainly comprises: the parts such as conducting strip group 1 and samming sheet group 2, the conducting strip 11,12,13 that wherein conducting strip group 1 has conductivity (can be metal material) by majority sequentially stacked combination forms, and a wherein outermost surfaces of conducting strip group 1 is defined as a contact-making surface 111, samming sheet group 2 is interted and is arranged at each conducting strip 11 respectively by majority, 12, samming sheet 21 between 13, 22, 23 institutes form, these samming sheets 21, 22, 23 area is less than conducting strip group 1 and has the sheet-like structure (can be graphite or other similar material) of guiding fast thermal properties along surface direction (laterally), in the structure disclosed in the present embodiment, this samming sheet 21, 22, 23 are strip, and there is respectively a near- thermal source section 211, 221, 231 and one thermal source far away section 212, 222, 232, and each samming sheet 21, 22, 23 and each conducting strip 11, 12, but the conductive adhesive layer 3 via a heat conduction between 13 forms a combination with conductivity.
When practical application, this conducting strip group 1 can be contacted with a default thermal source 40 by its contact-making surface 111, and make each samming sheet 21,22,23 approach this thermal source 40 with near-thermal source section 211,221,231, in illustrated embodiment, this thermal source 40 can be the electronic building brick (as: processor, power crystal etc.) on a circuit board 4, and between this thermal source 40 and contact-making surface 111, a heat-conducting glue 30 can be set according to need, to promote its heat-conducting effect.
During use, the heat major part that this thermal source 40 produces can conduct to this conducting strip 11 via contact-making surface 111 by heat-conducting glue 30, due to this conducting strip 11, 12, 13 is plates, and its metal material has the characteristic that heat is evenly dispersed towards the radial constant speed of surrounding, therefore heat can be passed to samming part 21 by conducting strip 11 and via conductive adhesive layer 3 very rapidly, utilize this samming part 21 to guide fast the characteristic of heat by heat along surface direction (laterally), make heat approach near-thermal source section 211 rapid diffusion of thermal source 40 or to be dispersed to the thermal source far away section 212 away from this thermal source 40 by concentrating, then, remaining heat can conduct to conducting strip 12 by conductive adhesive layer 3 by samming part 21, by the external divergent portion heat of this conducting strip 12, remaining heat can be passed to samming part 22 by conductive adhesive layer 3 again, for again by heat by the quick horizontal proliferation of near-thermal source section 221 to far away thermal source section 222, and remaining heat conducts to conducting strip 13 external divergent portion heat by conductive adhesive layer 3 again, finally, all remaining heats are passed to samming part 23 by conductive adhesive layer 3, and make again this heat by the quick horizontal proliferation of near-thermal source section 231 thermal source extremely far away section 232, characteristic by this kind with samming sheet 21,22,23 horizontal MULTIPLE DIFFUSION heats, the characteristic that coordinates each conducting strip 11,12,13 directly externally to disperse heat fast, can effectively avoid heat accumulation in approaching near the position of thermal source 40, produce the disappearance of abnormal high temperature to reduce local location.
In the present embodiment, this samming sheet 21, 22 are arranged at respectively conducting strip 11, 12, between 13, samming sheet 23 is arranged at another table side of conducting strip 13, but in application, also can be by samming sheet 22, 23 are arranged at conducting strip 11, 12, between 13, samming sheet 21 is arranged on the contact-making surface 111 of conducting strip 11, to form another kind of different combination, if and when this samming sheet 21 is arranged to the contact-making surface 111 of conducting strip 11, also can be simultaneously with the part of this contact-making surface 111 and samming sheet 21, be contacted with between this thermal source 40 of this thermal source 40(and the conducting strip 11 be close to and samming sheet 21 and also be provided with heat-conducting glue 30), use and reach the various combination aspect with identical effect, simultaneously, the samming sheet quantity of the conducting strip quantity of this conducting strip group 1 and samming part group 2 is according to need and suitably increase and decrease simultaneously all, has the combination of different heat conduction, radiating effect with formation.
Shown in please refer to the drawing 4, Fig. 5, the structure of known the utility model the 3rd embodiment mainly comprises: a samming sheet group 5, and the conducting strip group 1 identical with aforementioned the second embodiment, wherein this conducting strip group 1 has identical conducting strip 11, 12, 13, samming sheet group 5 is interted and is arranged at each conducting strip 11 respectively by majority, 12, samming sheet 51 between 13, 52, 53 institutes form, these samming sheets 51, 52, 53 for area is less than conducting strip group 1 and has the sheet-like structure (can be graphite or other similar material) of guiding fast thermal properties along surface direction (laterally), in the structure disclosed at the present embodiment, and samming sheet 51, 52, 53 respectively have the main extension 511 of a strip, 521, 531, each main extension 511, 521, 531 have respectively the source of the near-thermal close to thermal source 40 section 512, 522, 532 and away from the thermal source far away section 513 of this thermal source 40, 523, 533, and in main extension 511, 521, a side of 531 respectively is provided with the branching portion 514 that a plurality of oblique (parallel) extends, 524, 534, and these branching portions 514, 524, 534 towards stow away from heat 40 and main extension 511, 521, the oblique extension of 531 direction, and each samming sheet 51, 52, 53 and each conducting strip 11, 12, but the conductive adhesive layer 3a via a heat conduction between 13 forms a combination with conductivity.
