CN114189976A - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN114189976A CN114189976A CN202010958356.1A CN202010958356A CN114189976A CN 114189976 A CN114189976 A CN 114189976A CN 202010958356 A CN202010958356 A CN 202010958356A CN 114189976 A CN114189976 A CN 114189976A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- supporting plate
- electronic device
- air hole
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 24
- 230000000149 penetrating effect Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000005452 bending Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
Abstract
An electronic device includes a circuit board and a supporting board. The circuit board comprises at least one air hole penetrating through the circuit board. The supporting plate is fixed beside the circuit board, a gap is formed between the supporting plate and the circuit board, and the airflow passes through at least one air hole of the circuit board and flows through the gap to take away heat accumulated between the circuit board and the supporting plate.
Description
Technical Field
The present invention relates to an electronic device, and more particularly, to an electronic device with improved heat dissipation efficiency.
Background
At present, most of the commercially available display cards are provided with additional supporting back plates, and the main purpose is to prevent the circuit board of the display card from bending, and prevent the parts from being knocked down or prevent the display card from being short-circuited when water cooling leaks. Because of the cost consideration, part of the back plate made of plastic material will obstruct the heat dissipation path of convection and radiation undoubtedly, thereby causing the temperature rise of the electronic parts on the display card and affecting the service life of the product.
Disclosure of Invention
The invention provides an electronic device with better heat dissipation efficiency.
The invention relates to an electronic device, which comprises a circuit board and a supporting plate. The circuit board comprises at least one air hole penetrating through the circuit board. The supporting plate is fixed beside the circuit board, a gap is formed between the supporting plate and the circuit board, and the airflow passes through at least one air hole of the circuit board and flows through the gap to take away heat accumulated between the circuit board and the supporting plate.
In an embodiment of the invention, the supporting plate includes a plurality of walls protruding toward the circuit board to form a flow channel, and the flow channel corresponds to at least one air hole of the circuit board.
In an embodiment of the invention, the supporting plate includes a flow guiding rib protruding toward the circuit board and located in the flow channel, and a height of the flow guiding rib is smaller than a height of the plurality of walls.
In an embodiment of the invention, the circuit board includes a plugging end, and an outlet of the flow channel is far away from the plugging end.
In an embodiment of the invention, the supporting plate includes a through hole, and the air flow passes through at least one air hole of the circuit board, flows through the gap, and flows out of the through hole.
In an embodiment of the invention, the through hole is staggered from the at least one air hole, the circuit board includes a heat source, and the heat source is located between the at least one air hole and a projection position of the through hole to the circuit board.
In an embodiment of the invention, the electronic device further includes a flow guiding element disposed on the circuit board, corresponding to the at least one air hole, and protruding toward a direction away from the supporting plate, wherein the flow guiding element has a wall surface tapering toward a direction approaching the supporting plate.
In an embodiment of the invention, the electronic device further includes a fan, the circuit board includes a first surface and a second surface opposite to each other, the fan is located beside the first surface of the circuit board, the supporting plate is located beside the second surface of the circuit board, and a projection of the fan on the circuit board covers at least one air hole.
In an embodiment of the invention, the electronic device further includes a heat dissipation module including a base and a plurality of fins connected to the base, and a projection of the at least one air hole to the heat dissipation module corresponds to the fins and is located outside the base.
In an embodiment of the invention, the at least one air hole includes a plurality of air holes, and centers of the plurality of air holes are non-collinear.
Based on the above, the electronic device of the invention fixes the supporting plate beside the circuit board to improve the structural strength of the circuit board. In addition, the circuit board of the electronic device of the invention is provided with a through air hole, and a gap is arranged between the support plate and the circuit board. The air current passes through the air holes of the circuit board and flows through the gap between the support plate and the circuit board so as to take away the heat energy accumulated between the circuit board and the support plate, thereby effectively improving the heat convection effect on the back of the circuit board and further improving the heat dissipation efficiency.
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Drawings
Fig. 1 is a schematic diagram of a circuit board according to an embodiment of the invention.
Fig. 2 is a schematic partial cross-sectional view of an electronic device according to an embodiment of the invention.
Fig. 3A is a schematic perspective view of a circuit board and a supporting plate of an electronic device according to another embodiment of the invention.
Fig. 3B is a perspective view of the support plate of fig. 3A.
Fig. 4 is a perspective view of a supporting plate of an electronic device according to another embodiment of the invention.
Fig. 5A is a schematic perspective view of a circuit board and a supporting plate of an electronic device according to another embodiment of the invention.
Fig. 5B is a perspective view of the support plate of fig. 5A.
Fig. 5C is a schematic cross-sectional view of fig. 5A.
Fig. 6 is a schematic cross-sectional view of a circuit board and a supporting plate of an electronic device according to another embodiment of the invention.
