CN216903715U

CN216903715U - Laser heat abstractor and laser instrument

Info

Publication number: CN216903715U
Application number: CN202220373922.7U
Authority: CN
Inventors: 李永辉; 马英俊; 李悦萌
Original assignee: Anhui Guangzhi Technology Co Ltd
Current assignee: First Semiconductor Materials Co ltd
Priority date: 2022-02-23
Filing date: 2022-02-23
Publication date: 2022-07-05
Anticipated expiration: 2032-02-23

Abstract

The disclosure provides a laser heat dissipation device and a laser. The laser heat dissipation device comprises a heat sink, a first fan and a second fan, wherein the heat sink comprises a peripheral wall, the peripheral wall forms a channel which is circumferentially closed and is open at two ends in the axial direction, the peripheral wall is provided with an outer peripheral surface, and the outer peripheral surface is used for mounting components of a laser on the peripheral wall; the first fan and the second fan are respectively arranged at two axial ends of the channel of the radiator and are used for forming airflow which flows in a single direction along the axial direction of the radiator and is used for exchanging heat with a component of the laser installed on the peripheral wall through the peripheral wall so as to radiate heat. The laser comprises the laser heat sink and a laser component mounted on the laser heat sink. Under the condition of equal heat exchange capacity, the length and the width of the required laser heat dissipation device are obviously reduced, and the space using the laser is effectively utilized.

Description

Laser heat abstractor and laser instrument

Technical Field

The present disclosure relates to the field of optics, and in particular, to a heat dissipation device for a laser and a laser.

Background

The ultraviolet laser control box comprises components such as a direct-current power supply, an LD module and a circuit board, and in the working process of the ultraviolet laser, the control box can generate heat to generate a large amount of heat, and the heat can not be dissipated timely to influence the performance of each component.

At present, a direct current power supply depends on natural air cooling and needs to be installed on an aluminum plate with the thickness of 250mm multiplied by 3mm (namely, a single plate-shaped heat exchange aluminum plate) for heat dissipation, so that the overall dimension of the control box is greatly increased, and the heat dissipation efficiency is low.

SUMMERY OF THE UTILITY MODEL

In view of the problems in the background art, it is an object of the present disclosure to provide a heat dissipation device for a laser and a laser, which can improve the heat dissipation capability of components of the laser and reduce the occupied size.

Thus, in some embodiments, a laser heat sink includes a heat sink, a first fan, and a second fan, the heat sink including a peripheral wall forming a channel circumferentially closing both axial end openings, the peripheral wall having an outer peripheral surface for mounting components of a laser thereon; the first fan and the second fan are respectively arranged at two ends of the channel of the radiator in the axial direction, and are used for forming airflow which flows in the axial direction of the radiator in a single direction and is used for exchanging heat with a component of the laser installed on the peripheral wall through the peripheral wall so as to dissipate heat.

In some embodiments, the heat sink further comprises a plurality of fins arranged in two spaced-apart columns, the fins of each column being stacked and spaced apart from each other along a first direction perpendicular to the axial direction, each fin of each column extending along the axial direction and a second direction perpendicular to the axial direction, the second direction intersecting the first direction.

In some embodiments, the fins of the two columns are aligned and spaced apart from each other in the second direction.

In some embodiments, the axial ends of each fin are flush with the axial ends of the peripheral wall, respectively.

In some embodiments, all of the fins are the same size in the first direction and the second direction.

In some embodiments, the outer contour of the projection of the peripheral wall of the heat sink in the axial direction is rectangular, the first direction is an up-down direction, and the second direction is a horizontal direction; the first fan and the second fan are mounted to the peripheral wall at four corners of a rectangle at both ends in the axial direction of the peripheral wall.

In some embodiments, the laser heat sink further comprises a heat conducting block for mounting a laser diode module as one of the components of the laser; the heat-conducting block is attached and fixed on a first outer side surface of the peripheral wall corresponding to one side of the rectangular outer contour.

In some embodiments, the laser heat sink further includes a TEC refrigeration sheet attached and fixed to the first outer side surface of the peripheral wall, the TEC refrigeration sheet being located between the peripheral wall and the heat conduction block.

In some embodiments, a second outer side surface of the peripheral wall corresponding to the other side of the outer contour of the rectangle is used for mounting a direct current power supply as one of the components of the laser, and the second outer side surface is perpendicular to the first outer side surface.

In some embodiments, a laser includes the aforementioned laser heat sink and components of the laser mounted on the laser heat sink.

The beneficial effects of this disclosure are as follows: in the present disclosure, a channel is formed inside the peripheral wall, the laser component is mounted on the outer peripheral surface of the peripheral wall, and the first fan and the second fan are respectively arranged at two axial ends of the channel of the radiator to drive airflow to flow in the channel in a single direction, so that the heat exchange capability of the laser component can be enhanced.

Drawings

Fig. 1 is a perspective view of a laser according to the present disclosure;

FIG. 2 is a front view of FIG. 1;

fig. 3 is a perspective view of a heat sink of the laser.

