1321438 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，尤#沪— -發熱電子元件之固定元件之散熱裝置。〃將該散熱裝置固定至 【先前技術】 衆所周知，巾央處理子树在運行 為防止該發熱電子元件因熱量之累積導致其溫1321438 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and a heat dissipating device for a fixing component of a heating element.固定 Fixing the heat sink to the prior art. It is known that the towel processing subtree is operated to prevent the heat generating electronic component from being heated due to the accumulation of heat.
了將該散熱裝置緊貼固定至電子元件上，另外還需要固定元=常為 圍繞裝置中一種散熱裝置包括-散熱器、- ίϊϊ及與該固定模組配合而將該散熱器固定 _ Γ Ί11包括—底座及設於該底座上之複數散 底座中部於兩鰭片之間留設一溝槽。該扣具為長條形其 二釣扣部’細賴組對應該扣 部。該扣狀抵壓料置於錄熱11之溝槽内， 扣I·之扣合部’扣具發錢形，其減部向下抵壓散 rfit從而將該散熱_定至電子元件上。然而，為使扣具之鉤 固疋模組之扣合部扣合’需克服該扣具之彈性回復力，操作較 二愛％另ΐ ’扣合過程也常需借助工具完成，操作不便。故該散熱 裝置需進一步改進》 【發明内容】 有黎於此，有必要提供-種拆裝便捷之散熱裝置。 „ 一種散熱裝置，用於對發熱電子元件散熱，該散熱裝置包括-散 熱器、©疋模組及_•扣具，該散熱器包括—散熱趙及一與該散熱體 結。之·熱體’ -SJ定板與該導熱合，棚定板之相對兩側設有 X伸和第二臂’該扣具包括—連接部及由該連接部 延部’該連接部可旋轉地裝設至棚定模組上，該連接部設 有χίίί之抵；1部’該固定模組包括一減上述第一固定臂之底部，該 6 1321438 扣具藉由操作部之扳動帶動抵壓部旋轉而可抵壓上述第二固定臂β 與習知技術相比，散熱裝置之固定板與散熱器結合，固定模組抵 壓該固定板之第一固定臂，散熱裝置之扣具與固定模組可旋轉連接， 通過轉動該扣具’即可實現該扣具之抵壓部對固定板之第二固定臂之 抵壓或解除抵壓’而實現散熱裝置與電子元件之便捷組裝與拆卸。 【實施方式】The heat dissipating device is closely attached to the electronic component, and a fixing element is also required. Depending on a heat dissipating device in the surrounding device, a heat sink, a heat sink, and the fixing module are fixed to fix the heat sink _ Γ Ί 11 Including a base and a plurality of scattered bases disposed on the base to leave a groove between the two fins. The buckle is in the form of a long strip, and the second snap portion is corresponding to the buckle portion. The buckle-shaped pressing material is placed in the groove of the heat recording 11, and the fastening portion of the buckle I is buckled, and the reduced portion is pressed downward to dissipate the rfit to fix the heat dissipation to the electronic component. However, in order to fasten the fastening portion of the hooking and fastening module of the buckle, it is necessary to overcome the elastic restoring force of the fastener, and the operation is more difficult to perform with the tool, and the operation is inconvenient. Therefore, the heat dissipating device needs to be further improved. [Inventive content] There is a need for a dissipative and convenient heat dissipating device. „ A heat dissipating device for dissipating heat from the heat-generating electronic components, the heat dissipating device comprising a heat sink, a 疋 module and a _ buckle, the heat sink comprising: a heat sink and a heat sink body. '-SJ fixed plate and the heat conduction, the X-shaped extension and the second arm are provided on opposite sides of the slab plate. The buckle comprises a connecting portion and the connecting portion is rotatably mounted to the shed In the fixed module, the connecting portion is provided with χίίί; the first part of the fixing module includes a bottom portion of the first fixing arm, and the 6 1321438 buckle is driven by the rotation of the operating portion to rotate the pressing portion. The fixing arm of the heat dissipating device is combined with the heat sink, and the fixing module is pressed against the first fixing arm of the fixing plate, and the fastening device and the fixing module of the heat dissipating device are By rotating the buckle, the pressing portion of the buckle can be pressed or released against the second fixing arm of the fixing plate to realize convenient assembly and disassembly of the heat dissipating device and the electronic component. the way】
