1295420 、九、發明說明： 【發明所屬之技術領域】 本發明係關於一種散孰# 板,上 尤指一種用以冷卻電路 板上電子凡件之散熱裝置。 【先前技術】 隨著電腦產業不斷發展，雷 聲卡mm 電子70件如中央處理器、顯 卓卞片等運灯頻率和速度不辦掉 ^ ^ 又个_徒升，發熱量越來越大， Φ不及時散發，熱量累積引起 平槓5丨起酿度升南，影響電子元件正常 運灯。 電腦性能提升使得記愔，佐 Η ^ ^ θ 行己u體條、顯音效卡等板卡上晶片 谷1日盈增加，體積越來越小， 4 工作迷度越來越快，此過 程產生之熱量不斷增加，如何快# ^ , 划17陝逑將該附加卡上晶片熱量 快速有效散發，也成目前業者需解決之問題。 通常業界於電子元件上安裝散熱器辅助其散熱，要使 散熱器與發熱電子元件接觸緊密牢固，需借助一扣具實現 散熱器與該發熱電子元件之穩固連接。 然而，由於板卡上元件密布，空間小且相鄰板卡間距 窄，於其上安裝散熱器多有不便，且極易因於一板卡上安 裝散熱器而與其相鄰板卡產生操作干涉，給散熱器安裝拆 卸造成困難。 【發明内容】 有鑒於此，有必要提供一種結構緊凑、安裝方便之散 熱裝置。 Θ 6 1295420 m Λ ' 纟發明實施例之散熱裝i包括一對散熱板及將該二散 •熱板夾置於一電路板兩側之夾持件，該夾持件包括一抵靠 部及由抵靠部兩端延伸出且夾置於該二散熱板兩侧之一對 彈性夾持部，#-散熱板上活動連接使該二散熱板克服該 夹持件彈力而張開之操作體，該操作體緊貼於該散熱板一 侧表面。 該貝轭方式與習知技術相比較，本發明僅通過作用於 ⑩該操作體之外力克服該夹持件自身彈力，將該電路板放置 於該二散熱板間，安裝方便、快捷；該操作體自由狀態時 貼設於該二散熱板外側表面，結構緊湊，節省空間。 【實施方式】 請參閱圖1，本發明散熱裝置包括貼設於一電路板1〇 兩侧之一對散熱板20及夾緊二散熱板2〇於電路板1〇兩侧 之一對夾持件30。 請同時參閱圖2至圖3，該電路板10表面貼設有發熱 電子元件50，電路板1〇上設有一穿孔12。二散熱板加均 呈矩形板狀，每一散熱板20包括一本體22及活動連接於 本體22外侧表面之操作體24。其中一散熱板2〇之本體22 底部朝向電路板10延伸出一彎鈎23，該彎鈎23插入電路 板10之穿孔12以避免散熱板2〇沿電路板10長度方向移 動。每一散熱板20之本體22包括中央略高之凸台22〇及 其兩侧略低之凹地224。兩對碗狀扣合部26分別對稱分佈 於本體22外侧面、凸台220兩侧對應之凹地224，每一扣 7 1295420 二央5又有一圓形開口細，環繞該開口 260形成一 衣=、、彖262，該扣合部26還包括—直徑小 徑之底座（未標號）。一對長 直 地224上方邊缘，，… 出分別設置於凹 凸出部27下方設有况太/ 陷—長形槽謂。對應 29 , 、#描9又&體22紐邊方向延伸之條狀溝槽 罪近溝槽29由本體22衝壓形成-捲筒狀定位部28,BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink plate, and more particularly to a heat sink for cooling electronic components on a circuit board. [Prior Art] With the continuous development of the computer industry, the frequency and speed of the lights of the Thunder card mm 70 such as the central processing unit and the display unit are not eliminated. ^ ^ Another _ zoom, the heat is getting bigger and bigger. Φ is not dissipated in time, and the accumulation of heat causes the flat bar 5 to rise and the south is affected, which affects the normal operation of the electronic components. The performance improvement of the computer makes it possible to remember that the memory of the chip is increasing, the volume is getting smaller and smaller, and the work is getting faster and faster. This process is generated. The heat is increasing, how fast # ^, 划17 Shaanxi will quickly and effectively distribute the heat of the chip on the add-on card, which is also a problem that the current industry needs to solve. Generally, the industry installs a heat sink on an electronic component to assist in heat dissipation. To make the heat sink and the heat-generating electronic component in close contact with each other, a fastener is needed to securely connect the heat sink to the heat-generating electronic component. However, due to the dense components on the board, the space is small and the spacing between adjacent boards is narrow, it is inconvenient to install the heat sink thereon, and it is easy to interfere with the operation of the adjacent board due to the mounting of the heat sink on one board. It is difficult to install and disassemble the radiator. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink that is compact in structure and convenient to install. Θ 6 1295420 m Λ ' The heat sink assembly of the embodiment of the invention includes a pair of heat dissipation plates and clamping members for sandwiching the two heat dissipation plates on both sides of a circuit board, the clamping member including an abutting portion and An operating body extending from both ends of the abutting portion and sandwiching one of the two sides of the two heat dissipating plates, and the movable connecting body of the heat dissipating plate, the two heat dissipating plates are opened to overcome the elastic force of the clamping member, The operating body is in close contact with one side surface of the heat sink. Compared with the prior art, the present invention overcomes the elastic force of the clamping member only by acting on the external force of the operating body, and the circuit board is placed between the two heat dissipation plates, which is convenient and quick to install; The body is freely attached to the outer surface of the two heat dissipation plates, and has a compact structure and saves space. [Embodiment] Referring to FIG. 1 , a heat dissipating device of the present invention includes one of two sides of a circuit board 1 , a pair of heat dissipating plates 20 , and two clamping heat dissipating plates 2 on one side of the circuit board 1 . Item 30. Referring to FIG. 2 to FIG. 3 at the same time, the surface of the circuit board 10 is provided with a heat-generating electronic component 50, and a hole 12 is formed on the circuit board 1 . The two heat sinks are each in the form of a rectangular plate. Each of the heat sinks 20 includes a body 22 and an operating body 24 movably coupled to the outer surface of the body 22. A bottom portion of the body 22 of the heat sink 2 extends toward the circuit board 10 with a hook 23 which is inserted into the through hole 12 of the circuit board 10 to prevent the heat sink 2 from moving along the length of the circuit board 10. The body 22 of each heat sink 20 includes a boss 22 having a slightly higher center and a slightly lower recess 224 on both sides. The two pairs of bowl-shaped engaging portions 26 are symmetrically distributed on the outer side surface of the main body 22 and the corresponding concave land 224 on both sides of the boss 220. Each of the buckles 7 1295420 has a circular opening and a thin opening around the opening 260. And the 262, the fastening portion 26 further includes a base (not labeled) having a diameter of a small diameter. A pair of long straight 224 upper edges, ... are arranged respectively below the concave projections 27 to provide a conditional/sink-long slot. Corresponding to 29, #,9, and the strip 22 groove extending in the direction of the body 22, the sin-proximal groove 29 is stamped by the body 22 to form a roll-shaped positioning portion 28,
f定位部28還可用焊接或其他方式固定於本體22。該定位 β 28兩端開口方向朝向本體22長邊延伸方向， 槽29-端設有三角狀止動部，該本體22對應止動部 280位置設有衝壓形成之孔洞搬，該定 端之本體22設有-條狀凹陷·。 相對另 該操作體24由彈性材料弯折而成，該操作體24包括 一施力部241、沿施力部241末端反向垂直延伸出之一對活 動部244。該施力部241包括—操作部及沿該操作部 癱240相對自由端垂直延伸出之-對支撐部242。該活動部 244可轉動地穿設於定位部28内，其末端收容於凹陷284 内。自由狀態之操作體24之操作部24〇位於本體22底部 且不與本體22接觸，該支撐部242容納於溝槽29内，且 肩支撐。卩242與活動部244彎折處受止動部280限制不易 向上輕起而脫離溝槽29。 該夾持件30係一彈性片體，其包括一抵靠部32及由 抵罪部32兩端部同向延伸之一對大致相互平行之彈性夾持 部34 °每一夾持部34設有相互間隔之一對孔口 340。該孔 8 1295420 _ 3二。用以與二散熱板2G上之扣合部26相扣合。爽持件 立女裝於二散熱板2〇時，扣合部26穿入孔口 “Ο，扣合 邛26之環狀邊緣262受壓變形並壓緊於夾持部％之孔口 周而夾持件3(3之夾持部34夾緊於二散熱板20 外側表面。 凊參閱圖4至圖5,將電路板10預安裝於二散埶板2〇 ^間時，施加-對向上作用力於操作體24之操作部施， 鬌撐部242與活動部244之連接處因彈性變形繞過定位部 止動部280,操作部240由本體22底部向其頂部運動， 鼷、只苑加外力使二操作體24相互靠攏，克服二散熱板20 夾持件30之彈力而撐開二散熱板2〇，直至操作體24之 支撐部242抵頂於二散熱板2〇之凸出部27上，此時將電 路板10插入二散熱板2〇間，完成電路板1〇與二散熱板2〇 之安裴。安裝完畢後，作用於操作部24〇之外力向下移動 並繞過定位部28之止動部280，該操作部24〇由本體22 •頂#降至其底部；撤掉外力’支撐部242因彈力容納於溝 槽29内，即操作體24緊貼於二散熱板2〇外侧表面，夾持 件30借助其彈力緊緊將電路板w夾置於二散熱板π之間。 