TWI431237B - Heat sink and a method of making the same - Google Patents

Heat sink and a method of making the same Download PDF

Info

Publication number
TWI431237B
TWI431237B TW98114532A TW98114532A TWI431237B TW I431237 B TWI431237 B TW I431237B TW 98114532 A TW98114532 A TW 98114532A TW 98114532 A TW98114532 A TW 98114532A TW I431237 B TWI431237 B TW I431237B
Authority
TW
Taiwan
Prior art keywords
heat
fins
heat sink
manufacturing
fixing
Prior art date
Application number
TW98114532A
Other languages
Chinese (zh)
Other versions
TW201038908A (en
Inventor
Jian Yang
Jing Zhang
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW98114532A priority Critical patent/TWI431237B/en
Publication of TW201038908A publication Critical patent/TW201038908A/en
Application granted granted Critical
Publication of TWI431237B publication Critical patent/TWI431237B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

散熱器及其製造方法 Radiator and method of manufacturing same

本發明涉及一種散熱器及其製造方法,特別係指一種用於電子元件上之散熱器及該散熱器之製造方法。 The present invention relates to a heat sink and a method of manufacturing the same, and more particularly to a heat sink for an electronic component and a method of manufacturing the same.

隨著資訊技術之飛速發展,電腦內電子元件如中央處理器之運算速度越來越快,其產生之熱量也越來越多,而過多熱量若無法及時排出,將嚴重影響中央處理器運行時之穩定性。為此,業界通常在中央處理器頂面裝設一散熱器。利用散熱器來協助排出熱量,以確保中央處理器在適當溫度下正常工作。 With the rapid development of information technology, the electronic components in the computer, such as the central processing unit, are running faster and faster, and the heat generated by them is increasing. If too much heat is not discharged in time, it will seriously affect the operation of the central processing unit. Stability. To this end, the industry usually installs a heat sink on the top surface of the central processor. Use a heat sink to help dissipate heat to ensure that the central processor is working properly at the right temperature.

習知技術中之散熱器往往將複數平板狀散熱鰭片彎折後,散熱鰭片之底端疊合在一起以形成該散熱器之基座,該等散熱鰭片之頂部呈放射狀向外擴散以形成較大散熱區域。位於基座部分之相鄰散熱鰭片之間夾置有一隔板以提供散熱鰭片之間間隔。在該散熱器之組裝過程中,該等散熱鰭片之底端與隔板對應開設有安裝孔,藉由一鉚接設備將一鉚釘壓入該等安裝孔內,以將該等散熱鰭片與隔板結合起來形成所述基座。然後將該基座之底面銑平。 In the prior art, the heat sink often bends a plurality of flat fins, and the bottom ends of the fins are stacked to form a base of the heat sink. The tops of the fins are radially outward. Diffusion to form a larger heat sink area. A spacer is interposed between adjacent heat dissipation fins of the base portion to provide a space between the heat dissipation fins. During the assembly process of the heat sink, the bottom end of the heat dissipation fins is correspondingly provided with a mounting hole, and a rivet is pressed into the mounting holes by a riveting device to fix the heat dissipation fins The spacers are combined to form the base. The bottom surface of the pedestal is then flattened.

然而,在製造過程中,往往會出現裝配誤差,使得散熱器之散熱鰭片和隔板之安裝孔與鉚釘對不齊,如此,當鉚接設備工作時,很容易損壞散熱鰭片和隔板或者鉚釘,造成散熱器製造不良。 However, in the manufacturing process, assembly errors often occur, so that the mounting holes of the heat sink fins and the spacers are not aligned with the rivets, so that when the riveting device is working, it is easy to damage the heat sink fins and the spacers or Rivets cause poor heat sink manufacturing.

有鑒於此,有必要提供一種製造方便之散熱器及其製造方法。 In view of the above, it is necessary to provide a heat sink that is easy to manufacture and a method of manufacturing the same.