During use, the heat that this thermal source 40 produces can conduct to conducting strip 11 via contact-making surface 111 by heat-conducting glue 30, the part heat can externally be dispersed by conducting strip 11, all the other heats are passed to samming part 51 by conductive adhesive layer 3a rapidly, utilize this samming part 51 to guide fast the characteristic of heat by heat along surface direction (laterally), make the part heat can be quickly diffused to by the near-thermal source section 512 that approaches thermal source 40 on main extension 511 the thermal source far away section 513 of stow away from heat 40, heat on main extension 511 can be passed to respectively each branching portion 514 more simultaneously, to form even diffusion, then, remaining heat sequentially conducts to conducting strip 12, samming sheet 52, conducting strip 13, samming sheet 53 by conductive adhesive layer 3a, and can repeat respectively heat radiation and the horizontal heat conduction action of this conducting strip 11 and samming sheet 51, use and reach avoid heat accumulation identical with aforementioned the first embodiment in approaching near the effect of thermal source 40, can effectively avoid local location to produce the disappearance of abnormal high temperature.
Shown in please refer to the drawing 6, Fig. 7, the structure of known the utility model the 4th embodiment mainly comprises: a samming sheet group 6, and the conducting strip group 1 identical with aforementioned the second embodiment, wherein this conducting strip group 1 has identical conducting strip 11, 12, 13, samming sheet group 6 is interted and is arranged at each conducting strip 11 respectively by majority, 12, samming sheet 61 between 13, 62, 63 institutes form, these samming sheets 61, 62, 63 for area is less than conducting strip group 1 and has the sheet-like structure (can be graphite or other similar material) of guiding fast thermal properties along surface direction (laterally), in the structure disclosed at the present embodiment, and samming sheet 61, 62, 63 respectively have the main extension 611 of a strip, 621, 631, each main extension 611, 621, 631 have respectively the source of the near-thermal close to thermal source 40 section 612, 622, 632 and away from the thermal source far away section 613 of this thermal source 40, 623, 633, and in main extension 611, 621, 631 two sides respectively are provided with the branching portion 614 that most oblique (parallel) extends, 615, 624, 625, 634, 635, and these branching portions 614, 615, 624, 625, 634, 635 towards stow away from heat 40 and main extension 611, 621, the oblique extension of 631 direction, and each samming sheet 61, 62, 63 and each conducting strip 11, 12, but the conductive adhesive layer 3b via a heat conduction between 13 forms a combination with conductivity.
During use, the heat that thermal source 40 produces can conduct to conducting strip 11 via contact-making surface 111 by heat-conducting glue 30, except the part heat can externally be dispersed by conducting strip 11, all the other heats can be passed to samming part 61 by conductive adhesive layer 3b rapidly, utilize this samming part 61 to guide fast the characteristic of heat by heat along surface direction (laterally), make the part heat can be quickly diffused to by the near-thermal source section 612 that approaches thermal source 40 on main extension 611 the thermal source far away section 613 of stow away from heat 40, heat on main extension 611 can be passed to respectively each branching portion 614 more simultaneously, 615, to form even diffusion, then, remaining heat sequentially conducts to conducting strip 12, samming sheet 62, conducting strip 13, samming sheet 63 by conductive adhesive layer 3b, and repeats respectively heat radiation and the horizontal heat conduction action of this conducting strip 11 and samming sheet 61, by reaching avoid heat accumulation identical with aforementioned the first embodiment in approaching near the effect of thermal source 40, can effectively reduce the disappearance that local location produces abnormal high temperature.
Comprehensive the above, the utility model multiple heat dissipation modular construction has really can reduce the spare part cost, and makes the transmission of heat Quick uniform and the effect of dispersing, and is the utility model of a tool novelty and progressive in fact, new patent is filed an application in whence in accordance with the law; Only above-mentioned description, be only preferred embodiment explanation of the present utility model, and the variation, modification, change or the equivalent replacement person that such as according to technological means of the present utility model and category, extend, also all should fall in the utility model patent claim.
