CN218675881U

CN218675881U - Cooling fan for notebook computer

Info

Publication number: CN218675881U
Application number: CN202222635904.4U
Authority: CN
Inventors: 熊伟
Original assignee: Dongguan Aikang Industrial Co ltd
Current assignee: Dongguan Aikang Industrial Co ltd
Priority date: 2022-09-30
Filing date: 2022-09-30
Publication date: 2023-03-21
Anticipated expiration: 2032-09-30

Abstract

The utility model discloses a radiator fan for notebook computer, wherein, include: the fan is provided with an air inlet and an air outlet; the air conditioner comprises an air guide groove, wherein one end of the air guide groove is provided with an air inlet communicated with an air outlet, the other end of the air guide groove is provided with a heat dissipation port, a CPU accommodating cavity is arranged on the air guide groove between the air inlet and the heat dissipation port, a CPU is installed in the CPU accommodating cavity, the top of the CPU accommodating cavity is provided with a first opening, a radiator is installed in the air guide groove at a position close to the air inlet, the radiator comprises a plurality of radiating fins which are arranged at equal intervals, and a second opening is arranged on the air guide groove at a position corresponding to the top of the radiator; and one end of the heat conduction pipe is abutted to the CPU through the first opening, and the other end of the heat conduction pipe is abutted to the radiator through the second opening. The utility model discloses a radiator fan can be right CPU realizes the heat dissipation ventilation of dual mode, the radiating effect preferred.

Description

Cooling fan for notebook computer

Technical Field

The utility model relates to a radiator fan technical field, concretely relates to radiator fan for notebook computer.

Background

The central processing unit, referred to as CPU for short, is used as the operation and control core of the notebook computer, and is the final execution unit for information processing and program operation. When the CPU works, a large amount of heat energy is generated, which causes temperature rise, and further affects the service life of the device. However, the heat dissipation fan in the prior art usually directly performs heat dissipation and ventilation on the CPU, that is, only a single mode of heat dissipation and ventilation can be implemented on the CPU, and the heat dissipation effect is not good enough.

Thus, there is a need for improvements and enhancements in the art.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned prior art's weak point, the utility model aims to provide a radiator fan for notebook computer can realize the heat dissipation ventilation of dual mode, the radiating effect preferred to CPU.

In order to achieve the purpose, the utility model adopts the following technical proposal:

a cooling fan for a notebook computer, comprising:

the fan is provided with an air inlet and an air outlet;

the air conditioner comprises an air guide groove, wherein one end of the air guide groove is provided with an air inlet communicated with an air outlet, the other end of the air guide groove is provided with a heat dissipation port, a CPU accommodating cavity is arranged on the air guide groove between the air inlet and the heat dissipation port, a CPU is installed in the CPU accommodating cavity, the top of the CPU accommodating cavity is provided with a first opening, a radiator is installed in the air guide groove at a position close to the air inlet, the radiator comprises a plurality of radiating fins which are arranged at equal intervals, and a second opening is arranged on the air guide groove at a position corresponding to the top of the radiator;

and one end of the heat conduction pipe is abutted to the CPU through the first opening, and the other end of the heat conduction pipe is abutted to the radiator through the second opening.

In a further technical solution, in the cooling fan for a notebook computer, one end of the heat pipe near the first opening is abutted to the CPU through a first heat conducting plate, and the first heat conducting plate can close the first opening.

In a further technical solution, in the cooling fan for a notebook computer, one end of the heat pipe near the second opening is abutted to the radiator through a second heat conduction plate, and the second opening can be closed by the second heat conduction plate.

In a further technical solution, the cooling fan for the notebook computer, wherein the bottom of the CPU accommodating cavity is provided with a plurality of supporting columns, and the top of each supporting column is provided with a fixing screw hole for screwing the CPU.

In a further technical solution, the heat dissipation fan for the notebook computer, wherein a heat conduction cushion block for connecting the CPU and the first heat conduction plate is slidably mounted in the CPU accommodating cavity.

In a further technical scheme, the heat dissipation fan for the notebook computer is characterized in that slide rails are symmetrically arranged on the side walls of the two ends of the CPU accommodating cavity, and slide grooves in sliding fit with the slide rails are symmetrically arranged at the end parts of the two ends of the heat conduction cushion block.

In a further technical solution, the heat dissipation fan for the notebook computer is characterized in that a side of the CPU, which abuts against the heat conduction pad, is coated with heat conduction silicone grease.