一種散熱器製造方法,包括如下步驟:(a)提供複數散熱鰭片,將該等散熱鰭片間隔排列,該等散熱鰭片具有第一部位及與該第一部位相距一定距離之第二部位;(b)對該等散熱鰭片之第一部位在橫向上進行限位;(c)提供一捏合力,對該等散熱鰭片之第二部位施加橫向上之壓力,使得該等散熱鰭片由於第一部位在橫向上被限位而彎折變形,該等散熱鰭片之第二部位被收攏以形成一導熱基座,所述第一部位呈放射狀展開。 A method for manufacturing a heat sink, comprising the steps of: (a) providing a plurality of heat dissipating fins, wherein the heat dissipating fins have a first portion and a second portion at a distance from the first portion (b) limiting the first portion of the heat dissipating fins in the lateral direction; (c) providing a kneading force, applying a lateral pressure to the second portion of the heat dissipating fins, such that the fins The sheet is bent and deformed because the first portion is laterally constrained, and the second portion of the fins is gathered to form a heat conducting base, and the first portion is radially expanded.

一種散熱器,其包括複數散熱鰭片,該等散熱鰭片具有第一部位及第二部位,該等散熱鰭片之第二部位疊合在一起以形成一導熱基座,該等散熱鰭片之第一部位呈放射狀展開,所述散熱器還包括至少一套筒,該至少一套筒套設在所述導熱基座之外圍。 A heat sink includes a plurality of heat dissipating fins having a first portion and a second portion, wherein the second portions of the heat dissipating fins are stacked to form a heat conducting base, the heat dissipating fins The first portion is radially deployed, and the heat sink further includes at least one sleeve disposed on a periphery of the thermally conductive base.

與習知技術相比,所述基座之外圍套設有至少一套筒以束緊所述散熱鰭片之底端,避免用鉚釘鉚接出現定位不當之問題。 Compared with the prior art, the outer periphery of the base is provided with at least one sleeve to tighten the bottom end of the heat dissipation fin, so as to avoid the problem of improper positioning by rivet riveting.

散熱器之散熱鰭片不需要預先彎折成設定好之形狀,也不用提供隔板,而直接將散熱鰭片之第一部位在橫向上限位,然後,施加捏合力在散熱鰭片之第二部位即可使該散熱鰭片之第二部位被收攏,第一部位呈放射狀展開。 The heat sink fins do not need to be pre-bent into a set shape, and do not provide a spacer, but directly place the first portion of the heat sink fin at a lateral upper limit position, and then apply a pinching force to the second heat sink fin. The second portion of the heat dissipating fin is gathered, and the first portion is radially expanded.

10‧‧‧散熱器 10‧‧‧ radiator

12‧‧‧基座 12‧‧‧ Pedestal

13‧‧‧卡銷 13‧‧‧Karts

20、11‧‧‧散熱鰭片 20, 11‧‧‧ Heat sink fins

30‧‧‧固定架 30‧‧‧Retaining frame

31‧‧‧接觸板 31‧‧‧Contact plate

32‧‧‧安裝臂 32‧‧‧Installation arm

33‧‧‧通孔 33‧‧‧through hole

40‧‧‧套筒 40‧‧‧ sleeve

41‧‧‧金屬板 41‧‧‧Metal plates

42‧‧‧緊固件 42‧‧‧fasteners

43‧‧‧安裝片 43‧‧‧Installation

50‧‧‧扣具 50‧‧‧ buckle

51‧‧‧彈簧 51‧‧‧ Spring

52‧‧‧螺釘 52‧‧‧ screws

53‧‧‧卡簧 53‧‧‧ circlip

圖1係本發明一實施例之散熱器之立體組裝圖。 1 is a perspective assembled view of a heat sink according to an embodiment of the present invention.

圖2係圖1中散熱器之立體分解圖。 2 is an exploded perspective view of the heat sink of FIG. 1.

圖3至圖6係圖1中散熱器製造過程之示意圖。 3 to 6 are schematic views of the heat sink manufacturing process of FIG. 1.

請參閱圖1及圖2,本發明一實施例之散熱器10包括複數底端收攏之散熱鰭片20、設置於該散熱鰭片20底端之二固定架30、套設在該散熱鰭片20底端並將固定架30固定至底端之二套筒40及複數穿設在固定架30上以將該散熱器10安裝至一電子元件(圖未示)上之扣具50。 Referring to FIG. 1 and FIG. 2 , the heat sink 10 of the embodiment of the present invention includes a plurality of heat sink fins 20 at the bottom end, two fixing frames 30 disposed at the bottom end of the heat sink fins 20 , and the heat sink fins The bottom end 40 has two sleeves 40 fixed to the bottom end and a plurality of sleeves 40 which are disposed on the fixing frame 30 to mount the heat sink 10 to an electronic component (not shown).