Wherein, the reference numbers:
g: gap
100: electronic device
110. 110a, 110 b: circuit board
111: first side
112: second surface
113. 118: heat source
114. 114 a: air hole
115: plug-in terminal
116: flow guiding piece
117: wall surface
120. 120a, 120b, 120 c: supporting plate
121: wall body
122: flow passage
123: an outlet
124: flow guiding rib
125: perforation
130: fan with cooling device
140: heat radiation module
142: base seat
144: fin plate
Detailed Description
The invention will be described in detail with reference to the following drawings, which are provided for illustration purposes and the like:
fig. 1 is a schematic diagram of a circuit board according to an embodiment of the invention. Fig. 2 is a schematic partial cross-sectional view of an electronic device according to an embodiment of the invention. Referring to fig. 1 and fig. 2, an electronic device 100 (fig. 2) of the present embodiment includes a circuit board 110 and a supporting plate 120 (fig. 2). The circuit board 110 is, for example, an expansion card, and the circuit board 110 may be, for example, a PCI-E expansion card (e.g., a video card) or a memory module. In other embodiments, the type of the circuit board 110 is not limited thereto.
As shown in fig. 1, the circuit board 110 has a first surface 111, a second surface 112 and at least one air hole 114 penetrating through the first surface 111 and the second surface 112. In addition, the circuit board 110 includes heat sources 113 and 118, and the heat sources 113 and 118 are, for example, but not limited to, located on the first surface 111. In the present embodiment, the circuit board 110 includes a plurality of air holes 114, and the air holes 114 are located beside the heat sources 113 and 118, for example, located between the heat sources 113 and 118. Of course, in other embodiments, the location and number of the air holes 114 are not limited thereto.
As shown in fig. 2, in the present embodiment, the electronic device 100 further optionally includes a heat dissipation module 140 and a fan 130. The heat dissipation module 140 includes a base 142 and a plurality of fins 144 connected to the base 142. The base 142 of the heat dissipation module 140 is located beside the first side 111 of the circuit board 110 and is thermally coupled to the heat source 113, and the base 142 may also be thermally coupled to the heat source 118 (fig. 1), which will be illustrated below with respect to the portion of the electronic device 100 near the heat source 113, but related structures may also be disposed beside the heat source 118. The base 142 is, for example, an aluminum base, but the material of the base 142 is not limited thereto. The base 142 may be connected to the fins 144 by welding or bonding, and in other embodiments, the base 142 and the fins 144 may be made of the same material and integrally formed. In addition, the fan 130 is located beside the first surface 111 of the circuit board 110 and the heat dissipation module 140.
In the present embodiment, the projection of the air hole 114 to the plane of the fan 130 is located within the range of the fan 130, and the projection of the air hole 114 to the plane of the heat dissipation module 140 is located outside the base 142 and corresponds to the fins 144. This design allows the air of the fan 130 to directly blow toward the air holes 114 of the circuit board 110 through the gaps between the fins 144 without being blocked by the base 142 of the heat dissipation module 140, so as to allow a larger amount of air flow to pass through the air holes 114 of the circuit board 110. Of course, in other embodiments, the positional relationship between the fan 130, the heat dissipation module 140 and the air hole 114 is not limited thereto.
In addition, as shown in fig. 2, the supporting board 120 is fixed beside the circuit board 110, and the supporting board 120 is used to reinforce the circuit board 110, for example. For example, if the circuit board 110 is a PCI-E graphics card, the heat dissipation module 140 and the fan 130 are usually installed for heat dissipation. Because the mass of the heat dissipation module 140 and the fan 130 is large, when the circuit board 110 is horizontally inserted into a slot of a vertical main board (not shown), the circuit board 110 may be bent due to the heavy heat dissipation module 140 and the fan 130, and the supporting plate 120 disposed at one side of the circuit board 110 may be used to reinforce the structural strength of the circuit board 110 to reduce the probability of board bending. The supporting plate 120 may be a metal plate, a plastic plate or other materials, and the material of the supporting plate 120 is not limited thereto.
The supporting plate 120 can be fixed on the circuit board 110 by screw fastening, but in other embodiments, the supporting plate 120 can be fixed on the circuit board 110 by clamping or other methods. A gap G exists between the supporting plate 120 and the circuit board 110. Specifically, in the present embodiment, the supporting board 120 is disposed beside the second surface 112 of the circuit board 110, and has a gap G with the second surface 112 of the circuit board 110. Of course, the relative position of the supporting board 120 and the circuit board 110 is not limited thereto.
As shown in fig. 2, in the embodiment, since the circuit board 110 is provided with the air holes 114, the air flow passes through the air holes 114 of the circuit board 110, flows to the gap G between the second surface 112 of the circuit board 110 and the supporting plate 120, and flows out from between the four sides of the circuit board 110 and the four sides of the supporting plate 120. Therefore, the heat accumulated between the circuit board 110 and the supporting plate 120 can be taken away by the airflow, thereby effectively achieving the heat dissipation effect.
