200950684 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，尤其涉及一種具有風扇固 定裝置之散熱裝置。 【先前技術】 Ο 隨著電子資訊業不斷發展，電子元件運行頻率和速度 也於不斷提升。高頻高速將使電子元件產生之熱量越來越 多’溫度也越來越高，嚴重影響著電子元件運行時之性能 和穩定性，為了確保電子元件能正常運行，必須及時排出 電子元件運行所產生之大量熱量。為此，業界通常於該等 發熱電子元件表面安裝一散熱裝置，以辅助其散熱。 ❹ 美國專利第6,667,884號揭示了—種散熱裝置組合，其 包括安裝於電子it件上之散熱器及將散熱器固定於電路板 上之扣具。當電子元件工作時，其產生之熱量經由散熱器 散發至周圍之空氣中，從而確保其正常工作。 為了進纟提间散熱器之散熱效率，還於散熱器頂部 =量;走由風扇產生之高速氣流而迅速地將散熱器 扇運=作之過程中會產生振動，增加風 -風ml ’、曰由於上述散熱裝置組合之風扇藉由 几扇固疋件直翻定至散熱器之頂部 =振動會作用於散熱器上，加大散熱裝置組合之=產 因此’上述散熱裝置組合需要進一步改進。 6 200950684 【發明内容】 有鑒於此，實有必要提供一種具有風扇固定裝置且处 夠降低噪音之散熱裝置。 ％ 一種散熱裝置，用於散發一電子元件產生之熱量，該200950684 IX. Description of the Invention: The present invention relates to a heat sink, and more particularly to a heat sink having a fan fixing device. [Prior Art] Ο With the continuous development of the electronic information industry, the frequency and speed of electronic components are also constantly increasing. High-frequency high-speed will make more and more heat generated by electronic components' temperature is getting higher and higher, which seriously affects the performance and stability of electronic components during operation. In order to ensure the normal operation of electronic components, electronic components must be discharged in time. A lot of heat is generated. To this end, the industry usually installs a heat sink on the surface of the heat-generating electronic components to assist in heat dissipation. U.S. Patent No. 6,667,884 discloses a heat sink assembly comprising a heat sink mounted on an electronic component and a clip for securing the heat sink to the circuit board. When an electronic component is in operation, the heat it generates is dissipated through the heat sink to the surrounding air, ensuring its proper operation. In order to improve the heat dissipation efficiency of the radiator, it is also at the top of the radiator = the amount of high-speed airflow generated by the fan to quickly fan the radiator = vibration will occur during the process, increasing the wind-wind ml ',曰Because the fan of the above-mentioned heat dissipating device is directly turned to the top of the radiator by a few fixing members, the vibration will act on the heat sink, and the combination of the heat dissipating device is increased. Therefore, the above-mentioned heat dissipating device combination needs further improvement. 6 200950684 SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink having a fan fixing device and reducing noise. % A heat sink for dissipating heat generated by an electronic component,
散熱裝置包括與該電子元件接觸之底座、形成於底座上Z 複數散熱韓片及安裝於該底座上之一風扇，該等散熱韓片 開汉有一收容該風扇之容置空間，該風扇與該等散熱鰭 相隔設置。 ❹ 與習知技術相比，本發明散熱裝置使用時，風扇產生 之氣流除了從散熱鰭片之間之空隙流走之外，還從散熱鰭 片上之通孔流走，增加了散熱裝置之散熱效率；上述風扇 直接女裝於底座上，且收容於散熱鰭片之容置空間内，避 免與散熱鰭月直接接觸。這樣，風扇於振動過程中不會頻 繁地與散熱鰭片相碰而產生嚼音，也不會因為風扇與散熱 鰭片接觸而造成散熱鰭片之振動，從而降低本發明散熱裝 ❹置之噪音。 下面參照附圖結合實施例對本發明作進一步之描述。 【實施方式】 請參閱圖1，本發明散熱裝置用於對一電子元件（圖未 示）散熱，其包括一與該電子元件接觸之底座1〇、一置於 該底座10之風扇20、一將風扇2〇固定至底座1〇之扣具 30、安裝於底座1〇上之複數熱管4〇及置於底座上且供 熱管40穿設之一散熱鰭片組5〇。 200950684 上述底座10包括一大致呈方形之本體12、一自本體 _ 12 —端向外水平延伸之一連接板14及自該連接板14之相 對兩端且垂直於連接板14水平向外繼續延伸之二安裝板 16 ° 請同時參閱圖2,上述底座10之本體12上開設有一矩 形開口（圖未示）用以收容一基板122。該基板122靠近底 座10之本體12之一側邊而遠離本體12之另一相對侧邊， 該基板122大致中心位置開設有一方形孔（圖未示）用以 ® 收容一基座124。該基座124之底面與電子元件貼合用以吸 收該電子元件產生之熱量。該基座124之頂部開設有複數 平行於該基座124 —侧邊之溝槽1240用以收容該熱管40。 該底座10之本體12離該其中一安裝板16較遠之侧邊自其 底部彎折形成一卡板126，該卡板126平行於本體12之侧 邊且與該側邊形成一矩形開槽1260，該卡板126之延伸長 度與本體12側邊之長度相當，該卡板126之頂部設有一擋 ❿止槽1262。 上述連接板14之頂面超出上述底座10本體12之頂 面，於其他實施例中，連接板14之頂面可不超出上述本體 12之頂面。於本實施例中，二呈三角形狀之擋塊142自連 接板14之頂面相對兩端垂直向上延伸且垂直抵靠於該安裝 板16，二擋塊142之前端面於一個平面内以與上述風扇20 貼合。二凸柱144分別自二擋塊142之前側面垂直向外延 伸形成，每一凸柱144與其對應之安裝板16相隔設置以方 便安裝上述風扇20。 