Compared with the prior art, the utility model provides a radiator fan for notebook computer, wherein, include: the fan is provided with an air inlet and an air outlet; the air conditioner comprises an air guide groove, wherein one end of the air guide groove is provided with an air inlet communicated with an air outlet, the other end of the air guide groove is provided with a heat dissipation port, a CPU accommodating cavity is arranged on the air guide groove between the air inlet and the heat dissipation port, a CPU is installed in the CPU accommodating cavity, the top of the CPU accommodating cavity is provided with a first opening, a radiator is installed in the air guide groove at a position close to the air inlet, the radiator comprises a plurality of radiating fins which are arranged at equal intervals, and a second opening is arranged on the air guide groove at a position corresponding to the top of the radiator; and one end of the heat conduction pipe is abutted to the CPU through the first opening, and the other end of the heat conduction pipe is abutted to the radiator through the second opening. In the utility model, the low-temperature air flow blown by the fan is blown into the air inlet of the air guide groove through the air outlet, the low-temperature air flow is discharged from the heat dissipation port of the air guide groove after flowing through the CPU accommodating cavity through the air inlet, and the low-temperature air flow can perform primary ventilation and heat dissipation on the CPU in the CPU accommodating cavity when flowing through the CPU accommodating cavity; meanwhile, heat energy generated by the CPU during working can be conducted to the radiator through the heat conduction pipe, when low-temperature airflow flows through the air inlet of the air guide groove, the radiator at the air inlet in the air guide groove can be subjected to heat dissipation and ventilation, and then the CPU can be subjected to secondary ventilation and heat dissipation; furthermore, the utility model discloses a radiator fan can be right CPU realizes dual mode's heat dissipation and ventilation, the radiating effect preferred.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural view of a cooling fan for a notebook computer according to an embodiment of the present invention.

Fig. 2 is an exploded view of a cooling fan for a notebook computer according to an embodiment of the present invention.

Reference numerals are as follows: 1. the heat-conducting module comprises a fan, 11, an air inlet, 12, an air outlet, 2, an air guide groove, 21, an air inlet, 22, a heat dissipation port, 23, a CPU accommodating cavity, 24, a first opening, 25, a radiator, 26, a second opening, 27, supporting columns, 28, a heat-conducting cushion block, 3, a heat-conducting pipe, 31, a first heat-conducting plate, 32 and a second heat-conducting plate.

Detailed Description

In order to make the objects, technical solutions and effects of the present invention clearer and clearer, the following description of the present invention will refer to the accompanying drawings and illustrate embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

In the description of the present invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or assembly referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may for example be fixedly connected, detachably connected, or integrally connected; the two can be mechanically connected or electrically connected, or electrically connected (meaning that there is both electrical and signal connection between the two); the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other. When an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The specific meaning of the above terms in the present invention can be understood in specific cases for those skilled in the art.

In the description of the present invention, the terms "comprising," "including," "having," "containing," and the like, as used herein, are open-ended terms that mean including, but not limited to. Reference to the description of the terms "one embodiment," "a particular embodiment," "some embodiments," "for example," etc., means that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. The sequence of steps involved in the embodiments is for illustrative purposes to illustrate the implementation of the present application, and the sequence of steps is not limited and can be adjusted as needed.

Various non-limiting embodiments of the present invention are described in detail below with reference to the accompanying drawings.

Referring to fig. 1-2, an embodiment of the present invention provides a heat dissipation fan for a notebook computer, including:

the fan comprises a fan 1 (the inner fan blades of the fan are not shown), wherein an air inlet 11 and an air outlet 12 are arranged on the fan 1;

an air guide groove 2 (formed by buckling an upper shell and a lower shell), wherein one end of the air guide groove 2 is provided with an air inlet 21 communicated with the air outlet 12, the other end of the air guide groove 2 is provided with a heat radiating port 22, a CPU accommodating cavity 23 is arranged between the air inlet 21 and the heat radiating port 22 on the air guide groove 2, a CPU (not shown) is arranged in the CPU accommodating cavity 23, the top of the CPU accommodating cavity 23 is provided with a first opening 24, a radiator 25 is arranged in the air guide groove 2 at a position close to the air inlet 21, the radiator 25 comprises a plurality of radiating fins which are arranged at equal intervals, and a second opening 26 is arranged on the air guide groove 2 at a position corresponding to the top of the radiator 25;

and a heat transfer pipe 3, one end of the heat transfer pipe 3 abutting the CPU through the first opening 24, and the other end of the heat transfer pipe 3 abutting the heat sink 25 through the second opening 26.

Specifically, in this embodiment, the low-temperature airflow blown by the fan 1 is blown into the air inlet 21 of the air guiding groove 2 through the air outlet 12, the low-temperature airflow is discharged from the heat dissipating port 22 of the air guiding groove 2 after flowing through the CPU accommodating cavity 23 through the air inlet 21, and the low-temperature airflow can perform primary ventilation and heat dissipation on the CPU therein when flowing through the CPU accommodating cavity 23; meanwhile, the heat energy generated by the CPU during operation can be conducted to the radiator 25 through the heat conduction pipe 3, and when the low-temperature air current flows through the air inlet 21 of the air guide groove 2, the radiator 25 at the air inlet 21 in the air guide groove 2 can be subjected to heat dissipation and ventilation, that is, the CPU can be subjected to secondary ventilation and heat dissipation; furthermore, the cooling fan of the embodiment can realize dual-mode cooling and ventilation for the CPU, and the cooling effect is good.

