1336035 099年10月11日 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置組合，特別係指一種用來散發 電子元件所產生的熱Ϊ的散熱裝置組合"》 【先前技術】 [0002]中央處理器等電子元件在正常的運行過程中將產生大量 的熱’為了及時散發該等熱量，通常在電子元件上安裝 一散熱器，以協助其散熱。 [〇〇〇3]為了方便並牢靠地固定散熱器，業界通常在電路板上設 置一固定模組，利用扣具將散熱器固定到該固定模組上 ，如圖1所示’即是利用兩扣具40將散'熱為50固定在固定1336035 October 11th, 2008, the invention claims: [Technical field] [0001] The present invention relates to a heat sink assembly, in particular to a heat sink assembly for dissipating heat generated by electronic components" [Prior Art] [0002] Electronic components such as a central processing unit will generate a large amount of heat during normal operation. In order to dissipate the heat in time, a heat sink is usually mounted on the electronic component to assist in heat dissipation. [〇〇〇3] In order to conveniently and securely fix the heat sink, the industry usually installs a fixed module on the circuit board, and the heat sink is fixed to the fixed module by using a buckle, as shown in FIG. Two clips 40 will be scattered 'heat for 50 fixed at the fixed
>.r - A ^ ·.;< I 模組60上。每一扣具40大致！ “jj”狀且.兩端均向下彎 折形成一扣臂44 ’扣臂44上設有扣孔46 ’並在扣孔46的 上方開設有一拖孔48。散熱器5〇的相對兩側預留有供扣 具40放置的承載區52，固定模組6〇上設有與扣具4〇的扣 ； L.. " i 孔46扣合的凸緣62。組裝時，先將扣具40—端的扣臂44 的扣孔46卡合在固定模組60的凸緣62上，接著利用起子 等輔助工具插入扣具40另一扣臂44的撬孔48内並向下施 力使該扣臂44產生旋轉，直至其上的扣孔46扣合在固定 模組6 0對應的凸緣6 2上。拆卸時，則利用起子等工具插 入扣具40—端的撬扎48内並朝外扳動，使扣具4〇的扣孔 46與固定模組6〇的凸緣62脫離卡扣。這種扣具必須借助 工具的輔助作用，顯然十分不方便，實用性也大大降低 。另外，因這種扣具具有較大的剛度，需要施加較大的 力以克服其剛性，有時甚至施力過大而導致滑脫現象， 096134424 表單編號A0101 第5頁/共22頁 0993365120-0 1336035 099年10月11日後正替換頁 對周圍的電子元件造成損壞。 【發明内容】 [0004] 有鑒於此，實有必要提供一種組裝和拆卸操作方便的散 熱裝置組合。 [0005] 一種散熱裝置組合，包括一散熱體和一固定裝置，該散 熱體包括複數固定柱。其中，該固定裝置包括一背板， 其上設有一開口，該等固定柱與背板配合而將散熱體和 背板預組合；一扣具，其包括一與背板上的開口相對的 壓靠部、自壓靠部兩侧延伸而出的二枢接轴，以及自一 樞接轴―折延伸而出的一操作部。驅動該操作部可令扣 具在自由狀態和扣合狀態之間轉換；其中，扣具處於自 由狀態時，壓靠部與散熱體之間的距離最大；扣具處於 扣合狀態時，壓靠部穿入背板的開口内且與散熱體之間 的距離最小。 [0006] 與習知技術相比，本發明通過驅動操作部可令扣具在自 由狀態和扣合狀態之間轉換，可以方便地將該散熱裝置 組合安裝到電路板上或將該散熱裝置組合從電路板上拆 卸下來。 【實施方式】 [0007] 圖2所示為本發明一實施例中的散熱裝置組合。該散熱裝 置組合用於對一電路板200上的電子元件100 (圖2中的虛 線所示）進行散熱。該電路板200上設有四個穿孔220， 該等穿孔220環繞該電子元件100設置用以將該散熱裝置 組合固定在該電路板200上。 096134424 表單編號A0101 第6頁/共22頁 0993365120-0 Γ336035 [0008] 099年ίο月11日梭玉 如圖2中散熱裝置組合所處的位置’該散熱裝置組合包括 一位於電路板200下方的散熱體3〇〇和一位於電路板2〇〇 上方的固定裝置400。 [0009] [0010] [0011] 該散熱體3〇〇包括一散熱器310和一風扇330。該散熱器 310包括一基座312，其頂面3120與電子元件1〇〇直接接 觸’和複數散熱片314 ’該等散熱片314設置在基座312 的下方。該風扇330設於散熱器31〇的底部。 該散熱體300進一步包括四個設置於散熱器31〇的基座 312四角的固定柱350。如圖3中所示，每一固定柱350且 有一個位於其底端的頭部35晏.。.辛固定柱350靠近其頂端 處設有一環形的卡槽354。為》杈3在〇的‘頭^p352和卡 槽354與基座312和固定裝#ioi—一配‘ϋ將散熱體 300固定在電路板200上，其中，該固定柱35〇的頭部352 抵頂在基座312的底面，而固定杈350的卡槽354穿過電 路板200上的穿孔220後再與凤.定裝置4〇〇卡扣配合。 該固定裝置4GG包括-大致t “十，，字型的基板41〇、一 大致呈矩型的背板430，及一扣具45〇。其中，該基板 410貼設於電路板200的上表面；該背板43〇設於基板41〇 的上方並與固定柱350的卡槽354配合；該扣具45〇樞接 在背板430上，並可在第一位置和第二位置之間旋轉從而 將散熱體300固定在電路板200上或將散熱體3〇〇從電路 板200上拆卸下H下針對固定裝置4_具體結構作 進一步說明。 [0012] 該基板410包括一大致呈矩形的本體部412及四個延伸臂 096134424 表單编號A0101 第7頁/共22頁 0993365120-0 1336035 099年10月11日按正替换頁 414，該四個延伸臂41‘4自丰體部412的四角向外放射狀 延伸而出。一矩形的抵壓部416自本體部412的中部向上 凸伸而成，並凸向背板430。二間隔設置的定位塊418自 抵壓部41 6向上延伸而出，並指向背板430。每一延伸臂 414的末端部分設有一穿孔4140。將基板410貼在電路板 200的上表面，並令延伸臂414上的穿孔4140與電路板 200上相應的穿孔220對齊’此時，固定柱350即可依次 穿過電路板200上的穿孔220和延伸臂414上的穿孔4140 ，進而與背板430卡扣配合。 [0013] 背板430比基板410的面積大，並覆蓋於基板410上。