CN219328924U

CN219328924U - QSFP module with air-cooling heat dissipation function

Info

Publication number: CN219328924U
Application number: CN202320744931.7U
Authority: CN
Inventors: 邓增; 李宝峰; 孙言强; 张顺路; 马柯帆; 贾春波; 宋飞; 姚信安; 黎铁军
Original assignee: National University of Defense Technology
Current assignee: National University of Defense Technology
Priority date: 2023-04-06
Filing date: 2023-04-06
Publication date: 2023-07-11
Anticipated expiration: 2033-04-06

Abstract

The utility model discloses a QSFP module with an air cooling and heat dissipation function, which comprises a light port cage with an upper interface slot and a lower interface slot, wherein an air supply component is arranged between the upper interface slot and the lower interface slot of the light port cage, an air outlet is arranged on the side wall or the tail part of the light port cage, and the air supply component is used for sending external cooling air into the light port cage to cool QSFP interfaces arranged in the upper interface slot and the lower interface slot and then discharging the cooled QSFP interfaces from the air outlet, so that the convection heat dissipation of the QSFP interface module with improved power density and assembly density can be improved, the reliable thermal characteristics of the QSFP interface module can be ensured, and the QSFP module has the advantages of strong pertinence, strong heat dissipation capacity and high practicality.

Description

QSFP module with air-cooling heat dissipation function

Technical Field

The utility model relates to an optical fiber communication technology, in particular to a QSFP module with an air cooling and heat dissipation function.

Background

The QSFP (Quad Small Form-factor Pluggable) interface is a high-density and high-speed Pluggable data transmission device commonly used by a data center, and has important value in the aspects of high-performance calculation, switches, routers and storage. With the continuous increase of the transmission rate, the power consumption of the interface is continuously increased, especially after the assembly density of the module is increased, for example, after 4 QSFP interfaces are formed into an integral module, the heat of part of internal interfaces is more difficult to dissipate, so that the internal temperature of the module is rapidly increased, the fault rate of the inserted optical fiber is increased, and the module cannot be used even when the fault rate is serious. Related researches and patent documents exist on a heat dissipation scheme of a QSFP interface module, for example, chinese patent document with publication number CN 207665410U discloses a novel heat dissipation structure of a QSFP module, and describes that a heat dissipation effect is improved by enhancing a heat conduction capability and expanding a heat dissipation area. In addition, chinese patent publication No. CN 113906837a discloses an apparatus for transferring heat between a first module and a second module, which achieves the purpose of enhancing heat dissipation by designing an intermediate structure that enhances heat conductive performance. Both schemes strengthen the heat dissipation effect by enhancing the heat conduction. However, when multiple QSFP interfaces are stacked together, these solutions are difficult to effectively solve the heat dissipation problem of the bottom QSFP interface, resulting in excessive interface temperatures that affect its performance and lifetime. In addition, when the interface device is arranged at the tail end of the heat dissipation air duct, the heat dissipation problem is difficult to solve even if the heat conduction effect is optimized due to the fact that the air temperature is too high.

Disclosure of Invention

The utility model aims to solve the technical problems: aiming at the problems in the prior art, the QSFP module with the air cooling heat dissipation function is provided, the convection heat dissipation of the QSFP interface module with improved power density and assembly density can be improved, the reliable heat characteristic of the QSFP interface module is ensured, and the QSFP module has the advantages of being strong in pertinence, strong in heat dissipation capability and high in implementation property.

In order to solve the technical problems, the utility model adopts the following technical scheme:

the QSFP module with the air cooling and heat dissipation functions comprises an optical port cage with an upper interface slot and a lower interface slot, an air supply component is arranged between the upper interface slot and the lower interface slot of the optical port cage, an air outlet is arranged on the side wall or the tail of the optical port cage, and the air supply component is used for sending external cooling air into the optical port cage to cool QSFP interfaces arranged in the upper interface slot and the lower interface slot and then discharge the cooled QSFP interfaces from the air outlet.

Optionally, the air supply part includes fan and wind collector, the air inlet side at the wind collector is installed to the fan, the air outlet and the inner chamber intercommunication of light mouth cage of wind collector.