請參閱第一圖，該散熱裝置用於散發裝設於一電路板（圖未示） 上之一電子元件（圖未示）產生之熱量》該散熱裝置包括一散熱器， 該散熱器包括一散熱體50及一與該散熱體50結合之導熱體4〇。該散 熱裝置還包括一與該導熱體40配合之固定板30、一扣具20及一與該 扣具20、固定板30配合之固定模組1〇。Referring to the first figure, the heat dissipating device is configured to dissipate heat generated by an electronic component (not shown) mounted on a circuit board (not shown). The heat dissipating device includes a heat sink, and the heat sink includes a heat sink. The heat sink 50 and a heat conductor 4B combined with the heat sink 50. The heat dissipating device further includes a fixing plate 30 that cooperates with the heat conductor 40, a buckle 20, and a fixing module 1 that cooperates with the buckle 20 and the fixing plate 30.
固疋模組10為一方形框體，圍繞該電子元件設於電路板上。該固 定模組10具有一容置電子元件之開口 11〇及圍繞該開口 11〇之相互連 接之第一、二、二、四邊部12〇、13〇、140、150。該固定模組1〇之四 角向下延伸ό又有將該固定模組1〇固定至電路板上之四固定腳“ο。第 一邊部130於其外緣向上延伸一側壁17〇,該側壁17〇於其上端朝向開 口 110方向設有四間隔之定位塊17卜用於將扣具2〇定位于第二邊部 130與該定位塊171之間。該第二邊部13〇對應該側壁17〇之定位塊 171設有複數缺口 13卜在第三、四邊部14〇、15〇之連接處及第四、 一邊部150、120之連接處設有複數朝向開口 11〇方向之撞塊141、⑸、 121，擋塊121之一端向外突伸出第一邊部形成一扣耳123。 扣具20大致呈“L”形，由金屬絲彎折而成。該扣具2〇包括一連 接部210及由該連接部210 -端彎折延伸之操作部23()。該連接部21〇 對應固定模組10側壁170之相鄰定位塊m之間彎曲形成二抵壓部 2U，該二抵壓部211突伸向該固定模組1〇之開口 UG方向，作部 230之自由端回彎形成-手柄231，該手柄231上套置有一塑膠套體 250，以方便操作者操作。 導熱體40具有高導熱性，其包括-直徑較大之圓形底部41〇及由 該底部410垂直向上延伸之直彳i略小之柱體.柱體伽之上部形成 7 1321438 一空腔。散熱體50包括一柱形核體5i〇及由該核體51〇週邊向外呈輻 射狀延伸之複數鰭片530。該核體510之中心形成上下貫通該核體51〇 之通孔511，該導熱體40之柱體430結合至該通孔511内。該複數鰭 片530沿核體510之柱面周向略呈彎曲。 固定板30包括一環形主體部310及由該主體部31〇外緣向外延伸 之二分開之第一固定臂330、與該第一固定臂33〇延伸方向相反之二分 開第二固定臂350。該主體部310之中心具有一圓形開孔311，以供導 熱體40穿過。每-第-固定臂33〇之末端向下向外彎折形成一搶片 331 ’該擔片331與主體部310具有一階梯落差。 請參閲第二圖，組裝扣具20及固定模組1〇時，扣具2〇之連接部 210可轉動之裝設於固定模組1〇第二邊部13〇與側壁17〇之定位塊 之間。連接部210之每一抵壓部211位於相鄰二定位塊171之間且 凸向固定模組10之開口 11〇。 請參閱第三圖，組裝導熱體4〇、固定板30及散熱體50時，導熱 體40之柱體410穿過固定板3〇主體31〇之開孔311，配合固定在導熱 體40之柱體430之底部，而貼合在導熱體4〇底部41〇之上表面。導 熱體40之柱體430通過過盈配合固定在散熱體5〇之通孔511内。從 而固定板30夾置於散熱體50和導熱體4〇之間。 請參閱第四至六圖’使㈣，將導熱體4Q之底部41()置於電子元 件上’固定板30之第-固定臂33〇置於固定模組1〇第四邊部15〇下 方且其擔片331擋止於第四邊部15〇之底面。固定板3〇之二第二固 臂350位於固定模組1〇之開口 11〇内，且分別位於扣具2〇之二抵壓 部211下方。撞塊14H51、121擋止於散熱體50之底料侧。此時， ，熱裝置處於如第四圖所示狀態。向下轉動扣具2〇之操作部23〇直至 操作部230靠近手柄231之部位與固定模組1〇之扣耳123卡扣，此 扣具20之連接部210之抵壓部211肖下抵壓固定板3〇之第二固定臂 350 ’而使導熱體40之底部410之底面緊貼固定於電子元件上 使散熱器與電子元件緊密接觸，其如第五圖、第六圖所示。 當將散熱器從該電子元件上取除時，解除扣具2〇之操作部測與 8 1321438 固定模組ίο之扣耳123之卡扣，向上轉動操作部23〇，從 =所21-0之211對固定板30之第二固定臂350之抵其 散熱器和固定板3°即可從固定模組1。