CN104918425A - Housing, electronic device and heat radiation processing method - Google Patents
Housing, electronic device and heat radiation processing method Download PDFInfo
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- CN104918425A CN104918425A CN201410086537.4A CN201410086537A CN104918425A CN 104918425 A CN104918425 A CN 104918425A CN 201410086537 A CN201410086537 A CN 201410086537A CN 104918425 A CN104918425 A CN 104918425A
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Abstract
The invention discloses a housing, an electronic device and a heat radiation processing method. Electronic components of the electronic device are accommodated in the housing. The housing comprises a housing body, a heat insulation medium and a heat-conducting medium, wherein the heat insulation medium is arranged at a first area at the first side of the housing body; and the heat-conducting medium is arranged at a second area at the first side of the housing body, the second area is greater than the first area, and the hat insulation medium is in contact with the heat-insulating medium so as to enable the heat insulation medium to shield heat insulation of the electronic comments, and the area, which is in contact with the heat insulation medium, in the heat-conducting medium receives the heat radiation and transfers the heat radiation through the heat-conducting medium. According to the invention, the heat radiation of the electronic components in the electronic device is shielded through the heat insulation medium, such that the heat radiation can be transferred in the larger-area heat-conducting medium, the heat radiation can be transferred to the far end, which is away from the electronic components, in the second area, and the heat dissipation effect is improved.
Description
Technical field
The present invention relates to the thermal radiation treatment technology in electronic equipment, particularly relate to a kind of housing, electronic equipment and thermal radiation processing method.
Background technology
Shell in electronic equipment generally uses the heat sink material improving radiating effects such as graphite flake, but the heat sink material Z axis conductivities such as graphite flake are higher, cause the heat of casing internal cannot form effectively diffusion on casing surface, cause casing local temperature too high, affect radiating effect.
In sum, correlation technique, for the radiating efficiency how promoting casing surface, there is no effective solution.
Summary of the invention
The embodiment of the present invention provides a kind of housing, electronic equipment and thermal radiation processing method, can promote the radiating efficiency of casting of electronic device.
Embodiment of the present invention technical scheme is achieved in that
The embodiment of the present invention provides a kind of housing, is applied to electronic equipment, the electronic devices and components of accommodating described electronic equipment in described housing;
Described housing comprises: enclosure body, insulating medium and heat-conducting medium; Wherein,
Described insulating medium is arranged on the first area of the first side of described enclosure body;
Described heat-conducting medium is arranged at the second area of the first side of described enclosure body, and described second area is greater than described first area, and described insulating medium contacts with described heat-conducting medium;
With,
Make described insulating medium shield the thermal radiation of described electronic devices and components, thermal radiation described in the areas accept contacted with described insulating medium in described heat-conducting medium, and conduct described thermal radiation by described heat-conducting medium.
Preferably, described first area is corresponding with the position of the first electronic devices and components, and the distance between described insulating medium and described first electronic devices and components exceedes first threshold, with the thermal radiation making described insulating medium shield described first electronic devices and components; Wherein,
Described first electronic devices and components are the electronic devices and components that in described electronic devices and components, unit interval thermal radiation value exceedes Second Threshold.
Preferably, the area of described first area is greater than the area in the 3rd region, the region that described 3rd region covers for described first electronic devices and components, and,
Region upright projection corresponding to of described 3rd region in the first side of described enclosure body is the subregion of described first area.
Preferably, between described insulating medium and the first area of described enclosure body and between the second area of described heat-conducting medium and described enclosure body, stiffness films medium is also provided with; Wherein,
Described stiffness films medium is fitted with the first side of described insulating medium, described enclosure body respectively in described first area;
Described stiffness films medium is fitted with the first side of described heat-conducting medium, described enclosure body respectively at described second area.
Preferably, between the first area, described insulating medium of the first side of described enclosure body, be also provided with heat-conducting medium, to make to contact with described insulating medium in described heat-conducting medium and thermal radiation described in the areas accept do not covered by described insulating medium.
The embodiment of the present invention also provides a kind of electronic equipment, and described electronic equipment comprises above-described housing.
The embodiment of the present invention also provides a kind of thermal radiation processing method, is applied to and comprises in the electronic equipment of housing, the electronic devices and components of accommodating described electronic equipment in described housing; Described housing comprises: enclosure body, insulating medium and heat-conducting medium; Described method comprises:
In the first area of the first side of described enclosure body, described insulating medium is set;
Arrange described heat-conducting medium at the second area of the first side of described enclosure body, described insulating medium contacts with described heat-conducting medium, and described second area is greater than described first area;
With,
Make described insulating medium shield the thermal radiation of described electronic devices and components, thermal radiation described in the areas accept contacted with described insulating medium in described heat-conducting medium, and conduct described thermal radiation by described heat-conducting medium.