200950684 ' 上述安裝板16之頂面超出上述連接板14之頂面。該 ‘安裝板16遠離連接板14之一端開設有一用以與扣具30插 合之缺口 162。二圓柱形桿體18對應插入該缺口 162内。 該缺口 162之兩侧形成有二相對之安裝壁164。位於連接板 14左端之一缺口 162之其中一安裝壁164開設有一安裝孔 166，另一安裝壁164内側對應該安裝孔166之位置開設有 一盲孔168。其中一桿體18穿過安裝孔166後，插入或者 鉚入對應該安裝孔166之盲孔168内。另一桿體18位於連 ®接板14右端之一缺口 162之兩安裝壁164之間。位於連接 板14左端之桿體18之長度大於位於連接板14右端之桿體 18之長度，以免位於連接板14左端之桿體18脫離安裝孔 166 ° 上述扣具30由金屬片材一體衝壓成型，其用以安裝於 位於該底座10本體12 —端之安裝板16上，該扣具30包 括一抵壓壁32及自該抵壓壁32兩端相對抵壓壁32向外傾 @斜（即向遠離底座10之本體12之方向）延伸形成二彈性壁 33。每一彈性壁33末端朝向安裝板16延伸形成一鉤壁34。 其中對應位於上述連接板14左端之桿體18之鉤壁34自由 端向内彎折延伸出一捲筒35以套置於該桿體18上。另一 對應位於連接板14右端之桿體18之鉤壁34自由端向内彎 折延伸出一扣鉤36，該扣鉤36用以與該桿體18扣合。 上述熱管40之數量為三，且每一熱管40大致呈“U” 形設置。每一熱管40具有一水平之吸熱段42及與吸熱段 42相連且豎直向上延伸之二放熱段44。該等吸熱段42相 9 200950684 •互靠近且平行設置。該等吸熱段42對應收容於設於上述基 ’座124頂部之溝槽1240内用以吸收該基座124之從電子元 件上吸收來之熱量。上述放熱段44則相互隔開且平行設 置，以穿設於散熱鰭片組50中。 上述散熱鰭片組50包括複數第一散熱鰭片52、複數第 二散熱鰭片54和一第三散熱鰭片56。該等散熱鰭片52、 54、56之位置關係為：第一散熱鰭片52於最上層；第二散 熱鰭片56於最下層；第二散熱鰭片54於第一散熱鰭片52 ® 和第三散熱鰭片56之中間位置。 該等散熱鰭片52、54、56係大致呈矩形之金屬片，均 具有一大小相同且相互平行之本體520、540、560，該等散 熱鰭片52、54、56之本體520、540、560上均開設有複數 通孔51以供上述熱管40之放熱段44穿設和複數圓形通孔 53。該等本體520、540、560之前部靠近右侧邊開設有一 長方形通孔55。該等散熱鰭片52、54之本體520、540自 _ 兩相對之較長邊緣分別垂直一體向下延伸一短折緣58。該 短折緣58將該等散熱鰭片52、54以相同距離間隔。 上述第三散熱鰭片56之本體560自兩相對之較長邊緣 分別垂直一體向下延伸一長折緣59,該長折緣59之寬度比 上述短折緣58寬。其中一長折緣59之底面卡置於上述底 座10之本體12卡板126之擋止槽1262内以限製散熱鰭片 56之垂直方向之移動且起到支撐散熱鰭片組50之作用。 上述每一散熱鰭片54、56之本體540、560靠近前部 開設有一容置孔562，該等容置孔562共同形成一容置空間 200950684 ’ 510以收容該風扇20。上述風扇20之扇框22之四角落分 ―別開設有一定位孔24。 請同時參閱圖3和圖4，裝配時，首先將上述熱管40 之吸熱段42焊設於該底座10之本體12基座124之溝槽 1240内，熱管40之放熱段44對應穿入該等散熱鰭片52、 54、56本體520、540、560之通孔51内使第三散熱鰭片 56之其中一長折緣59嵌置於底座10之本體12卡板126 之擋止槽1262内；上述位於連接板14左端之桿體18穿過 ® 安裝孔166後，進一步穿入上述扣具30之捲筒35内，然 後插入或鉚入對應該安裝孔166之盲孔168内；該風扇20 自下而上穿入散熱鰭片組50之容置空間510内，並使底座 10連接板14之凸柱144對應插入風扇20下端之二定位孔 24内，同時推動扣具30之自由端向風扇20靠近，並使扣 具30之扣鉤36與位於連接板14右端之桿體18相卡扣， 此時，扣具30之抵壓壁32抵靠於風扇20之扇框22上以 _ 防止風扇20脫落。這樣，本發明散熱裝置組裝完成。 與習知技術相比，在本發明散熱裝置之使用過程中， 風扇20產生之氣流除了從散熱鰭片組50之空隙流走之 外，還從散熱鰭片52、54、56上之通孔53、55流走，增 加了散熱裝置之散熱效率；上述風扇20直接安裝在底座10 上，且收容在散熱鰭片組50之容置空間510内，避免與散 熱鰭片52、54、56直接接觸。這樣，風扇20在振動過程 中不會頻繁地與散熱鰭片52、54、56相碰而產生噪音，也 不會因為風扇20與散熱鰭片52、54、56接觸而造成散熱 11 200950684 ‘鰭片52、54、56之振動，從而降低本發明散熱裝置之噪音。 ' 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之立體分解圖。 圖2係本發明散熱裝置之扣具及底座之立體圖。 翁 圖3係本發明散熱裝置之部分組裝圖。 圖4係本發明散熱裝置之立體組裝圖。 【主要元件符號說明】 底座 10 本體 12、520、540、560 基座 124 基板 122 溝槽 1240卡板 126 矩形開槽 1260擋止槽 1262 連接板 14 安裝板 16 擋塊 142 凸柱 144 缺口 162 安裝壁 164 安裝孔 166 盲孔 168 桿體 18 風扇 20 扇框 22 定位子L 24 扣具 30 抵壓壁 32 彈性壁 33 鉤壁 34 12 200950684 捲筒； 35 扣鉤 36 熱管 40 吸熱段 42 放熱段 44 散熱鰭片組50 長折緣 59 容置孔 562 第一散熱鰭片 52 短折緣 58 第二散熱鰭片 54 容置空間 510 第三散熱鰭片56 通孔 51、53、55 eThe heat dissipating device includes a base that is in contact with the electronic component, a plurality of heat-dissipating Korean films formed on the base, and a fan mounted on the base, the heat-dissipating Korean film opening a receiving space for receiving the fan, the fan and the fan Wait for the heat sink fins to be spaced apart.相比 Compared with the prior art, when the heat dissipation device of the present invention is used, the airflow generated by the fan flows away from the gap between the heat dissipation fins, and also flows away from the through hole on the heat dissipation fin, thereby increasing the heat dissipation of the heat dissipation device. Efficiency; the fan is directly worn on the base and is housed in the accommodating space of the fins to avoid direct contact with the fins. In this way, the fan does not frequently collide with the heat dissipation fins to generate the chewing sound during the vibration process, and does not cause the vibration of the heat dissipation fins due to the