CN218679736U

CN218679736U - Charging and discharging power supply and formation grading equipment

Info

Publication number: CN218679736U
Application number: CN202222519035.9U
Authority: CN
Inventors: 刘斌
Original assignee: Sany Technology Equipment Co Ltd
Current assignee: Sany Technology Equipment Co Ltd
Priority date: 2022-09-22
Filing date: 2022-09-22
Publication date: 2023-03-21
Anticipated expiration: 2032-09-22

Abstract

The application relates to the technical field of power supplies, and particularly provides a charging and discharging power supply and formation and partial capacity equipment. The charging and discharging power supply is applied to the battery formation and capacity grading process and comprises a box body and a circuit board positioned in the box body; the heat dissipation assembly is positioned in the box body and comprises an air exhaust device and a cooling box, the cooling box used for containing cooling media is provided with a media inlet and a media outlet, and the cooling box is positioned at an air inlet or an air outlet of the air exhaust device. The application provides a charge-discharge power supply adopts the mode that liquid cooling and forced air cooling heat dissipation combined together, can effectively dispel the heat to closed box inside, and heat dispersion is high, and receives ambient temperature's influential nature low, still can effectively dispel the heat to the circuit board in the environment of high temperature, avoids damaging because of overheated, has solved among the prior art power and has used fan heat dissipation easily to receive environmental impact, the relatively poor problem of radiating effect.

Description

Charging and discharging power supply and formation grading equipment

Technical Field

The application relates to the technical field of power supplies, in particular to a charging and discharging power supply and formation and grading equipment.

Background

The heat dissipation performance of the charging and discharging power supply is particularly important, for example, the formation and capacity grading device is a device for performing formation (the process of stabilizing the performance of the battery after the battery is charged for the first time) and/or capacity grading (the process of charging and discharging the battery, detecting and determining the capacity of the battery, and screening or grading according to the capacity) operation on the lithium battery, and the charging and discharging power supply on the device needs to adjust different parameters according to the batch and specification of the charging and discharging battery, so that the circuit board of the power supply has a large volume, many components and parts and large heat generation quantity, and if the heat dissipation effect is poor, the power supply can be damaged due to overheating.

At present, a fan is usually used for radiating the power supply, but the traditional radiating mode is greatly influenced by the ambient temperature, if the ambient temperature is high, the radiating effect is obviously influenced, and the phenomenon that the power supply is damaged due to overheating still exists.

SUMMERY OF THE UTILITY MODEL

In view of this, embodiments of the present application are directed to provide a charging and discharging power supply, which can still effectively dissipate heat of a circuit board in a high temperature environment, thereby improving heat dissipation performance of the power supply, and effectively avoiding damage of the power supply due to overheating, so as to solve, to at least a certain extent, the problems that the heat dissipation of the power supply used in the chemical composition and tolerance process in the prior art is easily affected by the environment and the heat dissipation effect is poor when the power supply uses a fan.

The application provides a charging and discharging power supply which is applied to the battery formation and capacity grading process and comprises a box body and a circuit board positioned in the box body; and the cooling box is positioned at the air inlet or the air outlet of the air exhaust device.

In one possible embodiment, the cooling box is located on the air inlet side of the air exhaust device and is arranged opposite to the air inlet opening.

In a possible embodiment, the air exhaust device comprises fan blades and a casing, and the casing is connected with the cooling box; and/or at least two air exhausting devices are fixedly connected with one side wall of the cooling box; and/or a medium inlet of the cooling box is provided with a liquid inlet joint, and a medium outlet of the cooling box is provided with a liquid outlet joint.

In a possible embodiment, a plurality of communicated liquid flow passages are arranged in the cooling box along the transverse direction and/or the longitudinal direction; and/or the box body of the cooling box is made of metal.

In a possible implementation mode, a pipeline joint is arranged on the wall of the box body, a liquid supply pipeline is arranged in the box body, one end of the liquid supply pipeline is detachably connected with the cooling box through the joint, and the other end of the liquid supply pipeline is detachably connected with the pipeline joint on the box body; and/or the pipeline joints on the box body are all positioned on the first side wall of the box body.

In a possible implementation manner, the circuit board includes a first circuit board, the heat dissipation assembly is located on one side of a front board surface of the first circuit board, where the front board surface has components, and is connected to one end of the front board surface, and the air outlet of the air exhaust device faces the other end of the front board surface.