Wherein the reference numerals are as follows:

100 laser S1 center channel

100a laser diode module S2 side channel

100b DC power supply 111 outer peripheral surface

200 laser heat sink 111a first outer side

1 Heat sink 111b second outer side

L-axis 12 radiating fin

D1 first Direction 2 first Fan

D2 second direction 3 second fan

11 peripheral wall 4 heat conducting block

S channel 5 TEC refrigeration piece

Detailed Description

The accompanying drawings illustrate embodiments of the present disclosure and it is to be understood that the disclosed embodiments are merely examples of the disclosure, which can be embodied in various forms, and therefore, specific details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present disclosure.

Referring to fig. 1-3, laser 100 includes a laser heat sink 200 and components of laser 100 mounted on laser heat sink 200.

The laser heat sink 200 includes a heat sink 1, a first fan 2, and a second fan 3.

The heat sink 1 includes a peripheral wall 11. The peripheral wall 11 forms a passage S circumferentially closing both ends open in the axial direction L. The peripheral wall 11 has an outer peripheral surface 111, the outer peripheral surface 111 being for mounting components of the laser 100 thereon.

In an embodiment, referring to fig. 3, the heat sink 1 further comprises a plurality of fins 12. The plurality of fins 12 are arranged in two spaced-apart columns, the fins 12 of each column are stacked and spaced apart from each other in a first direction D1 perpendicular to the axial direction L, each fin 12 of each column extends in the axial direction L and a second direction D2 perpendicular to the axial direction L, and the second direction D2 intersects the first direction D1. The plurality of radiating fins 12 are arranged at intervals in two rows, so that the space between the two rows forms a central channel S1 for air to flow, the side channels S2 between the main channel and the adjacent radiating fins 12 and between the outermost radiating fins 12 in the second direction D2 and the peripheral wall are communicated, thus the air flow of the central channel can move along the axial direction L without any obstruction, and simultaneously enter the side channels S2 along the second direction D2 based on the principle of minimum resistance, and the air flow entering the side channels S2 can be blocked by the peripheral wall 11 and reflected to the main channel for confluence, and then the enhanced forced flow of the first fan 2 and the second fan 3 is combined, so that the heat exchange effect of the air on the radiating fins 12 and the peripheral wall 11 is greatly enhanced.

In one example, referring to fig. 3, the fins 12 of two columns are aligned and spaced apart from each other in the second direction D2. That is, the corresponding side channels S2 of the two fins 12 aligned in the second direction D2 are aligned with each other, reducing resistance to flow-splitting from the central channel S1 to the side channels S2 on both sides, improving heat exchange capability.

In one example, referring to fig. 3, both ends in the axial direction L of each fin 12 are flush with both ends in the axial direction L of the peripheral wall 11, respectively, thereby completely and completely utilizing the inner space of the peripheral wall 11 and improving the heat exchange capability.

In one example, all the heat dissipation fins 12 have the same size in the first direction D1 and the second direction D2, so that the heat exchange capacity in the first direction D1 and the second direction D2 are the same when the two rows are arranged at intervals, and the uniformity of heat exchange of the peripheral wall 11 is improved.

In the present disclosure, the material of the peripheral wall 11 and the heat sink 12 may be a material with high thermal conductivity, such as aluminum, copper, or the like. The peripheral wall 11 and the heat radiating fins 12 may be integrally formed by die casting, profile extrusion, or the like.

In the example shown in the drawings, the outer contour of the projection of the peripheral wall 11 of the heat sink 1 in the axial direction L is rectangular, the first direction D1 is the up-down direction, and the second direction D2 is the horizontal direction.

The first fan 2 and the second fan 3 are respectively provided at both ends of the passage S of the heat sink 1 in the axial direction L. The first fan 2 and the second fan 3 are used to form an air flow flowing unidirectionally in the axial direction L of the heat sink 1 for heat exchange with the members of the laser 100 mounted on the peripheral wall 11 via the peripheral wall 11 to dissipate heat.

In the example in the figure, the first fan 2 and the second fan 3 are mounted to the peripheral wall 11 at four corners of a rectangle at both ends in the axial direction L of the peripheral wall 11. The mounting process may employ a removable structure, such as by screw mounting or by pins, snap fit, etc.

As shown in fig. 1, in one example, the Laser heat sink 200 further includes a heat conduction block 4, the heat conduction block 4 being used to mount a Laser Diode (LD) module 100a, which is one of the components of the Laser 100; the heat-conducting block 4 is attached and fixed to the first outer side surface 111a of the peripheral wall 11 corresponding to one side of the rectangular outer contour. The heat conducting block 4 is used for enhancing heat exchange. The material of the heat conduction block 4 may be, but is not limited to, metal, and the metal may be, but is not limited to, copper. Likewise, the mounting may be of a removable construction, such as by screw mounting or by pins, snap fit, etc.

