M307290 . 八、新型說明： , 【新型所屬之技術領域】 本創作涉及一種電路板組合，特別是關於一種設有散 熱器之電路板組合。 [先前技術】 隨著電腦技術之不斷發展，電腦功能越來越多，相應 地電腦元件也越來越多，為了提高電腦工作之穩定性，電 0 腦内部使用了許多散熱裝置，當前電腦内使用之散熱器主 ' 要用於晶片之散熱，如何將散熱器固定在電路板上，則顯 得非常重要。 業界也推出一種晶片散熱器固定夾，其為一夾具單 體，用於方便地將一鋁擠型散熱器固定於晶片表面，其由 一中間框架和設於框架兩對角端之彈性扣件所組成，彈性 扣件設成連續彎曲段，並于末端形成一彎鉤狀，用以插置 入印刷電路板上對應位置之扣合孔中，此彈性扣件與中間 _ 框架是一體成型，組裝時，框架恰可嵌置於鋁擠型散熱器 表面壓合槽中。但由於目前出於環保考慮，通常採用無鉛 焊料焊接晶片，晶片之焊腳較脆，裝配散熱器過程中，固 定夾一端扣入電路板之扣合孔中，電路板有一定之形變， 這樣有可能造成電路板上晶片之焊腳鬆動，且固定夾有一 定之彈力施加在散熱器上，而散熱器本身有一定之重量， 這樣晶片所受外來壓力較大^容易造成晶片損壞。 【新型内容】 鑒於以上内容，有必要提供一種有效地防止散熱器壓 6 M307290 ^ 損晶片焊腳之電路板組合。 一種電路板組合，其包括一電路板、一裝配於該電路 板上之晶片及一安裝在該晶片上之散熱器，該散熱器具有 一底座及若干自該底座向上延伸之散熱鰭片，該散熱器之 底座設有若干向下延伸之支腳’該支腳支撐在該電路板上。 相對於習知技術，該支腳支撐散熱器，避免過多之壓 力施加在晶片上’該電路板組合能有效地防止壓損晶片焊 腳。 . 【實施方式】 請參閱圖1和圖2，一電路板組合包括一電路板20、 一裝配在該電路板20上之晶片30及一輔助該晶片30散 熱之散熱器10。 該散熱器10設有一底座11及若干自該底座11向上 延伸形成之散熱鰭片12，該底座11在四角分別設有一向 下延伸之支腳110，該支腳110大體呈一階梯形，每一支 _ 腳110設有一橫截面積較大之限位部111及一自該限位部 111延伸形成之橫截面積較小之插入部112 ;該晶片30貼 裝於該電路板20上，該晶片30上塗有一導熱層40,該電 路板20上設有與該插入部112相應之開孔21，該開孔21 之橫截面積比該限位部111之橫截面積小，以限制該限位 部111穿過該開孔21。 安裝該散熱器10時，該散熱器10之插入部112穿過 該電路板20之開孔21，該限位部111無法透過開孔21而 與該電路板20之上表面相抵，此時該散熱器10之底座11 7 M307290 擠壓該晶片30上之導熱層40,由於支腳110之限位部111 支撐在該電路板20上，該支腳110承載了該散熱器10大 部分重力，該晶片30承擔散熱器10施加之壓力得以減 少；該散熱器10之插入部112透過焊接、粘接或螺絲鎖 固等方式將該散熱器10固定在該電路板20上。 請參閱圖3和圖4，在本創作電路板組合另一實施例 中，一電路板組合包括一電路板20’、一裝配在該電路板 20’上之晶片30’、一輔助該晶片30’散熱之散熱器10’及一 常見之散熱器扣具，在本實施例中，該扣具為一彈性鋼絲 40,。 該散熱器10’設有一底座11’及若干自該底座11’向上 延伸形成之散熱鰭片12’，該底座1Γ在四角分別設有一向 下延伸之支腳110’，每一支腳110’有一豎直長度；該晶片 30’上塗有一導熱層50’ ；該鋼絲40’兩端分別設有一卡鉤 41，；該電路板20’上設有供卡鉤41’卡合之卡合部21’。 安裝該散熱器10’時，首先將該散熱器10’放置在該晶 片30’上，此時該散熱器10’之底座11’擠壓該晶片30’上之 導熱層50’，由於支腳110’支撐在該電路板20’上，該支腳 110’承載了該散熱器10’大部分重力，該晶片30’承擔散熱 器10’施加之壓力得以減少；然後將該鋼絲40’穿過散熱器 10’並將其兩端之卡鉤41’分別與該電路板20’之卡合部21’ 卡合，從而將該散熱器10’固定在該電路板20’上。 在上述兩個實施例中，該支腳可以設有多個，其可為 不同形狀；所述電路板可在與該支腳對應的位置上設有凹 M307290 槽；該散熱器之支腳也可與該散熱器非一體形成，作為單 個之元件固定於散熱器底座，構成了底座向下延伸之支 腳。 綜上所述，本創作符合新型專利之要件，爰依法提出 專利申請。惟，以上僅為本創作之較佳實施例，舉凡熟悉 本案技藝之人士，在爰依本創作精神所作之等效修飾或變 化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本創作電路板組合較佳實施例之立體分解圖。 圖2係圖1中之電路板組合組裝後之剖面圖。 圖3係本創作電路板組合另一較佳實施例之立體分解圖。 圖4係圖3中之電路板組合組裝後之剖面圖。 【主要元件符號說明】 散熱器 10 基座 11 支腳 110 限位部 111 插入部 112 散熱鰭片 12 電路板 20 開孔 21 晶片 30 導熱層 40 散熱器 105 基座 11， 支腳 110? 散熱鰭片 12, 電路板 20? 卡合部 21， 晶片 30， 鋼絲 40, 卡鉤 41， 導熱層 50,M307290 . VIII. New description: , [New technical field] This creation relates to a circuit board combination, in particular to a circuit board combination with a heat sink. [Prior Art] With the continuous development of computer technology, more and more computer functions, and more and more computer components, in order to improve the stability of computer work, many heat sinks are used inside the computer. It is very important to use the heat sink main to be used for heat dissipation of the chip and how to fix the heat sink on the circuit board. The industry also introduces a wafer heat sink fixing clip, which is a clamp unit for conveniently fixing an aluminum extruded heat sink to the surface of the wafer, and an intermediate frame and elastic fasteners disposed at two diagonal ends of the frame. The elastic fastener is formed as a continuous curved section, and a hook shape is formed at the end