contact between the fan and the heat dissipation fins, thereby reducing the noise of the heat dissipation device of the present invention. . The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings. [Embodiment] Referring to Figure 1, the heat dissipating device of the present invention is used for dissipating heat to an electronic component (not shown), and includes a base 1 in contact with the electronic component, a fan 20 disposed on the base 10, and a fan The fan 2 is fixed to the base 1 of the buckle 30, the plurality of heat pipes 4 安装 mounted on the base 1 , and the heat supply tube 40 is disposed through the heat dissipation fin set 5 . 200950684 The base 10 includes a substantially square body 12, a connecting plate 14 extending horizontally outward from the body -12, and extending from the opposite ends of the connecting plate 14 and extending perpendicularly to the connecting plate 14 The second mounting plate 16 ° Please refer to FIG. 2 . The body 12 of the base 10 defines a rectangular opening (not shown) for receiving a substrate 122 . The substrate 122 is adjacent to one side of the body 12 of the base 10 and away from the other opposite side of the body 12. The base plate 122 defines a central hole (not shown) for receiving a base 124. The bottom surface of the pedestal 124 is attached to the electronic component for absorbing heat generated by the electronic component. A plurality of grooves 1240 parallel to the sides of the base 124 are defined in the top of the base 124 for receiving the heat pipe 40. The side of the body 12 of the base 10 that is far from the one of the mounting plates 16 is bent from the bottom thereof to form a card 126. The card 126 is parallel to the side of the body 12 and forms a rectangular slot with the side. The extension of the card 126 is equivalent to the length of the side of the body 12. The top of the card 126 is provided with a stop groove 1262. The top surface of the connecting plate 14 is beyond the top surface of the body 12 of the base 10. In other embodiments, the top surface of the connecting plate 14 may not exceed the top surface of the body 12. In the present embodiment, the two triangular shaped stoppers 142 extend vertically upward from opposite ends of the top surface of the connecting plate 14 and vertically abut against the mounting plate 16. The front end faces of the second stops 142 are in a plane to Fan 20 fits. The two protrusions 144 are respectively formed to extend perpendicularly from the front side of the second block 142. Each of the protrusions 144 is spaced apart from the corresponding mounting plate 16 to conveniently mount the fan 20. 200950684 'The top surface of the mounting plate 16 above the top surface of the connecting plate 14 described above. The 'mounting plate 16 defines a notch 162 for engaging with the clip 30 away from one end of the connecting plate 14. Two cylindrical rods 18 are correspondingly inserted into the notches 162. Two opposite mounting walls 164 are formed on both sides of the notch 162. One of the mounting walls 164 of one of the cutouts 162 at the left end of the connecting plate 14 defines a mounting hole 166, and a blind hole 168 is defined in the inner side of the mounting wall 164 opposite to the mounting hole 166. One of the rods 18 passes through the mounting hole 166 and is inserted or riveted into the blind hole 168 corresponding to the mounting hole 166. The other body 18 is located between the two mounting walls 164 of one of the notches 162 at the right end of the connector