Optionally, the air outlet of wind collector still is connected with the guide duct, be equipped with a plurality of air outlets on the lateral wall of guide duct, a plurality of air outlets all communicate with the inner chamber of light mouth cage.

Optionally, the power end of the fan is also connected with a speed regulator for regulating the speed of the fan.

Optionally, at least one of the air collector and the air guide pipe is provided with a semiconductor refrigeration sheet for refrigerating the cooling air.

Optionally, be equipped with the intermediate panel that is used for installing the leaded light post between upper interface slot and the lower floor interface slot of light mouth cage, air supply part installs on intermediate panel.

Optionally, the air supply component is a synthetic jet air supply device.

Optionally, the synthetic jet air blower comprises a housing and at least one air supply cavity arranged in the housing, wherein a piezoelectric film with a through hole is arranged in the air supply cavity, the piezoelectric film divides the air supply cavity into two halves, and one half of the piezoelectric film is provided with a plurality of external communication ports communicated with the inner cavity of the optical port cage.

Optionally, a power supply interface is arranged on the shell, and the power supply interface is connected with the electrode of the piezoelectric film.

Optionally, the power supply interface is connected with a driving circuit for driving the piezoelectric film to vibrate to generate air flow.

Compared with the prior art, the utility model has the following advantages: the utility model comprises an optical port cage with an upper interface slot and a lower interface slot, wherein an air supply component is arranged between the upper interface slot and the lower interface slot of the optical port cage, an air outlet is arranged on the side wall or the tail part of the optical port cage, the air supply component is used for sending external cooling air into the optical port cage to cool QSFP interfaces arranged in the upper interface slot and the lower interface slot and then discharge the cooled QSFP interfaces from the air outlet, and the utility model is different from the prior art in that the heat dissipation is enhanced by enhancing the heat conducting performance.

Drawings

Fig. 1 is a schematic structural diagram of a QSFP module with an air cooling and heat dissipation function according to an embodiment of the present utility model.

Fig. 2 is a schematic structural diagram of an air supply component according to a first embodiment of the present utility model.

Fig. 3 is a schematic structural diagram of an air supply component in a second embodiment of the present utility model.

Legend description: 1. a light opening cage; 11. an upper interface slot; 12. a lower layer interface slot; 13. an air outlet; 14. an intermediate panel; 2. an air supply component; 21. a blower; 22. a wind collector; 23. an air guide pipe; 231. an air outlet; 24. a housing; 241. a power supply interface; 25. an air supply cavity; 251. an external communication port; 26. a piezoelectric film.

Detailed Description

Embodiment one:

as shown in fig. 1, this embodiment provides a QSFP module with air cooling and heat dissipation functions, including an optical port cage 1 with an upper interface slot 11 and a lower interface slot 12, an air supply component 2 is disposed between the upper interface slot 11 and the lower interface slot 12 of the optical port cage 1, an air outlet 13 is mounted on a side wall or a tail portion of the optical port cage 1, and the air supply component 2 is used for sending external cooling air into the optical port cage 1 to cool QSFP interfaces mounted in the upper interface slot 11 and the lower interface slot 12 and then discharge the cooled air from the air outlet 13. Compared with the prior art that heat dissipation is enhanced by enhancing heat conduction performance, the QSFP module with the air cooling heat dissipation function in the embodiment achieves enhanced heat dissipation by enhancing convection heat transfer in the multi-channel QSFP module, so that the convection heat dissipation of the QSFP interface module with improved power density and assembly density can be improved, the reliable heat characteristic of the QSFP interface module is ensured, and the QSFP interface module has the advantages of being high in pertinence, strong in heat dissipation capacity and high in implementation performance.