Claims (18)
1. a multiple heat dissipation modular construction, is characterized in that at least comprising: a conducting strip group, the stacked composition of conducting strip that is had conductivity by majority; One samming sheet group, by most, can be formed by the quick samming sheet along surface direction guiding heat, each samming sheet is arranged at intervals between each conducting strip, and each samming sheet has respectively the near-thermal source section close to a thermal source, and the thermal source far away section of extending towards the direction away from this thermal source; At least one of them is contacted with this thermal source for this conducting strip group and this samming sheet group.
2. multiple heat dissipation modular construction as claimed in claim 1, is characterized in that, each conducting strip has respectively the samming sheet of an adjacent correspondence, and each samming sheet is arranged at respectively the side of the conducting strip of adjacent correspondence towards thermal source.
3. multiple heat dissipation modular construction as claimed in claim 2, is characterized in that, this conducting strip group and this samming sheet group are contacted with this thermal source simultaneously.
4. multiple heat dissipation modular construction as claimed in claim 3, is characterized in that, between at least one of this conducting strip group, samming sheet group and this thermal source, is provided with heat-conducting glue.
5. multiple heat dissipation modular construction as claimed in claim 1, is characterized in that, each conducting strip has respectively the samming sheet of an adjacent correspondence, and each samming sheet is arranged at respectively a side of the conducting strip stow away from heat of adjacent correspondence.
6. multiple heat dissipation modular construction as claimed in claim 5, is characterized in that, this conducting strip group is contacted with this thermal source, and be provided with heat-conducting glue between this conducting strip group and thermal source.
7. as claim 1 or 2 or 3 or 4 or 5 or 6 described multiple heat dissipation modular constructions, it is characterized in that, the area of this samming sheet is less than contacted conducting strip area.
8. multiple heat dissipation modular construction as claimed in claim 7, is characterized in that, the plates that this samming sheet is a strip.
9. multiple heat dissipation modular construction as claimed in claim 8, is characterized in that, this samming sheet has the main extension of a strip, is provided with the branching portion of at least one oblique extension in this main extension one side.
10. multiple heat dissipation modular construction as claimed in claim 9, is characterized in that, this branching portion is towards the oblique extension of the direction of stow away from heat and main extension.
11. multiple heat dissipation modular construction as claimed in claim 8, is characterized in that, this samming sheet has the main extension of a strip, is respectively equipped with the branching portion of at least one oblique extension in these main extension two sides.
12. multiple heat dissipation modular construction as claimed in claim 11, is characterized in that, this branching portion is towards the oblique extension of the direction of stow away from heat and main extension.
13. as claim 1 or 2 or 3 or 4 or 5 or 6 described multiple heat dissipation modular constructions, it is characterized in that, the area of this samming sheet is same as contacted conducting strip area.
14. as claim 1 or 2 or 3 or 4 or 5 or 6 described multiple heat dissipation modular constructions, it is characterized in that, be respectively equipped with a conductive adhesive layer that has thermal conductivity concurrently between each conducting strip and each samming sheet.
15. multiple heat dissipation modular construction as claimed in claim 7, is characterized in that, is respectively equipped with a conductive adhesive layer that has thermal conductivity concurrently between each conducting strip and each samming sheet.
16. multiple heat dissipation modular construction as claimed in claim 9, is characterized in that, is respectively equipped with a conductive adhesive layer that has thermal conductivity concurrently between each conducting strip and each samming sheet.
17. multiple heat dissipation modular construction as claimed in claim 11, is characterized in that, is respectively equipped with a conductive adhesive layer that has thermal conductivity concurrently between each conducting strip and each samming sheet.
18. multiple heat dissipation modular construction as claimed in claim 13, is characterized in that, is respectively equipped with a conductive adhesive layer that has thermal conductivity concurrently between each conducting strip and each samming sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320373493 CN203369024U (en) | 2013-06-27 | 2013-06-27 | Multiple-heat-radiation-assembly structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320373493 CN203369024U (en) | 2013-06-27 | 2013-06-27 | Multiple-heat-radiation-assembly structure |
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| Publication Number | Publication Date |
|---|---|
| CN203369024U true CN203369024U (en) | 2013-12-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320373493 Expired - Fee Related CN203369024U (en) | 2013-06-27 | 2013-06-27 | Multiple-heat-radiation-assembly structure |
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| CN (1) | CN203369024U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104918425A (en) * | 2014-03-10 | 2015-09-16 | 联想(北京)有限公司 | Housing, electronic device and heat radiation processing method |
-
2013
- 2013-06-27 CN CN 201320373493 patent/CN203369024U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104918425A (en) * | 2014-03-10 | 2015-09-16 | 联想(北京)有限公司 | Housing, electronic device and heat radiation processing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131225 Termination date: 20160627 |