SG10201404283UA - Semiconductor structure - Google Patents
Semiconductor structureInfo
- Publication number
- SG10201404283UA SG10201404283UA SG10201404283UA SG10201404283UA SG10201404283UA SG 10201404283U A SG10201404283U A SG 10201404283UA SG 10201404283U A SG10201404283U A SG 10201404283UA SG 10201404283U A SG10201404283U A SG 10201404283UA SG 10201404283U A SG10201404283U A SG 10201404283UA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor structure
- semiconductor
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102127697A TWI467757B (en) | 2013-08-02 | 2013-08-02 | Semiconductor structure |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201404283UA true SG10201404283UA (en) | 2015-03-30 |
Family
ID=52502902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201404283UA SG10201404283UA (en) | 2013-08-02 | 2014-07-22 | Semiconductor structure |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5933645B2 (en) |
KR (1) | KR101613190B1 (en) |
CN (1) | CN104347682A (en) |
SG (1) | SG10201404283UA (en) |
TW (1) | TWI467757B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI467711B (en) * | 2013-09-10 | 2015-01-01 | Chipbond Technology Corp | Semiconductorstructure |
TWI493662B (en) * | 2013-09-27 | 2015-07-21 | Chipbond Technology Corp | Semiconductor structure |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01120028A (en) * | 1987-11-02 | 1989-05-12 | Nec Corp | Semiconductor integrated circuit |
JP2833655B2 (en) * | 1989-03-30 | 1998-12-09 | 富士通株式会社 | Method for manufacturing semiconductor device |
KR930001371A (en) * | 1991-06-27 | 1993-01-16 | 김광호 | Semiconductor Manufacturing Substrate and Formation Method |
JPH08293476A (en) * | 1995-04-21 | 1996-11-05 | Hitachi Ltd | Semiconductor wafer and photomask and manufacture of semiconductor integrated circuit device |
JP2001127024A (en) * | 1999-10-28 | 2001-05-11 | Iwate Toshiba Electronics Kk | Semiconductor device and manufacturing method thereof |
KR20010059532A (en) * | 1999-12-30 | 2001-07-06 | 박종섭 | Manufacturing method for semiconductor device |
JP3718205B2 (en) * | 2003-07-04 | 2005-11-24 | 松下電器産業株式会社 | Chip stacked semiconductor device and manufacturing method thereof |
JP5428123B2 (en) * | 2006-08-16 | 2014-02-26 | 富士通セミコンダクター株式会社 | Semiconductor device and manufacturing method thereof |
US8014154B2 (en) * | 2006-09-27 | 2011-09-06 | Samsung Electronics Co., Ltd. | Circuit substrate for preventing warpage and package using the same |
US7960814B2 (en) * | 2007-08-08 | 2011-06-14 | Freescale Semiconductor, Inc. | Stress relief of a semiconductor device |
JP5353153B2 (en) * | 2007-11-09 | 2013-11-27 | パナソニック株式会社 | Mounting structure |
US7888776B2 (en) * | 2008-06-30 | 2011-02-15 | Texas Instruments Incorporated | Capacitor-based method for determining and characterizing scribe seal integrity and integrity loss |
US8125054B2 (en) * | 2008-09-23 | 2012-02-28 | Texas Instruments Incorporated | Semiconductor device having enhanced scribe and method for fabrication |
JP5297859B2 (en) | 2009-03-27 | 2013-09-25 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
TWI399845B (en) * | 2009-09-24 | 2013-06-21 | Powertech Technology Inc | Multi-chip stacked device without loop height and its manufacturing method |
JP2011216753A (en) * | 2010-04-01 | 2011-10-27 | Panasonic Corp | Semiconductor device, and method of manufacturing the same |
JP5536682B2 (en) * | 2011-01-18 | 2014-07-02 | 日本特殊陶業株式会社 | Component built-in wiring board |
US20120286397A1 (en) * | 2011-05-13 | 2012-11-15 | Globalfoundries Inc. | Die Seal for Integrated Circuit Device |
CN103021962B (en) * | 2011-09-20 | 2015-07-22 | 中芯国际集成电路制造(北京)有限公司 | Semiconductor chip and processing method thereof |
TWI520288B (en) * | 2011-10-04 | 2016-02-01 | 頎邦科技股份有限公司 | Semiconductor structure and package |
-
2013
- 2013-08-02 TW TW102127697A patent/TWI467757B/en active
- 2013-08-15 CN CN201310356743.8A patent/CN104347682A/en active Pending
-
2014
- 2014-07-22 SG SG10201404283UA patent/SG10201404283UA/en unknown
- 2014-07-22 JP JP2014148601A patent/JP5933645B2/en active Active
- 2014-07-29 KR KR1020140096432A patent/KR101613190B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2015032826A (en) | 2015-02-16 |
KR101613190B1 (en) | 2016-04-18 |
TW201507148A (en) | 2015-02-16 |
CN104347682A (en) | 2015-02-11 |
JP5933645B2 (en) | 2016-06-15 |
KR20150016110A (en) | 2015-02-11 |
TWI467757B (en) | 2015-01-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201604650SA (en) | Semiconductor device | |
GB201315208D0 (en) | Compound semiconductor structure | |
EP2942816A4 (en) | Semiconductor device | |
EP2966683A4 (en) | Semiconductor device | |
SG10201707381WA (en) | Semiconductor device | |
HK1206868A1 (en) | Semiconductor device | |
TWI563660B (en) | Semiconductor device | |
EP2975641A4 (en) | Semiconductor device | |
HK1205590A1 (en) | Semiconductor device | |
EP2874188A4 (en) | Semiconductor device | |
GB201510735D0 (en) | Semiconductor device | |
HK1201376A1 (en) | Semiconductor device | |
HK1214032A1 (en) | Semiconductor device | |
EP3021485A4 (en) | Semiconductor device | |
HK1205356A1 (en) | Semiconductor device | |
HK1201989A1 (en) | Semiconductor device | |
EP3024024A4 (en) | Semiconductor module | |
HK1208958A1 (en) | Semiconductor device | |
SG11201603413PA (en) | Semiconductor device | |
HK1207474A1 (en) | Semiconductor device | |
HK1202705A1 (en) | Semiconductor device | |
HK1213036A1 (en) | Tube-fastening structure | |
TWI563515B (en) | Semiconductor device | |
PL3044389T3 (en) | Mullion-transom structure | |
EP2953159A4 (en) | Semiconductor device |