本發明第二實施例如圖6所示，該第二實施例與第一 實施例區別在於將第一實施例中操作體24之操作部24〇去 掉’使其成一對相互獨立之操作體44。該操作體44包括一 支撐部442及與該支撐部442連接之活動部4料。將電路板 1〇安裝至該散熱裝置時，施加外力於操作體44之支撐部 442直至其克服夾持件3〇自身彈力而將二散熱板2〇撐開— 9 1295420 個能將該電路板10插入二散熱板2〇間之空間。 使用該散熱裝置時，無需借助其他工具，僅通 作用於二散熱板20操作體24、44上以克服夹持件3〇 彈力，放置電路板10於二散熱板20間，安裝方便、快 =體24、44自由狀態時貼設於二散熱板20外側表面: m構緊凑，節省空間。 綜上料’本發明符合發明專财件，爰依法提出專 鲁^請。惟’以上所述者僅為本發明之較佳實施例，舉凡 4、了本案技藝之人士，在爰依本發明精神所作之等效修 或變化，皆應涵蓋於以下之申請專利範圍内。 / 【圖式簡單說明】 體組=係本㈣散Μ置之第—實施例與—電路板之立 圖2係圖1之立體分解圖。 圖3係圖1中圈瓜處之局部放大圖。 圖4係圖2之預組裝圖。 圖5係圖4之組裝圖。 圖6係本發明第二實施例與一電路板之立體組合圖。 主要元件符號說明】 電路板 10 穿孔 12 散熱板 20 夾持件 30 本體 22 操作體 24 > 44 彎鈎 23 凸台 220 1295420 凹地 224 扣合部 26 開口 260 環狀邊緣 262 凸出部 27 長形槽 270 定位部 28 溝槽 29 止動部 280 孔洞 282 凹陷 284 操作部 240 支撐部 242 > 442 活動部 244、444 抵靠部 32 夹持部 34 孔口 340 發熱電子元件 50 施力部 241 11The positioning portion 28 can also be secured to the body 22 by welding or other means. The opening direction of the two ends of the positioning β 28 is extended toward the long side of the main body 22, and the end of the groove 29 is provided with a triangular stopper. The main body 22 is provided with a hole formed by punching corresponding to the position of the stopping portion 280, and the body of the fixed end 22 is provided with a strip-shaped depression. The operating body 24 is bent from an elastic material, and the operating body 24 includes a biasing portion 241 and a pair of movable portions 244 extending perpendicularly in the opposite direction of the end of the biasing portion 241. The urging portion 241 includes an operation portion and a pair of support portions 242 extending perpendicularly from opposite ends of the operation portion 瘫240. The movable portion 244 is rotatably disposed in the positioning portion 28, and the end thereof is received in the recess 284. The operating portion 24 of the operating body 24 in the free state is located at the bottom of the body 22 and is not in contact with the body 22, and the supporting portion 242 is received in the groove 29 and supported by the shoulder. The bent portion of the weir 242 and the movable portion 244 is restricted by the stopper portion 280 from being easily lifted upward and released from the groove 29. The clamping member 30 is an elastic piece body, and includes an abutting portion 32 and an elastic clamping portion 34 which is substantially parallel to each other by a pair of opposite ends of the abutting portion 32. Each clamping portion 34 is provided. One of the apertures 340 is spaced apart from each other. The hole 8 1295420 _ 3 two. It is used to engage with the fastening portion 26 on the two heat dissipation plates 2G. When the two heat sinks are placed on the two heat sinks, the fastening portion 26 penetrates into the opening. The annular edge 262 of the snap ring 26 is compressed and pressed and pressed against the mouth of the clamping portion. The clamping portion 3 of the clamping member 3 is clamped to the outer surface of the two heat dissipation plates 20. Referring to Figures 4 to 5, when the circuit board 10 is pre-mounted between the two diffusion plates 2, the application-to-up is applied. The action is applied to the operating portion of the operating body 24, and the joint between the brace portion 242 and the movable portion 244 is elastically deformed to bypass the positioning portion stop portion 280, and the operating portion 240 is moved from the bottom of the body 22 to the