所述散熱鰭片20由導熱性能良好之金屬材料製成,如銅,鋁。該等散熱鰭片20之底端疊合在一起形成散熱器10之基座12。該基座12大致呈長方體狀,其底面與所述電子元件直接貼合以吸收該電子元件產生之熱量。該等散熱鰭片20之頂部呈放射狀向外擴散,並于頂端形成一弧狀結構。 The heat dissipation fins 20 are made of a metal material having good thermal conductivity, such as copper or aluminum. The bottom ends of the heat dissipation fins 20 are stacked together to form the base 12 of the heat sink 10. The susceptor 12 has a substantially rectangular parallelepiped shape, and a bottom surface thereof is directly attached to the electronic component to absorb heat generated by the electronic component. The tops of the fins 20 are radially outwardly diffused and form an arc-like structure at the top end.

所述二固定架30分別設置在所述散熱器10之基座12之相對兩側。每一固定架30包括一接觸板31及由該接觸板31之頂端向外水平延伸之二安裝臂32。該安裝臂32呈長條狀,其末端開設有通孔33,以供所述扣具50穿過。該二固定架30之接觸板31分別貼設在所述基座12之相對兩側,四安裝臂32延伸向該基座12外。 The two fixing brackets 30 are respectively disposed on opposite sides of the base 12 of the heat sink 10 . Each of the holders 30 includes a contact plate 31 and two mounting arms 32 extending horizontally outward from the top end of the contact plate 31. The mounting arm 32 has an elongated shape with a through hole 33 at its end for the fastener 50 to pass through. The contact plates 31 of the two mounting brackets 30 are respectively attached to opposite sides of the base 12, and the four mounting arms 32 extend outwardly of the base 12.

所述套筒40包括一環繞在所述基座12外圍之金屬板41及二將該金屬板41之兩端固定在一起之緊固件42。該金屬板41繞著該基座12之外圍彎折並於該金屬板41之兩端向外彎折形成二安裝片43。該二安裝片43相互靠近以供緊固件42穿設鎖固。所述二套筒40並排套設在基座12之外圍。 The sleeve 40 includes a metal plate 41 surrounding the periphery of the base 12 and two fasteners 42 for fixing the two ends of the metal plate 41 together. The metal plate 41 is bent around the periphery of the base 12 and bent outward at both ends of the metal plate 41 to form two mounting pieces 43. The two mounting tabs 43 are adjacent to each other for the fastener 42 to be threaded. The two sleeves 40 are arranged side by side on the periphery of the base 12 .

所述扣具50包括一套設有彈簧51之螺釘52及套設在該螺釘52底端 之卡簧53。 The clip 50 includes a set of screws 52 provided with a spring 51 and a bottom end of the screw 52 The circlip 53.

請參閱圖3至圖6,本發明還提供一種製造所述散熱器10之方法,主要步驟包括: Referring to FIG. 3 to FIG. 6, the present invention also provides a method for manufacturing the heat sink 10. The main steps include:

(1)備置複數平板狀散熱鰭片11及複數柱狀卡銷13。該等散熱鰭片11可由擠制成型之一整條散熱片等距切割而成。該等散熱鰭片11平行等距排列,相鄰二散熱鰭片11之間垂直於散熱鰭片11之長度方向放置一卡銷13,卡銷13位於散熱鰭片11之中部。該等卡銷13被固定並排成一列,以將該複數散熱鰭片11中部在橫向上限位。 (1) A plurality of flat fins 11 and a plurality of columnar pins 13 are provided. The heat dissipating fins 11 can be cut from the entire heat sink by one of the extruded heat sinks. The heat dissipation fins 11 are arranged in parallel at equal intervals. A card pin 13 is disposed between the adjacent two heat dissipation fins 11 perpendicular to the longitudinal direction of the heat dissipation fins 11 , and the bayonet 13 is located in the middle of the heat dissipation fins 11 . The bayonet pins 13 are fixed and arranged in a row to center the plurality of fins 11 in the lateral upper limit position.

