TWI603668B - Electronic assembly and electronic device - Google Patents

Description

Electronic assembly and electronic device

The present invention relates to an electronic assembly and an electronic device, and more particularly to an electronic assembly and an electronic device having a heat dissipation function.

Due to the versatility and thin design, electronic devices such as smart phones and tablets are very popular. This type of electronic device is usually equipped with a component such as a central processing unit that generates heat, so it is necessary to reduce the temperature of these heating elements by means of heat dissipation to ensure that these heating elements can operate normally.

FIG. 1 illustrates a conventional electronic assembly. Referring to FIG. 1, the electronic assembly 10 constitutes a plurality of electronic components inside the smart phone, and includes a circuit board 11, a central processing unit 12 (ie, a heat generating component), a shield cover 13, and a heat pipe 14. The central processing unit 12 and the shield cover 13 are both mounted on the circuit board 11. The shield cover 13 encloses the central processing unit 12, and the top of the shield cover 13 is thermally coupled to the top of the central processing unit 12 via a thermal pad 15. The heat pipe 14 is also thermally coupled to the top of the shield cover 13 such that the thermal energy of the central processing unit 12 is conducted to the heat pipe 14 via the heat dissipation pad 15 and the shield cover 13 for conduction to other places via the heat pipe 14 for heat dissipation.

Referring to FIG. 1 again, since the electronic assembly 10 adopts a structure in which components are stacked, the overall thickness of the electronic assembly 10 is also continuously reduced in the case where the appearance of the smart phone is continuously thinned, so that the thickness of the heat pipe 14 is strictly limited. In some designs, the thickness of the heat pipe 14 must even be less than 0.5 mm, thereby reducing the effectiveness of the heat pipe 14. Similarly, since the electronic assembly 10 adopts a structure in which components are stacked, the thermal resistance of the central processing unit 12 occurs between the central processing unit 12 and the heat dissipation pad 15, between the heat dissipation pad 15 and the shield cover 13, and the shield cover 13 and the heat pipe 14 Between these, the thermal resistance causes a certain degree of attenuation (for example, a temperature difference of 20 degrees Celsius), thus causing a reduction in heat dissipation performance.

The invention relates to an electronic assembly for improving the heat dissipation effect of a heat pipe on a heat generating component.

The invention relates to an electronic device for improving the heat dissipation effect of a heat pipe on a heat generating component.

The invention provides an electronic assembly comprising a circuit board, a heating element and a heat pipe. The heating element has a bottom surface and a side surface connected to the bottom surface. The heat generating component is mounted to the circuit board with the bottom surface. The heat pipe is thermally coupled to the side of the heat generating component to absorb heat from the heat generating component.

The invention provides an electronic device comprising a housing, a display and an electronic assembly. The display is mounted on the housing. The electronics assembly is disposed within the housing. The electronic assembly includes a circuit board, a heating element, and a heat pipe. Heating element has a bottom The face is connected to one side of the bottom surface. The heat generating component is mounted to the circuit board with the bottom surface. The heat pipe is thermally coupled to the side of the heat generating component to absorb heat from the heat generating component.

Based on the above, the thickness of the heat pipe is strictly limited compared to the conventional component stacking method. In the present invention, the heat generating component is mounted on the circuit board and thermally coupled to the heat pipe with its side surface, thereby relaxing the thickness limit of the heat pipe, so that the heat pipe is Performance is improved.

The above described features and advantages of the invention will be apparent from the following description.

10‧‧‧Electronic assembly

11‧‧‧ boards

12‧‧‧Central Processing Unit

13‧‧‧Shield cover

14‧‧‧heat pipe

15‧‧‧ Thermal pad

50‧‧‧Electronic devices

52‧‧‧ housing

54‧‧‧ display

100‧‧‧Electronic assembly

110‧‧‧Circuit board

120‧‧‧heating components

120a‧‧‧ bottom

120b‧‧‧ side

120c‧‧‧ top surface

122‧‧‧Logic chip module

124‧‧‧ memory module

130‧‧‧heat pipe

140‧‧‧Shield cover

151‧‧‧First thermal conduction layer

152‧‧‧second thermal layer

153‧‧‧ Third heat conducting layer

154‧‧‧4th heat conduction layer

1 is a partial cross-sectional view of a conventional electronic device.

2 is a partial cross-sectional view of an electronic assembly in accordance with an embodiment of the present invention.

3 is a top plan view of some of the components of the electronic assembly of FIG. 2.

4 is a top plan view of an electronic assembly in accordance with another embodiment of the present invention.

Figure 5 is a plan view of an electronic assembly in accordance with another embodiment of the present invention.

Figure 6 is a plan view of an electronic assembly in accordance with another embodiment of the present invention.

Figure 7 is a partial cross-sectional view showing an electronic assembly in accordance with an embodiment of the present invention.

Figure 8 is a cross-sectional view showing an electronic device according to another embodiment of the present invention.