Further, in one embodiment, the heat dissipation fan for notebook computer, wherein one end of the heat conduction pipe 3 near the first opening 24 is abutted to the CPU through a first heat conduction plate 31, and the first heat conduction plate 31 can close the first opening 24;

one end of the heat transfer pipe 3 near the second opening 26 is abutted against the heat sink 25 via a second heat transfer plate 32, and the second heat transfer plate 32 can close the second opening 26.

Specifically, in the present embodiment, the first opening 24 is sealed by the first heat conduction plate 31, and the second opening 26 is sealed by the second heat conduction plate 32, so that the low-temperature airflow blown into the air guiding groove 2 by the fan 1 can be prevented from leaking to affect the ventilation and heat dissipation effects of the heat dissipation fan.

Further, in one embodiment, in the cooling fan for a notebook computer, a plurality of support columns 27 are disposed at the bottom of the CPU accommodating cavity 23, and fixing screw holes for screwing the CPU are disposed at the top of the support columns 27.

Further, in the cooling fan for the notebook computer, a heat conducting cushion block 28 for connecting the CPU and the first heat conducting plate 31 is slidably mounted in the CPU accommodating cavity 23.

Further, in the cooling fan for a notebook computer, slide rails are symmetrically arranged on the side walls of the two ends of the CPU accommodating cavity 23, and sliding grooves in sliding fit with the slide rails are symmetrically arranged on the end portions of the two ends of the heat conducting cushion block 28.

Further, in the cooling fan for the notebook computer, a side of the CPU abutting against the heat conducting pad 28 is coated with heat conducting silicone grease.

Specifically, in this embodiment, the CPU may be fixed on the supporting pillar 27 by matching a self-tapping screw with the fixing screw, and then the heat conducting pad 28 is embedded into the CPU accommodating cavity 23 through the first opening 24, and then slides downward to make the bottom of the heat conducting pad 28 abut against the CPU, and meanwhile, the heat conducting efficiency between the CPU and the heat conducting pad 28 may be improved by coating heat conducting silicone grease on the CPU, where a heat conducting process generated when the CPU works in this embodiment is as follows: CPU → heat conducting pad 28 → first heat conducting plate 31 → heat conducting pipe 3 → second heat conducting plate 32 → radiator 25, and the low temperature air flow blown into the air guiding groove 2 by the fan 1 ventilates and radiates heat to the radiator 25.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be understood that the application of the present invention is not limited to the above examples, and that modifications or changes can be made by those skilled in the art based on the above description, and all such modifications and changes are intended to fall within the scope of the appended claims.

Claims

1. A cooling fan for a notebook computer is characterized by comprising:

the fan (1), the said fan (1) is equipped with the air intake (11) and air outlet (12);

the air guide device comprises an air guide groove (2), wherein one end of the air guide groove (2) is provided with an air inlet (21) communicated with an air outlet (12), the other end of the air guide groove is provided with a heat dissipation port (22), a CPU accommodating cavity (23) is arranged between the air inlet (21) and the heat dissipation port (22) on the air guide groove (2), a CPU is arranged in the CPU accommodating cavity (23), the top of the CPU accommodating cavity (23) is provided with a first opening (24), a radiator (25) is arranged in the air guide groove (2) at a position close to the air inlet (21), the radiator (25) comprises a plurality of radiating fins which are arranged at equal intervals, and a second opening (26) is arranged on the air guide groove (2) at a position corresponding to the top of the radiator (25);

and a heat conduction pipe (3), wherein one end of the heat conduction pipe (3) is abutted against the CPU through the first opening (24), and the other end of the heat conduction pipe (3) is abutted against the radiator (25) through the second opening (26).

2. The heat dissipating fan for a notebook computer according to claim 1, wherein one end of the heat pipe (3) near the first opening (24) abuts against the CPU through a first heat conducting plate (31), and the first heat conducting plate (31) closes the first opening (24).

3. The heat dissipating fan for a notebook computer according to claim 2, wherein one end of the heat conductive pipe (3) near the second opening (26) abuts against the heat sink (25) via a second heat conduction plate (32), and the second heat conduction plate (32) closes the second opening (26).

4. The cooling fan for the notebook computer according to claim 3, wherein a plurality of support columns (27) are disposed at the bottom of the CPU accommodating cavity (23), and fixing screw holes for screwing the CPU are disposed at the top of the support columns (27).

5. The heat dissipation fan for notebook computer as claimed in claim 4, wherein a heat conduction cushion block (28) for connecting the CPU and the first heat conduction plate (31) is slidably mounted in the CPU accommodation chamber (23).

6. The heat dissipation fan for the notebook computer according to claim 5, wherein the side walls of the two ends of the CPU accommodating cavity (23) are symmetrically provided with slide rails, and the ends of the two ends of the heat conducting cushion block (28) are symmetrically provided with slide grooves slidably engaged with the slide rails.

7. The heat dissipation fan for notebook computer as claimed in claim 6, wherein the CPU is coated with heat conductive silicone grease on the side abutting against the heat conductive pad (28).