在 背板430中心部分形成有一大致k矩形的開口 432，該開 口 432與基板410上的抵壓部416|i對應，且抵壓部416上 的定位塊418凸伸於該開口 432内。在背板430上臨近開 口 432兩側處，分別設有一收容部434，該收容部434自 背板430向上垂直延伸而出，且在每一收容部434的底部 形成有一缺口 4342。此外，在背板430上還形成有兩個樞 接部436，這兩個樞接部436位於開口 432的相對兩側且 上述的收容部434也位於兩個枢接部436之間。每一個樞 接部436為具有樞接孔4362的卷狀結構，其是先自背板 430向上延伸再向背板430彎折而形成》該兩個樞接部 436的樞接孔4362和該兩個收容部434的缺口 4342大致位 於同一條直線上’用以安裝上述扣具450並令扣具450圍 繞該樞接孔4362轉動》 [0014] 背板430上還形成有四個彎曲的狹長槽437，該等狹長槽 437分佈於背板430的四角用於收容、固定固定柱350。 096134424 表單編號 A0101 第 8 頁/共 22 頁 0993365120-0 Γ336035 _ 099年10月11日按正替換頁 每一個狹長槽437的寬度要比卡槽354的直徑小。每一個 狹長槽437的一端終止於一第一通孔438，該第一通孔 438的直徑要比卡槽354的直徑大；每—個狹長槽437的 另一端終止於一第二通孔439，該第二通孔439的直徑要 比卡槽3 54的直徑小。 [0015] 該等狹長槽437位於以背板430的中心為圓心的圓周上， 且該等狹長槽437的第一通孔438、第二通孔439在該圓 周上呈交替排列。這樣設計，固定柱350可穿過電路板 200和基板410，並穿設於相應的第一通孔438内；此時 ’沿著圖4中所示的方向A ’即順時針方向轉動背板4 3 〇使 背板430在平行於自身的平面内相對參:熱體3〇〇及電路板 2〇0旋轉’固定柱35〇將沿者相應;的.叙.美槽4 3 γ相對背板 430滑動β當固定柱350滑動到相應的第二通孔439，固 疋柱350的卡槽354與该第一通孔439的邊緣配合而防止 固定柱350從狹長槽437内滑脫。換言之，通過固定柱 350卡槽354和背板430的配合即可將散熱裝置組合預組 裝到電路板200上。之後，旋轉柩接於背板43〇上的扣具 450，即可方便地將散熱裝置組合緊緊地固定於電路板 200上。該扣具450的具體結構如下所述。 [0016] 該扣具450係由線狀材料，如金屬絲等彎折形成，其包括 一凸出的壓靠部452、從壓靠部452的相對兩端延伸而出 的二枢接轴454，以及自每一框接轴454彎折延伸而出的 一操作部456 ’該操作部456主要為了便於操作該扣具 450 ° 該扣具450樞接到背板430上之後，每一個樞接軸454的 096134424 表單編號Α0101 第9頁/共22頁 0993365120-0 [0017] 1336035 099年10月11日镔正替换頁 兩端分別收容於相鄰的樞接部436的樞接孔4362和收容部 434的缺口 4342内；與此同時，壓靠部452位於收容部 434之間並穿設於背板43〇的開口 432内以抵壓基板410的 抵壓部41 6。 [0018]如上所述，通過旋轉背板430使固定柱350的卡槽354與 背板430配合，從而將散熱裝置組合預組裝到電路板2〇〇 上。此時’操作扣具450的操作部456，令扣具450從第 一位置即扣具450處於自由狀態的位置，旋轉到第二位置 即扣具450處於扣合狀態的位置，即可將散熱裝置組合緊 緊地固定到電路板200上。 _9]如圖3及圖4所示，固定裝置400却扣具450處於自由狀態 。在該狀態’扣具450的操.作部45、6大致垂直於背板430 ，且壓靠部452與基板410之間具有一段距離。同時，電 路板200鬆散地限位於散熱體300和背板430之間。 [0020] 驅動操作部456，使其在垂直於背板430的平面内沿著圖3 中的方向B，即逆時針方向旋轉；此時，操作部456以扣 具450的極接軸454為轉動軸旋轉，導致扣具45〇的壓靠 部452與基板410的抵壓部416之間的距離逐漸減小。隨 著操作部456的繼續旋轉’扣具450的壓靠部452與抵壓 部416接觸，開始產生變形並對抵壓部416施加一個逐漸 增大的力令基板410趨向於向電路板200運動。與此同時 ，電路板200與背板430之間的距離不斷增大，使得背板 430對固定柱350的卡槽354施加一個不斷增大的力，在 該力的作用下，散熱器310的基座312與電路板2〇〇上的 電子元件100的接觸也越來越緊密。 096134424 表單編號A0101 第10頁/共22頁 0993365120-0 Γ336035 [0021] [0022] [0023] [0024] 096134424 099年l〇月11日接正替換頁 如圖5及圖6所示’操作部456旋轉至接觸背板430，壓靠 部452同時抵頂在抵壓部416和定位塊418上，此時，該 扣具450處於扣合狀態。在該狀態，電路板2〇〇與背板 430之間保持一定的距離，使得背板430對固定柱350施 加一個足夠大的力而令散熱器310的基座312與電路板 200上的電子元件100緊密接觸。 此外’當扣具450處於扣合狀態時，扣具450的壓靠部 452和操作部456位於枢接軸454的相對兩侧，這樣一來 ’扣具450本身構成了 一個杠桿結構。換言之，樞接轴 454相當於_個杠桿的支點，壓靠部452相當於杠桿的阻 "..in, ' ... . . ,.. 力臂’而操作部456相當於辛稈的系力^f S在扣具45〇處 於扣合狀態時，基板410對壓靠部452施加一個阻力防止 扣具450因震動等原因而回轉到自由狀態。 另外’在扣具450處於扣合狀態時，由於固定柱350的卡 槽354與背板430的第二通孔439:的邊緣之間存在較大的 摩擦力’該摩擦力可防止背板430沿著與圖4中的方向A 相反的方向旋轉，從而可進一步確保散熱器31〇與電子元 件100緊密接觸。 當需要將散熱器310從電路板200上拆卸下來時，可先沿 著與圖3中的方向b相反的方向旋轉操作部456，使扣具 450處於自由狀態，並導致固定柱350的卡槽354與背板 430的第二通孔439的邊緣之間的摩擦力消失。然後，沿 著與圖4中的方向A相反的方向旋轉背板430，令固定柱 350沿著相應的狹長槽437從第二通孔439滑動至第一通 孔437 »此時，可方便地將固定柱350從背板430的第一 表單編號A0101 第11頁/共22頁 0993365120-0 1336035 099年10月11日垵正替换頁 通孔437、基板410上的穿外4140及電路板20 0上的穿孔 220中抽出，從而將散熱器310從電路板200上拆卸下來 〇 [0025] 在上述實施中，基板410用於增強電路板200的強度，並 承受扣具450抵壓部452的作用力。在其他實施例中，該 基板410可以省略而令扣具450的壓靠部452直接作用於 電路板200上，從而將散熱器310安裝到電路板200上。 [0026] 综上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施例 ，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所％之等效修飾或變化， 皆應涵蓋於以下申請專利範圍内·。 