CN210864610U

CN210864610U - Server structure

Info

Publication number: CN210864610U
Application number: CN202020138683.8U
Authority: CN
Inventors: 穆冠良
Original assignee: British Virgin Islands Commercial Whale Chain Advanced Co ltd
Current assignee: Bee computing (Hong Kong) Ltd.
Priority date: 2020-01-21
Filing date: 2020-01-21
Publication date: 2020-06-26
Anticipated expiration: 2030-01-21

Abstract

The application discloses a server structure, which comprises an electronic operation module and an airflow generating piece, wherein the electronic operation module comprises a plurality of plates which are arranged at intervals, a plurality of heat source generating elements are arranged on the surface of each plate, each plate is provided with a first end edge and a second end edge which are opposite, and the first end edge of each plate is provided with a vacancy part; the airflow generating piece is arranged on one side of the first end edge of each plate and corresponds to the vacant part, airflow generated by the airflow generating piece passes through the space between the plates from the first end edges of the plates, and the airflow takes away heat sources generated by the heat source generating elements to the outside of the electronic operation module. The first end edge of the plate is provided with the hollow part, so that air flow generated by the air flow generating part can be mixed before entering spaces among the plates through the hollow part, the air flow entering the spaces is uniform, the heat dissipation capacity entering the spaces is average, and the problem of uneven heat dissipation efficiency among the plates is solved.

Description

Server structure

Technical Field

The application relates to the technical field of servers, in particular to a server structure enabling heat dissipation airflow to be uniformly distributed.

Background

The server has a plurality of circuit boards, and the electronic components on each circuit board generate heat during operation, so a fan is usually disposed in the server to generate airflow, so that the airflow can dissipate heat through the electronic components on the circuit boards, thereby preventing the operating state of the electronic components from being affected by the over-temperature of the electronic components. In the prior art, a fan is disposed at an edge of a circuit board, and an airflow generated by the fan enters a space formed by oppositely arranging adjacent circuit boards from the edge of the circuit board, and is dissipated by a heat-generating electronic component along a board surface. Because the fan has different wind speeds at the axis and the edge, and the electronic components are arranged differently on the circuit boards, the flow resistance of each space is also different, so that the air flow entering each space between the circuit boards is not uniformly distributed, and the heat dissipation efficiency of the electronic components on the circuit boards is different. In addition, the air flow tends to generate wind-cut noise at the board edge flowing over the circuit board.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a server structure, solves the uneven problem of radiating efficiency that causes of a plurality of circuit boards inhomogeneous in air flow among the present server.

In order to solve the technical problem, the present application is implemented as follows:

the server structure comprises an electronic operation module and an airflow generating piece, wherein the electronic operation module comprises a plurality of plates which are arranged at intervals, a plurality of heat source generating elements are arranged on the surface of each plate, each plate is provided with a first end edge and a second end edge which are opposite, and the first end edge of each plate is provided with a vacancy part; the airflow generating piece is arranged on one side of the first end edge of each plate and corresponds to the vacant part, airflow generated by the airflow generating piece passes through the space between the plates from the first end edges of the plates, and the airflow takes away heat sources generated by the heat source generating elements to the outside of the electronic operation module.

In the embodiment of the application, the hollow part is formed at the first end edge of the plate, the air flow generated by the air flow generating module can be mixed before entering the spaces among the plates through the hollow part, so that the air flow entering the spaces is homogenized, the heat dissipation capacity entering the spaces is averaged, and the problem of uneven heat dissipation efficiency among the plates is solved. In addition, the air flow can reduce wind-cut noise when flowing through the first end edge of each plate by arranging the hollow part at the first end edge of each plate.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a perspective view of a server structure according to an embodiment of the present application:

FIG. 2 is a front view of the server architecture of FIG. 1;

FIG. 3 is an exploded perspective view of the server architecture of FIG. 1;

FIG. 4 is an exploded view of the server architecture of FIG. 2;

FIG. 5 is a perspective view of the server structure of FIG. 1 with heat conductors and a housing removed;

fig. 6 is a front view of the server architecture of fig. 5.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Please refer to fig. 1, 2, 3 and 4, which are a perspective view of a server structure, a front view of the server structure of fig. 1, an exploded perspective view of the server structure of fig. 1 and an exploded perspective view of the server structure of fig. 2 according to an embodiment of the present application; as shown in the drawings, the present embodiment provides a server structure 100, which includes an electronic operation module 10 and an airflow generating member 21, wherein the electronic operation module 10 includes a plurality of boards 11 arranged at intervals, a board surface of each board 11 has a plurality of heat source generating elements, each board 11 has a first end edge 111 and a second end edge 113 which are opposite, and a vacancy 112 is provided at the first end edge 111 of at least one board 11; the airflow generating member 21 is disposed at one side of the first end edge 111 of each plate 11 and corresponds to the gap 112, the airflow generated by the airflow generating member 21 passes through the plurality of plates 11 from the first end edges 111 of the plurality of plates 11, and the airflow takes away the heat generated by the plurality of heat source generating elements to the outside of the electronic operating module 10.