2 is a partial cross-sectional view of an electronic assembly in accordance with an embodiment of the present invention. Referring to FIG. 2, in the embodiment, the electronic assembly 100 can be applied to an electronic device, in particular It is a thin electronic device such as a smart phone or a tablet. The electronic assembly 100 includes a circuit board 110, a heating element 120, and a heat pipe 130. The circuit board 110 may be a motherboard or a module board or the like. The heating element 120 is an element that emits heat to increase its temperature and needs to be cooled during operation, such as a central processing unit (CPU), a graphics processing unit (GPU), a charging device, and a power supply filter choke. (power chock), amplifier circuit group (RFPA), etc., and the present invention is not limited thereto. The heating element 120 has a bottom surface 120a and a side surface 120b connected to the bottom surface 120a. The heating element 120 is mounted to the circuit board 110 with a bottom surface 120a. The heat pipe 130 is thermally coupled to the side 120b of the heat generating component 120 to absorb heat from the heat generating component 120. The heat pipe 130 utilizes a phase change process in which the internal medium evaporates at its evaporation end and condenses at the condensation end to rapidly conduct heat. Compared to the conventional electronic assembly (for example, the electronic assembly in FIG. 1), a structure in which components are stacked on a circuit board is employed. In the present embodiment, the electronic assembly 100 employs a structure in which components are arranged side by side on the circuit board 110. The heat pipe 130 can be thermally coupled to the side surface 120b of the heat generating component 120, thereby relaxing the thickness limit of the heat pipe 130, so that the performance of the heat pipe 130 is improved.

In this embodiment, the electronic assembly 100 further includes a first heat conductive layer 151. The first heat conduction layer 151 is disposed between the side surface 120 b of the heat generating component 120 and the heat pipe 130 such that the heat generating component 120 can be thermally coupled to the heat pipe 130 via the first heat conductive layer 151 to conduct heat of the heat generating component 120 to the heat pipe 130 . The first heat conduction layer 151 may be a heat dissipation pad, a phase change material (PCM) layer or other material layer having high thermal conductivity. In addition, the electronic assembly 100 further includes a second heat conductive layer 152. The second heat conduction layer 152 can be disposed between the circuit board 110 and the heat pipe 130. The circuit board 110 can be thermally coupled to the heat pipe 130 via the second heat conductive layer 152 to conduct heat of the circuit board 110 to the heat pipe 130. The second thermally conductive layer 152 can be a thermal pad, a phase change material (PCM) layer, or other layer of material having high thermal conductivity.

In order to prevent electromagnetic interference (EMI) from affecting a specific type of heating element 120, in the embodiment, the electronic assembly 100 may further include a shielding cover 140. The shield cover 140 is mounted to the circuit board 110 and surrounds the heat generating component 120 with the heat pipe 130. The shield cover 140 is typically made of metal and thus has good thermal conductivity. Therefore, the heat generating component 120 can also be thermally coupled to the shield cover 140 such that the shield cover 140 can also provide auxiliary heat dissipation. The heat generating component 120 has a top surface 120c connected to its side surface 120b, and the heat generating component 120 can be thermally coupled to the shield cover 140 by its top surface 120c. Compared to the conventional electronic assembly (for example, the electronic assembly in FIG. 1), a structure in which components are stacked on a circuit board is employed. In the present embodiment, the electronic assembly 100 employs a structure in which components are arranged side by side on the circuit board 110. The heat generating component 120 can be thermally coupled to the heat pipe 130 without passing through the shield cover 140, thereby reducing the thermal resistance between the heat generating component 120 and the heat pipe 130, so that the performance of the heat pipe 130 is improved.

In this embodiment, the electronic assembly 100 further includes a third heat conductive layer 153. The third heat conduction layer 153 is disposed between the heat generating component 120 and the shield cover 140 such that the heat generating component 120 can be thermally coupled to the shield cover 140 via the third heat conductive layer 153 to conduct heat of the heat generating component 120 to the shield cover 140. The third thermally conductive layer 153 can be a thermal pad, a phase change material (PCM) layer, or other layer of material having high thermal conductivity. Further, the heat pipe 130 may be thermally coupled to the shield cover 140 such that heat of the heat generating component 120 may be conducted to the heat pipe 130 via the shield cover 140. In this embodiment, the electronic assembly 100 is more packaged. A fourth heat conducting layer 154 is included. The fourth heat conduction layer 154 is disposed between the heat pipe 130 and the shielding cover 140 such that the shielding cover 140 can be thermally coupled to the heat pipe 130 via the fourth heat conduction layer 154 to conduct heat of the shielding cover 140 to the heat pipe 130. The fourth thermally conductive layer 154 can be a thermal pad, a phase change material (PCM) layer, or other layer of material having high thermal conductivity.

