TWI560424B - Heat-dissipating assembly structure - Google Patents

Heat-dissipating assembly structure

Info

Publication number
TWI560424B
TWI560424B TW102117945A TW102117945A TWI560424B TW I560424 B TWI560424 B TW I560424B TW 102117945 A TW102117945 A TW 102117945A TW 102117945 A TW102117945 A TW 102117945A TW I560424 B TWI560424 B TW I560424B
Authority
TW
Taiwan
Prior art keywords
heat
assembly structure
dissipating assembly
dissipating
assembly
Prior art date
Application number
TW102117945A
Other languages
Chinese (zh)
Other versions
TW201445105A (en
Inventor
Shenghung Tsai
Hsinen Chen
Hsiangchao Liu
Original Assignee
Wistron Neweb Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wistron Neweb Corp filed Critical Wistron Neweb Corp
Priority to TW102117945A priority Critical patent/TWI560424B/en
Publication of TW201445105A publication Critical patent/TW201445105A/en
Application granted granted Critical
Publication of TWI560424B publication Critical patent/TWI560424B/en

Links

TW102117945A 2013-05-21 2013-05-21 Heat-dissipating assembly structure TWI560424B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW102117945A TWI560424B (en) 2013-05-21 2013-05-21 Heat-dissipating assembly structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102117945A TWI560424B (en) 2013-05-21 2013-05-21 Heat-dissipating assembly structure

Publications (2)

Publication Number Publication Date
TW201445105A TW201445105A (en) 2014-12-01
TWI560424B true TWI560424B (en) 2016-12-01

Family

ID=52706988

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102117945A TWI560424B (en) 2013-05-21 2013-05-21 Heat-dissipating assembly structure

Country Status (1)

Country Link
TW (1) TWI560424B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM256665U (en) * 2004-01-20 2005-02-01 Top Yang Technology Entpr Co Hook plate structure for object
TWM303415U (en) * 2006-07-07 2006-12-21 Icoolpsc Comp Products Corp Lt Cooling device
TWM307290U (en) * 2006-09-08 2007-03-01 Hon Hai Prec Ind Co Ltd Combination of printed circuit board
TWM322704U (en) * 2007-05-22 2007-11-21 Inventec Appliances Corp Fixing mechanism for a portable electronic device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM256665U (en) * 2004-01-20 2005-02-01 Top Yang Technology Entpr Co Hook plate structure for object
TWM303415U (en) * 2006-07-07 2006-12-21 Icoolpsc Comp Products Corp Lt Cooling device
TWM307290U (en) * 2006-09-08 2007-03-01 Hon Hai Prec Ind Co Ltd Combination of printed circuit board
TWM322704U (en) * 2007-05-22 2007-11-21 Inventec Appliances Corp Fixing mechanism for a portable electronic device

Also Published As

Publication number Publication date
TW201445105A (en) 2014-12-01

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