top thereof. The external force is applied to close the two operating bodies 24 to overcome the elastic force of the two heat sinks 20 and the two heat sinks 2 are extended until the supporting portion 242 of the operating body 24 abuts against the protruding portion of the two heat sinks 2 27, at this time, the circuit board 10 is inserted between the two heat sinks 2, and the installation of the circuit board 1〇 and the second heat sink 2〇 is completed. After the installation is completed, the force acts on the operation unit 24〇 and moves downward and bypasses. The stopping portion 280 of the positioning portion 28 is lowered from the body 22 • the top # to the bottom thereof; the external force is removed. The supporting portion 242 is accommodated in the groove 29 by the elastic force. That is, the operating body 24 is in close contact with the outer surface of the two heat dissipating plates 2, and the clamping member 30 is tightly sandwiched between the two heat dissipating plates π by the elastic force thereof. The second embodiment of the present invention is as shown in FIG. The second embodiment differs from the first embodiment in that the operating portion 24 of the operating body 24 of the first embodiment is removed from the 'actually independent pair of operating bodies 44. The operating body 44 includes a supporting portion 442 and The supporting portion 442 is connected to the movable portion 4. When the circuit board 1 is mounted to the heat dissipating device, an external force is applied to the supporting portion 442 of the operating body 44 until it overcomes the elastic force of the clamping member 3 to displace the two heat dissipating plates 2 Opening - 9 1295420 The circuit board 10 can be inserted into the space between the two heat sinks 2. When the heat sink is used, it is only applied to the operating bodies 24, 44 of the two heat sinks 20 by means of other tools to overcome the clips. Hold the piece 3 〇 elastic, place the circuit board 10 between the two heat sinks 20, easy to install, fast = body 24, 44 free state when attached to the outer surface of the two heat sink 20: m compact, save space. 'The invention complies with the invention of special wealth, and 提出Professional law However, the above description is only the preferred embodiment of the present invention. For those skilled in the art, equivalent modifications or variations made in accordance with the spirit of the present invention are intended to be included in the following claims. / [Simplified description of the figure] Body group = system (4) The first embodiment of the method - the vertical diagram of the circuit board 2 is the exploded view of Figure 1. Figure 3 is a partial enlargement of the circle in Figure 1. Figure 4 is a pre-assembled view of Figure 2. Figure 5 is an assembled view of Figure 4. Figure 6 is a perspective view of a second embodiment of the present invention and a circuit board. Plate 20 Clamping member 30 Body 22 Operating body 24 > 44 Hook 23 Boss 220 1295420 Concave land 224 Knotting portion 26 Opening 260 Annular edge 262 Projection portion 27 Long groove 270 Positioning portion 28 Groove 29 Stop portion 280 hole 282 recess 284 operation portion 240 support portion 242 > 442 movable portion 244, 444 abutment portion 32 nip portion 34 hole 340 heat-generating electronic component 50 urging portion 241 11