Preferably, the first area of described the first side in described enclosure body arranges described insulating medium, comprising:
In the first area of the first side of described enclosure body, described insulating medium is set, and described first area is corresponding with the position of the first electronic devices and components, distance between described insulating medium and described first electronic devices and components exceedes first threshold, with the thermal radiation making described insulating medium shield described first electronic devices and components;
Wherein, described first electronic devices and components are the electronic devices and components that in described electronic devices and components, unit interval thermal radiation value exceedes Second Threshold.
Preferably, the area of described first area is greater than the area in the 3rd region, the region that described 3rd region covers for described first electronic devices and components, and,
Region upright projection corresponding to of described 3rd region in the first side of described enclosure body is the subregion of described first area.
Preferably, described method also comprises:
Between described insulating medium and the first area of described enclosure body and between the second area of described heat-conducting medium and described enclosure body, stiffness films medium is set; Wherein,
Described stiffness films medium is fitted with the first side of described insulating medium, described enclosure body respectively in described first area;
Described stiffness films medium is fitted with the first side of described heat-conducting medium, described enclosure body respectively at described second area.
Preferably, the first area of described the first side in described enclosure body arranges described insulating medium, arranges described heat-conducting medium, comprising at the second area of the first side of described enclosure body:
In the first area of the first side of described enclosure body and second area, described heat-conducting medium is set, and on the heat-conducting medium arranged in described first area, described insulating medium is set, to make to contact with described insulating medium in described heat-conducting medium and thermal radiation described in the areas accept do not covered by described insulating medium.
In the embodiment of the present invention, by the thermal radiation of electronic devices and components in insulating medium shielded electronic equipment, thermal radiation can be impelled to conduct at the heat-conducting medium that area is larger, thus by the far-end away from electronic devices and components in thermal radiation conducting second region, radiating effect can be improve.
Accompanying drawing explanation
Fig. 1 is the structural representation of the embodiment of the present invention one middle shell;
Fig. 2 is the structural representation of the embodiment of the present invention two middle shell;
Fig. 3 is the structural representation of the embodiment of the present invention three middle shell;
Fig. 4 is the structural representation of the embodiment of the present invention four middle shell;
Fig. 5 is the structural representation of the embodiment of the present invention five middle shell;
Fig. 6 is the schematic flow sheet of thermal radiation processing method in the embodiment of the present invention seven;
Fig. 7 is the schematic flow sheet of thermal radiation processing method in the embodiment of the present invention eight;
Fig. 8 is the schematic flow sheet of thermal radiation processing method in the embodiment of the present invention nine;
Fig. 9 is the schematic flow sheet of thermal radiation processing method in the embodiment of the present invention ten;
Figure 10 is the schematic flow sheet of thermal radiation processing method in the embodiment of the present invention 11.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Embodiment one
The present embodiment records a kind of housing, is applied to the electronic equipments such as notebook computer, smart mobile phone, panel computer, as shown in Figure 1, and the electronic devices and components 16 of accommodating described electronic equipment in described housing;
Described housing can comprise: enclosure body 11, insulating medium 12 and heat-conducting medium 13; Wherein,
Described insulating medium 12 is arranged on the first area 14 of the first side of described enclosure body 11;
Described heat-conducting medium 13 is arranged at the second area 15 of the first side of described enclosure body, and described insulating medium 12 contacts with described heat-conducting medium 13, and described second area 15 is greater than described first area 14;
With, described insulating medium 12 is made to shield the thermal radiation (thermal radiation as shown in phantom in Figure 1) of described electronic devices and components 16, the region contacted with described insulating medium 12 in described heat-conducting medium 13, also be near thermal radiation described in the areas accept of described electronic devices and components 16 in described heat-conducting medium 13, and conduct described thermal radiation by described heat-conducting medium 13.
In the present embodiment, described insulating medium 12 can adopt the medium that the conductive coefficient such as silicon dioxide, calcium oxide is low; Described heat-conducting medium 13 can adopt the medium that the conductive coefficients such as Graphene are high; The thickness of described insulating medium 12 and described heat-conducting medium 13 is determined according to the distance between described enclosure body 11 and electronic devices and components 16, usual thickness is less than 1 millimeter, certainly, when enclosure body 11 and the distance of electronic devices and components 16 are larger, thickness also can be greater than 1 millimeter; According to the difference of material, the mode that insulating medium 12 and heat-conducting medium 13 can fit or spray is arranged at the region of enclosure body 11 correspondence.