之開 與習知技術相比，扣具20可旋轉之連接至固定模組1〇上 板30結合至散熱器之導熱體4〇上，固定板3〇之第— 於固定模組1G之第四邊部15Q下方，通過旋轉扣具2Q之操 =， 扣具20之抵壓部211向下抵壓固定板3〇之第二固定臂35〇而實現散 熱裝置與電子元件之緊祕合，或者扣錢之缝部211解除對^The solid module 10 is a square frame, and is disposed on the circuit board around the electronic component. The fixing module 10 has an opening 11 for receiving electronic components and first, second, second and fourth sides 12〇, 13〇, 140, 150 connected to each other around the opening 11〇. The four corners of the fixing module 1 are extended downwards, and the fixing module 1 is fixed to the four fixing legs of the circuit board. The first side portion 130 extends upwardly from the outer edge thereof by a side wall 17〇. The side wall 17 is provided with a four-position positioning block 17 at the upper end thereof toward the opening 110 for positioning the clip 2〇 between the second side portion 130 and the positioning block 171. The second side portion 13〇 corresponds to The positioning block 171 of the side wall 17 is provided with a plurality of notches 13 at the junction of the third and fourth sides 14〇, 15〇 and the junction of the fourth and side portions 150 and 120 with a plurality of blocks facing the opening 11〇. 141, (5), 121, one end of the stopper 121 protrudes outwardly from the first side to form a buckle 123. The buckle 20 is substantially in the shape of an "L" and is bent by a wire. The buckle 2 includes a connecting portion 210 and an operating portion 23 ( ) bent from the connecting portion 210 - end. The connecting portion 21 弯曲 is bent between the adjacent positioning blocks m of the side wall 170 of the fixed module 10 to form a pressing portion 2U. The two pressing portions 211 protrude toward the opening UG direction of the fixing module 1 , and the free end of the portion 230 is bent back to form a handle 231 . The handle 231 The plastic sleeve body 250 is disposed to facilitate the operation of the operator. The heat conductor 40 has high thermal conductivity, and includes a large diameter round bottom 41〇 and a column slightly smaller than the vertical direction of the bottom portion 410. The upper portion of the cylinder body forms a cavity of 13 1321438. The heat sink 50 includes a cylindrical core body 5i and a plurality of fins 530 extending radially outward from the periphery of the core body 51. The center of the core body 510 A through hole 511 penetrating the core body 51 is formed, and the pillar 430 of the heat conductor 40 is coupled into the through hole 511. The plurality of fins 530 are slightly curved along the circumferential direction of the cylindrical surface of the core body 510. The fixing plate 30 includes a ring. The main body portion 310 and the two first fixed arms 330 extending outward from the outer edge of the main body portion 31 are separated from the second fixing arms 350 by two opposite to the extending direction of the first fixing arms 33. The main body portion 310 The center has a circular opening 311 for the heat conductor 40 to pass through. The end of each of the first-fixing arms 33〇 is bent downwardly and outwardly to form a grab sheet 331. The stretcher 331 has a body 310 with the body portion 310. Step drop. Please refer to the second figure. When assembling the clip 20 and the fixed module 1〇, the clip The connecting portion 210 of the connecting portion 210 is rotatably disposed between the second side portion 13A of the fixed module 1 and the positioning block of the side wall 17A. Each pressing portion 211 of the connecting portion 210 is located at the adjacent two positioning blocks 171. Between