panel 14. The length of the rod 18 at the left end of the connecting plate 14 is greater than the length of the rod 18 at the right end of the connecting plate 14 so that the rod 18 at the left end of the connecting plate 14 is not separated from the mounting hole 166 °. The above-mentioned clip 30 is integrally stamped from a metal sheet. It is mounted on the mounting plate 16 at the end of the body 12 of the base 10. The buckle 30 includes a pressing wall 32 and the outer end of the pressing wall 32 is inclined outwardly from the pressing wall 32. That is, the two elastic walls 33 are formed to extend away from the body 12 of the base 10. The end of each resilient wall 33 extends toward the mounting plate 16 to form a hook wall 34. The free end of the hook wall 34 corresponding to the rod 18 at the left end of the connecting plate 14 is bent inwardly to extend a reel 35 to be placed on the rod body 18. Another free end of the hook wall 34 corresponding to the rod body 18 at the right end of the connecting plate 14 is bent inwardly to extend a hook 36 for engaging with the rod body 18. The number of the heat pipes 40 described above is three, and each of the heat pipes 40 is disposed in a substantially "U" shape. Each heat pipe 40 has a horizontal heat absorption section 42 and two heat release sections 44 connected to the heat absorption section 42 and extending vertically upward. The endothermic sections 42 phase 9 200950684 • are placed close to each other and in parallel. The heat absorbing segments 42 are received in the grooves 1240 provided at the top of the base portion 124 for absorbing the heat absorbed by the susceptor 124 from the electronic components. The heat release sections 44 are spaced apart from each other and disposed in parallel to be disposed in the heat dissipation fin set 50. The heat dissipation fin set 50 includes a plurality of first heat dissipation fins 52, a plurality of second heat dissipation fins 54, and a third heat dissipation fin 56. The positional relationship of the heat dissipation fins 52, 54 and 56 is: the first heat dissipation fin 52 is at the uppermost layer; the second heat dissipation fin 56 is at the lowermost layer; and the second heat dissipation fin 54 is at the first heat dissipation fin 52 ® and The middle position of the third heat dissipation fin 56. The heat dissipation fins 52, 54 and 56 are substantially rectangular metal sheets, each having a body 520, 540, 560 of the same size and parallel to each other, and the bodies 520, 540 of the heat dissipation fins 52, 54, 56, A plurality of through holes 51 are defined in the 560 for the heat releasing portion 44 of the heat pipe 40 to pass through and the plurality of circular through holes 53. A rectangular through hole 55 is defined in the front portion of the bodies 520, 540, and 560 near the right side. The bodies 520, 540 of the heat dissipating fins 52, 54 extend vertically downward from a relatively long edge to a short flange 58. The short flanges 58 space the heat sink fins 52, 54 at the same distance. The body 560 of the third heat dissipating fin 56 extends vertically downward from a pair of opposite long edges to form a long flange 59. The width of the long flange 59 is wider than the short flange 58. The bottom surface of one of the long flanges 59 is inserted into the stop groove 1262 of the body 12 of the base 10 to limit the vertical movement of the heat dissipation fins 56 and to support the heat dissipation fin set 50. A receiving hole 562 is defined in the body 540, 560 of