In the present embodiment, by the thermal radiation of electronic devices and components in insulating medium shielded electronic equipment, thermal radiation can be impelled to conduct at the heat-conducting medium that area is larger, thus thermal radiation can be conducted to the far-end away from electronic devices and components in heat-conducting medium, improve radiating effect.
Embodiment two
The present embodiment records a kind of housing, is applied to the electronic equipments such as notebook computer, smart mobile phone, panel computer, as shown in Figure 2, and the electronic devices and components 26 of accommodating described electronic equipment and the first electronic devices and components 27 in described housing;
Described housing can comprise: enclosure body 21, insulating medium 22 and heat-conducting medium 23; Wherein,
Described insulating medium 22 is arranged on the first area 24 of the first side of described enclosure body 21;
Described heat-conducting medium 23 is arranged at the second area 25 of the first side of described enclosure body 21, and described insulating medium 22 contacts with described heat-conducting medium 23, and described second area 25 is greater than described first area 24;
With, described insulating medium 22 is made to shield the thermal radiation (thermal radiation as shown in phantom in Figure 2) of described electronic devices and components 26 and the first electronic devices and components 27, the region contacted with described insulating medium 22 in described heat-conducting medium 23, also namely in described heat-conducting medium 23 near thermal radiation described in the areas accept of described electronic devices and components 26 and the first electronic devices and components 27, and conduct described thermal radiation by described heat-conducting medium 23.
As shown in Figure 2, described first area 24 is corresponding with the position of the first electronic devices and components 27, and, when the remaining space inside of electronic equipment is larger, in electronic equipment as larger in some thickness, distance D between described insulating medium 22 and described first electronic devices and components 27 also can exceed first threshold, and to make the thermal radiation of described insulating medium 23 to described first electronic devices and components 27 have better shield effectiveness, described first threshold is determined according to the thickness of different electronic equipments;
Wherein, described first electronic devices and components 27 are the electronic devices and components that in described electronic devices and components 26, unit interval thermal radiation value exceedes Second Threshold, and described Second Threshold is determined according to the mean unit time thermal radiation value of electronic devices and components 26; In practical application, CPU, Graphics Processing Unit (GPU, Graphic Processing Unit) the unit thermal radiation value of electronic equipment are higher, and therefore, the first electronic devices and components 27 can be one or two in CPU and GPU; Certainly, the first electronic devices and components 27 also can be other electronic devices and components in electronic equipment.
In the present embodiment, described insulating medium 22 can adopt the medium that the conductive coefficient such as silicon dioxide, calcium oxide is low; Described heat-conducting medium 23 can adopt the medium that the conductive coefficients such as Graphene are high; The thickness of described insulating medium 22 and described heat-conducting medium 23 is determined according to the distance between described enclosure body 21 and electronic devices and components 26, usual thickness is less than 1 millimeter, certainly, when enclosure body 21 and the distance of electronic devices and components 26 are larger, thickness also can be greater than 1 millimeter; According to the difference of material, the mode that insulating medium 22 and heat-conducting medium 23 can fit or spray is arranged at the region of enclosure body 21 correspondence.
Also it should be noted that, the area of first area 24 is greater than the area in the 3rd region 28, the region that described 3rd region 28 covers for described first electronic devices and components 27, and region upright projection corresponding to of described 3rd region 27 in the first side of described enclosure body 21 is the subregion of described first area 24; Like this, the first electronic devices and components 27 can be made just to insulating medium 22, thus improve insulating medium 22 to the thermal-radiating shield effectiveness of the first electronic devices and components 27.
In the present embodiment, the electronic devices and components that insulating medium is just large to unit interval thermal radiation value in electronic equipment, thermal radiation can be impelled to conduct at the heat-conducting medium that area is larger, thus thermal radiation can be conducted to the far-end away from electronic devices and components in heat-conducting medium, improve radiating effect.
Embodiment three
The present embodiment records a kind of housing, is applied to the electronic equipments such as notebook computer, smart mobile phone, panel computer, as shown in Figure 3, and the electronic devices and components 36 of accommodating described electronic equipment in described housing;
Described housing can comprise: enclosure body 31, insulating medium 32 and heat-conducting medium 33; Wherein,
Described insulating medium 32 is arranged on the first area 34 of the first side of described enclosure body 31;
Described heat-conducting medium 33 is arranged at the second area 35 of the first side of described enclosure body 31, and described insulating medium 32 contacts with described heat-conducting medium 33;
With, described insulating medium 32 is made to shield the thermal radiation of described electronic devices and components 36, the region contacted with described insulating medium 32 in described heat-conducting medium 33, also be near thermal radiation (thermal radiation as shown in phantom in Figure 3) described in the areas accept of described electronic devices and components 36 in described heat-conducting medium 33, and conduct described thermal radiation by described heat-conducting medium 33.