【圖式簡單說明】 [0027] 圖1係習知散熱裝置的立體分解圖。 [0028] 圖2係本發明一實施例中散熱裝置組合的立體分解圖，其 中該散熱裝置組合用於對一電路板上的電子元件進行散 熱。 [0029] 圖3係圖2中散熱裝置組合與電路板的組裝圖，其中該散 熱裝置組合的扣具處於自由狀態。 [0030] 圖4係圖3中的散熱裝置組合及電路板的底部朝上時的立 體圖。 [0031] 圖5係圖2中散熱裝置組合與電路板的組裝圖，其中該散 熱裝置組合的扣具處於扣合狀態。 096134424 表單編號A0101 第12頁/共22頁 0993365120-0 099年10月11日梭正替换頁 1336035 [0032] 圖6係圖5中的散熱裝置組合及電路板的底部朝上時的立 體圖。 【主要元件符號說明】 [0033] 電子元件：100 [0034] 電路板：200 [0035] 穿孔：22 0 [0036] 散熱體：300 [0037] 散熱器：310 [0038] 基座：312 1 '.、 u. V-, Ϋ··γ^ --7 一, [0039] 頂面：3120 [0040] 散熱片：314 [0041] 風扇：330 [0042] 固定柱：3 5 0 [0043] 頭部：352 [0044] 卡槽：354 [0045] 固定裝置：400 [0046] 基板：410 [0047] 本體部：412 [0048] 延伸臂：414 [0049] 穿孔：4140 096134424 表單編號Α0101 第13頁/共22頁 0993365120-0 1336035 [0050] 抵壓部：416 [0051] 定位塊：418 [0052] 背板：430 [0053] 開口 ： 432 [0054] 收容部：434 [0055] 缺口 ： 4342 [0056] 枢接部：43 6 [0057] 樞接孔：4362 [0058] 狹長槽：437 [0059] 第一通孔：438 [0060] 第二通孔：439 [0061] 扣具：450 [0062] 壓靠部：45 2 [0063] 極接軸：454 [0064] 操作部：456 096134424 表單编號A0101 第14頁/共22頁 099年10月11日接正替换頁 0993365120-0>.r - A ^ ·.; < I on module 60. Each buckle 40 is roughly! The "jj" shape and the two ends are bent downward to form a buckle arm 44. The buckle arm 44 is provided with a buckle hole 46' and a through hole 48 is formed above the buckle hole 46. A bearing area 52 for the fastener 40 is reserved on opposite sides of the heat sink 5〇, and a buckle with the buckle 4〇 is disposed on the fixing module 6〇; L.. " i hole 46 fastening flange 62. When assembling, the buckle hole 46 of the buckle arm 44 of the buckle 40 is first engaged on the flange 62 of the fixing module 60, and then inserted into the bore 48 of the other buckle arm 44 of the buckle 40 by using an auxiliary tool such as a driver. The downwardly biasing force causes the buckle arm 44 to rotate until the buckle hole 46 thereon is fastened to the flange 62 corresponding to the fixed module 60. When disassembling, the tool is inserted into the shackle 48 of the clip 40 at the end of the clip 40 and pulled outward, so that the buckle hole 46 of the clip 4 与 is disengaged from the flange 62 of the fixing module 6 。. This kind of buckle must be assisted by the aid of the tool, which is obviously very inconvenient and the practicality is greatly reduced. In addition, because the buckle has a large rigidity, it is required to apply a large force to overcome its rigidity, and sometimes even excessive force causes slippage, 096134424 Form No. A0101 Page 5 / Total 22 Page 0993365120-0 1336035 After October 11, 099, the replacement page is causing damage to surrounding electronic components. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide a heat sink assembly that is easy to assemble and disassemble. [0005] A heat sink assembly includes a heat sink and a fixture, the heat sink including a plurality of fixed columns. The fixing device comprises a back plate, and an opening is arranged thereon, the fixing column cooperates with the back plate to pre-assemble the heat sink and the back plate; and a buckle includes a pressure opposite to the opening on the back plate The two pivoting shafts extending from the two sides of the supporting portion and the two pivoting shafts extend from the pivoting shaft. Driving the operating portion can switch the buckle between the free state and the snapping state; wherein, when the buckle is in the free state, the distance between the pressing portion and the heat sink is the largest; when the buckle is in the buckled state, the buckle is pressed The portion penetrates into the opening of the backing plate and has a minimum distance from the heat sink. Compared with the prior art, the present invention can drive the buckle between the free state and the snap-fit state by driving the operating portion, and the heat sink can be conveniently assembled to the circuit board or the heat sink can be combined. Removed from the board. [Embodiment] FIG. 2 shows a heat sink assembly according to an embodiment of the present invention. The heat sink assembly is used to dissipate heat from electronic component 100 (shown by dashed lines in Figure 2) on a circuit board 200. The circuit board 200 is provided with four through holes 220, which are disposed around the electronic component 100 for fixing the heat sink assembly to the circuit board 200. 096134424 Form No. A0101 Page 6 of 22 Page 0993365120-0 Γ336035 [0008] 099 ίο月11日索玉 Figure 2 The position where the heat sink assembly is located 'The heat sink assembly includes a lower layer under the circuit board 200 The heat sink 3〇〇 and a fixture 400 located above the circuit board 2〇〇. [0011] The heat sink 3 includes a heat sink 310 and a fan 330. The heat sink 310 includes a base 312 having a top surface 3120 that is in direct contact with the electronic component 1' and a plurality of heat sinks 314'. The heat sinks 314 are disposed below the base 312. The fan 330 is disposed at the bottom of the heat sink 31〇. The heat sink 300 further includes four fixing posts 350 disposed at four corners of the base 312 of the heat sink 31A. As shown in Fig. 3, each of the fixing posts 350 has a head 35 晏 at its bottom end. The sinus fixing post 350 is provided with an annular card slot 354 near its top end. The heat sink 300 is fixed to the circuit board 200, and the head of the fixed post 35〇 is fixed on the circuit board 200 by the 'head' p352 and the card slot 354 and the base 312 and the fixed mount #ioi. The 352 is abutted on the bottom surface of the base 312, and the slot 354 of the fixed cymbal 350 passes through the through hole 220 on the circuit board 200 and then snaps into engagement with the phoenix fixed device 4 。. The fixing device 4GG includes a substantially "t", a font substrate 41, a substantially rectangular back plate 430, and a buckle 45. The substrate 410 is attached to the upper surface of the circuit board 200. The back plate 43 is disposed above the substrate 41〇 and cooperates with the slot 354 of the fixing post 350. The buckle 45 is pivotally connected to the back plate 430 and can be rotated between the first position and the second position. Therefore, the heat sink 300 is fixed on the circuit board 200 or the heat sink 3 is removed from the circuit board 200. The specific structure of the fixing device 4_ is