Therefore, no matter the material of the supporting plate 120 is a heat conducting material or a non-heat conducting material, the electronic device 100 of the embodiment can effectively enhance the heat convection between the circuit board 110 and the supporting plate 120 by the design of the circuit board 110 with the air holes 114 formed therein, thereby enhancing the heat dissipation effect.
Fig. 3A is a schematic perspective view of a circuit board and a supporting plate of an electronic device according to another embodiment of the invention. Fig. 3B is a perspective view of the support plate of fig. 3A. Referring to fig. 3A and 3B, the main difference between the present embodiment and the previous embodiment is that, firstly, in fig. 1, the centers of the air holes 114 are not collinear. That is, the air holes 114 are substantially aligned in a row, but are slightly staggered. Such a design may reduce the effect of providing the through air holes 114 on the circuit board 110 on the structural strength of the circuit board 110. In one embodiment, any air hole 114 and the adjacent air holes 114 can be completely staggered instead of being arranged in a row, thereby effectively improving the structural strength. In fig. 3A, the centers of the air holes 114a of the circuit board 110a are collinear.
Second, as shown in fig. 3B, in the present embodiment, the supporting plate 120a includes a plurality of walls 121 protruding toward the circuit board 110 to form a flow channel 122, and the flow channel 122 corresponds to the air hole 114a of the circuit board 110 a. Therefore, the air flows through the air holes 114a of the circuit board 110a into the flow channels 122 of the support plate 120a and out along the flow channels 122. Thus, the airflow can flow out along a specific direction. The designer can adjust the direction, width, and number of the runners 122 as required to achieve the desired heat dissipation effect.
In addition, in the embodiment, the circuit board 110a includes a plug end 115, and the outlet 123 of the flow channel 122 may be far from the plug end 115. The plug terminal 115 is, for example, a terminal of a PCI-E interface, but is not limited thereto. For example, in fig. 3A, the plug end 115 is located at the lower part, and the support plate 120a has two flow channels 122, and the upward flow channel 122 is far from the plug end 115, so that the air flow can flow in a wider direction. Of course, the outlet 123 of the flow channel 122 may also face the plug end 115, and the flow channel 122 facing downward in fig. 3A may guide the airflow to the main board, thereby further dissipating heat from the components on the main board.
Fig. 4 is a perspective view of a supporting plate of an electronic device according to another embodiment of the invention. Referring to fig. 4, a main difference between the supporting plate 120B of the present embodiment and the supporting plate 120a of fig. 3B is that in the present embodiment, the supporting plate 120B includes a flow guide rib 124 protruding from the upper surface and located in the flow channel 122, and a height of the flow guide rib 124 is smaller than a height of the wall 121. The design of the guide ribs 124 may help to direct the flow of air, which may effectively reduce pressure drop.
Fig. 5A is a schematic perspective view of a circuit board and a supporting plate of an electronic device according to another embodiment of the invention. Fig. 5B is a perspective view of the support plate of fig. 5A. Fig. 5C is a schematic cross-sectional view of fig. 5A. Referring to fig. 5A to 5C, a main difference between the supporting plate 120C of the present embodiment and the supporting plate 120a of fig. 3B is that in fig. 3A, air flows out from between the circuit board 110a and the supporting plate 120 a. In the present embodiment, the supporting plate 120C includes a through hole 125 (fig. 5C). The air flows through the air holes 114 of the circuit board 110, through the flow channels 122 and out of the through holes 125 of the support plate 120 c. That is, in the present embodiment, the air flow flows out from behind the support plate 120 c.
As shown in fig. 5C, in the present embodiment, the through hole 125 of the supporting plate 120C is offset from the air hole 114, and the heat source 113 of the circuit board 110 is located between the air hole 114 and the projection position of the through hole 125 to the circuit board 110. Therefore, when the air flows through the air holes 114 of the circuit board 110, flows through the flow channel 122, and flows out of the through holes 125 of the supporting plate 120c, heat can be taken away from the heat source 113, and the heat can be dissipated from the heat source 113.
Fig. 6 is a schematic cross-sectional view of a circuit board and a supporting plate of an electronic device according to another embodiment of the invention. Referring to fig. 6, the main difference between the present embodiment and the embodiment of fig. 5C is that in the present embodiment, a flow guiding element 116 is disposed on the first surface 111 of the circuit board 110. The flow guide 116 corresponds to the air hole 114 and protrudes toward a direction away from the support plate 120 c.
In the present embodiment, the flow guide 116 has a wall surface 117 that is tapered toward (below) the support plate 120 c. The flow guiding element 116 can be used to guide the airflow into the air holes 114 of the circuit board 110, and since the flow guiding element 116 has a tapered wall 117, the wider portion can increase the airflow passing through the air holes 114, and the narrower portion can accelerate the airflow passing through, thereby improving the heat dissipation effect.
In summary, the electronic device of the present invention fixes the supporting plate beside the circuit board to enhance the structural strength of the circuit board. In addition, the circuit board of the electronic device of the invention is provided with a through air hole, and a gap is arranged between the support plate and the circuit board. The air current passes through the air holes of the circuit board and flows through the gap between the support plate and the circuit board so as to take away the heat energy accumulated between the circuit board and the support plate, thereby effectively improving the heat convection effect on the back of the circuit board and further improving the heat dissipation efficiency.
The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. An electronic device, comprising:
a circuit board including at least one air hole therethrough; and
and the supporting plate is fixed beside the circuit board, a gap is formed between the supporting plate and the circuit board, and the airflow passes through the at least one air hole of the circuit board and flows through the gap so as to take away the heat accumulated between the circuit board and the supporting plate.
2. The electronic device of claim 1, wherein the supporting plate comprises a plurality of walls protruding toward the circuit board to form a flow channel, and the flow channel corresponds to the at least one air hole of the circuit board.
3. The electronic device of claim 2, wherein the supporting plate comprises a guiding rib protruding toward the circuit board and located in the flow channel, and a height of the guiding rib is smaller than a height of the walls.
4. The electronic device of claim 2, wherein the circuit board includes a plug end, and an outlet of the flow channel is far from the plug end.
5. The electronic device of claim 1, wherein the supporting plate comprises a through hole, and the air flow passes through the at least one air hole of the circuit board, flows through the gap and flows out of the through hole.
6. The electronic device of claim 5, wherein the through hole is offset from the at least one air hole, and the circuit board comprises a heat source located between the at least one air hole and a projected position of the through hole on the circuit board.
7. The electronic device of claim 1, further comprising:
a flow guiding element, which is arranged on the circuit board, corresponds to the at least one air hole and protrudes towards the direction far away from the supporting plate, and the flow guiding element is provided with a wall surface gradually reducing towards the direction close to the supporting plate.
8. The electronic device of claim 1, further comprising:
the circuit board comprises a first surface and a second surface which are opposite, the fan is positioned beside the first surface of the circuit board, the supporting plate is positioned beside the second surface of the circuit board, and the projection of the fan to the circuit board covers the at least one air hole.
9. The electronic device of claim 1, further comprising:
the heat dissipation module comprises a base and a plurality of fins connected with the base, and the projection of the at least one air hole to the heat dissipation module corresponds to the fins and is positioned outside the base.
10. The electronic device of claim 1, wherein the at least one air hole comprises a plurality of air holes, and a plurality of centers of the plurality of air holes are non-collinear.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010958356.1A CN114189976A (en) | 2020-09-14 | 2020-09-14 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010958356.1A CN114189976A (en) | 2020-09-14 | 2020-09-14 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114189976A true CN114189976A (en) | 2022-03-15 |
Family
ID=80600699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010958356.1A Pending CN114189976A (en) | 2020-09-14 | 2020-09-14 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114189976A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI292694B (en) * | 2006-08-29 | 2008-01-11 | ||
| CN102238856A (en) * | 2010-04-28 | 2011-11-09 | 宏碁股份有限公司 | Radiating system and radiating method |
| CN102591433A (en) * | 2011-01-10 | 2012-07-18 | 技嘉科技股份有限公司 | Radiation module and electronic device with same |
| CN102819300A (en) * | 2011-06-08 | 2012-12-12 | 技嘉科技股份有限公司 | Radiator and electronic device structure |
| CN110325015A (en) * | 2018-03-30 | 2019-10-11 | 光宝电子(广州)有限公司 | Electronic device |
| US20200053910A1 (en) * | 2018-08-10 | 2020-02-13 | Giga-Byte Technology Co.,Ltd. | Fan expansion card and motherboard module |
-
2020
- 2020-09-14 CN CN202010958356.1A patent/CN114189976A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI292694B (en) * | 2006-08-29 | 2008-01-11 | ||
| CN102238856A (en) * | 2010-04-28 | 2011-11-09 | 宏碁股份有限公司 | Radiating system and radiating method |
| CN102591433A (en) * | 2011-01-10 | 2012-07-18 | 技嘉科技股份有限公司 | Radiation module and electronic device with same |
| CN102819300A (en) * | 2011-06-08 | 2012-12-12 | 技嘉科技股份有限公司 | Radiator and electronic device structure |
| CN110325015A (en) * | 2018-03-30 | 2019-10-11 | 光宝电子(广州)有限公司 | Electronic device |
| US20200053910A1 (en) * | 2018-08-10 | 2020-02-13 | Giga-Byte Technology Co.,Ltd. | Fan expansion card and motherboard module |
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