TW201126127A - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
TW201126127A
TW201126127A TW99101224A TW99101224A TW201126127A TW 201126127 A TW201126127 A TW 201126127A TW 99101224 A TW99101224 A TW 99101224A TW 99101224 A TW99101224 A TW 99101224A TW 201126127 A TW201126127 A TW 201126127A
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TW
Taiwan
Prior art keywords
heat sink
fixing frame
heat
limiting structure
elastic
Prior art date
Application number
TW99101224A
Other languages
Chinese (zh)
Inventor
Heng Liu
Jing Zhang
Original Assignee
Foxconn Tech Co Ltd
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Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW99101224A priority Critical patent/TW201126127A/en
Publication of TW201126127A publication Critical patent/TW201126127A/en

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Abstract

A heat dissipation device includes a heat sink and a holder receiving the heat sink therein. A plurality of protrusions extend inwardly from an inner side of the holder, for limiting the heat sink from movement in a longitudinal direction. The heat sink defines a plurality of recesses in a lateral side thereof. The protrusions extend through corresponding recesses. The holder disposes a plurality of elastic restricting structures. The elastic restricting structures are engaged in corresponding recesses, for limiting the heat sink from rotating about the holder in a direction.

Description

201126127 六、發明說明: 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置,尤其涉及一種帶有固定架之 散熱裝置。 【先前技術】 [0002] 隨著電子產業之迅速發展,電子元件如中央處理器等之 運算速度大幅度提高,其產生之熱量也隨之劇增,如何 將電子元件之熱量散發出去,以保證其正常運行,一直 0 是業界重視之問題。為有效散發中央處理器在運行過程 中產生之熱量,業界通常在電子元件表面加裝一散熱器 ,從而使電子元件自身溫度維持在正常運行範圍内。 [0003] 將散熱器安裝到電路板上之常見手段很多,其中,可以 收容散熱器並可固定到電路板上之固定架就是其中一種 ,然而,習知之固定架通常通過固定架自身上形成彈性 卡扣機構與散熱器預先扣接在一起。雖然這種固定結構 也較為簡單便捷,然,由於固定架作為結構支撐件,其 Ο 強度較大。是故,該固定架需要加大之施加力來使其發 生彈性形變而與散熱器配合,使安裝散熱器之過程較為 困難。 【發明内容】 [0004] 有鑒於此,實有必要提供一種組裝便捷之散熱裝置。 [0005] 一種散熱裝置,包括一散熱器和固定架,所述散熱器收 容在該固定架内,該固定架内側設置有與所述散熱器配 合之限位凸部,以限制該散熱器相對固定架在縱向上移 動,所述散熱器側部形成有供所述限位凸部對應通過之 099101224 表單編號A0101 第3頁/共19頁 0992002447-0 201126127 凹陷部,所述固定架上設置有與所述凹陷部配合之彈性 限位結構,以限制所述散熱器相對於所述固定架沿一時 針方向轉動。 [0006] 上述散熱裝置之散熱器上設置之凹陷部可使固定架内侧 之限位凸部無需變形便可由上而下通過該散熱器,再旋 轉散熱器而無需施加較大之力量便可使固定架與散熱器 緊固在一起,而不存在因為施力過大造成固定架損壞之 可能,可見其組裝便捷。 【實施方式】 [0007] 請參閱圖1和圖2,本發明一些實施例中之散熱裝置可用 於對安裝在電路板40上之發熱電子元件42 (例如,電腦 CPU)進行散熱,該散熱裝置可包括一散熱器10、用來將 散熱器10固定到電路板40上之一固定架20。在一些實施 例中,該固定架20之頂部還安裝有一風扇30,以驅動散 熱器10周圍之空氣進行強制對流,而提高散熱效率。 [0008] 上述散熱器10在一些實施例中可呈圓柱狀,並可採用成 本較為低廉之擠制(例如,鋁擠、銅擠)成型,該散熱 器10包括一導熱柱12和由導熱柱12周面向外發散延伸之 複數散熱片14。該導熱柱12呈圓柱狀設置,導熱柱12底 端面向下凸伸並超出該等散熱片14 (如圖3所示),以與 電子元件42頂表面接觸從而吸收電子元件42之熱量。所 述散熱片14由導熱柱12之圓柱周面均勻向外發散延伸, 每一散熱片14之自由端分叉形成二分支片140,以增加散 熱面積。散熱片14以及分支片140自導熱柱12向外延伸發 散之同時,朝順時針或逆時針之方向彎曲。在本實施例 099101224 表單編號A0101 第4頁/共19頁 0992002447-0 201126127 中,散熱片14以及分支片14〇均按照順時針之方向彎曲。 該散熱器10周面上形成有複數向内凹陷之凹陷部16,每 一凹陷部16是由對應之分支片140表面及兩侧之分支片 140圍成之空間。其中,部分散熱片14之橫向延伸長度( 即由導熱柱12之圓柱面向外延伸長度)小於相鄰之其他 散熱片14之長度,從而在對應短橫向延伸長度之散熱片 14之位置處形成該凹陷部μ。 [0009] Ο 上述風扇30具有一呈扁圓筒狀之扇框32,該扇框32之周 緣向外延伸有四對相互間隔之凸出部34。所述四對凸出 部34關於風扇30軸心對稱分佈於扇框32之周緣,每一對 凸出部34分別靠近扇框32之上下緣,其中靠近扇框μ下 緣之凸出部34與固定架2〇配合,且該凸出部34之底面與 扇框32之下緣齊平。每一凸出部34大致呈直角三角形板 狀,並開設有與固定架2〇配合之一穿孔340。 [0010] ο 上述固定架20在一些實施例中由塑膠_料一體成型,具 有一收容散熱器10之筒體22 »該筒體22在一些實施例中 可呈圓筒狀’其頂部可形成一通風孔24,以供安裝於筒 體22上之風扇30產生之氣流向下吹向散熱器。該通風 孔24之具體形狀可以由筒體22頂端緣向内水準延伸之支 撐板21來進行調整。筒體22由其頂端緣之四均勻間隔處 分別向外水準延伸有承接板26,以承接風扇30之四下緣 凸出部34。每一承接板26垂直向上延伸有一插入凸出部 34穿孔34〇内之固定柱26〇,每一承接板26還在固定柱 260 —側垂直向上延伸有一扣片262,扣片262之上端部 内側向内凸設有倒勾狀卡扣部264,卡扣部264在固定柱 099101224 表單編St Α0101 第5頁/共19頁 0992002447-0 201126127 260插入下緣凸出部34穿孔34〇之同時滑過下緣凸出部以 而抵卡在下緣凸出部34之頂面’從而將風扇3〇固定在固 定架20上。 [0011] [0012] 上述筒體22底端部均勻、間隔向下設置有與該散熱器1〇 凹陷部16對應之安裝腳28。在本實施例中,安裝腳28與 凹陷部16之數量對應為四。每一安裝腳28向外設置有一 安裝筒280 ’每一安裝筒280内穿置一固定件1〇〇。當所 述固定件100向下穿過電路板4〇上位於電子元件42周圍之 安裝孔44 ’可將散熱裝置固定到電子元件42上。