Between described insulating medium 32 and the first area 34 of described enclosure body 31 and between the second area 35 of described heat-conducting medium 33 and described enclosure body 31, be also provided with stiffness films medium 37;
Wherein,
Described stiffness films medium 37 is fitted with the first side of described insulating medium 32, described enclosure body 31 respectively in described first area 34;
Described stiffness films medium 37 is fitted with the first side of described heat-conducting medium 33, described enclosure body 31 respectively at described second area 35.
Insulating medium 32 and heat-conducting medium 33 can be fitted with stiffness films medium 37 respectively in advance, thus improve the efficiency that insulating medium 32 and heat-conducting medium 33 are set in enclosure body 31, reduce enforcement difficulty, in practical application, the film with rigidity that stiffness films medium 37 can adopt PETG (PET, PolyEthylene Terephthalate) material to make; Certainly, stiffness films medium 37 also can adopt other materials to make, as long as have rigidity, unpliant film.
In the present embodiment, described insulating medium 32 can adopt the medium that the conductive coefficient such as silicon dioxide, calcium oxide is low; Described heat-conducting medium 33 can adopt the medium that the conductive coefficients such as Graphene are high; The thickness of described insulating medium 32 and described heat-conducting medium 33 is determined according to the distance between described enclosure body 31 and electronic devices and components 36, usual thickness is less than 1 millimeter, certainly, when enclosure body 31 and the distance of electronic devices and components 36 are larger, thickness also can be greater than 1 millimeter.
In the present embodiment, by the mode of stiffness films medium, insulating medium and heat-conducting medium are set, improve the efficiency that insulating medium and heat-conducting medium are set, and, by the thermal radiation of electronic devices and components in insulating medium shielded electronic equipment, thermal radiation can be impelled to conduct at the heat-conducting medium that area is larger, thus thermal radiation can be conducted to the far-end away from electronic devices and components in heat-conducting medium, improve radiating effect.
Embodiment four
The present embodiment records a kind of housing, is applied to the electronic equipments such as notebook computer, smart mobile phone, panel computer, as shown in Figure 4, and the electronic devices and components 46 of accommodating described electronic equipment and the first electronic devices and components 47 in described housing;
Described housing can comprise: enclosure body 41, insulating medium 42 and heat-conducting medium 43; Wherein,
Described heat-conducting medium 43 is arranged at first area 44 and the second area 45 of the first side of described enclosure body 41, and described second area 45 is greater than described first area 44;
Described insulating medium 42 is arranged on described heat-conducting medium 45 in described first area 44, that is, between the first area 44, described insulating medium 42 of the first side of described enclosure body 41, is also provided with heat-conducting medium 43.
With, described insulating medium 42 is made to shield the thermal radiation of described electronic devices and components 46, first electronic devices and components 47, the region contacted with described insulating medium 42 in described heat-conducting medium 43, namely also contact with described insulating medium 42 in described heat-conducting medium 43 and thermal radiation (thermal radiation as shown in phantom in Figure 4) described in the areas accept do not covered by described insulating medium 42, and conduct described thermal radiation by described heat-conducting medium 43.
As shown in Figure 4, described first area 44 is corresponding with the position of the first electronic devices and components 47, and, when the remaining space inside of electronic equipment is larger, in electronic equipment as larger in some thickness, distance D between described insulating medium 42 and described first electronic devices and components 47 also can exceed first threshold, and to make the thermal radiation of described insulating medium 43 to described first electronic devices and components 47 have better shield effectiveness, described first threshold is determined according to the thickness of different electronic equipments;
Wherein, described first electronic devices and components 47 are the electronic devices and components that in described electronic devices and components 46, unit interval thermal radiation value exceedes Second Threshold, and described Second Threshold is determined according to the mean unit time thermal radiation value of electronic devices and components 46; In practical application, CPU, GPU unit thermal radiation value of electronic equipment is higher, and therefore, the first electronic devices and components 47 can be one or two in CPU and GPU; Certainly, the first electronic devices and components 47 also can be other electronic devices and components in electronic equipment.