for inserting into a fastening hole of a corresponding position on the printed circuit board, and the elastic fastener is integrally formed with the middle_frame. When assembled, the frame can be embedded in the press-fit groove on the surface of the aluminum extruded heat sink. However, due to environmental considerations, the lead-free solder is usually used to solder the wafer. The soldering feet of the wafer are brittle. During the assembly of the heat sink, one end of the fixing clip is buckled into the fastening hole of the circuit board, and the circuit board has a certain deformation. The soldering feet of the wafer on the circuit board may be loose, and the fixing clip has a certain elastic force applied to the heat sink, and the heat sink itself has a certain weight, so that the external pressure of the wafer is large, and the wafer is easily damaged. [New content] In view of the above, it is necessary to provide a circuit board combination that effectively prevents the heat sink from being damaged by 6 M307290 ^. A circuit board assembly includes a circuit board, a chip mounted on the circuit board, and a heat sink mounted on the circuit board, the heat sink having a base and a plurality of heat dissipation fins extending upward from the base, the heat dissipation The base of the device is provided with a plurality of downwardly extending legs which are supported on the circuit board. In contrast to conventional techniques, the legs support the heat sink to prevent excessive pressure from being applied to the wafer. The circuit board assembly is effective to prevent pressure loss of the wafer solder fillet. [Embodiment] Referring to Figures 1 and 2, a circuit board assembly includes a circuit board 20, a wafer 30 mounted on the circuit board 20, and a heat sink 10 for assisting the wafer 30 to dissipate heat. The heat sink 10 is provided with a base 11 and a plurality of heat dissipating fins 12 extending upward from the base 11. The base 11 is respectively provided with a downwardly extending leg 110 at four corners. The leg 110 is substantially stepped. The _ leg 110 is provided with a limiting portion 111 having a larger cross-sectional area and an insertion portion 112 having a smaller cross-sectional area extending from the limiting portion 111. The wafer 30 is mounted on the circuit board 20, The wafer 30 is coated with a heat conducting layer 40. The circuit board 20 is provided with an opening 21 corresponding to the insertion portion 112. The cross-sectional area of the opening 21 is smaller than the cross-sectional area of the limiting portion 111 to limit the The limiting portion 111 passes through the opening 21 . When the heat sink 10 is mounted, the insertion portion 112 of the heat sink 10 passes through the opening 21 of the circuit board 20. The limiting portion 111 cannot pass through the opening 21 and the upper surface of the circuit board 20 is opposite. The base 11 7 307290 of the heat sink 10 presses the heat conductive layer 40 on the wafer 30. Since the limiting portion 111 of the leg 110 is supported on the circuit board 