Referring to fig. 1, the optical port cage 1 generally adopts the top surface of the top as a heat dissipation surface, and can be provided with an air-cooled radiator or a liquid cooling plate to realize heat dissipation of the whole module, however, as the bottom QSFP module is far away from the heat dissipation surface and a gap exists in the middle, heat conduction can only be performed through aluminum foils on the side surfaces, which results in poor heat dissipation of the bottom QSFP module. In this embodiment, the air supply component 2 is disposed between the upper layer interface slot 11 and the lower layer interface slot 12 of the optical port cage 1, and the air outlet 13 is installed on the side wall or the tail of the optical port cage 1, so that cooling air is fed from the air inlet between the upper layer interface slot 11 and the lower layer interface slot 12, and is discharged from the air outlet 13 after exchanging heat with the QSFP module.

Of course, the air supply member 2 may employ a micro fan array, a synthetic jet device, a bladeless fan, or the like as needed. As an alternative embodiment, as shown in fig. 2, the air supply component 2 in this embodiment includes a fan 21 and a wind collector 22, where the fan 21 is installed on the air inlet side of the wind collector 22, and the air outlet of the wind collector 22 is communicated with the inner cavity of the light port cage 1. In the multi-channel QSFP interface stacking installation form, a certain space needs to be reserved between the upper interface and the lower interface for installing the light guide column structure, but due to small space and small air inlet, system cooling air is difficult to enter the inside of the QSFP module, so that heat cannot be efficiently dissipated, aiming at the problems, the air supply component 2 in the embodiment comprises a fan 21 and an air collector 22, the fan 21 is used for actively supplying air, the air collector 22 is used for boosting and enhancing wind power, so that heat can be efficiently dissipated through the narrow space between the upper interface slot 11 and the lower interface slot 12 of the light port cage 1, and the method of enhancing local wind speed by specifically designing the air guide structure is used for realizing enhanced heat dissipation. As an alternative embodiment, referring to fig. 2, the wind collector 22 is funnel-shaped in this embodiment, and the fan 21 is installed at the opening side of the funnel.

Considering that the narrow space length between the upper layer interface slot 11 and the lower layer interface slot 12 of the optical port cage 1 is longer, in order to improve the uniformity of air flow feeding, the heat dissipation effect of the inner side of the optical port cage 1 is improved, as shown in fig. 2, the air outlet of the air collector 22 is further connected with an air guide pipe 23, a plurality of air outlets 231 are arranged on the side wall of the air guide pipe 23, and the plurality of air outlets 231 are all communicated with the inner cavity of the optical port cage 1, so that uniform and consistent cold air supply can be formed by using the air outlets 231.

In addition, considering the quantity of different QSFP interfaces of the QSFP module and the difference of heat under different load states, a speed regulator for regulating the speed of the fan 21 can be further connected to the power end of the fan 21, and the speed regulation of the fan 21 is realized by utilizing the speed regulator, so that dynamic power control can be performed according to the quantity of different QSFP interfaces of the QSFP module and the difference of heat under different load states, and the energy saving effect is improved.

In addition, further considering the problems that the temperature is too high and the cooling performance of the fan 21 is insufficient due to the environment temperature and the like, a semiconductor refrigeration sheet for refrigerating the cooling air can be arranged on at least one of the fan 22 and the air guide pipe 23, so that the air supply temperature can be regulated and controlled in an active refrigeration mode, the air supply temperature is further controlled, and the heat dissipation effect is improved.

As shown in fig. 2, in this embodiment, an intermediate panel 14 for mounting a light guide column is provided between the upper interface slot 11 and the lower interface slot 12 of the light port cage 1, and the air supply member 2 is mounted on the intermediate panel 14. The middle panel 14 is an existing part of the light port cage 1, and the air supply part 2 is arranged on the middle panel 14, so that the improvement of the existing light port cage 1 can be conveniently realized.