In a possible implementation manner, the circuit board comprises at least two first circuit boards, and one end of each first circuit board is provided with the heat dissipation assembly.

In a possible implementation manner, the medium inlet of each cooling box is connected with the liquid inlet header pipe of the liquid supply pipeline, the medium outlet of each cooling box is connected with the liquid outlet header pipe of the liquid supply pipeline, and two pipeline joints respectively connected with the liquid inlet header pipe and the liquid outlet header pipe are arranged on the first side wall of the box body.

In a possible implementation manner, two wind shields are arranged on two sides of the front board surface of the first circuit board, an air guide plate is obliquely arranged above the front board surface, the two wind shields are respectively arranged on two sides of the air outlet of the air exhaust device, and the distance between the board surface of the air guide plate and the first circuit board is gradually reduced along the air outlet direction.

The application also provides a chemical component capacity equipment, including cabinet body frame, needle bed and as above any charge-discharge power supply, charge-discharge power supply with the needle bed all is located in the cabinet body frame.

According to the application provides a charge-discharge power supply, it dispels the heat through radiator unit in the box, radiator unit includes exhaust device and cooler bin, cooling medium has in the cooler bin, and can change, with the supply cooling source of continuation, the cooler bin is located exhaust device air intake or air outlet department, can cool off near the air of exhaust device and the air current that exhaust device produced, so, the air current that blows to other regions from exhaust device department is the low temperature air current, can the produced heat of circuit board in the efficient absorption box, prevent that the circuit board is overheated. The setting of cooler bin can enough make the air current be the low temperature air current, carries out high-efficient heat dissipation to power supply box inside, in high temperature environment, also can effectively dispel the heat, and power heat dispersion receives ambient temperature's influence can show and reduce.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation assembly in an embodiment of the present application;

fig. 2 is a schematic structural view of a heat dissipation assembly and a first circuit board according to some embodiments of the present disclosure;

fig. 3 is a schematic view of the inside of a charging and discharging power supply box in the embodiment of the present application;

fig. 4 is a schematic diagram of a heat dissipation assembly and a first circuit board according to another embodiment of the present disclosure.

In FIGS. 1-4:

1. a first circuit board; 2. an air exhaust device; 3. a cooling tank; 4. a liquid inlet joint; 5. a liquid outlet joint; 6. a box body; 7. a liquid inlet header pipe; 8. a liquid outlet main pipe; 9. a liquid inlet main joint; 10. a liquid outlet main joint; 11. a second circuit board; 12. a wind deflector; 13. an air deflector.

Detailed Description

The embodiment of this application is dedicated to providing a charge-discharge power supply, adopts the mode that liquid cooling and forced air cooling heat dissipation combined together, can effectively dispel the heat to closed box inside, and heat dispersion is high, and receives ambient temperature's influenzability low, still can effectively dispel the heat to the circuit board in the environment of high temperature, avoids damaging because of overheated, has solved among the prior art power at least to a certain extent and has used fan heat dissipation easily to receive environmental impact, the relatively poor problem of radiating effect. The embodiment of the application is also directed to providing the component-capacitor equipment comprising the charging and discharging power supply, so that the power supply on the component-capacitor equipment can effectively dissipate heat, the phenomenon that the power supply is damaged due to overheating is effectively avoided, and the service life of the equipment is prolonged.

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

Referring to fig. 1-4, an embodiment of the present application provides a charging and discharging power supply, which can be applied to a battery formation and capacity grading process to supply power for battery formation and/or capacity grading operation, the charging and discharging power supply includes a box 6, a circuit board is disposed in the box 6, and a heat dissipation assembly is disposed in the box 6, the heat dissipation assembly includes an air exhaust device 2 and a cooling box 3, and the air exhaust device 2 is a device generating air flow, such as a fan or a blower. The cooling tank 3 has an inner cavity for receiving a cooling medium and has a medium inlet and a medium outlet for facilitating the exchange of the cooling medium in the tank to provide a continuous source of cooling inside the tank 6. The cooling box 3 is located the air inlet or the air outlet of the air exhaust device 2, and the air at the air inlet or the air outlet of the air exhaust device 2 is effectively cooled, so that the air flow blown outwards by the air exhaust device 2 is low-temperature air flow, and the low-temperature air flow flows through other areas in the box body 6, such as components and parts on a circuit board, and can effectively dissipate heat of the circuit board. The housing 6 of the power supply is usually closed to prevent water from entering the housing 6 or the circuit board from being severely wetted.

