TWI407893B - Heat dissipation device - Google Patents

Abstract

A heat dissipation device is used for dissipating heat generated by an electronic device. The heat dissipation device comprises a base attached on the electronic device, a plurality of fins located above the base and a fan mounted on the base. These fins define a receiving space to receive the fan therein. The fan is spaced from these fins.

Description

Heat sink

The invention relates to a light-emitting diode lamp, in particular to a light-emitting diode lamp with waterproof structure.

With the continuous development of the electronic information industry, the frequency and speed of electronic components are also constantly increasing. High-frequency high-speed will make the electronic components generate more and more heat, and the temperature is also higher and higher, which seriously affects the performance and stability of the electronic components during operation. In order to ensure the normal operation of the electronic components, the electronic components must be discharged in time. A lot of heat is generated. To this end, the industry usually installs a heat sink on the surface of the heat-generating electronic components to assist in heat dissipation.

U.S. Patent No. 6,667,884 discloses a heat sink assembly comprising a heat sink mounted to an electronic component and a clip for securing the heat sink to the circuit board. When the electronic component is in operation, the heat it generates is dissipated through the heat sink to the surrounding air to ensure its normal operation.

In order to further improve the heat dissipation efficiency of the heat sink, a fan is further installed on the top of the heat sink, and the heat absorbed by the heat sink is quickly taken away by the high-speed airflow generated by the fan.

It is well known that fans generate vibration during operation and increase fan operation. The noise or abnormal sound, because the fan of the heat sink combination is directly fixed to the top of the heat sink by a fan fixing member, the vibration generated by the fan during operation acts on the heat sink to increase the noise of the heat sink combination. Therefore, the above heat sink combination needs further improvement.

In view of this, it is necessary to provide a heat sink having a fan fixing device and capable of reducing noise.

A heat dissipating device for dissipating heat generated by an electronic component, the heat dissipating device comprising a base in contact with the electronic component, a plurality of heat dissipating fins formed on the base, and a fan mounted on the base, the heat dissipating fins The accommodating space for accommodating the fan is provided, and the fan is disposed apart from the heat dissipating fins.

Compared with the prior art, when the heat dissipation device of the present invention is used, the airflow generated by the fan flows away from the gap between the heat dissipation fins, and also flows away from the through hole on the heat dissipation fin, thereby increasing the heat dissipation efficiency of the heat dissipation device. The fan is directly mounted on the base and is housed in the accommodating space of the heat dissipation fin to avoid direct contact with the heat dissipation fin. In this way, the fan does not frequently collide with the heat dissipation fins during the vibration process to generate noise, and the fan does not vibrate due to the contact of the heat dissipation fins, thereby reducing the noise of the heat dissipation device of the present invention.

The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

10‧‧‧Base

14‧‧‧Connecting plate

16‧‧‧Installation board

18‧‧‧ rod body

20‧‧‧Fan

22‧‧‧Fan frame

24‧‧‧Positioning holes

30‧‧‧ buckle

32‧‧‧Resist the wall

33‧‧‧Flexible wall

34‧‧‧ hook wall

35‧‧‧ reel

36‧‧‧ hook

40‧‧‧heat pipe

42‧‧‧heating section

44‧‧‧heating section

50‧‧‧Fixing fin set

51, 53, 55‧‧‧ through holes

52‧‧‧First heat sink fin

54‧‧‧Second heat sink fins

56‧‧‧ Third heat sink fin

58‧‧‧ Short break

59‧‧‧ long margin

122‧‧‧Substrate

124‧‧‧Base

126‧‧‧ card board

142‧‧ ‧block

144‧‧‧Bump

162‧‧‧ gap

164‧‧‧Installation wall

166‧‧‧ mounting holes

168‧‧‧Blind hole

510‧‧‧ accommodating space

12, 520, 540, 560‧‧‧ ontology

562‧‧‧ accommodating holes

1240‧‧‧ trench

1260‧‧‧Rectangle slotting

1262‧‧‧stop groove

1 is an exploded perspective view of a light-emitting diode lamp of the present invention.