Embodiment two:

the present embodiment is basically the same as the first embodiment, and is mainly different in the implementation form of the air blowing member 2. In this embodiment, the air supply member 2 is a synthetic jet air supply device. As shown in fig. 3, the synthetic jet blower comprises a housing 24 and at least one blower chamber 25 arranged in the housing 24, wherein a piezoelectric film 26 with through holes is arranged in the blower chamber 25, the piezoelectric film 26 divides the blower chamber 25 into two halves, and one half of the piezoelectric film is provided with a plurality of external communication ports 251 communicated with the inner cavity of the light port cage 1. As shown in fig. 3, in this embodiment, a power supply interface 241 is provided on the housing 24, and the power supply interface 241 is connected to the electrode of the piezoelectric film 26. As shown in fig. 3, a driving circuit is connected to the power supply interface 241 in this embodiment, so as to drive the piezoelectric film 26 to vibrate to generate an air flow. The piezoelectric film 26 is supplied with a driving voltage through the power supply interface 241, and the piezoelectric film 26 is driven to vibrate to generate an air flow through the external communication port 251. Enters the inside of the optical port cage 1, and is discharged from the exhaust port 13 after heat dissipation is completed. The air flow can be restrained or reversed, and the air enters from the external communication port 251 and is discharged from the air inlet. Similarly, in order to control the temperature of the air entering the optical port cage 1, a semiconductor refrigerating sheet can be arranged on the surface of the synthetic jet air supply device, and the air supply temperature can be regulated and controlled in an active refrigeration mode.

The above description is only a preferred embodiment of the present utility model, and the protection scope of the present utility model is not limited to the above examples, and all technical solutions belonging to the concept of the present utility model belong to the protection scope of the present utility model. It should be noted that modifications and adaptations to the present utility model may occur to one skilled in the art without departing from the principles of the present utility model and are intended to be within the scope of the present utility model.

Claims

1. The utility model provides a QSFP module with forced air cooling heat dissipation function, includes light mouth cage (1) that has upper interface slot (11) and lower floor interface slot (12), its characterized in that is equipped with air supply component (2) between upper interface slot (11) and lower floor interface slot (12) of light mouth cage (1), air exit (13) are installed to lateral wall or afterbody of light mouth cage (1), air supply component (2) are used for sending outside cooling air into in light mouth cage (1) in order to discharge from air exit (13) after the QSFP interface of installing in upper interface slot (11) and lower floor interface slot (12) cools down.

2. The QSFP module with an air cooling and heat dissipation function according to claim 1, wherein the air supply component (2) includes a fan (21) and an air collector (22), the fan (21) is installed at an air inlet side of the air collector (22), and an air outlet of the air collector (22) is communicated with an inner cavity of the light port cage (1).

3. The QSFP module with an air cooling and heat dissipating function according to claim 2, wherein the air outlet of the air collector (22) is further connected with an air guide pipe (23), a plurality of air outlets (231) are arranged on the side wall of the air guide pipe (23), and the plurality of air outlets (231) are all communicated with the inner cavity of the light port cage (1).

4. A QSFP module with an air cooling and heat dissipating function according to claim 3, wherein the power end of the fan (21) is further connected to a speed regulator for regulating the speed of the fan (21).

5. The QSFP module with an air-cooled heat dissipation function according to claim 4, wherein at least one of the air collector (22) and the air guide pipe (23) is provided with a semiconductor cooling fin for cooling the cooling air.

6. The QSFP module with an air-cooled heat dissipation function according to claim 1, wherein an intermediate panel (14) for mounting a light guide column is disposed between the upper interface slot (11) and the lower interface slot (12) of the light port cage (1), and the air supply component (2) is mounted on the intermediate panel (14).

7. The QSFP module with air-cooled heat dissipation function according to claim 1, wherein the air supply member (2) is a synthetic jet air supply.

8. The QSFP module with air-cooled heat dissipation function according to claim 7, wherein the synthetic jet air blower includes a housing (24) and at least one air blowing chamber (25) disposed in the housing (24), a piezoelectric film (26) with a through hole is disposed in the air blowing chamber (25), the piezoelectric film (26) divides the air blowing chamber (25) into two halves, and one half of the air blowing chamber is provided with a plurality of external communication ports (251) communicating with the inner cavity of the optical port cage (1).

9. The QSFP module with air-cooled heat dissipation function according to claim 8, wherein a power supply interface (241) is provided on the housing (24), and the power supply interface (241) is connected to an electrode of the piezoelectric film (26).

10. The QSFP module with air-cooled heat dissipation function according to claim 9, wherein the power supply interface (241) is connected to a driving circuit for driving the piezoelectric film (26) to vibrate to generate an air flow.