(2)備置二固定架30,每一固定架30具有一接觸板31及與接觸板31垂直之安裝臂32,將二固定架30之接觸板31分別貼設在該等散熱鰭片11最外側之二散熱鰭片11之外側,並位於相應散熱鰭片11之底部。所述卡銷13位於該固定架30之上方。 (2) Two fixing frames 30 are provided. Each of the fixing frames 30 has a contact plate 31 and a mounting arm 32 perpendicular to the contact plate 31. The contact plates 31 of the two fixing frames 30 are respectively attached to the heat dissipating fins 11 The outer side of the outer fins 11 is located on the outer side of the fins 11 and located at the bottom of the corresponding fins 11. The bayonet 13 is located above the fixing frame 30.

(3)提供一捏合力,該捏合力垂直作用於二固定架30之接觸板31上。當捏合力迫使兩側散熱鰭片11向中部靠近時,由於所述卡銷13固定不動,散熱鰭片11在橫向上之移動被阻擋,因而被彎折于底端形成所述散熱器10之基座12,而於頂端呈放射狀展開以形成弧狀結構。 (3) A kneading force is provided which acts perpendicularly on the contact plate 31 of the two holders 30. When the pinching force forces the two side heat dissipating fins 11 toward the middle, since the bayonet 13 is fixed, the movement of the heat dissipating fins 11 in the lateral direction is blocked, and thus the bottom end is bent to form the heat sink 10 The susceptor 12 is radially spread at the top end to form an arcuate structure.

(4)備置二套筒40,將二套筒40並排套設在所述基座12之外圍,同時將所述固定架30與基座12緊束在一起,以起到穩固定型之作用。 (4) Two sleeves 40 are provided, and the two sleeves 40 are sleeved side by side on the periphery of the base 12, and the fixing frame 30 and the base 12 are tightly bundled together to function as a stable type.

(5)將基座12之底部銑平,以使該基座12之底面與一電子元件(圖未示)緊密接觸。 (5) The bottom of the susceptor 12 is flattened so that the bottom surface of the susceptor 12 is in close contact with an electronic component (not shown).

(6)備置複數扣具50,將扣具50穿設在所述固定架30之安裝臂32上。 (6) A plurality of clips 50 are provided, and the clips 50 are disposed on the mounting arms 32 of the mounts 30.

可以理解地,在步驟(1)之後,可以先提供捏合力迫使所述散熱鰭片11之底端收攏以形成基座12,然後,在基座12之相對兩側分別貼設所述固定架30。 It can be understood that after the step (1), a kneading force may be first provided to force the bottom end of the heat dissipation fin 11 to be gathered to form the base 12, and then the fixing frame is respectively attached on opposite sides of the base 12 30.

與習知技術相比,所述散熱器10之平板狀之散熱鰭片11不需要預先彎折成設定好之形狀,也不用提供隔板,直接將平板狀之散熱鰭片11等間距地插入預先固定好之卡銷13之間。施加捏合力在散熱鰭片11之兩側之固定架30上,即可使該散熱鰭片11之底端形成該散熱器10之基座12,該散熱鰭片11之頂端呈放射狀展開。然後套設二套筒40在基座12之外圍以實現固定架30與散熱鰭片底端之固定,不需要在散熱鰭片11底端開設安裝孔,然後精確定位鉚釘並將鉚釘穿入安裝孔內。再者,該固定架30上安裝成本低廉且通用性強之螺釘52和卡簧53,即可達到將散熱器10貼設在電子元件上。不需要另外製作一適合該散熱器10之扣具。總體上看,本發明散熱器10製造工序更簡單,製造成本更低廉。 Compared with the prior art, the flat fins 11 of the heat sink 10 do not need to be bent into a set shape in advance, and the spacers are not provided, and the flat fins 11 are directly inserted at equal intervals. The pin 13 is fixed in advance. The bottom end of the heat dissipation fin 11 is formed on the fixing frame 30 on both sides of the heat dissipation fin 11 so that the bottom end of the heat dissipation fin 11 forms the base 12 of the heat sink 10. The top end of the heat dissipation fin 11 is radially expanded. Then, the sleeves 40 are sleeved on the periphery of the base 12 to fix the fixing bracket 30 and the bottom end of the heat dissipation fins. It is not necessary to open a mounting hole at the bottom end of the heat dissipation fins 11, and then accurately position the rivets and insert the rivets into the installation. Inside the hole. Moreover, the screw 52 and the circlip 53 which are low in cost and versatile are mounted on the fixing frame 30, so that the heat sink 10 can be attached to the electronic component. There is no need to separately make a fastener suitable for the heat sink 10. In general, the heat sink 10 of the present invention has a simpler manufacturing process and a lower manufacturing cost.

綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧散熱器 10‧‧‧ radiator

12‧‧‧基座 12‧‧‧ Pedestal

20‧‧‧散熱鰭片 20‧‧‧ Heat sink fins

30‧‧‧固定架 30‧‧‧Retaining frame

31‧‧‧接觸板 31‧‧‧Contact plate

32‧‧‧安裝臂 32‧‧‧Installation arm

33‧‧‧通孔 33‧‧‧through hole

40‧‧‧套筒 40‧‧‧ sleeve

41‧‧‧金屬板 41‧‧‧Metal plates

42‧‧‧緊固件 42‧‧‧fasteners

43‧‧‧安裝片 43‧‧‧Installation

50‧‧‧扣具 50‧‧‧ buckle

51‧‧‧彈簧 51‧‧‧ Spring

52‧‧‧螺釘 52‧‧‧ screws

53‧‧‧卡簧 53‧‧‧ circlip

Claims (8)

一種散熱器製造方法,包括如下步驟:(a)提供複數散熱鰭片,將該等散熱鰭片間隔排列,該等散熱鰭片具有第一部位及與該第一部位相距一定距離之第二部位;(b)對該等散熱鰭片之第一部位在橫向上進行限位;(c)提供一捏合力,對該等散熱鰭片之第二部位施加橫向上之壓力,使得該等散熱鰭片由於第一部位在橫向上被限位而彎折變形,該等散熱鰭片之第二部位被收攏以形成一導熱基座,該第一部位呈放射狀展開;(d)提供二固定架,該二固定架分別貼設在該導熱基座之相對兩側;及(e)提供至少一套筒,該至少一套筒套設在該等散熱鰭片之第二部位以束緊該固定架於該等散熱鰭片之第二部位。 A method for manufacturing a heat sink, comprising the steps of: (a) providing a plurality of heat dissipating fins, wherein the heat dissipating fins have a first portion and a second portion at a distance from the first portion (b) limiting the first portion of the heat dissipating fins in the lateral direction; (c) providing a kneading force, applying a lateral pressure to the second portion of the heat dissipating fins, such that the fins The sheet is bent and deformed because the first portion is laterally constrained, and the second portion of the heat dissipating fins is gathered to form a heat conducting base, the first portion is radially expanded; (d) the second fixing frame is provided The two fixing brackets are respectively disposed on opposite sides of the heat conducting base; and (e) providing at least one sleeve, the at least one sleeve is sleeved on the second portion of the heat dissipation fins to tighten the fixing Mounted on the second part of the heat sink fins. 如申請專利範圍第1項所述之散熱器製造方法,其中該步驟(b)係通過將複數卡銷分別設置在該等散熱鰭片形成之間隙中並固定來實現該等散熱鰭片之第一部位在橫向上之限位。 The method for manufacturing a heat sink according to claim 1, wherein the step (b) is performed by disposing a plurality of bayonet pins in the gap formed by the heat dissipating fins and fixing the fins. A position is limited in the lateral direction. 如申請專利範圍第2項所述之散熱器製造方法,其中該步驟(c)還包括二固定架,該二固定架分別貼設在該等散熱鰭片之相對兩側,該捏合力藉由作用於該二固定架上進而作用於該等散熱鰭片上。 The heat sink manufacturing method of claim 2, wherein the step (c) further comprises two fixing brackets respectively attached to opposite sides of the heat dissipating fins, wherein the kneading force is caused by Acting on the two fixing frames to act on the heat dissipation fins. 如申請專利範圍第1項所述之散熱器製造方法,其中該等散熱鰭片由擠制成型之一整條散熱片切割而成。 The method of manufacturing a heat sink according to claim 1, wherein the heat dissipation fins are cut from one of the extruded heat sinks. 如申請專利範圍第4項所述之散熱器製造方法,其中該固定架包括一接觸板及由該接觸板之頂端向外水平延伸之二安裝臂。 The method of manufacturing a heat sink according to claim 4, wherein the holder comprises a contact plate and two mounting arms extending horizontally outward from a top end of the contact plate. 如申請專利範圍第5項所述之散熱器製造方法,其中還包括將複數螺釘穿設在該固定架之安裝臂上。 The method of manufacturing a heat sink according to claim 5, further comprising: inserting a plurality of screws on the mounting arm of the fixing frame. 如申請專利範圍第1項所述之散熱器製造方法,其中還包括將該導熱基座之底面銑平。 The method of manufacturing a heat sink according to claim 1, further comprising milling the bottom surface of the heat conductive base. 一種散熱器,包括複數散熱鰭片,每一散熱鰭片具有第一部位及第二部位,該等散熱鰭片之第二部位疊合在一起以形成一導熱基座,該等散熱鰭片之第一部位呈放射狀展開,其改良在於:該散熱器還包括至少一套筒,該至少一套筒套設在該導熱基座之外圍,該散熱器還包括二固定架,該二固定架分別貼設在該導熱基座之相對兩側,該至少一套筒套設在該固定架之外圍以將該固定架束緊在該導熱基座上。 A heat sink includes a plurality of heat dissipation fins, each of the heat dissipation fins has a first portion and a second portion, and the second portions of the heat dissipation fins are stacked to form a heat conduction base, and the heat dissipation fins The first portion is radially expanded, and the improvement is that the heat sink further comprises at least one sleeve, the at least one sleeve is sleeved on the periphery of the heat-conducting base, and the heat sink further comprises two fixing frames, the two fixing frames They are respectively disposed on opposite sides of the heat-conducting base, and the at least one sleeve is sleeved on the periphery of the fixing frame to fasten the fixing frame to the heat-conducting base.
TW98114532A 2009-04-30 2009-04-30 Heat sink and a method of making the same TWI431237B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98114532A TWI431237B (en) 2009-04-30 2009-04-30 Heat sink and a method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98114532A TWI431237B (en) 2009-04-30 2009-04-30 Heat sink and a method of making the same