In the present embodiment, described insulating medium 42 can adopt the medium that the conductive coefficient such as silicon dioxide, calcium oxide is low; Described heat-conducting medium 43 can adopt the medium that the conductive coefficients such as Graphene are high; The thickness of described insulating medium 42 and described heat-conducting medium 43 is determined according to the distance between described enclosure body 41 and electronic devices and components 46, usual thickness is less than 1 millimeter, certainly, when enclosure body 41 and the distance of electronic devices and components 46 are larger, thickness also can be greater than 1 millimeter; According to the difference of material, the mode that insulating medium 42 and heat-conducting medium 43 can fit or spray is arranged at the region of enclosure body 11 correspondence.
Also it should be noted that, the area of first area 42 is greater than the area in the 3rd region 48, the region that described 3rd region 48 covers for described first electronic devices and components 47, and region upright projection corresponding to of described 3rd region 48 in the first side of described enclosure body 41 is the subregion of described first area 42; Like this, the first electronic devices and components 47 can be made just to insulating medium 42, thus improve insulating medium 42 to the thermal-radiating shield effectiveness of the first electronic devices and components 47.
In the present embodiment, the electronic devices and components that insulating medium is just large to unit interval thermal radiation value in electronic equipment, thermal radiation can be impelled to conduct at the heat-conducting medium that area is larger, thus by the far-end away from electronic devices and components in thermal radiation conducting second region, radiating effect can be improve.
Embodiment five
The present embodiment records a kind of housing, is applied to the electronic equipments such as notebook computer, smart mobile phone, panel computer, as shown in Figure 5, and the electronic devices and components 56 of accommodating described electronic equipment in described housing;
Described housing can comprise: enclosure body 51, insulating medium 52 and heat-conducting medium 53; Wherein,
Described heat-conducting medium 53 is arranged at first area 54 and the second area 55 of the first side of described enclosure body 51,
Described insulating medium 52 is arranged on described heat-conducting medium 55 in described first area 54, that is, between the first area 54, described insulating medium 52 of the first side of described enclosure body 51, is also provided with heat-conducting medium 53.
With, described insulating medium 52 is made to shield the thermal radiation of described electronic devices and components 56, contact with described insulating medium 52 in described heat-conducting medium 53 and thermal radiation (thermal radiation as shown in phantom in Figure 5) described in the areas accept do not covered by described insulating medium 52, and conduct described thermal radiation by described heat-conducting medium 53.
Between described insulating medium 52 and the first area 54 of described enclosure body 51 and between the second area 55 of described heat-conducting medium 53 and described enclosure body 51, be also provided with stiffness films medium 57; Wherein,
Described stiffness films medium 57 is fitted with the first side of described insulating medium 52, described enclosure body 51 respectively in described first area 54;
Described stiffness films medium 57 is fitted with the first side of described heat-conducting medium 53, described enclosure body 51 respectively at described second area 55.
Insulating medium 52 and heat-conducting medium 53 can be fitted with stiffness films medium 57 respectively in advance, thus improve the efficiency that insulating medium 52 and heat-conducting medium 53 are set in enclosure body 51, reduce enforcement difficulty, in practical application, the film with rigidity that stiffness films medium 57 can adopt PET material to make; Certainly, stiffness films medium 57 also can adopt other materials to make, as long as have rigidity, unpliant film.
In the present embodiment, described insulating medium 52 can adopt the medium that the conductive coefficient such as silicon dioxide, calcium oxide is low; Described heat-conducting medium 53 can adopt the medium that the conductive coefficients such as Graphene are high; The thickness of described insulating medium 52 and described heat-conducting medium 53 is determined according to the distance between described enclosure body 51 and electronic devices and components 56, usual thickness is less than 1 millimeter, certainly, when enclosure body 51 and the distance of electronic devices and components 56 are larger, thickness also can be greater than 1 millimeter.
In the present embodiment, by the mode of stiffness films medium, insulating medium and heat-conducting medium are set, improve the efficiency that insulating medium and heat-conducting medium are set, and, by the thermal radiation of electronic devices and components in insulating medium shielded electronic equipment, thermal radiation can be impelled to conduct at the heat-conducting medium that area is larger, thus by the far-end away from electronic devices and components in thermal radiation conducting second region, radiating effect can be improve.
Embodiment six
The present embodiment records a kind of electronic equipment, and described electronic equipment comprises the housing described in embodiment one to embodiment five any embodiment.
Here it is to be noted: the description in following methods embodiment, is similar with the description of above-mentioned housing embodiments, and the beneficial effect with housing embodiments describes, and does not repeat.For the ins and outs do not disclosed in the inventive method embodiment, please refer to the description of inventive shell embodiment.