20, the leg 110 carries most of the gravity of the heat sink 10, The wafer 30 is subjected to a reduction in the pressure applied by the heat sink 10; the insertion portion 112 of the heat sink 10 is fixed to the circuit board 20 by soldering, bonding or screwing. Referring to FIG. 3 and FIG. 4, in another embodiment of the present circuit board assembly, a circuit board assembly includes a circuit board 20', a wafer 30' mounted on the circuit board 20', and an auxiliary chip 30. 'The heat sink 10' and a common heat sink clip, in this embodiment, the buckle is an elastic wire 40. The heat sink 10' is provided with a base 11' and a plurality of heat dissipating fins 12' extending upward from the base 11'. The base 1 is respectively provided with a downwardly extending leg 110' at each of the four corners, and each leg 110' The wafer 30' is coated with a heat conducting layer 50'; the two ends of the wire 40' are respectively provided with a hook 41; the circuit board 20' is provided with a engaging portion 21 for the hook 41' to be engaged. '. When the heat sink 10' is mounted, the heat sink 10' is first placed on the wafer 30'. At this time, the base 11' of the heat sink 10' presses the heat conductive layer 50' on the wafer 30' due to the legs. 110' is supported on the circuit board 20', the leg 110' carries most of the weight of the heat sink 10', and the pressure applied by the wafer 30' to the heat sink 10' is reduced; then the wire 40' is passed through The heat sink 10' and the hooks 41' at both ends thereof are respectively engaged with the engaging portions 21' of the circuit board 20', thereby fixing the heat sink 10' to the circuit board 20'. In the above two embodiments, the legs may be provided in plurality, which may have different shapes; the circuit board may be provided with a concave M307290 slot at a position corresponding to the leg; the legs of the heat sink are also It may be non-integrally formed with the heat sink, and is fixed as a single component to the base of the heat sink, and constitutes a leg extending downward from the base. In summary, this creation meets the requirements of the new patent and submits a patent application in accordance with the law. However, the above are only preferred embodiments of the present invention, and those skilled in the art will be able to cover the equivalent modifications or variations in the spirit of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of a preferred embodiment of the present circuit board assembly. 2 is a cross-sectional view showing the assembled circuit board of FIG. 1. 3 is an exploded perspective view of another preferred embodiment of the present circuit board assembly. 4 is a cross-sectional view showing the assembled circuit board of FIG. 3. [Main component symbol description] Heat sink 10 Base 11 Leg 110 Limiting portion 111 Inserting portion 112 Heat sink fin 12 Circuit board 20 Opening 21 Wafer 30 Heat conducting layer 40 Heat sink 105 Base 11, Leg 110? Heat sink fin Sheet 12, circuit board 20? engaging portion 21, wafer 30, wire 40, hook 41, heat conducting layer 50,