CN218918062U - High-efficiency heat radiation module and notebook computer - Google Patents

Abstract

The utility model discloses a high-efficiency heat dissipation module and a notebook computer, wherein the high-efficiency heat dissipation module comprises a bottom shell, a CPU and a radiator, wherein a containing cavity is arranged in the bottom shell, and the CPU and the radiator are sequentially arranged in the containing cavity; a first screw hole is formed in the side wall of the bottom shell in a penetrating manner; the radiator comprises a radiating bottom plate and a plurality of radiating fins which are uniformly and equidistantly arranged on the radiating bottom plate, and a second screw hole is formed in the radiating bottom plate at a position corresponding to the first screw hole; the first screw hole is in threaded connection with the second screw hole through a screw, so that the bottom shell and the radiator are wrapped by the CPU. According to the utility model, the CPU is wrapped by the bottom shell and the radiator, so that the problems that dust is easily accumulated on the CPU, the heat dissipation effect is affected and the working performance of the CPU is further affected can be avoided.

Description

High-efficiency heat radiation module and notebook computer

Technical Field

The utility model relates to the technical field of heat dissipation modules, in particular to a high-efficiency heat dissipation module and a notebook computer.

Background

The CPU is used as the operation and control core of computer system and is the final execution unit for information processing and program running. When the CPU works, a large amount of heat energy is generated, so that the temperature is increased, the service life of equipment is further influenced, in order to improve the service life of the CPU, a heat dissipation module is often adopted in the prior art to cool the CPU, however, the existing heat dissipation module cannot wrap the CPU, dust is easily accumulated on the CPU, the heat dissipation effect is influenced, and the working performance of the CPU is further influenced.

Accordingly, there is a need for improvement and advancement in the art.

Disclosure of Invention

In view of the above-mentioned shortcomings of the prior art, the present utility model aims to provide a high-efficiency heat dissipation module and a notebook computer, which are aimed at solving the problems that the existing heat dissipation module cannot realize the wrapping of a CPU, so that dust is easily accumulated on the CPU, the heat dissipation effect is affected, and the working performance of the CPU is further affected.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the high-efficiency heat radiation module comprises a bottom shell, wherein a containing cavity is arranged in the bottom shell, and a CPU and a radiator are sequentially arranged in the containing cavity;

a first screw hole is formed in the side wall of the bottom shell in a penetrating manner;

the radiator comprises a radiating bottom plate and a plurality of radiating fins which are uniformly and equidistantly arranged on the radiating bottom plate, and a second screw hole is formed in the radiating bottom plate at a position corresponding to the first screw hole;

the first screw hole is in threaded connection with the second screw hole through a screw, so that the bottom shell and the radiator are wrapped by the CPU.

In a further technical scheme, the high-efficiency heat dissipation module is characterized in that heat conduction silicone grease is coated on one side of the CPU, which is abutted against the heat dissipation bottom plate.

In a further technical scheme, the efficient heat dissipation module is characterized in that the heat dissipation fins are uniformly provided with a plurality of breaking slits along the extending direction of the heat dissipation fins.

In a further technical scheme, the efficient heat dissipation module is characterized in that a plurality of hemispherical protrusions are uniformly arranged on the side walls of the heat dissipation fins along the extending direction in a staggered mode.

In a further technical scheme, the efficient heat dissipation module is characterized in that the heat dissipation bottom plate and the heat dissipation fins are of an integrated structure.

In a further technical scheme, the efficient heat dissipation module further comprises a heat dissipation fan arranged at one end of the radiator, and the wind direction blown out by the heat dissipation fan is parallel to the extending direction of the heat dissipation fins.

A notebook computer comprising the efficient heat dissipation module according to any one of the above.

Compared with the prior art, the utility model provides a high-efficiency heat dissipation module and a notebook computer, wherein the high-efficiency heat dissipation module comprises a bottom shell, a containing cavity is arranged in the bottom shell, and a CPU and a radiator are sequentially arranged in the containing cavity; a first screw hole is formed in the side wall of the bottom shell in a penetrating manner; the radiator comprises a radiating bottom plate and a plurality of radiating fins which are uniformly and equidistantly arranged on the radiating bottom plate, and a second screw hole is formed in the radiating bottom plate at a position corresponding to the first screw hole; the first screw hole is in threaded connection with the second screw hole through a screw, so that the bottom shell and the radiator are wrapped by the CPU. According to the utility model, the CPU is wrapped by the bottom shell and the radiator, so that the problems that dust is easily accumulated on the CPU, the heat dissipation effect is affected and the working performance of the CPU is further affected can be avoided.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are only some embodiments described in the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a high-efficiency heat dissipation module according to an embodiment of the present utility model.

Fig. 2 is an exploded view of the efficient heat dissipation module according to the embodiment of the present utility model.

Fig. 3 is a side view of the heat sink shown in fig. 2.

Reference numerals: 1. the heat radiator comprises a bottom shell, 11, a containing cavity, 12, a first screw hole, 13, a screw, 2, a CPU,3, a radiator, 31, a heat radiating bottom plate, 32, heat radiating fins, 33, a second screw hole, 34, a breaking gap, 35 and a hemispherical bulge.

Detailed Description

In order to make the objects, technical solutions and effects of the present utility model clearer and more specific, the present utility model will be described in further detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or component to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanical connection, electrical connection, or electrical signal connection (both electrical connection and signal connection are provided between the two); can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of the two components. When an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. It will be understood by those of ordinary skill in the art that the terms described above are in the specific sense of the present utility model.