每一安 裝腳28内侧向内凸出設置有一限位岛部2¾,該限位凸部 25靠近安裝腳28之底部,且在散熱器1〇收容於該筒體22 内時’該限位凸部25之頂部與散熱器1〇散熱片14之底部 齊平。 請同時參閱圖3 ’上述筒體22内壁向内凸伸有複數支撐凸 部23 ’支撐凸部23緊鄰筒體22頂部之支撐板21,並抵接 . 在散熱器10散熱片14之頂部。該筒體22上設置有與對應 限位凸部2 5周向間隔之至少—^扣合,該卡扣組合包 括一由該筒體22内壁向内凸設之限位結構27以及一設置 在筒體22上並與該限位結構27配合之彈性限位結構220。 該限位結構27垂直於筒體22之頂部支撐板21且靠近安裝 腳28 ’且彈性限位結構22〇與限位結構27間隔且遠離該安 裝腳28 °該筒體22底端部開設有與限位結構27相等數量 之缺口 29,每一缺口 29之靠近限位結構27之一側面朝遠 離s玄限位結構2 7之方向彎折或彎曲延伸有彈性限位結構 220。每一彈性限位結構22〇為其橫截面呈“V”字形之片 099101224 表單編號A0101 第6頁/共19頁 0992002447-0 201126127 ❹ [0013] 狀結構。該彈性限位結構220包括一由筒體22之缺口 29之 一侧面垂直延伸之固定片222、一由該固定片222之一端 朝向筒體22内彎折或彎曲延伸之連接彈片224以及一由該 連接彈片224之一端朝向筒體22外彎折或彎曲延伸之自由 彈片226。自由彈片226之自由端延伸出筒體22外,連接 彈片224與自由彈片226之間之連接部分位於筒體22内。 本實施例中,設置有兩對卡扣組合,其中,二限位結構 27關於筒體22軸心對稱設置,二彈性限位結構220關於筒 體22軸心對稱設置。可以理解,在其他實施例中,所述 卡扣組合之數量可與所述散熱器10之凹陷部16之數量相 當。201126127 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a heat sink, and more particularly to a heat sink with a mount. [Prior Art] [0002] With the rapid development of the electronics industry, the computing speed of electronic components such as central processing units has been greatly improved, and the heat generated by them has also increased dramatically. How to dissipate the heat of electronic components to ensure that Its normal operation, always 0 is an issue that the industry pays attention to. In order to effectively dissipate the heat generated by the central processing unit during operation, the industry usually installs a heat sink on the surface of the electronic component to maintain the electronic component's own temperature within the normal operating range. [0003] There are many common methods for mounting a heat sink on a circuit board, wherein one of the holders that can accommodate the heat sink and can be fixed to the circuit board is one of them. However, the conventional holder usually forms elasticity through the holder itself. The snap mechanism is pre-attached to the heat sink. Although the fixing structure is also relatively simple and convenient, since the fixing frame is used as a structural support member, the strength of the crucible is large. Therefore, the holder requires an increased force to deform elastically to cooperate with the heat sink, making the process of installing the heat sink more difficult. SUMMARY OF THE INVENTION [0004] In view of this, it is necessary to provide a heat dissipating device that is easy to assemble. [0005] A heat dissipating device includes a heat sink and a fixing frame, wherein the heat sink is received in the fixing frame, and a limiting protrusion corresponding to the heat sink is disposed inside the fixing frame to limit the heat sink The fixing frame is moved in the longitudinal direction, and the side portion of the heat sink is formed with a recessed portion for the corresponding convex portion to pass through 099101224, Form No. A0101, No. 3/19 pages, 0992002447-0201126127, and the fixing frame is provided with An elastic limiting structure coupled to the recess to limit rotation of the heat sink relative to the holder in a clockwise direction. [0006] The recessed portion provided on the heat sink of the heat dissipating device can allow the limiting convex portion on the inner side of the fixing frame to pass through the heat sink from top to bottom without deformation, and then rotate the heat sink without applying a large force. The fixing frame is fastened together with the heat sink, and there is no possibility that the fixing frame is damaged due to excessive force applied, so that the assembly is convenient. [0007] Referring to FIG. 1 and FIG. 2, a heat sink device in some embodiments of the present invention may be used to dissipate heat from a heat-generating electronic component 42 (eg, a computer CPU) mounted on a circuit board 40. A heat sink 10 can be included to secure the