As shown in fig. 1, in an example, the laser heat dissipation device 200 further includes a TEC (thermo Electric cooler) cooling plate 5, the TEC cooling plate 5 is attached and fixed to the first outer side surface 111a of the peripheral wall 11, and the TEC cooling plate 5 is located between the peripheral wall 11 and the heat conduction block 4. The TEC refrigeration piece 5 plays a role in enhancing heat exchange, and meanwhile, the advantage of small size of the TEC refrigeration piece 5 is utilized, so that the small-size requirement of the laser 100 can be well met.

As shown in fig. 1, in one example, a second outer side surface 111b of the peripheral wall 11 corresponding to the other side of the outer contour of the rectangle is used to mount a dc power supply 100b as one of the components of the laser 100, and the second outer side surface 111b is perpendicular to the first outer side surface 111 a. Likewise, the mounting may be of a removable construction, such as by screw mounting or by pins, snap fit, etc.

In the present disclosure, the adoption of the outer contour of the rectangle of the peripheral wall 11 enables convenient mounting of the corresponding members of the laser 100 with the corresponding four faces of the rectangle.

In the present disclosure, the gas may be air or other specialized gas, such as nitrogen.

Note that although the terminology of the laser heat sink 200 includes a laser, it can be applied to other fields than a laser based on its heat dissipation characteristics.

In the present disclosure, laser 100 may be, but is not limited to, an ultraviolet laser.

As described above, in the present disclosure, the channel S is formed inside the peripheral wall 11, the components of the laser 100 are mounted on the outer peripheral surface 111 of the peripheral wall 11, the first fan 2 and the second fan 3 are respectively disposed at the two ends of the channel S of the heat sink 1 in the axial direction L to drive the air flow to flow in one direction in the channel S, and the heat exchange capability for the components of the laser 100 can be enhanced.

The above detailed description is used to describe a number of exemplary embodiments, but is not intended to limit the combinations explicitly disclosed herein. Thus, unless otherwise specified, various features disclosed herein can be combined together to form a number of additional combinations that are not shown for the sake of brevity.

Claims

1. A laser heat dissipation device (200) is characterized by comprising a heat sink (1), a first fan (2) and a second fan (3),

the heat sink (1) comprises a peripheral wall (11), wherein the peripheral wall (11) forms a channel (S) which is circumferentially closed and is open at two ends in the axial direction (L), the peripheral wall (11) is provided with an outer peripheral surface (111), and the outer peripheral surface (111) is used for mounting components of the laser (100);

the first fan (2) and the second fan (3) are respectively arranged at two ends of a channel (S) of the radiator (1) in the axial direction (L), and the first fan (2) and the second fan (3) are used for forming airflow which flows in the axial direction (L) of the radiator (1) in a single direction and is used for exchanging heat with a component of the laser (100) installed on the peripheral wall (11) through the peripheral wall (11) to dissipate heat.

2. The laser heat sink (200) according to claim 1,

the heat sink (1) further comprises a plurality of fins (12),

the plurality of fins (12) are arranged in two spaced-apart columns, the fins (12) of each column being stacked and spaced apart from each other in a first direction (D1) perpendicular to the axial direction (L), each fin (12) of each column extending in the axial direction (L) and a second direction (D2) perpendicular to the axial direction (L), the second direction (D2) intersecting the first direction (D1).

3. The laser heat sink (200) according to claim 2,

the fins (12) of the two columns are aligned and spaced apart from each other in the second direction (D2).

4. The laser heat sink (200) according to claim 2,

both ends in the axial direction (L) of each fin (12) are flush with both ends in the axial direction (L) of the peripheral wall (11).

5. The laser heat sink (200) according to claim 2,

all the fins (12) have the same size in the first direction (D1) and the second direction (D2).

6. The laser heat sink (200) according to claim 2,

the outer contour of the projection of the peripheral wall (11) of the radiator (1) in the axial direction (L) is rectangular,

the first direction (D1) is a vertical direction, and the second direction (D2) is a horizontal direction;

the first fan (2) and the second fan (3) are mounted to the peripheral wall (11) at four corners of a rectangle at both ends of the peripheral wall (11) in the axial direction (L).

7. The laser heat sink (200) according to claim 6,

the laser heat dissipation device (200) further comprises a heat conduction block (4), wherein the heat conduction block (4) is used for installing a laser diode module (100a) which is one of the components of the laser (100);

the heat-conducting block (4) is attached and fixed to a first outer side surface (111a) of the peripheral wall (11) corresponding to one side of the rectangular outer contour.

8. The laser heat sink (200) according to claim 7,

the laser heat dissipation device (200) also comprises a TEC refrigeration plate (5),

the TEC refrigeration piece (5) is attached to and fixed on the first outer side surface (111a) of the peripheral wall (11), and the TEC refrigeration piece (5) is located between the peripheral wall (11) and the heat conduction block (4).

9. The laser heat sink (200) according to claim 7,

a second outer side surface (111b) of the peripheral wall (11) corresponding to the other side of the rectangular outer contour is used for mounting a direct current power supply (100b) which is one of the components of the laser (100), and the second outer side surface (111b) is perpendicular to the first outer side surface (111 a).

10. A laser (100) comprising the laser heat sink (200) of any of claims 1-9 and components of the laser (100) mounted on the laser heat sink (200).