Figure 2 is an exploded perspective view of another angle in Figure 1.

Figure 3 is a perspective assembled view of Figure 1.

4 is a perspective assembled view of FIG. 2.

Referring to FIG. 1 , a heat dissipating device of the present invention is used for dissipating heat to an electronic component (not shown), and includes a base 10 in contact with the electronic component, a fan 20 disposed on the base 10 , and a fan 20 fixed to the fan 20 . The buckle 30 of the base 10, the plurality of heat pipes 40 mounted on the base 10, and the heat supply pipe 40 are disposed on the base 10 and the heat supply pipe 40 is disposed.

The base 10 includes a substantially square body 12, a connecting plate 14 extending horizontally from one end of the body 12, and two opposite ends extending from the opposite ends of the connecting plate 14 and extending perpendicularly to the connecting plate 14 Board 16.

Referring to FIG. 2, a rectangular opening (not shown) is formed in the body 12 of the base 10 for receiving a substrate 122. The substrate 122 is adjacent to one side of the body 12 of the base 10 and away from the other opposite side of the body 12. The base plate 122 defines a square hole (not shown) at a substantially central position for receiving a base 124. The bottom surface of the pedestal 124 is attached to the electronic component to absorb heat generated by the electronic component. A groove 1240 parallel to one side of the base 124 is defined in the top of the base 124 for receiving the heat pipe 40. The side of the body 12 of the base 10 that is far from the one of the mounting plates 16 is bent from the bottom thereof to form a card 126. The card 126 is parallel to the side of the body 12 and forms a rectangular slot with the side. The extension of the card 126 is equivalent to the length of the side of the body 12. The top of the card 126 is provided with a stop groove 1262.

The top surface of the connecting plate 14 is beyond the top surface of the body 12 of the base 10. In other embodiments, the top surface of the connecting plate 14 may not exceed the top surface of the body 12. In the present embodiment, the two triangular shaped stoppers 142 extend vertically upward from opposite ends of the top surface of the connecting plate 14 and vertically abut against the mounting plate 16. The front end faces of the second stops 142 are in a plane to The fan 20 is attached. The two protrusions 144 are respectively formed vertically extending from the front side of the second block 142. Each of the protrusions 144 is spaced apart from the corresponding mounting plate 16 to facilitate the installation of the fan 20.

The top surface of the mounting plate 16 extends beyond the top surface of the connecting plate 14. The mounting plate 16 defines a notch 162 for engaging with the clip 30 away from one end of the connecting plate 14 . Two cylindrical rods 18 are correspondingly inserted into the notches 162. Two opposite mounting walls 164 are formed on both sides of the notch 162. One of the mounting walls 164 of one of the cutouts 162 of the left end of the connecting plate 14 defines a mounting hole 166, and a blind hole 168 is defined at a position of the other mounting wall 164 opposite to the mounting hole 166. One of the rods 18 passes through the mounting hole 166 and is inserted or riveted into the blind hole 168 corresponding to the mounting hole 166. The other rod 18 is located between the two mounting walls 164 of one of the notches 162 at the right end of the web 14. The length of the rod 18 at the left end of the connecting plate 14 is greater than the length of the rod 18 at the right end of the connecting plate 14 to prevent the rod 18 at the left end of the connecting plate 14 from coming off the mounting hole 166.

The buckle 30 is integrally stamped and formed by a metal sheet for mounting on a mounting plate 16 at one end of the body 12 of the base 10. The buckle 30 includes a pressing wall 32 and opposite ends of the pressing wall 32. The abutting wall 32 is outwardly inclined (i.e., away from the body 12 of the base 10) to form two resilient walls 33. The end of each resilient wall 33 extends toward the mounting plate 16 to form a hook wall 34. Which corresponds to the above connection The free end of the hook wall 34 of the rod 18 at the left end of the plate 14 is bent inwardly to extend out of a reel 35 to be placed over the rod 18. Another free end of the hook wall 34 corresponding to the rod body 18 at the right end of the connecting plate 14 is bent inwardly to extend a hook 36 for engaging with the rod body 18.