And set up cooler bin 3 in closed box 6, be equivalent to set up a cooling source in box 6, the continuation provides coolant, combine the air current that exhaust device 2 produced, the low temperature air current that lasts the flow in box 6 has been formed, mode through forced air cooling and liquid cooling combination, can carry out high-efficient heat dissipation to closed box 6, carry out high-efficient cooling to the circuit board, prevent that the circuit board that the heat production is big from damaging because of overheated, and compare in ordinary fan heat dissipation, the power that this application provided, the radiating effect receives ambient temperature's influence less, the heat dispersion of power in high temperature environment has been improved, improve the tolerance of power to high temperature environment.

On the other hand, it can also be said that, the charging and discharging power supply provided by this embodiment, because the heat dissipation assembly with the above structure is arranged in the box 6, the box 6 can be of a closed structure, and it is not necessary to open an air opening on the box like a power supply using a fan for heat dissipation in the prior art, so that the heat dissipation performance of the power supply is improved, the heat can be effectively dissipated in a high-temperature environment, and the overheating damage is prevented, and the box 6 can be also closed, so that the working quality is better prevented from being affected by the moisture of internal components.

So set up, it is thus clear, the charge-discharge power that this embodiment provided, through the combination of exhaust device 2 and cooler bin 3, adopt the mode that forced air cooling and liquid cooling combined together, can carry out high-efficient heat dissipation to the inside of closed power supply box, and showing and having reduced ambient temperature to the harmful effects of radiating effect, the heat dispersion and the high temperature resistance of power have been improved, prevent the power very effectively and damage because of overheated, the effective life of extension power, not only solved the poor problem that receives the environmental impact of the radiating effect that the power has through fan heat dissipation, also solved the problem that the charge-discharge power that becomes partial capacity used among the prior art leads to the power to overheat damage because of circuit board calorific capacity is big easily to a certain extent at least, and make box 6 can be closed structure, on the basis of improving heat dissipation, can also better prevent that box 6 from intaking or circuit board from seriously weing scheduling problem.

As mentioned above, in some embodiments, the box 6 of the charging and discharging power supply is of a closed structure, for example, the box 6 includes a top plate, a frame of the box 6, and a bottom plate, the frame of the box 6 is generally enclosed by four side plates, the top plate and the bottom plate are respectively connected and cover two sides of the frame of the box 6, and a sealing member is provided between the top plate and the frame of the box 6, and between the bottom plate and the frame of the box 6, so as to form a sealed connection. Four side plates forming the frame of the box body 6 are also provided with sealing elements at the joints of the two adjacent side plates, or the two adjacent side plates are in sealing connection by welding or bonding and the like.

The cooling box 3 is located at the air inlet or the air outlet of the air exhausting device 2, specifically, in some embodiments, the cooling box 3 is located at the air inlet side or the air outlet side of the air exhausting device 2 and is disposed opposite to the air inlet or the air outlet of the air exhausting device 2, or, in other words, an axial projection of the air exhausting device 2 (i.e., an axial projection of the fan blade) and a projection of the cooling box 3 in the direction at least partially coincide. In the preferred embodiment, the cooling box 3 is located on the air intake side of the air exhaust device 2 and opposite to the air intake.

The cooling box 3 can also be connected with the exhaust device 2, so, on the one hand, reduce the interval of the two, be convenient for carry out heat conduction, on the other hand, the cooling box 3 links together with the exhaust device 2, has formed a module, and radiator unit can wholly arrange, also can wholly carry out position change, dismantlement maintenance etc. the operation of being convenient for. For example, the air exhaust device 2 is a fan, and includes blades and a housing for fixing the blades, and the housing is connected to the box body of the cooling box 3, or the housing is connected to the wall of the cooling box 3.

The exhaust device 2 and the cooling box 3 can be detachably connected by fasteners, and thus, are convenient to detach and connect.

In some embodiments, at least two air exhausting devices 2 are connected to the single-side wall of the cooling box 3, so that the generated air flow can be increased, and the heat dissipation effect can be enhanced.

In some embodiments, a plurality of liquid flow passages are arranged in the cooling box 3, for example, a plurality of liquid flow passages extend along the length direction of the cooling box 3, are arranged along the width direction, and are connected in series at the head end and the tail end or at one end.

The box body material of the cooling box 3 includes metal, for example, the box wall of the side connected with or close to the air exhausting device 2 is made of metal, or the whole box body is made of metal, which is more beneficial to heat conduction and exchange, and enhances the cooling efficiency of the cooling box 3 to the surrounding air.