3 is a top plan view of some of the components of the electronic assembly of FIG. 2. Referring to FIG. 3, in the present embodiment, the heat generating component 120 is mounted to the circuit board 110, and the heat pipe 130 is thermally coupled to one side of the heat generating component 120. 4 is a top plan view of an electronic assembly in accordance with another embodiment of the present invention. Referring to FIG. 4, in another embodiment, the heat pipe 130 can be thermally coupled to two adjacent sides of the heat generating component 120. Figure 5 is a plan view of an electronic assembly in accordance with another embodiment of the present invention. Referring to FIG. 5, in another embodiment, the heat pipe 130 can be thermally coupled to three adjacent sides of the heat generating component 120. Figure 6 is a plan view of an electronic assembly in accordance with another embodiment of the present invention. Referring to FIG. 6 , in another embodiment, the heat pipe 130 may be thermally coupled to four adjacent sides of the heat generating component 120 such that the heat pipe 130 surrounds the entire heat generating component 120 .

Figure 7 is a partial cross-sectional view showing an electronic assembly in accordance with an embodiment of the present invention. Referring to FIG. 7, in the embodiment, the heating element 120 can include a logic chip module 122 and a memory module 124 to form a chipset. The logic chip module 122 is mounted to the circuit board 110, and the memory module 124 is stacked to the logic chip module 122 such that the logic chip module 122 is located between the circuit board 110 and the memory module 124. The logic chip module 122 is, for example, a central processing unit chip package, and the memory module 124 is, for example, a multi-memory chip package, and thus constitutes a package stack structure of a PoP (Package on Package) type. Logic compared to memory module 124 Wafer module 122 is the primary source of heat generation. The heat of the logic chip module 122 can be directly transmitted to the heat pipe 130 disposed on the side of the logic chip module 122 without being transmitted to the heat pipe 130 via the memory module 124 and the shield cover 140, thereby achieving good heat dissipation. .

Figure 8 is a cross-sectional view showing an electronic device according to another embodiment of the present invention. Referring to FIG. 8 , in the embodiment, the electronic device 50 can be a thin electronic device, such as a smart phone or a tablet computer. The electronic device 50 includes a housing 52, a display 54 and an electronic assembly 100 that is the same or similar to the embodiment of FIG. Display 54 is mounted to housing 52 and electronic assembly 100 is disposed within housing 52. In this embodiment, the display 54 can be a touch display. The electronic assembly 100 may be the same or similar to the embodiment of FIG. 1, and may be the electronic assembly 100 of the other embodiments described above. Therefore, for a detailed description of the electronic assembly 100, reference may be made to the specific description of the above embodiments.

In summary, the thickness of the heat pipe is strictly limited compared to the conventional component stacking method. In the present invention, the heat generating component is mounted on the circuit board and thermally coupled to the heat pipe with its side surface, thereby relaxing the thickness limit of the heat pipe. The efficiency of the heat pipe is improved.

Compared with the conventional component stacking method, the thermal resistance between the heat generating component and the heat pipe is increased. In the present invention, the heat pipe is thermally coupled to the side of the heat generating component, so that the heat generating component can be thermally coupled to the heat pipe without passing through the shield cover. The thermal resistance between the heating element and the heat pipe is reduced, so that the efficiency of the heat pipe is improved.

In the present invention, when the heating element includes the logic chip module and the memory module stacked in sequence, the heat of the logic chip module located under the memory module can be directly transmitted to the setting side of the logic chip module. Heat pipe without memory The module and the shield cover are then conducted to the heat pipe, thereby achieving good heat dissipation.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧Electronic assembly

110‧‧‧Circuit board

120‧‧‧heating components

120a‧‧‧ bottom

120b‧‧‧ side

120c‧‧‧ top surface

130‧‧‧heat pipe

140‧‧‧Shield cover

151‧‧‧First thermal conduction layer

152‧‧‧second thermal layer

153‧‧‧ Third heat conducting layer

154‧‧‧4th heat conduction layer

Claims (10)

An electronic assembly comprising: a circuit board; a heat generating component having a bottom surface and a side surface connected to the bottom surface, wherein the heat generating component is mounted to the circuit board by the bottom surface; and a heat pipe thermally coupled to the heat generating component The side of the component absorbs heat from the heat generating component. The electronic assembly of claim 1, further comprising: a first heat conducting layer disposed between the side of the heat generating component and the heat pipe. The electronic assembly of claim 1, further comprising: a second heat conducting layer disposed between the circuit board and the heat pipe. The electronic assembly of claim 1, further comprising: a shielding cover mounted to the circuit board and surrounding the heating element with the heat pipe. The electronic assembly of claim 4, wherein the heat generating component is thermally coupled to the shield cover. The electronic assembly of claim 4, further comprising: a third heat conducting layer disposed between the heat generating component and the shielding cover. The electronic assembly of claim 4, wherein the heat pipe is thermally coupled to the shield cover. The electronic assembly of claim 7, further comprising: a fourth heat conducting layer disposed between the heat pipe and the shielding cover. The electronic assembly of claim 1, wherein the heating element It includes a central processing unit, a graphics processing unit, a charging device component, a power supply filter choke or an amplifier circuit group. The electronic assembly of claim 1, wherein the heating element comprises a logic chip module and a memory module, the logic chip module is mounted to the circuit board, and the memory module is stacked to The logic chip module is disposed between the circuit board and the memory module.