heat sink 10 to one of the mounts 20 on the circuit board 40. In some embodiments, a fan 30 is mounted on the top of the mount 20 to drive air around the heat sink 10 for forced convection to improve heat dissipation efficiency. [0008] The heat sink 10 described above may be cylindrical in some embodiments and may be formed by a relatively inexpensive extrusion (eg, aluminum extrusion, copper extrusion) comprising a thermally conductive column 12 and a thermally conductive column. A plurality of fins 14 extending outwardly for 12 weeks. The heat conducting column 12 is disposed in a cylindrical shape, and the bottom end surface of the heat conducting column 12 protrudes downward and extends beyond the heat sink 14 (shown in FIG. 3) to contact the top surface of the electronic component 42 to absorb the heat of the electronic component 42. The fins 14 are uniformly spread outwardly from the cylindrical peripheral surface of the heat conducting column 12, and the free ends of each fin 14 are bifurcated to form two branch pieces 140 to increase the heat radiating area. The fins 14 and the branch pieces 140 are bent outward in the clockwise or counterclockwise direction as they extend outward from the heat transfer column 12. In the present embodiment, 099101224, Form No. A0101, Page 4/19, 0992002447-0 201126127, the fins 14 and the branch pieces 14 are all bent in the clockwise direction. A plurality of concave portions 16 recessed inwardly are formed on the circumferential surface of the heat sink 10, and each of the recess portions 16 is a space surrounded by the branch pieces 140 on the surface of the corresponding branch piece 140 and on both sides. Wherein, the lateral extension length of the partial heat sink 14 (ie, the length extending from the cylindrical surface of the heat conducting column 12) is smaller than the length of the adjacent other heat sinks 14, so that the position is formed at the position of the heat sink 14 corresponding to the short lateral extension length. The depressed portion μ. [0009] The fan 30 has a flat cylindrical frame 32 having four pairs of mutually spaced projections 34 extending outwardly from the periphery of the frame 32. The four pairs of protrusions 34 are symmetrically distributed on the periphery of the fan frame 32 about the axis of the fan 30, and each pair of protrusions 34 is adjacent to the upper edge of the upper frame 32, wherein the protrusion 34 of the lower edge of the frame frame μ is adjacent. Cooperating with the fixing frame 2, and the bottom surface of the protruding portion 34 is flush with the lower edge of the fan frame 32. Each of the projections 34 has a substantially right-angled triangular shape and is provided with a perforation 340 that cooperates with the holder 2 . [0010] The above-described holder 20 is integrally formed of plastic material in some embodiments, and has a barrel 22 that houses the heat sink 10. The barrel 22 may be cylindrical in some embodiments, and the top portion thereof may be formed. A venting opening 24 for blowing the airflow generated by the fan 30 mounted on the cylinder 22 downward toward the radiator. The specific shape of the venting opening 24 can be adjusted by the support plate 21 extending inwardly from the top end edge of the barrel 22. The tubular body 22 has a receiving plate 26 extending outwardly from the four evenly spaced end edges thereof to receive the four lower edge projections 34 of the fan 30. Each of the receiving plates 26 extends vertically upwardly with a fixing post 26〇 inserted into the through hole 34 of the protruding portion 34. Each receiving plate 26 further has a buckle piece 262 extending vertically upward from the side of the fixing post 260, and the upper end portion of the buckle piece 