In the description of the present utility model, the terms "comprising," "including," "having," "containing," and the like are open-ended terms, meaning including, but not limited to. Reference to the terms "one embodiment," "a particular embodiment," "some embodiments," "for example," etc., means that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. The sequence of steps involved in the embodiments is used to schematically illustrate the practice of the present application, and is not limited thereto and may be appropriately adjusted as desired.

Various non-limiting embodiments of the present utility model are described in detail below with reference to the attached drawing figures.

Referring to fig. 1-3, the embodiment of the present utility model provides a high-efficiency heat dissipation module, which includes a bottom shell 1, wherein a receiving cavity 11 is provided in the bottom shell 1, and a CPU2 and a heat sink 3 sequentially disposed in the receiving cavity 11 are further included;

a first screw hole 12 is symmetrically formed in the side wall of the bottom shell 1 in a penetrating manner;

the radiator 3 comprises a radiating bottom plate 31 and a plurality of radiating fins 32 uniformly and equidistantly arranged on the radiating bottom plate 31, and a second screw hole 33 is formed in the radiating bottom plate 31 at a position corresponding to the first screw hole 12;

the first screw hole 12 is screwed with the second screw hole 33 through a screw 13, so that the bottom shell 1 and the radiator 3 can wrap the CPU 2.

Further, the efficient heat dissipation module further includes a heat dissipation fan (not shown) disposed at one end of the heat sink 3, and a wind direction blown out by the heat dissipation fan is parallel to the extending direction of the heat dissipation fins 32.

Specifically, in this embodiment, the bottom shell 1 and the radiator 3 may effectively wrap the CPU2, so that the problem that dust is easily accumulated on the CPU may be avoided, and at the same time, the radiator fan ventilates and radiates the radiator 3, so that the normal operation of the CPU may be ensured.

Further, in one embodiment, the high-efficiency heat dissipation module is characterized in that a side of the CPU2 abutting against the heat dissipation base plate 31 is coated with heat-conducting silicone grease.

Specifically, in the present embodiment, the heat conduction efficiency between the CPU2 and the heat sink 3 can be improved by the heat conduction silicone grease.

Further, in one embodiment, the heat dissipation module is provided with a plurality of breaking slits 34 uniformly along the extending direction of the heat dissipation fins 32.

Specifically, in this embodiment, when the air flow blown by the cooling fan passes through the cooling slot (the cooling slot is formed between the two cooling fins 32), the air flow in the cooling slot may flow into the cooling slot of the partition wall through the breaking opening 34, and then the air flows in the two cooling slots may interfere with each other to form turbulence, so that the air flow passing through the cooling slot can carry more heat, and ventilation and heat dissipation of the cooling fins 32 are more facilitated.

Further, in the efficient heat dissipation module, the heat dissipation fins 32 are uniformly provided with a plurality of hemispherical protrusions 35 along the side walls in the extending direction thereof in a vertically staggered manner.

Specifically, in this embodiment, the hemispherical protrusion 35 may further block the airflow flowing through the heat sink, and may form a stronger turbulent flow, so that the airflow flowing through the heat sink may carry more heat, which is more beneficial to ventilation and heat dissipation of the heat sink fins 32.

Further, in one embodiment, the heat dissipating bottom plate 31 and the heat dissipating fins 32 are integrally formed.

Based on the above embodiment, the present utility model further provides a notebook computer, which includes the efficient heat dissipation module set as described in any one of the above embodiments, and the detailed description is omitted herein.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It is to be understood that the utility model is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims.

Claims (7)

1. The efficient heat dissipation module is characterized by comprising a bottom shell (1), wherein a containing cavity (11) is arranged in the bottom shell (1), and a CPU (2) and a radiator (3) which are sequentially arranged in the containing cavity (11) are also included;

a first screw hole (12) is formed in the side wall of the bottom shell (1) in a penetrating manner;

the radiator (3) comprises a radiating bottom plate (31) and a plurality of radiating fins (32) which are uniformly and equidistantly arranged on the radiating bottom plate (31), and a second screw hole (33) is formed in the radiating bottom plate (31) at a position corresponding to the first screw hole (12);

the first screw hole (12) is in threaded connection with the second screw hole (33) through a screw (13), so that the bottom shell (1) and the radiator (3) are wrapped by the CPU (2).

2. The efficient heat dissipation module as claimed in claim 1, wherein a side of the CPU (2) abutting against the heat dissipation base plate (31) is coated with heat conductive silicone grease.

3. A high-efficiency heat-dissipating module according to claim 2, wherein the heat-dissipating fins (32) are uniformly provided with a plurality of breaking slits (34) along the extending direction thereof.

4. A high-efficiency heat dissipation module according to claim 3, wherein the heat dissipation fins (32) are uniformly provided with a plurality of hemispherical protrusions (35) staggered up and down along the side walls in the extending direction thereof.

5. A high efficiency heat sink module as claimed in claim 4, wherein the heat sink base plate (31) and the heat sink fins (32) are integrally formed.

6. A high efficiency heat radiation module set as set forth in any one of claims 1-5, further comprising a heat radiation fan provided at one end of the heat radiator (3), wherein the wind direction blown out by the heat radiation fan is parallel to the extending direction of the heat radiation fins (32).

7. A notebook computer comprising the high-efficiency heat dissipation module of any one of claims 1-6.

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