Publications (2)

Publication Number Publication Date
TW201038908A TW201038908A (en) 2010-11-01
TWI431237B true TWI431237B (en) 2014-03-21

Family

ID=44995199

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98114532A TWI431237B (en) 2009-04-30 2009-04-30 Heat sink and a method of making the same

Country Status (1)

Country Link
TW (1) TWI431237B (en)

Also Published As

Publication number Publication date
TW201038908A (en) 2010-11-01

Similar Documents

Publication Publication Date Title
US7489513B2 (en) Heat dissipation device
US7349212B2 (en) Heat dissipation device
TWI466627B (en) Clip
US20110108237A1 (en) Heatsink with flexible base and height-adjusted cooling fins
US8320130B2 (en) Heat dissipation device with bracket
US20120222835A1 (en) Heat dissipating device
TWI497260B (en) Heat sink assembly and electronic device using the same
CN112004372B (en) Heat sink device
US20090166009A1 (en) Heat dissipation device having heat pipes for supporting heat sink thereon
US9417015B2 (en) Heat exchanger backing plate and method of assembling same
TWI431237B (en) Heat sink and a method of making the same
TW201302036A (en) Heat dissipation device with a fan holder
US7002795B2 (en) Low noise heatsink
US20110155346A1 (en) Heat dissipation device with fan holder
CN210671051U (en) Heat sink device
US8230905B2 (en) Heat dissipation device having a fan holder
TWI492035B (en) Base and heat dissipating module having the same
TWI530661B (en) Heat dissipation device
JP2013138160A (en) Heat sink fastener, heat sink fixing method, and electronic component using heat sink fastener
TWM423286U (en) Heat pipe type heat sink for enhancing heat conducting efficiency
TWI394521B (en) Fan holder and heat dissipation device with the fan holder
TW201126127A (en) Heat dissipation device
TWI307007B (en) Heat dissipation device
TWI400425B (en) Method and Structure of Flat Heat Conveying Pipe Fastening Cooling Fin
TWM471742U (en) Heat sink assembly device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees