SG10201404283UA - Semiconductor structure - Google Patents

Semiconductor structure

Info

Publication number
SG10201404283UA
SG10201404283UA SG10201404283UA SG10201404283UA SG10201404283UA SG 10201404283U A SG10201404283U A SG 10201404283UA SG 10201404283U A SG10201404283U A SG 10201404283UA SG 10201404283U A SG10201404283U A SG 10201404283UA SG 10201404283U A SG10201404283U A SG 10201404283UA
Authority
SG
Singapore
Prior art keywords
semiconductor structure
semiconductor
Prior art date
Application number
SG10201404283UA
Inventor
Hsieh Chin-Tang
Guo Shyh-Jen
Hsu You-Ming
Original Assignee
Chipbond Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipbond Technology Corp filed Critical Chipbond Technology Corp
Publication of SG10201404283UA publication Critical patent/SG10201404283UA/en

Links

SG10201404283UA 2013-08-02 2014-07-22 Semiconductor structure SG10201404283UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102127697A TWI467757B (en) 2013-08-02 2013-08-02 Semiconductor structure

Publications (1)

Publication Number Publication Date
SG10201404283UA true SG10201404283UA (en) 2015-03-30

Family

ID=52502902

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201404283UA SG10201404283UA (en) 2013-08-02 2014-07-22 Semiconductor structure

Country Status (5)

Country Link
JP (1) JP5933645B2 (en)
KR (1) KR101613190B1 (en)
CN (1) CN104347682A (en)
SG (1) SG10201404283UA (en)
TW (1) TWI467757B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI467711B (en) * 2013-09-10 2015-01-01 Chipbond Technology Corp Semiconductorstructure
TWI493662B (en) * 2013-09-27 2015-07-21 Chipbond Technology Corp Semiconductor structure

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01120028A (en) * 1987-11-02 1989-05-12 Nec Corp Semiconductor integrated circuit
JP2833655B2 (en) * 1989-03-30 1998-12-09 富士通株式会社 Method for manufacturing semiconductor device
KR930001371A (en) * 1991-06-27 1993-01-16 김광호 Semiconductor Manufacturing Substrate and Formation Method
JPH08293476A (en) * 1995-04-21 1996-11-05 Hitachi Ltd Semiconductor wafer and photomask and manufacture of semiconductor integrated circuit device
JP2001127024A (en) * 1999-10-28 2001-05-11 Iwate Toshiba Electronics Kk Semiconductor device and manufacturing method thereof
KR20010059532A (en) * 1999-12-30 2001-07-06 박종섭 Manufacturing method for semiconductor device
JP3718205B2 (en) * 2003-07-04 2005-11-24 松下電器産業株式会社 Chip stacked semiconductor device and manufacturing method thereof
JP5428123B2 (en) * 2006-08-16 2014-02-26 富士通セミコンダクター株式会社 Semiconductor device and manufacturing method thereof
US8014154B2 (en) * 2006-09-27 2011-09-06 Samsung Electronics Co., Ltd. Circuit substrate for preventing warpage and package using the same
US7960814B2 (en) * 2007-08-08 2011-06-14 Freescale Semiconductor, Inc. Stress relief of a semiconductor device
JP5353153B2 (en) * 2007-11-09 2013-11-27 パナソニック株式会社 Mounting structure
US7888776B2 (en) * 2008-06-30 2011-02-15 Texas Instruments Incorporated Capacitor-based method for determining and characterizing scribe seal integrity and integrity loss
US8125054B2 (en) * 2008-09-23 2012-02-28 Texas Instruments Incorporated Semiconductor device having enhanced scribe and method for fabrication
JP5297859B2 (en) 2009-03-27 2013-09-25 ルネサスエレクトロニクス株式会社 Semiconductor device
TWI399845B (en) * 2009-09-24 2013-06-21 Powertech Technology Inc Multi-chip stacked device without loop height and its manufacturing method
JP2011216753A (en) * 2010-04-01 2011-10-27 Panasonic Corp Semiconductor device, and method of manufacturing the same
JP5536682B2 (en) * 2011-01-18 2014-07-02 日本特殊陶業株式会社 Component built-in wiring board
US20120286397A1 (en) * 2011-05-13 2012-11-15 Globalfoundries Inc. Die Seal for Integrated Circuit Device
CN103021962B (en) * 2011-09-20 2015-07-22 中芯国际集成电路制造(北京)有限公司 Semiconductor chip and processing method thereof
TWI520288B (en) * 2011-10-04 2016-02-01 頎邦科技股份有限公司 Semiconductor structure and package

Also Published As

Publication number Publication date
JP2015032826A (en) 2015-02-16
KR101613190B1 (en) 2016-04-18
TW201507148A (en) 2015-02-16
CN104347682A (en) 2015-02-11
JP5933645B2 (en) 2016-06-15
KR20150016110A (en) 2015-02-11
TWI467757B (en) 2015-01-01

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