further described. [0012] The substrate 410 includes a substantially rectangular shape. The body portion 412 and the four extension arms 096134424 Form No. A0101 Page 7 / Total 22 pages 0993365120-0 1336035 On October 11, 099, according to the replacement page 414, the four extension arms 41'4 are from the body portion 412 The four corners extend radially outwardly. A rectangular pressing portion 416 protrudes upward from the central portion of the body portion 412 and protrudes toward the back plate 430. The two spaced positioning blocks 418 extend upward from the pressing portion 41 6 Out and pointing to the back plate 430. The end portion of each of the extension arms 414 is provided with a through hole 4140. The substrate 410 is attached to the upper surface of the circuit board 200, and the through holes 4140 on the extension arm 414 are aligned with the corresponding through holes 220 on the circuit board 200. At this time, the fixing post 350 can sequentially pass through the through holes 220 on the circuit board 200 and The through hole 4140 of the extension arm 414 is further engaged with the back plate 430. [0013] The back plate 430 is larger than the area of the substrate 410 and covers the substrate 410. A substantially k-shaped opening is formed in the central portion of the back plate 430. 432, the opening 432 corresponds to the pressing portion 416|i on the substrate 410, and the positioning block 418 on the pressing portion 416 protrudes into the opening 432. The two sides of the back plate 430 adjacent to the opening 432 are respectively disposed. There is a receiving portion 434 extending vertically upward from the back plate 430, and a notch 4342 is formed at the bottom of each receiving portion 434. Further, two pivoting portions 436 are formed on the back plate 430. The two pivoting portions 436 are located on opposite sides of the opening 432 and the receiving portion 434 is also located between the two pivoting portions 436. Each of the pivoting portions 436 is a roll structure having a pivot hole 4362, which is Firstly extending from the back plate 430 and then bending to the back plate 430 to form The pivoting holes 4362 of the two pivoting portions 436 and the notches 4342 of the two receiving portions 434 are substantially on the same straight line 'to mount the fastener 450 and rotate the buckle 450 around the pivoting hole 4362. A plurality of curved elongated slots 437 are formed on the backplane 430. The elongated slots 437 are distributed at the four corners of the backplane 430 for receiving and fixing the fixing post 350. 096134424 Form No. A0101 Page 8 of 22 0993365120-0 Γ336035 _ October 11th, 2010 Pressing the positive replacement page Each slit 437 has a smaller width than the diameter of the slot 354. One end of each of the elongated slots 437 terminates in a first through hole 438 having a diameter larger than the diameter of the slot 354; the other end of each of the elongated slots 437 terminates in a second through hole 439. The diameter of the second through hole 439 is smaller than the diameter of the card slot 3 54. [0015] The