The number of the heat pipes 40 described above is three, and each heat pipe 40 is disposed substantially in a "U" shape. Each heat pipe 40 has a horizontal heat absorption section 42 and two heat release sections 44 connected to the heat absorption section 42 and extending vertically upward. The endothermic sections 42 are adjacent to each other and arranged in parallel. The heat absorbing segments 42 are received in the trenches 1240 disposed at the top of the pedestal 124 for absorbing the heat absorbed by the susceptor 124 from the electronic components. The heat release sections 44 are spaced apart from each other and disposed in parallel to be disposed in the heat dissipation fin set 50.

The heat dissipation fin set 50 includes a plurality of first heat dissipation fins 52 , a plurality of second heat dissipation fins 54 , and a third heat dissipation fin 56 . The positional relationship of the heat dissipation fins 52, 54 and 56 is: the first heat dissipation fin 52 is at the uppermost layer; the second heat dissipation fin 56 is at the lowermost layer; the second heat dissipation fin 54 is at the first heat dissipation fin 52 and The middle position of the three heat sink fins 56.

The heat dissipation fins 52, 54 and 56 are substantially rectangular metal sheets, each having a body 520, 540, 560 of the same size and parallel to each other, and the bodies 520, 540 of the heat dissipation fins 52, 54, 56, A plurality of through holes 51 are defined in the 560 for the heat releasing portion 44 of the heat pipe 40 to pass through and the plurality of circular through holes 53. A rectangular through hole 55 is defined in the front portion of the bodies 520, 540, and 560 near the right side. The bodies 520, 540 of the heat dissipating fins 52, 54 extend vertically downward from the opposite edges to form a short flange 58. The short flange 58 of the heat sink fins The sheets 52, 54 are spaced apart by the same distance.

The body 560 of the third heat dissipating fin 56 extends vertically downward from the opposite long edges to form a long flange 59. The width of the long flange 59 is wider than the short flange 58. The bottom surface of one of the long flanges 59 is placed in the stopping groove 1262 of the body 12 of the base 10 to limit the vertical movement of the heat dissipation fins 56 and to support the heat dissipation fin set 50.

Each of the heat dissipation fins 54 and 560 has a receiving hole 562 formed in the front portion of the heat sinking fins 54 and 560. The receiving holes 562 form an accommodating space 510 to receive the fan 20 . A positioning hole 24 is defined in each of the four corners of the fan frame 22 of the fan 20.

Referring to FIG. 3 and FIG. 4 simultaneously, in the assembly, the heat absorption section 42 of the heat pipe 40 is first welded into the groove 1240 of the base 124 of the body 10 of the base 10, and the heat release section 44 of the heat pipe 40 is correspondingly inserted into the groove 1240. One of the long fins 59 of the third heat sink fin 56 is embedded in the stop groove 1262 of the body 12 of the base 10 of the base 10 of the heat sink fins 52, 54 and 56. The rod 18 at the left end of the connecting plate 14 passes through the mounting hole 166, further penetrates into the reel 35 of the clip 30, and is inserted or riveted into the blind hole 168 corresponding to the mounting hole 166; the fan 20 The bottom of the fan is inserted into the accommodating space 510 of the heat dissipating fin set 50, and the protruding post 144 of the connecting plate 14 of the base 10 is inserted into the positioning hole 24 at the lower end of the fan 20, and the free end of the clip 30 is pushed. The fan 20 is close to the hook 18 of the clip 30 and the rod 18 at the right end of the connecting plate 14 is buckled. At this time, the pressing wall 32 of the clip 30 abuts against the fan frame 22 of the fan 20 to prevent The fan 20 is detached. Thus, the heat sink of the present invention is assembled.