Embodiment seven
The present embodiment records a kind of thermal radiation processing method, is applied to and comprises in the electronic equipment of housing, the electronic devices and components 16 of accommodating described electronic equipment in described housing; As shown in Figure 1, described housing comprises: enclosure body 11, insulating medium 12 and heat-conducting medium 13; The schematic diagram of the housing shown in composition graphs 1, as shown in Figure 6, the thermal radiation processing method that the present embodiment is recorded comprises the following steps:
Step 601, arranges described insulating medium 12 in the first area 14 of the first side of described enclosure body 11.
Step 602, arranges described heat-conducting medium 13 at the second area 15 of the first side of described enclosure body 11.
Described insulating medium 12 contacts with described heat-conducting medium 13, and described second area 15 is greater than described first area 14.
With, described insulating medium 12 is made to shield the thermal radiation of described electronic devices and components 16, the region contacted with described insulating medium 12 in described heat-conducting medium 13, also namely near electronic devices and components 16 areas accept described in thermal radiation, and conduct described thermal radiation by described heat-conducting medium 13.
The execution sequence of step 601 and step 602 can be exchanged.
Embodiment eight
The present embodiment records a kind of thermal radiation processing method, is applied to and comprises in the electronic equipment of housing, the electronic devices and components 26 of accommodating described electronic equipment and the first electronic devices and components 27 in described housing; As shown in Figure 2, described housing comprises: enclosure body 21, insulating medium 22 and heat-conducting medium 23; The schematic diagram of the housing shown in composition graphs 2, as shown in Figure 7, the thermal radiation processing method that the present embodiment is recorded comprises the following steps:
Step 701, arranges described insulating medium 22 in the first area 24 of the first side of described enclosure body 21, and described first area 24 is corresponding with the position of the first electronic devices and components 27.
Distance D between described insulating medium 22 and described first electronic devices and components 27 exceedes first threshold, has good shield effectiveness to make the thermal radiation of described insulating medium 22 to described first electronic devices and components 26; Wherein,
Described first electronic devices and components 27 are the electronic devices and components that in described electronic devices and components 26, unit interval thermal radiation value exceedes Second Threshold.
The area of described first area 24 is greater than the area in the 3rd region 28, the region that described 3rd region 28 covers for described first electronic devices and components 27, and region upright projection corresponding to of described 3rd region 28 in the first side of described enclosure body 21 is the subregion of described first area 24.
Step 702, arranges described heat-conducting medium 23 at the second area 25 of the first side of described enclosure body 21, and described insulating medium 22 contacts with described heat-conducting medium 23, and described second area 25 is greater than described first area 24.
With, described insulating medium 22 is made to shield the thermal radiation of described electronic devices and components 26 first electronic devices and components 27, contact with described insulating medium 22 in described heat-conducting medium 23 and thermal radiation described in the areas accept that covers of insulated medium 22, and conduct described thermal radiation by described heat-conducting medium 23.
The execution sequence of step 701 and step 702 can be exchanged.
Embodiment nine
The present embodiment records a kind of thermal radiation processing method, is applied to and comprises in the electronic equipment of housing, the electronic devices and components 36 of accommodating described electronic equipment in described housing; As shown in Figure 3, described housing comprises: enclosure body 31, insulating medium 32 and heat-conducting medium 33; The schematic diagram of the housing shown in composition graphs 3, as shown in Figure 8, the thermal radiation processing method that the present embodiment is recorded comprises the following steps:
Step 801, arranges stiffness films medium 37 in the first area 34 of described enclosure body 31 and second area 35.
Step 802, arranges described insulating medium 32 in the first area 34 of the first side of described enclosure body 31.
Step 803, arranges described heat-conducting medium 33 at the second area 35 of the first side of described enclosure body 31.
Described insulating medium 32 contacts with described heat-conducting medium 33, and described second area 35 is greater than described first area 34.
The execution sequence of step 802 and step 803 can be exchanged.
In practical application, also position that can be first corresponding with first area 34 on stiffness films medium 37 arranges insulating medium 32, position corresponding with second area 35 on stiffness films medium 37 arranges heat-conducting medium 33, then stiffness films medium 37 is arranged at first area 34 and the second area 35 of enclosure body 31 first side.
Described stiffness films medium 37 is fitted with the first side of described insulating medium 32, described enclosure body 31 respectively in described first area 34; Described stiffness films medium 37 is fitted with the first side of described heat-conducting medium 33, described enclosure body 31 respectively at described second area 35.