elongated slots 437 are located on a circumference centered on the center of the back plate 430, and the first through holes 438 and the second through holes 439 of the elongated slots 437 are alternately arranged on the circumference. In this way, the fixing post 350 can pass through the circuit board 200 and the substrate 410 and pass through the corresponding first through hole 438; at this time, the direction back A is rotated clockwise in the direction A' shown in FIG. 4 3 〇 背 背 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 430 The plate 430 slides β. When the fixing post 350 slides to the corresponding second through hole 439, the locking groove 354 of the fixing post 350 cooperates with the edge of the first through hole 439 to prevent the fixing post 350 from slipping out of the elongated slot 437. In other words, the heat sink assembly can be pre-assembled onto the circuit board 200 by the cooperation of the retaining post 350 card slot 354 and the backing plate 430. Thereafter, the fastener 450 spliced to the back plate 43 is rotatably fastened to the circuit board 200 by the heat sink assembly. The specific structure of the clip 450 is as follows. [0016] The buckle 450 is formed by bending a linear material such as a wire or the like, and includes a protruding pressing portion 452 and two pivoting shafts 454 extending from opposite ends of the pressing portion 452. And an operating portion 456 that extends from each of the frame shafts 454. The operating portion 456 is mainly for facilitating operation of the buckle 450°. After the buckle 450 is pivotally connected to the backing plate 430, each pivoting 096134424 of the shaft 454 Form No. 1010101 Page 9/Total 22 Page 0993365120-0 [0017] 1336035 On October 11, 099, the two ends of the replacement page are respectively received in the pivotal holes 4362 of the adjacent pivoting portions 436 and accommodated. At the same time, the pressing portion 452 is located between the receiving portion 434 and penetrates through the opening 432 of the back plate 43A to press against the pressing portion 41 6 of the substrate 410. As described above, the card slot 354 of the fixing post 350 is engaged with the back plate 430 by rotating the back plate 430, thereby preassembling the heat sink assembly onto the circuit board 2''. At this time, the operation portion 456 of the operation of the buckle 450 allows the buckle 450 to be disengaged from the first position, that is, the position where the buckle 450 is in the free state, and is rotated to the second position, that is, the position where the buckle 450 is in the engaged state. The device combination is tightly secured to the circuit board 200. _9] As shown in FIGS. 3 and 4, the fixing device 400 has the buckle 450 in a free state. In this state, the operating portions 45, 6 of the buckle 450 are substantially perpendicular to the backing plate 430, and the pressing portion 452 has a distance from the substrate 410. At the same time, the circuit board 200 is loosely confined between the heat sink 300 and the back plate 430. [0020] driving the operating