The server structure 100 shown in fig. 1, 2, 3, and 4 is not shown in the housing of the server for convenience of explanation and for clarity of the main features of the present application. The electronic operating module 10 is a module for performing electronic functions of the server, and includes a plurality of plates 11, and the plurality of plates 11 are spaced apart from each other. A plurality of heat source generating elements (not shown) are provided on the plate member 11. In the present embodiment, the board 11 is a circuit board, and the heat source generating element is an electronic element. Because electronic components, such as processor chips or various high power components, may generate heat during operation. Thereby becoming a plurality of heat source generating elements on the plate member 11. Since excessive temperatures may affect the operation of the electronic components, it is necessary to dissipate heat from the plurality of heat source generating elements to maintain the space between the boards 11 at a proper temperature to ensure the operation efficiency of the electronic operation module 10. An air flow generating member 21 is provided at the first end edge 111 of the plate member 11, and the air flow generating member 21 generates an air flow which enters the space between the plate members 11 from the first end edge 111 of the plate member 11 and flows through the plurality of heat source generating elements to dissipate heat in a forced convection manner. The airflow generating member 21 is disposed corresponding to the gap 112, and in the present embodiment, the gap 112 is aligned with the air outlet of the airflow generating member 21.

In the present embodiment, the plurality of plate members 11 are arranged at equal intervals from each other. In the present embodiment, the plurality of plate members 11 are arranged in parallel with each other. However, the present application is not limited thereto, and the distance between the plates 11 may also be different, for example, the plates 11 are provided with heat conducting assemblies 30 with different structures, and the distance between the plates 11 may be changed according to the heights of the different heat conducting assemblies 30. Each plate member 11 has a rectangular configuration and has a first end edge 111 and a second end edge 113 disposed opposite to each other, and the airflow generating member 21 may be disposed near the first end edge 111 and the second end edge 113. The hollow portion 112 corresponds to the airflow generating member 21, and allows the airflow generated by the airflow generating member 21 to flow in a direction perpendicular to the plate surface of the plate members 11, thereby equalizing the intake amount of each space between the plate members 11.

The server structure 100 of the present application further includes an auxiliary airflow guiding member 22, the auxiliary airflow guiding member 22 is disposed at the second end edge 113 of each board 10 and is opposite to the airflow generating member 21, and the auxiliary airflow guiding member 22 guides the airflow with the heat source to leave the electronic operating module 10 from the second end edge 113. For example, the air outlet end of the airflow generator 21 faces the first end edge 111 to allow air to enter the spaces between the plates 11, and the air inlet end of the auxiliary air guider 22 faces the second end edge 113 to allow air to exit the spaces between the plates 11. In the present embodiment, the airflow generating member 21 and the auxiliary airflow guiding member 22 are both axial fans.

The server structure 100 of the present application further includes a plurality of heat conductive members 30 disposed on the plate surface of each board 11 and thermally connected to the heat source generating element, and the air flow passes through the plurality of heat conductive members 30. The heat conduction assembly 30 is a structure that conducts heat of the heat source generating element to a large surface area, and when the air flow passes through the heat conduction assembly 30, the heat dissipation amount per unit time can be increased, and a rapid cooling effect is achieved. In the present embodiment, the heat conducting member 30 may be, for example, a heat dissipating fin. In addition, in order to prevent the air flow from flowing through an area where heat dissipation is not required (an area where no heat source generating element is present), the server structure 100 of the present application further includes an air flow guide 40 provided on the plate surface of the plate 11, and the air flow passes through the heat source generating element along the air flow guide 40. In the present embodiment, the airflow guiding member 40 is a guiding plate, and is disposed along the heat conducting member 30, and after the airflow enters the space between the plate members 11 from the first end edge 111 of the plate member 11, the airflow is guided by the airflow guiding member 40 to flow through the heat conducting member 30 without entering the region above the plate member 11, which does not need to dissipate heat, as shown in fig. 1 and 3.

Since the larger the amount of air flow passing through the heat source generating element per unit time, the more heat can be taken away, the amount of air flow in each space between the plates 11 is related to the heat dissipation efficiency of the heat source generating element on the plate 11. In addition, since the heat convection efficiency is also related to the physical properties of the air flow and the average speed of the air flow in addition to the heat dissipation structure, in order to enable the heat dissipation efficiency on each board 11 to be averaged, it is desirable that the air flow speeds in the respective spaces between the boards 11 be also approximated in the case where the heat dissipation structure on each board 11 is the same or similar, so as to enable the heat dissipation efficiency to be averaged for each board 11.