each of the heat dissipating fins 54 and 56. The receiving hole 562 forms an accommodating space 200950684 510 to accommodate the fan 20. The four corners of the fan frame 22 of the fan 20 are separately provided with a positioning hole 24. Referring to FIG. 3 and FIG. 4, the heat-absorbing section 42 of the heat pipe 40 is first welded into the groove 1240 of the base 124 of the body 10 of the base 10, and the heat-dissipating section 44 of the heat pipe 40 is correspondingly inserted into the groove 1240. One of the long fins 59 of the third heat sink fin 56 is embedded in the stop groove 1262 of the body 12 of the base 10 of the heat sink fins 52, 54 and 56. The rod 18 at the left end of the connecting plate 14 passes through the mounting hole 166, penetrates into the reel 35 of the clip 30, and is inserted or riveted into the blind hole 168 corresponding to the mounting hole 166; the fan 20 penetrates into the accommodating space 510 of the heat dissipating fin set 50 from bottom to top, and the protruding post 144 of the connecting plate 14 of the base 10 is correspondingly inserted into the two positioning holes 24 of the lower end of the fan 20, and simultaneously pushes the free end of the clip 30 Approaching the fan 20 and snapping the hook 36 of the clip 30 to the rod 18 at the right end of the connecting plate 14, at this time, the pressing wall 32 of the clip 30 abuts against the fan frame 22 of the fan 20 to _ Prevent the fan 20 from coming off. Thus, the heat sink of the present invention is assembled. Compared with the prior art, in the use of the heat dissipating device of the present invention, the airflow generated by the fan 20 flows away from the gap of the heat dissipating fin group 50, and also through the through holes on the heat dissipating fins 52, 54, 56. 53, 55 flow away, increasing the heat dissipation efficiency of the heat sink; the fan 20 is directly mounted on the base 10 and housed in the accommodating space 510 of the heat sink fin set 50, avoiding direct contact with the heat sink fins 52, 54, 56 contact. In this way, the fan 20 does not frequently collide with the heat dissipation fins 52, 54, 56 during the vibration to generate noise, and does not cause heat dissipation due to the contact of the fan 20 with the heat dissipation fins 52, 54, 56. The vibration of the sheets 52, 54, 56 reduces the noise of the heat sink of the present invention. In summary, the present invention complies with the patent requirements of the invention and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a heat sink of the present invention. 2 is a perspective view of a clip and a base of the heat sink of the present invention. Figure 3 is a partial assembly view of the heat sink of the present invention. 4 is a perspective assembled view of the heat sink of the present invention. [Main component symbol description] Base 10 Body 12, 520, 540, 560 Base 124 Base plate 122 Groove 1240 Card 126 Rectangular slot 1260 Stop groove 1262 Connecting plate 14 Mounting plate 16 Stop 142 Tab 144 Notch 162 Mounting Wall 164 Mounting hole 166 Blind hole 168 Rod body 18 Fan 20 Fan frame 22 Positioner L 24 Buckle 30 Resistant wall 32 Elastic wall 33 Hook wall 34 12 200950684 Reel; 35 Clasp 36 Heat pipe 40 Heat absorbing section 42 Heat release section 44 Heat sink fin set 50 long flange 59 accommodating hole 562 first heat sink fin 52 short flange 58 second heat sink fin 54 accommodating space 510 third heat sink fin 56 through hole 51, 53, 55 e
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