The box wall of the box body 6 is provided with a pipeline joint, the box body 6 is also internally provided with a liquid supply pipeline, and the liquid supply pipeline is connected with a liquid supply system outside the box body 6 through the pipeline joint on the box body 6 and continuously replaces the cooling medium in the cooling box 3. Particularly, the liquid supply pipeline includes feed liquor pipe and drain pipe, and one end of feed liquor pipe links to each other with a feed liquor pipe joint on the box 6, and the other end links to each other with the medium entry of cooling box 3, and one end of drain pipe links to each other with a drain pipe joint on the box 6, and the other end links to each other with the medium export of cooling box 3.

The pipe joints on the box 6 are all located on the same side wall of the box 6, such as a first side wall, and the first side wall may be a side wall in the length direction of the box 6 or a side wall in the width direction. So, the pipeline of outside liquid cooling system arrange in 6 one side of box can, easily realize the operation of being connected and breaking off of box 6 and outside liquid cooling system.

In some embodiments, one end of the liquid supply pipeline is connected with the cooling box 3 through a joint and is detachably connected with the other end of the liquid supply pipeline is detachably connected with a pipeline joint on the box body 6. So, the whole convenient to detach of liquid supply pipeline changes or maintains, and each part of being convenient for arranges in box 6, also is convenient for adjust the position of arranging of pipeline in box 6.

As shown in fig. 1, a medium inlet of the cooling tank 3 is provided with a liquid inlet joint 4, and a medium outlet is provided with a liquid outlet joint 5. As shown in fig. 3, the tank 6 is provided with a liquid inlet main joint 9 and a liquid outlet main joint 10. One end of a liquid inlet pipe of the liquid supply pipeline is connected with a liquid inlet main joint 9, the other end of the liquid inlet pipe is connected with a liquid inlet joint 4 on the cooling box 3, one end of a liquid outlet pipe is connected with a liquid outlet main joint, and the other end of the liquid outlet pipe is connected with a liquid outlet joint 5 on the cooling box 3.

The heat dissipation assembly is located in the box body 6, can be connected to the box wall and can be arranged close to the circuit board, and therefore the circuit board can be dissipated in a targeted mode.

The circuit board in the box 6 comprises a first circuit board 1, the first circuit board 1 can be a power board, the circuit board further comprises a second circuit board 11, and the second circuit board 11 is a control board, so that circuit elements are divided into two circuit boards, the heat influence of the power board with large heat generation quantity on the control board is reduced, and the heat dissipation component can cool and dissipate the first circuit board 1 in a targeted manner, so that the heat dissipation efficiency can be further improved.

In some embodiments, as shown in fig. 2 and fig. 4, the heat dissipation assembly is located on one side of a front board surface (the board surface with the component is referred to as the front board surface) of the first circuit board 1 with the component, and is connected to one end of the front board surface of the first circuit board 1, and the air outlet of the air exhausting device 2 faces the other end of the first circuit board 1. So set up, the low temperature air current that exhaust device 2 blew out at first blows to each components and parts on the first circuit board 1 again, and the low temperature air current is in the top of the positive face of first circuit board 1, from the one end flow direction to the other end of first circuit board 1, and all components and parts regions of way first circuit board 1 comprehensively and effectual absorption first circuit board 1 goes up the heat that each components and parts produced, to each high-efficient cooling of components and parts.

In some embodiments, the circuit board includes at least two first circuit boards 1, and the at least two first circuit boards 1 may be arranged side by side in the box 6, for example, along the width direction of the box 6. As shown in fig. 3, one end of each first circuit board 1 is connected to a heat dissipation assembly, and an air outlet of the heat dissipation assembly faces the other end of the first circuit board 1. With the arrangement, each circuit board with large heat generation quantity in the box body 6 is provided with an independent heat dissipation assembly, and each heat dissipation assembly is connected to the corresponding circuit board, so that airflow is firstly and intensively blown to each component on the circuit board, and the heat dissipation effect is obviously enhanced; meanwhile, it can be stated that the circuit board in the box body 6 is provided with at least two first circuit boards 1, the power supply has high power, and the structure of the heat dissipation assembly provided by the embodiment can improve the heat dissipation efficiency by pertinently cooling and dissipating heat of each power board, and can more comprehensively prolong that each circuit component is not overheated and damaged, so that the heat dissipation efficiency is high enough for effectively dissipating heat of a high-power supply, and the charging and discharging power supply applied to the chemical composition and capacitance process can have good heat dissipation performance and prolong the service life.