Please refer to fig. 5 and 6, which are perspective views of the server structure of fig. 1 for removing the heat conductive element and the housing and a front view of the server structure of fig. 5; in fig. 5 and 6, the heat conduction member 30, the air flow guide member 40, and the auxiliary air guide member 22 are omitted in order to clearly show the space for forming the air flow channel between the plates 11. As shown, the airflow generating member 21 is disposed near the first end edge 111 of each plate member 11. In the case where the flow velocity of the air flow generated by the air flow generating member 21 is uneven, for example, the velocity of the air flow generated by the axial flow fan may be uneven at different positions, and the velocity of the air flow of the intake air at each space between the plate members 11 is different because each space between the plate members 11 corresponds to a different position of the air flow generating member 21 (axial flow fan).

The first end edge 111 department of the plate 11 of the electronic operation module 10 of the application sets up the vacancy portion 112, and the air current that the air current produced 21 can flow in the direction perpendicular to the plate 11 before each space that gets into between the plate 11, namely lets the air current can intensive mixing before each space that gets into between the plate 11, makes the average air flow of air current before each space that gets into between the plate 11 similar to play similar radiating effect to each plate 11.

As shown in fig. 6, in the present embodiment, the cutout 112 is a cutout provided at the first end edge 111 of the plate member 11, and at least one edge of the cutout 112 is linear. At least one edge of the cutout 112 is parallel to the first end edge 111. The edge of the cutout 112 refers to the edge of the plate member 11 that is connected to the first end edge 111 and defines the contour of the cutout 112. In the present embodiment, the edge of the vacancy 112 includes two inclined edges connected to the first end edge 111 and a parallel edge parallel to the first end edge 111, and each position on the parallel edge of the vacancy 112 maintains the same vertical distance with the extension line L of the first end edge 111, but in another embodiment, the edge of the vacancy 112 has a circular arc shape. So that the positions on the edge of the cutout 112 have different vertical distances from the extension line of the first end edge 111. The shape of the edge of the hollow portion 112 (notch) can be determined according to the requirement and is not limited herein. In addition, the width of the gap 112 of each plate 11 may be different from the width of the gap 112 of each plate 11 (or may be the same as the width of the gap) of each plate 11 (or may be different from the width of the gap) of each plate 11 (or may be the same as the width of the gap) of each plate 11).

In the case where the length of the first end edge 111 is large, a plurality of the air flow generating members 21 may be provided at the first end edge 111, and as shown in fig. 5 and 6, two air flow generating members 21 may be provided up and down along the first end edge 111, and each plate member 11 may be provided with a plurality of the cutouts 112 at positions corresponding to the air flow generating members 21.

In addition, in order to avoid the air flow from escaping to other spaces where heat dissipation is not required, the plate 11 at the lowermost portion

The recess 112 (the plate closest to the housing wall) may not be formed, avoiding the air flow from escaping to the space between the housing and the plate 11.

In addition, since the air flow has a high temperature by absorbing heat of the heat source generating element when passing the second end edge 113, in order to smoothly discharge the air flow having a high temperature, the air flow having a high temperature is discharged except that the second air flow generating member 22 is provided at the second end edge 113, and no void portion is provided at the second end edge 113 of the plate member 11.

To sum up, the application provides a server structure, and it sets up a plurality of vacancy portions at the first end edge (inlet end) of each plate, and when the air current that the air current produced got into the space between each plate from the first end edge of each plate, air current accessible vacancy portion flowed in the direction perpendicular with the plate to the air flow that makes the space that gets into between each plate reaches averagely, and then makes the air current average to the radiating efficiency of each plate. In addition, the first and second substrates are,

it should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A server structure is characterized by comprising an electronic operation module and an airflow generating piece, wherein the electronic operation module comprises a plurality of plates which are arranged at intervals, a plurality of heat source generating elements are arranged on the surface of each plate, each plate is provided with a first end edge and a second end edge which are opposite, and the first end edge of at least one plate is provided with a vacancy part; the air flow generating piece is arranged on one side of the first end edge of each plate and corresponds to the vacant part, air flow generated by the air flow generating piece passes through the space between the plates from the first end edges of the plates, and the air flow takes away heat sources generated by the heat source generating elements to the outside of the electronic operation module.

2. The server structure according to claim 1, further comprising an auxiliary flow guide provided at the second end edge of each of the boards and opposite to the airflow generating member, the auxiliary flow guide guiding the airflow with the heat source to exit the electronic operation module from the second end edge.

3. The server structure of claim 1, wherein the void portion comprises at least one notch.

4. The server structure according to claim 3, wherein at least one edge of the cutout portion has a linear or circular arc shape.

5. The server structure of claim 4, wherein at least one edge of the void is parallel to the first end edge.

6. The server structure according to claim 1, further comprising a plurality of heat conductive members respectively provided at the plate surface of each of the boards and corresponding to a plurality of the heat source generating elements.

7. The server structure according to claim 1, further comprising an air flow guide provided on the plate surface of the plate member, the air flow passing through the heat source generating element along the air flow guide.

8. The server structure of claim 1, wherein the board is a circuit board and the heat generating component is an electronic component.

9. The server structure of claim 1, wherein a plurality of said plates are arranged at equal intervals from one another.