the openings 11 of the fixing module 10, please refer to the third figure. When the heat conductor 4, the fixing plate 30 and the heat sink 50 are assembled, the cylinder 410 of the heat conductor 40 passes through the fixing plate 3 and the main body 31. The opening 311 of the crucible is fixed to the bottom of the cylinder 430 of the heat conductor 40, and is attached to the upper surface of the bottom portion 41 of the heat conductor 4. The cylinder 430 of the heat conductor 40 is fixed in the through hole 511 of the heat sink 5 through an interference fit. The fixing plate 30 is sandwiched between the heat sink 50 and the heat conductor 4A. Please refer to the fourth to sixth figure 'make (4), place the bottom 41() of the thermal conductor 4Q on the electronic component. The first fixed arm 33 of the fixing plate 30 is placed under the fourth side 15 of the fixed module 1 The support piece 331 is stopped on the bottom surface of the fourth side portion 15〇. The second fixing arm 3 of the fixing plate 3 is located in the opening 11 of the fixing module 1 and is respectively located under the pressing portion 211 of the fastening device 2〇. The bumpers 14H51, 121 are stopped on the bottom side of the heat sink 50. At this time, the thermal device is in the state as shown in the fourth figure. The operation portion 23 of the fastener 2 is rotated downward until the portion of the operation portion 230 close to the handle 231 is engaged with the buckle 123 of the fixed module 1 , and the pressing portion 211 of the connection portion 210 of the buckle 20 is slanted downward. The second fixing arm 350' of the fixing plate 3 is pressed, and the bottom surface of the bottom portion 410 of the heat conductor 40 is closely attached to the electronic component to bring the heat sink into close contact with the electronic component, as shown in FIG. 5 and FIG. When the heat sink is removed from the electronic component, the operation portion of the buckle 2〇 is released and the buckle of the buckle 13 of the fixed module ίο, and the operation portion 23〇 is rotated upward, from the = 21-0 The 211 pairs of the second fixing arm 350 of the fixing plate 30 are fixed to the heat sink and the fixing plate by 3° from the fixed module 1. Compared with the prior art, the buckle 20 is rotatably connected to the fixed module 1 and the upper plate 30 is coupled to the heat conductor 4 of the heat sink, and the fixed plate 3 is the first of the fixed module 1G. Under the four sides 15Q, by the rotation of the fastener 2Q, the pressing portion 211 of the buckle 20 presses down the second fixing arm 35〇 of the fixing plate 3〇 to achieve a tight connection between the heat sink and the electronic component. Or the deduction of the money 211 is released to ^