Compared with the prior art, during the use of the heat dissipating device of the present invention, the airflow generated by the fan 20 flows away from the gap of the heat dissipating fin set 50, and also passes through the through holes of the heat dissipating fins 52, 54, 56. 53, 55 flow away, increasing the heat dissipation efficiency of the heat sink; the fan 20 is directly mounted on the base 10 and housed in the accommodating space 510 of the heat sink fin set 50, avoiding direct contact with the heat sink fins 52, 54, 56 contact. In this way, the fan 20 does not frequently collide with the heat dissipation fins 52, 54, 56 during the vibration to generate noise, and does not cause the heat dissipation fins 52 due to the contact of the fan 20 with the heat dissipation fins 52, 54, 56. The vibration of 54, 56, thereby reducing the noise of the heat sink of the present invention.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧Base

14‧‧‧Connecting board

16‧‧‧Installation board

20‧‧‧Fan

22‧‧‧Fan frame

24‧‧‧Positioning holes

30‧‧‧ buckle

40‧‧‧heat pipe

42‧‧‧heating section

44‧‧‧heating section

50‧‧‧Fixing fin set

51, 53, 55‧‧‧ through holes

52‧‧‧First heat sink fin

54‧‧‧Second heat sink fins

56‧‧‧ Third heat sink fin

58‧‧‧ Short break

59‧‧‧ long margin

126‧‧‧ card board

510‧‧‧ accommodating space

12, 520, 540, 560‧‧‧ ontology

562‧‧‧ accommodating holes

1262‧‧‧stop groove

Claims (11)

A heat dissipating device for dissipating heat generated by an electronic component, the heat dissipating device comprising a base in contact with the electronic component, a plurality of heat dissipating fins formed on the base, a fan and a buckle for mounting the fan on the base The improvement is that the heat dissipation fins have a receiving space for receiving the fan, and the fan is disposed apart from the heat dissipation fins, and the heat dissipation fins are further provided with a through hole for the airflow generated by the fan to pass through. The heat dissipation device of claim 1, wherein each of the heat dissipation fins comprises a body parallel to the base, and the plurality of heat pipes are connected to the base and the body of the heat dissipation fins. The heat dissipating device of claim 1, wherein the base comprises a body, a connecting plate extending horizontally from a side of the body, and opposite ends of the connecting plate and perpendicular to the connecting plate Continue to extend the second mounting plate. The heat dissipating device of claim 3, wherein the opposite ends of the connecting plate are formed with two stops, the two blocks extending vertically upward from the top surface of the connecting plate and perpendicular to the mounting plate. The heat dissipating device of claim 4, wherein one side of each of the stoppers extends vertically outward to form a protrusion, and the protrusion is inserted into the bottom of the fan. The heat sink of claim 3, wherein one end of the clip is pivotally connected to one of the mounting plates, and the other end is snapped to the other mounting plate to press against the bottom of the fan. The heat dissipation device of claim 3, wherein the two mounting plates are far A notch is formed at one end of the connecting plate, and the two rods are correspondingly inserted into the notch. The heat dissipating device of claim 7, wherein the buckle is integrally stamped and formed from a metal sheet, and comprises a pressing wall and an outer side of the pressing wall obliquely extending outwardly from the pressing wall to form two elastic The wall, each resilient wall end extending toward the mounting plate to form a hook wall. The heat dissipating device of claim 8, wherein the free end of the hook wall is bent inwardly to extend a hook, and the free end of the other hook wall is bent inwardly to extend a reel, the reel The sleeve is placed on one of the rods, and the hook is engaged with the other rod body, and the pressing wall abuts against the fan. The heat dissipating device of claim 2, wherein the heat dissipating fins of the heat dissipating fins are vertically extended downwardly from the opposite long edges of the main body of the heat dissipating fins. edge. The heat dissipating device of claim 10, wherein a side of the base of the base that is far from the one of the mounting plates is bent from the bottom thereof to form a card, and a top of the card is provided with a stopping groove. The long flange card is placed in the stop groove.