When the heat dissipation assemblies are at least two, the liquid supply pipeline is provided with a liquid inlet main pipe 7 and a liquid outlet main pipe 8, the medium inlets of the cooling boxes 3 are connected with the liquid inlet main pipe 7 of the liquid supply pipeline, the liquid outlets of the cooling boxes are connected with the liquid outlet main pipe 8 of the liquid supply pipeline, and two pipeline joints respectively connected with the liquid inlet main pipe 7 and the liquid outlet main pipe 8 are arranged on the first side wall of the box body 6. With such an arrangement, only two pipeline joints, such as a liquid inlet main joint 9 and a liquid outlet main joint 10, need to be arranged on the side wall of the box body 6 to connect the liquid supply pipeline with an external liquid supply system.

When the number of the heat dissipation assemblies is at least two, the liquid supply pipelines can respectively supply liquid to each heat dissipation assembly, and can also supply liquid through one serial pipeline, namely, each cooling box 3 can be arranged in parallel or in series. In the preferred embodiment, each cooling box 3 is connected in series in a pipeline, so that excessive pipeline branches for liquid inlet and outlet are not needed, and the influence on the arrangement of components in the box body 6 caused by excessive pipelines is avoided.

Further, in order to increase the contact between the airflow and the first circuit board 1, in some embodiments, an air guiding assembly is further disposed on the front surface of the first circuit board 1 having components, so that the airflow can better flow along the front surface of the first circuit board 1. Specifically, as shown in fig. 4, the heat dissipation assembly is located on the front board surface of the first circuit board 1 having the components and parts, and is located at one end of the front board surface of the first circuit board 1 in the length direction, the air outlet of the air exhaust device 2 faces the other end of the front board surface of the first circuit board 1 in the length direction, the air guide assembly comprises two air deflectors 12 located on two sides of the first circuit board 1 in the width direction, the two air deflectors 12 are respectively arranged on two sides of the heat dissipation assembly, and are also located on two sides of the air outlet of the air exhaust device 2, so that the two air deflectors 12 have a gathering effect on the air flow generated by the air exhaust device 2, the air flow of the large subsection is blown between the two air deflectors 12, and is blown to the other end from one end of the first circuit board 1, and the air loss is effectively reduced.

The air guide assembly further comprises an air guide plate 13 located above the front plate surface of the first circuit board 1, the air guide plate 13 and the first circuit board 1 are arranged at intervals, and the inclined air outlet relative to the air exhaust device 2 is formed by gradually inclining the air guide plate 13 along the vertical direction along the air outlet direction by taking the first circuit board 1 as an example when being tiled on the horizontal plane, and the distance between the plate surface and the front plate surface of the first circuit board 1 is gradually reduced and the distance between the plate surface and the air exhaust device 2 is gradually increased. So, can press and lead first circuit board 1 with what the air current was gathered together more through the aviation baffle 13 that pushes down gradually, make more low temperature wind be close to and flow along the positive face of first circuit board 1, strengthen the radiating effect.

The embodiment of the application also provides a component capacity equipment, which comprises the charging and discharging power supply of any one of the above embodiments, and also comprises a needle bed. The formation and grading equipment uses the charge and discharge power supply with the structure to perform formation or grading on the battery, and the charge and discharge power supply is high in heat dissipation performance, can avoid damage caused by overheating, is little influenced by the ambient temperature, prolongs the effective service life of the power supply, and also prolongs the effective service life of the formation and grading equipment. The derivation process of the beneficial effect is consistent with the derivation process of the beneficial effect of the charging and discharging power supply, and details are not repeated here.

And because the charge-discharge power supply that this application provided has good heat dispersion, receives ambient temperature's influence for a short time, can put into the formation partial volume workshop, be close to the setting with the body or the needle bed of formation partial volume equipment, can reduce the operation cost of formation partial volume process.

For example, the chemical composition and content equipment comprises a cabinet frame, and the charging and discharging power supply and the needle bed are both positioned in the cabinet frame for chemical composition and content operation. So, compare in establishing the power at the external current formation partial volume equipment of cabinet, the formation partial volume equipment structure of this embodiment is clean and tidy, and integrated nature is high, has the transport of being convenient for and the beneficial nature of arranging, more can wholly place in the formation workshop, reduces the complexity that equipment arranged, reduces occupation space, reduces the operation cost to a certain extent.