262 The inside of the inner side is convexly provided with a hook-shaped hooking portion 264, and the latching portion 264 is inserted into the bottom edge of the lower edge projection portion 34 at the same time as the fixing post 099101224, the form is St Α 0101, 5th page, and 19 pages 0992002447-0 201126127 260. The lower edge projection is slid over the top surface of the lower edge projection 34 to fix the fan 3 to the holder 20. [0012] The bottom end portion of the tubular body 22 is uniformly provided with a mounting leg 28 corresponding to the recessed portion 16 of the heat sink 1b. In the present embodiment, the number of the mounting legs 28 and the recessed portions 16 corresponds to four. Each mounting leg 28 is outwardly provided with a mounting cylinder 280'. Each mounting cylinder 280 is provided with a fixing member 1''. The heat sink can be secured to the electronic component 42 as the fastener 100 passes down through the mounting hole 44' of the circuit board 4 about the periphery of the electronic component 42. A limiting island portion 226 is disposed inwardly of each of the mounting legs 28, and the limiting convex portion 25 is adjacent to the bottom of the mounting leg 28, and when the heat sink 1 is received in the tubular body 22, the limiting convex portion The top of the portion 25 is flush with the bottom of the heat sink 1〇 heat sink 14. Referring to Fig. 3, the inner wall of the tubular body 22 is inwardly projecting with a plurality of supporting projections 23' to support the convex portion 23 adjacent to the top of the tubular body 22 and abutting against the top of the heat sink 10 of the heat sink 10. The cylinder 22 is provided with at least a circumferential gap with the corresponding limiting protrusions 25, and the buckle assembly includes a limiting structure 27 protruding inward from the inner wall of the cylinder 22 and a The elastic limiting structure 220 is disposed on the cylinder 22 and cooperates with the limiting structure 27. The limiting structure 27 is perpendicular to the top support plate 21 of the tubular body 22 and adjacent to the mounting leg 28 ′ and the elastic limiting structure 22 间隔 is spaced apart from the limiting structure 27 and away from the mounting leg 28°. The bottom end of the tubular body 22 is open. A plurality of notches 29 are defined in the same manner as the limiting structure 27, and one of the notches 29 is bent or bent away from the side of the limiting structure 27 to extend the elastic limiting structure 220. Each of the elastic limiting structures 22 is a piece having a V-shaped cross section. 099101224 Form No. A0101 Page 6 of 19 0992002447-0 201126127 ❹ [0013] Shaped structure. The elastic limiting structure 220 includes a fixing piece 222 extending perpendicularly from one side of the notch 29 of the cylinder 22, a connecting elastic piece 224 bent or bent from one end of the fixing piece 222 toward the cylindrical body 22, and a connecting piece 224 One end of the connecting elastic piece 224 is bent toward the outer side of the cylindrical body 22 or bent to extend the free elastic piece 226. The free end of the free elastic piece 226 extends out of the cylindrical body 22, and the connecting portion between the connecting elastic piece 224 and the free elastic piece 226 is located inside the cylindrical body 22. In this embodiment, two pairs of snap combinations are provided, wherein the two limit structures 27 are axially symmetrically disposed with respect to the barrel 22, and the two elastic limit structures 220 are axially symmetrically disposed with respect to the barrel 22. It will be appreciated that in other embodiments, the number of snap combinations may be comparable to the number of recesses 16 of the heat sink 10.