With, described insulating medium 32 is made to shield the thermal radiation of described electronic devices and components 36, the region contacted with described insulating medium 32 in described heat-conducting medium 33, also namely near electronic devices and components 36 areas accept described in thermal radiation, and conduct described thermal radiation by described heat-conducting medium 33.
Embodiment ten
The present embodiment records a kind of thermal radiation processing method, is applied to and comprises in the electronic equipment of housing, the electronic devices and components 46 of accommodating described electronic equipment and the first electronic devices and components 47 in described housing; As shown in Figure 4, described housing comprises: enclosure body 41, insulating medium 42 and heat-conducting medium 43; The schematic diagram of the housing shown in composition graphs 4, as shown in Figure 9, the thermal radiation processing method that the present embodiment is recorded comprises the following steps:
Step 901, arranges described heat-conducting medium 43 in the first area 44 of the first side of described enclosure body 41 and second area 45.
Step 902, arranges described insulating medium 42 in the first area 44 of the first side of described enclosure body 41.
Described insulating medium 42 contacts with described heat-conducting medium 43, and described second area 45 is greater than described first area 44.
With, described insulating medium 42 is made to shield the thermal radiation of described electronic devices and components 46 and the first electronic devices and components 47, thermal radiation described in the region contacted with described insulating medium 42 in described heat-conducting medium 43 and the areas accept do not covered by described insulating medium 42, and conduct described thermal radiation by described heat-conducting medium 43.
Also it should be noted that, as shown in Figure 4, the area of first area 44 is greater than the area in the 3rd region 48, the region that described 3rd region 48 covers for described first electronic devices and components 47, and region upright projection corresponding to of described 3rd region 48 in the first side of described enclosure body 41 is the subregion of described first area 44; Like this, the first electronic devices and components 47 can be made just to insulating medium 42, thus improve insulating medium 42 to the thermal-radiating shield effectiveness of the first electronic devices and components 47.
Embodiment 11
The present embodiment records a kind of thermal radiation processing method, is applied to and comprises in the electronic equipment of housing, the electronic devices and components 56 of accommodating described electronic equipment in described housing; As shown in Figure 5, described housing comprises: enclosure body 51, insulating medium 52 and heat-conducting medium 53; The schematic diagram of the housing shown in composition graphs 5, as shown in Figure 10, the thermal radiation processing method that the present embodiment is recorded comprises the following steps:
Step 1001, arranges stiffness films medium 57 in the first area 54 of the first side of described enclosure body 51 and second area 55.
Step 1002, region corresponding with first area 54 and second area 55 on described stiffness films medium 57 arranges heat-conducting medium 53.
Step 1003, on described heat-conducting medium 53, the region corresponding with first area 54 arranges described insulating medium 52.
Described insulating medium 52 contacts with described heat-conducting medium 53, and described second area 55 is greater than described first area 54.
With, described insulating medium 52 is made to shield the thermal radiation of described electronic devices and components 56, contact with insulating medium 52 in described heat-conducting medium 53 and thermal radiation described in the areas accept that covers of insulated medium 52, and conduct described thermal radiation by described heat-conducting medium 53.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; change can be expected easily or replace, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of described claim.
Claims (11)
1. a housing, is applied to electronic equipment, it is characterized in that, the electronic devices and components of accommodating described electronic equipment in described housing;
Described housing comprises: enclosure body, insulating medium and heat-conducting medium; Wherein,
Described insulating medium is arranged on the first area of the first side of described enclosure body;
Described heat-conducting medium is arranged at the second area of the first side of described enclosure body, and described second area is greater than described first area, and described insulating medium contacts with described heat-conducting medium;
With,
Make described insulating medium shield the thermal radiation of described electronic devices and components, thermal radiation described in the areas accept contacted with described insulating medium in described heat-conducting medium, and conduct described thermal radiation by described heat-conducting medium.
2. housing according to claim 1, is characterized in that,
Described first area is corresponding with the position of the first electronic devices and components, and the distance between described insulating medium and described first electronic devices and components exceedes first threshold, with the thermal radiation making described insulating medium shield described first electronic devices and components; Wherein,
Described first electronic devices and components are the electronic devices and components that in described electronic devices and components, unit interval thermal radiation value exceedes Second Threshold.
3. housing according to claim 2, is characterized in that, the area of described first area is greater than the area in the 3rd region, the region that described 3rd region covers for described first electronic devices and components, and,
Region upright projection corresponding to of described 3rd region in the first side of described enclosure body is the subregion of described first area.