portion 456 to rotate in a direction perpendicular to the back plate 430 in the direction B in FIG. 3, that is, in a counterclockwise direction; at this time, the operating portion 456 is connected to the pole 454 of the buckle 450. The rotation of the rotating shaft causes the distance between the pressing portion 452 of the buckle 45A and the pressing portion 416 of the substrate 410 to gradually decrease. As the operating portion 456 continues to rotate, the pressing portion 452 of the buckle 450 comes into contact with the pressing portion 416, starts to deform and applies a gradually increasing force to the pressing portion 416 to cause the substrate 410 to move toward the circuit board 200. . At the same time, the distance between the circuit board 200 and the back plate 430 is continuously increased, so that the back plate 430 applies an increasing force to the slot 354 of the fixing post 350. Under the force, the heat sink 310 The contact of the pedestal 312 with the electronic component 100 on the circuit board 2 is also getting closer. 096134424 Form No. A0101 Page 10/Total 22 Page 0993365120-0 Γ336035 [0021] [0024] [0024] 096134424 099 〇月11日正正换页 as shown in Figure 5 and Figure 6 'Operation Department The 456 is rotated to contact the backing plate 430, and the pressing portion 452 is simultaneously abutted against the pressing portion 416 and the positioning block 418. At this time, the buckle 450 is in the engaged state. In this state, the circuit board 2 is kept at a certain distance from the back plate 430, so that the back plate 430 applies a sufficient force to the fixing post 350 to make the base 312 of the heat sink 310 and the electrons on the circuit board 200. Element 100 is in intimate contact. Further, when the buckle 450 is in the engaged state, the pressing portion 452 of the buckle 450 and the operating portion 456 are located on opposite sides of the pivot shaft 454, so that the buckle 450 itself constitutes a lever structure. In other words, the pivot shaft 454 is equivalent to the fulcrum of the _ lever, and the pressing portion 452 is equivalent to the resistance of the lever "..in, '. . . , .. force arm' and the operating portion 456 is equivalent to the stalk When the buckle 45 is in the engaged state, the base 410 applies a resistance to the pressing portion 452 to prevent the buckle 450 from rotating to a free state due to vibration or the like. In addition, when the buckle 450 is in the buckled state, there is a large frictional force between the slot 354 of the fixing post 350 and the edge of the second through hole 439: of the backing plate 430. This frictional force prevents the backing plate 430. Rotation in a direction opposite to the direction A in FIG. 4 can further ensure that the heat sink 31 is in close contact with the electronic component 100. When the heat sink 310 needs to be detached from the circuit board 200, the operation portion 456 may be first rotated in a direction opposite to the direction b in FIG. 3, so that the buckle 450 is in a free state, and the card slot of the fixing post 350 is caused. The friction