組裝散熱裝置時,先將風扇30放置在固定架20上卡扣固 定;將散熱器10周面上之凹陷部16與固定架20安裝腳28 内側之限位凸部25對應,使限位凸部25對應穿過凹陷部 16,同時,所述限位結構27收容在凹陷部16内。所述連 接彈片224與自由彈片226之間之連接部分夾置在二相鄰 之分支片140之間,此時,散熱器10處於未鎖固狀態。在 本實施例中,散熱器10處於未鎖合狀態時,該限位結構 27容置在凹陷部16内且其一侧面抵靠在位於凹陷部16 — 侧之分支片140上(如圖4所示)。請同時參閱圖5,由限 位結構27朝向彈性限位結構220方向旋轉散熱器10,所述 限位凸部25越過多個散熱片14之分支片140而抵靠在散熱 器10之底部,所述分支片140之自由端部朝向與該分支片 140之彎曲時針方向相同之方向(即朝向所述限位結構27 之方向)彎曲變形而滑過所述連接彈片224之側面,同時 099101224 表單編號A0101 第7頁/共19頁 0992002447-0 201126127 ,限位結構27在凹陷部16内轉動’當限位結構27與彈性 限位結構2 2 0之間之分支片14 0全部滑過彈性限位結構 220後,限位結構27之另一側面抵靠在位於凹陷部16另一 侧之分支片140上,同時,位於凹陷部1 6 —側之分支片 140抵靠在彈性限位結構220之自由彈片226上,此時散 熱器10處於鎖固狀態(如圖5所示)。由於限位凸部μ抵 靠在散熱器10之底部,限位結構27與彈性限位結構22〇分 別抵靠在對應凹陷部16之相對兩側,即抵靠在凹陷部16 之兩侧分支片140之側面,使得散熱器10在其軸線方向上 不能移動,同時也不能繞軸線轉動,從而將散熱器_ 固在固定架20上。 [0014] [0015] [⑻ 16] 099101224 請一併參閱圖6,拆卸散埶 結構22D之自㈣咖時’施加外力於彈性限位 庳限位結構27方a 之自由端,自由彈片226朝向對 由彈片226之間之連發生彈性變形,使得連接彈片224與自 。然後反向旋轉散熱:分抬離對應分支片140之自由端 16對應即可將散哉器G使限位與所述凹陷部 “,'器10由固定_上卸下。 與習知技術相比, 可使固定架2G内側:散熱器1G周面上設置之凹陷部16 通過該散熱mo,再I位凸部25無需變形便可由上而下 固定架20之固定連接轉散熱_就可完成散熱器10、 定架20與散熱器1〇緊阳而無需施加較大之力量便可使固 、在一起,組裝方便、快捷。 另外,在散熱器1〇轅 由端發生彈性變形後、所述相應之部分散熱片14自 連接彈P24,過所述對應之彈性限位結構220之 表單編號AGHH ^ ^ 14為強度小、彈性好之銘薄片 8真/共19胃 09920 201126127 體,是故=容易在散熱器_動時發生損壞 器10與固定架20之整個組合過程安全可靠。 欢… [0017] 最後’將《裝置玫置到電路板4Q之電子元件心 通過固定架二安裝腳28上之固定件m與電路板40上之 安農孔44配°而將散熱袭置固定到電子元件42上。 [剩2所述’本發㈣合發料利要件,爰依法提出專利 。惟=上所述者僅為本發明之較佳實施例 ,舉凡 Ο 熟悉本案技藝之人士 ’在爰依本發明精神所作之等效修 飾或變化,皆應涵蓋於以下之f請專利範圍内。 【圖式簡單說明】 剛T面參照附圖,結合具體實施斜對本發明作進一步之描 述。 圆m係本發明-些實_中之散熱裂置安裝於—電路板上 之立體組裝圖。 [0021] 圖2係圖1中散熱裝置之立體分解圖。When the heat dissipating device is assembled, the fan 30 is firstly fastened on the fixing frame 20; the recessed portion 16 on the circumferential surface of the heat sink 10 is corresponding to the limiting convex portion 25 on the inner side of the mounting post 28 of the mounting bracket 20, so as to limit the convex portion. The portion 25 corresponds to pass through the recess 16 while the stop structure 27 is received in the recess 16 . The connecting portion between the connecting elastic piece 224 and the free elastic piece 226 is sandwiched between two adjacent branch pieces 140. At this time, the heat sink 10 is in an unlocked state. In this embodiment, when the heat sink 10 is in the unclosed state, the limiting structure 27 is received in the recessed portion 16 and a side thereof abuts on the branch piece 140 on the side of the recessed portion 16 (see FIG. 4). Shown). Referring to FIG. 5 simultaneously, the heat sink 10 is rotated by the limiting structure 27 toward the elastic limiting structure 220. The limiting protrusion 25 passes over the branch piece 140 of the plurality of fins 14 and abuts against the bottom of the heat sink 10. The free end portion of the branch piece 140 is bent and deformed toward the side of the connecting elastic piece 224 in the same direction as the bending direction of the branch piece 140 (ie, the direction toward the limiting structure 27), and the 099101224 form is simultaneously No. A0101, page 7 / 19 pages 0992002447-0 201126127, the limiting structure 27 rotates in the recessed portion 16 when the branch piece 14 0 between the limiting structure 27 and the elastic limiting structure 2 2 0 slides over the elastic limit After the bit structure 220, the other side of the limiting structure 27 abuts