The foregoing describes the general principles of the present application in conjunction with specific embodiments, however, it is noted that the advantages, effects, etc. mentioned in the present application are merely examples and are not limiting, and they should not be considered essential to the various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is for the purpose of illustration and description and is not intended to be limiting, since the foregoing disclosure is not intended to be exhaustive or to limit the disclosure to the precise details disclosed.

The components, devices referred to in this application are meant as illustrative examples only and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the drawings. The components, devices may be connected, arranged, configured in any manner, as will be appreciated by those skilled in the art. Words such as "including," "comprising," "having," and the like are open-ended words that mean "including, but not limited to," and are used interchangeably therewith. The words "or" and "as used herein mean, and are used interchangeably with, the word" and/or, "unless the context clearly dictates otherwise. The word "such as" is used herein to mean, and is used interchangeably with, the phrase "such as but not limited to".

It should also be noted that in the apparatus, devices of the present application, the components may be disassembled and/or reassembled. These decompositions and/or recombinations are to be considered as equivalents of the present application.

The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

It should be understood that the terms "first", "second", and the like used in the description of the embodiments of the present application are only used for clearly illustrating the technical solutions, and are not used for limiting the protection scope of the present application.

The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of example aspects and embodiments have been discussed above, those of skill in the art will recognize certain variations, modifications, alterations, additions and sub-combinations thereof.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modifications, equivalents and the like that are within the spirit and principle of the present application should be included in the scope of the present application.

Claims

1. A charging and discharging power supply is applied to a battery formation and capacity grading process and is characterized by comprising the following steps:

the circuit board is positioned in the box body;

and the cooling box is positioned at the air inlet or the air outlet of the air exhaust device.

2. The charging and discharging power supply according to claim 1, wherein said cooling box is provided at an air inlet side of said air discharging device and opposite to said air inlet.

3. The charging and discharging power supply according to claim 1 or 2, wherein the air exhausting device comprises a fan blade and a housing, and the housing is connected with the cooling box;

and/or at least two air exhausting devices are fixedly connected with one side wall of the cooling box.

4. The charging and discharging power supply according to claim 1, wherein a plurality of liquid flow passages communicated with each other are arranged in the cooling tank along the transverse direction and/or the longitudinal direction;

and/or the box body of the cooling box is made of metal;

and/or a medium inlet of the cooling box is provided with a liquid inlet joint, and a medium outlet of the cooling box is provided with a liquid outlet joint.

5. The charge-discharge power supply according to claim 1, wherein a pipe joint is provided on a wall of the box body, a liquid supply pipe is provided inside the box body, one end of the liquid supply pipe is detachably connected with the cooling box through a joint, and the other end of the liquid supply pipe is detachably connected with a pipe joint on the box body;

and/or the pipeline joints on the box body are all positioned on the first side wall of the box body.

6. The charging and discharging power supply according to claim 1, wherein the circuit board comprises a first circuit board, the heat dissipation assembly is located on one side of a front board surface of the first circuit board, the front board surface is provided with components, the heat dissipation assembly is connected to one end of the front board surface, and an air outlet of the air exhaust device faces to the other end of the front board surface.

7. The charging and discharging power supply according to claim 1 or 6, wherein the circuit board includes at least two first circuit boards, and one end of each of the first circuit boards is provided with the heat dissipation assembly.

8. The charging and discharging power supply according to claim 7, wherein the medium inlet of each cooling box is connected with the liquid inlet header pipe of the liquid supply pipeline, the medium outlet of each cooling box is connected with the liquid outlet header pipe of the liquid supply pipeline, and two pipeline joints respectively connected with the liquid inlet header pipe and the liquid outlet header pipe are arranged on the first side wall of the box body.

9. The charging and discharging power supply according to claim 6, wherein two wind shields are disposed on two sides of the front surface of the first circuit board, an inclined wind deflector is disposed above the front surface, the two wind shields are respectively arranged on two sides of the wind outlet of the wind discharging device, and the distance between the front surface of the wind deflector and the first circuit board is gradually reduced along the wind outlet direction.

10. A chemical component capacity equipment, characterized by comprising a cabinet frame, a needle bed and the charge-discharge power supply according to any one of claims 1-9, wherein the charge-discharge power supply and the needle bed are both positioned in the cabinet frame.