板30之第二固定臂35G之抵麗而實現從電子元件上去除該散熱裝置。 從而’該散熱裝置與電子元件之裝拆便捷。 請參閱第七圖，其為本發明散熱裝置之另一實施例，該實施例與 第-實施例不同之處在於該實施射固定模組1〇，之第四邊部15〇，、側 壁170’之底緣之中部各向下延伸一將該固定模組1〇固定至電路板上之 固定腳160’，該側壁170,於該固定腳160,上方設一缺口 173，扣具2〇， 於二抵壓部211’之間對應該缺口 173處設一彎曲部213，該彎曲部213 與該抵壓部211’大致垂直，以避免扣具2〇,在固定固定腳16〇，時產生干 涉。該固定模組10’的四角各向下延伸一支腳18〇。固定板3〇，之每一 第一、第二固定臂330,、350’之末端各設一擋片331，、351。The second fixed arm 35G of the board 30 is detached to remove the heat sink from the electronic component. Therefore, the heat dissipating device and the electronic component are easily assembled and disassembled. Please refer to the seventh embodiment, which is another embodiment of the heat dissipating device of the present invention. The difference between the embodiment and the first embodiment is that the fourth fixing portion 1〇, the side wall 170, and the side wall 170 The bottom of the bottom edge of each of the bottom edges is fixed to the fixing leg 160' of the circuit board. The side wall 170 is provided with a notch 173 and a buckle 2〇. A curved portion 213 is disposed between the two pressing portions 211 ′ corresponding to the notch 173 . The curved portion 213 is substantially perpendicular to the pressing portion 211 ′ to avoid the buckle 2 〇, which is generated when the fixing leg 16 固定 is fixed. put one's oar in. The four corners of the fixing module 10' each extend downwardly with a leg 18 。. Each of the first and second fixed arms 330, 350' is provided with a blocking piece 331, 351 at a fixed plate 3''.
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申 凊。惟，以上所述者僅為本發明之較佳實施例，自不能以此限制本案 之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之 等效修飾或變化，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 第一圖係本發明散熱裝置一實施例之立體分解圖。 第二圖係圖第一圖之部分組裝圖。 第三圖係第二圖之部分組裝圖。 第四圖係第一圖中散熱裝置扣合前之立體組裝圖。 第五圖係第一圖中散熱裝置扣合後之立體組裝圖。 9 1321438 第六圖係第五圖另一方向上之視圖。 第七圖係本發明散熱裝置之另一實施例之立體分解圖。 【主要元件符號說明】 固定模組 10 開口 110 邊部 120、130、140、150、 150’擋塊 121 ' 141 ' 151 扣耳 123 缺口 131 ' 173 固定腳 160 、 160， 側壁 170 、 170， 定位塊 171 支腳 180 扣具 20、20， 連接部 210 抵壓部 2U、211， 操作部 230 手柄 231 套體 250 固定板 30、30， 主體部 310 開孔 311 第一固定臂 330、330’ 擋片 331、33Γ、351 第二固定臂 350 、 350’ 導熱體 40 底部 410 柱體 430 散熱體 50 核體 510 通孔 511 縛片 530 10In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application in accordance with the law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is an exploded perspective view of an embodiment of a heat sink according to the present invention. The second figure is a partial assembly diagram of the first figure. The third figure is a partial assembly diagram of the second figure. The fourth figure is an assembled view of the first embodiment of the heat dissipating device before being fastened. The fifth figure is an assembled view of the heat dissipating device in the first figure after being fastened. 9 1321438 The sixth figure is a view of the fifth direction in the other direction. Figure 7 is a perspective exploded view of another embodiment of the heat sink of the present invention. [Main component symbol description] Fixed module 10 opening 110 side 120, 130, 140, 150, 150' stop 121 ' 141 ' 151 lug 123 notch 131 ' 173 fixed foot 160, 160, side wall 170, 170, positioning Block 171 legs 180 fasteners 20, 20, connecting portion 210 pressing portions 2U, 211, operating portion 230 handle 231 sleeve 250 fixing plates 30, 30, main body portion 310 opening 311 first fixed arms 330, 330' block Sheet 331, 33Γ, 351 Second fixed arm 350, 350' Thermal body 40 Bottom 410 Column 430 Heat sink 50 Core 510 Through hole 511 Binder 530 10