on the branch piece 140 on the other side of the recessed portion 16, while the branch piece 140 on the side of the recessed portion 16 abuts against the elastic limiting structure 220. On the free elastic piece 226, the heat sink 10 is in a locked state (as shown in FIG. 5). Since the limiting protrusions 51 abut against the bottom of the heat sink 10, the limiting structure 27 and the elastic limiting structure 22 are respectively abutted on opposite sides of the corresponding recessed portion 16, that is, abutting on both sides of the recessed portion 16 The side of the sheet 140 is such that the heat sink 10 cannot move in its axial direction while also being unable to rotate about the axis, thereby fixing the heat sink _ to the holder 20. [0015] [(8) 16] 099101224 Please refer to FIG. 6 together, when disassembling the divergent structure 22D from (4) coffee, 'applying external force to the free end of the elastic limit stop structure 27 side a, the free elastic piece 226 is oriented The pair is elastically deformed by the connection between the elastic pieces 226, so that the connecting elastic piece 224 is self-connected. Then, the heat is reversely rotated: the lifter G is lifted off the corresponding free end 16 of the corresponding branch piece 140 to displace the heat sink G from the recessed portion, and the device 10 is detached from the fixed portion. The inner side of the fixing frame 2G: the recessed portion 16 provided on the circumferential surface of the heat sink 1G passes through the heat dissipating mo, and the I-position convex portion 25 can be dissipated from the fixed connection of the upper and lower fixing frames 20 without deformation. The heat sink 10, the fixed frame 20 and the heat sink 1 are tightly packed and can be solidified and assembled without applying a large force. Moreover, after the heat sink 1 is elastically deformed from the end, the heat sink 10 The corresponding part of the heat sink 14 is self-joining the elastic piece P24, and the form number AGHH ^ ^ 14 of the corresponding elastic limiting structure 220 is a small piece of the thin piece 8 which is small in strength and good in elasticity. It is easy to make the whole combination process of the damage device 10 and the fixed frame 20 safe and reliable when the radiator _ moving. [0017] Finally, the device is placed on the electronic component core of the circuit board 4Q through the mounting bracket 2 The upper fixing member m is matched with the Annon hole 44 on the circuit board 40. The thermal attack is fixed to the electronic component 42. [Remaining 2 said 'the present invention (4) is issued in accordance with the legal requirements. However, the above is only a preferred embodiment of the present invention, and is familiar with the case. The equivalent modifications or variations made by the skilled person in the spirit of the present invention are to be included in the following patents. [Simplified Schematic] The T-face is referred to the drawings, and the present invention is combined with the specific implementation. Further, a description will be given of a three-dimensional assembly diagram of the heat sink of the present invention, which is mounted on a circuit board. [0021] FIG.