4. housing according to claim 1, is characterized in that,
Between described insulating medium and the first area of described enclosure body and between the second area of described heat-conducting medium and described enclosure body, be also provided with stiffness films medium; Wherein,
Described stiffness films medium is fitted with the first side of described insulating medium, described enclosure body respectively in described first area;
Described stiffness films medium is fitted with the first side of described heat-conducting medium, described enclosure body respectively at described second area.
5. the housing according to any one of Claims 1-4, is characterized in that,
Also heat-conducting medium is provided with, to make to contact with described insulating medium in described heat-conducting medium and thermal radiation described in the areas accept do not covered by described insulating medium between the first area, described insulating medium of the first side of described enclosure body.
6. an electronic equipment, is characterized in that, described electronic equipment comprises the housing described in any one of claim 1 to 5.
7. a thermal radiation processing method, is applied to and comprises in the electronic equipment of housing, the electronic devices and components of accommodating described electronic equipment in described housing; It is characterized in that, described housing comprises: enclosure body, insulating medium and heat-conducting medium; Described method comprises:
In the first area of the first side of described enclosure body, described insulating medium is set;
Arrange described heat-conducting medium at the second area of the first side of described enclosure body, described insulating medium contacts with described heat-conducting medium, and described second area is greater than described first area;
With,
Make described insulating medium shield the thermal radiation of described electronic devices and components, thermal radiation described in the areas accept contacted with described insulating medium in described heat-conducting medium, and conduct described thermal radiation by described heat-conducting medium.
8. method according to claim 7, is characterized in that, the first area of described the first side in described enclosure body arranges described insulating medium, comprising:
In the first area of the first side of described enclosure body, described insulating medium is set, and described first area is corresponding with the position of the first electronic devices and components, distance between described insulating medium and described first electronic devices and components exceedes first threshold, with the thermal radiation making described insulating medium shield described first electronic devices and components;
Wherein, described first electronic devices and components are the electronic devices and components that in described electronic devices and components, unit interval thermal radiation value exceedes Second Threshold.
9. method according to claim 8, is characterized in that, the area of described first area is greater than the area in the 3rd region, the region that described 3rd region covers for described first electronic devices and components, and,
Region upright projection corresponding to of described 3rd region in the first side of described enclosure body is the subregion of described first area.
10. method according to claim 7, is characterized in that, described method also comprises:
Between described insulating medium and the first area of described enclosure body and between the second area of described heat-conducting medium and described enclosure body, stiffness films medium is set; Wherein,
Described stiffness films medium is fitted with the first side of described insulating medium, described enclosure body respectively in described first area;
Described stiffness films medium is fitted with the first side of described heat-conducting medium, described enclosure body respectively at described second area.
11. methods according to any one of claim 7 to 10, it is characterized in that, the first area of described the first side in described enclosure body arranges described insulating medium, arranges described heat-conducting medium, comprising at the second area of the first side of described enclosure body:
In the first area of the first side of described enclosure body and second area, described heat-conducting medium is set, and on the heat-conducting medium arranged in described first area, described insulating medium is set, to make to contact with described insulating medium in described heat-conducting medium and thermal radiation described in the areas accept do not covered by described insulating medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410086537.4A CN104918425A (en) | 2014-03-10 | 2014-03-10 | Housing, electronic device and heat radiation processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410086537.4A CN104918425A (en) | 2014-03-10 | 2014-03-10 | Housing, electronic device and heat radiation processing method |
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| Publication Number | Publication Date |
|---|---|
| CN104918425A true CN104918425A (en) | 2015-09-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410086537.4A Pending CN104918425A (en) | 2014-03-10 | 2014-03-10 | Housing, electronic device and heat radiation processing method |
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| CN202306430U (en) * | 2011-10-12 | 2012-07-04 | 联想(北京)有限公司 | Computer radiating device and computer |
| CN203369024U (en) * | 2013-06-27 | 2013-12-25 | 吴哲元 | Multiple-heat-radiation-assembly structure |
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| US6644395B1 (en) * | 1999-11-17 | 2003-11-11 | Parker-Hannifin Corporation | Thermal interface material having a zone-coated release linear |
| TW200535394A (en) * | 2004-04-30 | 2005-11-01 | Hewlett Packard Development Co | Heat spreader with controlled z-axis conductivity |
| CN101271209A (en) * | 2006-10-27 | 2008-09-24 | 三星电子株式会社 | Backlight unit and liquid crystal display device including the same |
| CN202306430U (en) * | 2011-10-12 | 2012-07-04 | 联想(北京)有限公司 | Computer radiating device and computer |
| CN203369024U (en) * | 2013-06-27 | 2013-12-25 | 吴哲元 | Multiple-heat-radiation-assembly structure |
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Application publication date: 20150916 |