between the edge 354 and the edge of the second through hole 439 of the backing plate 430 disappears. Then, the back plate 430 is rotated in a direction opposite to the direction A in FIG. 4, and the fixing post 350 is slid from the second through hole 439 to the first through hole 437 along the corresponding elongated slot 437. The fixing post 350 is replaced from the first form number A0101 of the backing plate 430, page 11/22, 0993365120-0 1336035, October 11, 099, replacing the through hole 437, the through hole 4140 on the substrate 410, and the circuit board 20 The hole 220 in the 0 is extracted to remove the heat sink 310 from the circuit board 200. [0025] In the above embodiment, the substrate 410 is used to reinforce the strength of the circuit board 200 and to withstand the buckle 450 of the buckle 450. Force. In other embodiments, the substrate 410 can be omitted and the pressing portion 452 of the clip 450 directly acts on the circuit board 200 to mount the heat sink 310 to the circuit board 200. In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations of the person skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0027] FIG. 1 is an exploded perspective view of a conventional heat sink. 2 is an exploded perspective view of a heat sink assembly in accordance with an embodiment of the present invention, wherein the heat sink assembly is used to dissipate heat from electronic components on a circuit board. 3 is an assembled view of the heat sink assembly and the circuit board of FIG. 2, wherein the buckle of the heat sink assembly is in a free state. [0029] FIG. 4 is a perspective view of the heat sink assembly of FIG. 3 and the bottom of the circuit board facing upward. [0030] FIG. [0031] FIG. 5 is an assembled view of the heat sink assembly and the circuit board of FIG. 2, wherein the buckle of the heat sink assembly is in a snap-fit state. 096134424 Form No. A0101 Page 12 of 22 0993365120-0 October 11th, 2008, Shuttle Replacement Page 1336035 [0032] FIG. 6 is a perspective view of the heat sink assembly of FIG. 5 and the bottom of the circuit board facing upward. [Main component symbol description] [0033] Electronic component: 100 [0034] Circuit board: 200 [0035] Perforation: 22 0 [0036] Heat sink: 300 [0037] Heat sink: 310 [0038] Base: 312 1 ' , u. V-, Ϋ··γ^ --7 one, [0039] top surface: 3120 [0040] heat sink: 314 [0041] fan: 330 [0042] fixed column: 3 5 0 [0043] head Section: 352 [0044] Card slot: 354 [0045] Fixing device: 400 [0046] Base plate: 410 [0047] Body portion: 412 [0048] Extension arm: 414 [0049] Perforation: 4140 096134424 Form number Α 0101 Page 13 / Total 22 pages 0993365120-0 1336035 [0050] Compression: 416 [0051] Positioning block: 418 [0052] Back plate: 430 [0053] Opening: 432 [0054] Containment: 434 [0055] Notch: 4342 [ 0056] pivoting portion: 43 6 [0057] pivoting hole: 4362 [0058] elongated slot: 437 [0059] first through hole: 438 [0060] second through hole: 439 [0061] buckle: 450 [0062] ] Pressing: 45 2 [0063] Pole: 454 [0064] Operation: 456 096134424 Form No. A0101 Page 14 of 22 October 10, 1099 Replacement page 0993365120-0