GG

[0022] 圖 [0023] 3係圖2中散熱裝置之散熱器與固定架之倒 置圖。 圖4係圖3中散熱裝置之散熱器與固定架處於未鎖固狀 之俯視圖。 態 [_目5係圖4中散熱裝置之散熱器與固定架處於鎖固狀態之 俯視圖。 [0025]圖6係圖5中散熱裝置之散熱器與固定架處於解鎖狀態之 俯視圖。 【主要元件符號說明】 0992002447-0 099101224 表單編號A0101 第9頁/共19頁 201126127 [0026] 散熱器:10 [0027] 導熱柱:12 [0028] 散熱片:14 [0029] 分支片:140 [0030] 凹陷部:16 [0031] 固定架:20 [0032] 支撐板:21 [0033] 筒體:22 [0034] 支撐凸部:23 [0035] 通風孔:24 [0036] 限位凸部:25 [0037] 承接板:26 [0038] 固定柱:260 [0039] 扣片:262 [0040] 卡扣部:2 6 4 [0041] 限位結構:27 [0042] 安裝腳:28 [0043] 安裝筒:280 [0044] 缺口 : 29 099101224 表單編號A0101 第10頁/共19頁 0992002447-0 201126127 [0045] 彈性限位結構:220 [0046] 固定片:222 [0047] 連接彈片:224 [0048] 自由彈片:226 [0049] 風扇:30 [0050] 扇框:32 [0051] 凸出部:34 [0052] 穿孔:340 [0053] 電路板:40 [0054] 電子元件:42 [0055] 安裝孔:44 [0056] 固定件:100 099101224 表單編號A0101 第Π頁/共19頁 0992002447-0[0022] FIG. 3 is an inverted view of the heat sink and the fixture of the heat sink of FIG. 2. Fig. 4 is a top plan view showing the heat sink and the fixing frame of the heat dissipating device of Fig. 3 in an unlocked shape. [FIG. 5 is a top view of the heat sink and the fixing frame of the heat sink in FIG. 4 in a locked state. 6 is a top plan view showing the heat sink and the holder of the heat sink of FIG. 5 in an unlocked state. [Main component symbol description] 0992002447-0 099101224 Form number A0101 Page 9 of 19 201126127 [0026] Heat sink: 10 [0027] Thermal column: 12 [0028] Heat sink: 14 [0029] Branch: 140 [ 0030] Depression: 16 [0031] Retaining frame: 20 [0032] Support plate: 21 [0033] Cylinder: 22 [0034] Supporting projection: 23 [0035] Ventilation hole: 24 [0036] Limiting projection: 25 [0037] Receiving plate: 26 [0038] Fixing post: 260 [0039] Clasp: 262 [0040] Buckle: 2 6 4 [0041] Limiting structure: 27 [0042] Mounting feet: 28 [0043] Mounting cylinder: 280 [0044] Notch: 29 099101224 Form No. A0101 Page 10/Total 19 Page 0992002447-0 201126127 [0045] Elastic limit structure: 220 [0046] Fixing piece: 222 [0047] Connecting shrapnel: 224 [0048 Free Shrapnel: 226 [0049] Fan: 30 [0050] Fan Frame: 32 [0051] Projection: 34 [0052] Piercing: 340 [0053] Board: 40 [0054] Electronic Components: 42 [0055] Installation Hole: 44 [0056] Fixings: 100 099101224 Form number A0101 Page/19 pages 0992002447-0

Claims (1)

201126127 七、申請專利範圍: 1 . 一種散熱裝置,包括一散熱器和固定架,所述散熱器收容 在該固定架内,該固定架内側設置有與所述散熱器配合之 限位凸部,以限制該散熱器相對固定架在縱向上移動,其 改良在於:所述散熱器側部形成有供所述限位凸部對應通 過之凹陷部,所述固定架上設置有與所述凹陷部配合之彈 性限位結構,以限制所述散熱器相對於所述固定架沿一時 針方向轉動。 2 .如申請專利範圍第1項所述之散熱裝置,其中還包括另一 限位結構,該另一限位結構與該彈性限位結構在周向上間 隔設置,以限制該散熱器相對於該固定架沿另一時針方向 轉動。 3 .如申請專利範圍第2項所述之散熱裝置,其中該彈性限位 結構包括一朝向該固定架内延伸之連接彈片和一由該連接 彈片之一端朝向該固定架外彎折或彎曲延伸之自由彈片。 4 .如申請專利範圍第3項所述之散熱裝置,其中該自由彈片 之自由端延伸出該固定架外。 I 5 .如申請專利範圍第4項所述之散熱裝置,其中該自由彈片 遠離該另一限位結構。 6.如申請專利範圍第5項所述之散熱裝置,其中該另一限位 結構由該固定架之内壁向内凸設形成,該另一限位結構與 該連接彈片和自由彈片之連接部分共同卡置在該散熱器之 對應凹陷部内。 7 .如申請專利範圍第1項至第6項中任一項所述之散熱裝置, 其中該散熱器包括一導熱柱以及由導熱柱周面向外發散延 099101224 表單編號A0101 第12頁/共19頁 0992002447-0 201126127 伸之複數散熱片,該凹陷部由多個相鄰散熱片向外延伸之 長度小於其他散熱片之長度而形成於散熱器之周面上。 8.如申請專利範圍第7項所述之散熱裝置,其中該散熱片朝 向與該彈性限位結構所限制轉動之時針方向相反之方向延 伸。 9 .如申請專利範圍第1項所述之散熱裝置,其中該限位凸部 抵在該散熱器之底部。 10 .如申請專利範圍第1項所述之散熱裝置,其中該固定架包 括套設該散熱器上端部之一筒體和由筒體底部向下延伸之 複數安裝腳,該限位凸部分別由安裝腳之内側向内凸起。 〇 099101224 表單編號A0101 第13頁/共19頁 0992002447-0201126127 VII. Patent application scope: 1. A heat dissipating device, comprising a heat sink and a fixing frame, wherein the heat sink is housed in the fixing frame, and a fixing convex portion matched with the heat sink is disposed inside the fixing frame, In order to limit the movement of the heat sink relative to the fixing frame in the longitudinal direction, the heat sink side portion is formed with a recessed portion through which the limiting convex portion passes correspondingly, and the fixing frame is provided with the concave portion Cooperating with the elastic limiting structure to limit the rotation of the heat sink relative to the fixing frame in a clockwise direction. 2. The heat dissipating device of claim 1, further comprising another limiting structure, wherein the other limiting structure and the elastic limiting structure are circumferentially spaced to limit the heat sink relative to the heat sink The holder rotates in another hour hand direction. 3. The heat dissipating device of claim 2, wherein the elastic limiting structure comprises a connecting elastic piece extending toward the fixing frame and a bending or bending extension from one end of the connecting elastic piece toward the fixing frame Free shrapnel. 4. The heat sink of claim 3, wherein the free end of the free elastic piece extends out of the holder. The heat sink of claim 4, wherein the free shrapnel is away from the other limit structure. 6. The heat dissipating device of claim 5, wherein the other limiting structure is formed inwardly from an inner wall of the fixing frame, and the connecting portion of the other limiting structure and the connecting elastic piece and the free elastic piece is connected. The common card is placed in the corresponding recess of the heat sink. The heat dissipating device according to any one of claims 1 to 6, wherein the heat sink comprises a heat conducting column and is extended by the circumferential surface of the heat conducting column 099101224. Form No. A0101 Page 12 of 19 Page 0992002447-0 201126127 The plurality of fins are extended, and the recess is formed on the peripheral surface of the heat sink by a plurality of adjacent fins extending outwardly for a length smaller than the length of the other fins. 8. The heat sink of claim 7, wherein the heat sink extends in a direction opposite to an hour hand direction of the limited rotation of the elastic stop structure. 9. The heat sink of claim 1, wherein the limiting protrusion abuts the bottom of the heat sink. The heat dissipating device of claim 1, wherein the fixing frame comprises a sleeve body that sleeves an upper end portion of the heat sink and a plurality of mounting legs extending downward from a bottom of the cylinder body, the limiting convex portions respectively Projected inward from the inside of the mounting foot. 〇 099101224 Form No. A0101 Page 13 of 19 0992002447-0
TW99101224A 2010-01-18 2010-01-18 Heat dissipation device TW201126127A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113162154A (en) * 2021-03-27 2021-07-23 深圳市鑫嘉恒科技有限公司 Charger with heat dissipation function

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113162154A (en) * 2021-03-27 2021-07-23 深圳市鑫嘉恒科技有限公司 Charger with heat dissipation function

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