TWI407886B - Printed circuit board fastening mechanism - Google Patents
Printed circuit board fastening mechanism Download PDFInfo
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- TWI407886B TWI407886B TW100100367A TW100100367A TWI407886B TW I407886 B TWI407886 B TW I407886B TW 100100367 A TW100100367 A TW 100100367A TW 100100367 A TW100100367 A TW 100100367A TW I407886 B TWI407886 B TW I407886B
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Abstract
Description
本發明是有關於一種固定機構，且特別是有關於一種電路板固定機構。This invention relates to a securing mechanism and, more particularly, to a circuit board securing mechanism.
隨著科技的發展，人們對於電腦系統的功能以及的要求均越來越高。由於複雜的積體電路設計將會消耗大量的電能，而這些消耗的電能將會轉換成為熱量造成溫度的上升，因此使得電腦系統中溫度上升更形嚴重。當熱量聚集在機殼內部而無法即時散掉時，將造成電子元件無法正常工作。With the development of technology, people's functions and requirements for computer systems are getting higher and higher. Since the complex integrated circuit design will consume a large amount of electric energy, and the consumed electric energy will be converted into heat to cause an increase in temperature, the temperature rise in the computer system is more serious. When heat is collected inside the casing and cannot be dissipated immediately, the electronic components will not work properly.
隨著無線通訊技術發展，如WiFi、藍牙、GPS等通訊技術已經成為筆記型電腦中常見的輔助功能。因此，筆記型電腦中需設置有對應的天線電路板，以提供如WiFi、藍牙、GPS等功能。為了收訊品質的考量，這些天線電路板往往是設置在顯示殼體的外框部分，現有的天線電路板多是透過螺絲固定並使用散熱座對其散熱，會增加零件的數量以及組裝成本。With the development of wireless communication technologies, communication technologies such as WiFi, Bluetooth, and GPS have become common auxiliary functions in notebook computers. Therefore, the notebook computer needs to be provided with a corresponding antenna circuit board to provide functions such as WiFi, Bluetooth, GPS, and the like. In order to consider the quality of the receiving, these antenna circuit boards are often disposed in the outer frame portion of the display casing. The existing antenna circuit boards are mostly fixed by screws and radiated by the heat sinks, which increases the number of parts and the assembly cost.
因此本發明的目的就是在提供一種電路板固定機構，用以無螺絲固定電路板。SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a circuit board securing mechanism for securing a circuit board without screws.
依照本發明一實施例，提出一種電路板固定機構，用以固定一電路板，包含第一殼體，第一殼體之材料為金屬。第一殼體包含底面以及夾持件。夾持件設置於底面上，夾持件具有壓制面，壓制面平行於底面，壓制面與底面之間具有間隔，其中電路板容置於間隔之中，壓制面接觸電路板以定位。According to an embodiment of the invention, a circuit board fixing mechanism for fixing a circuit board includes a first housing, and the material of the first housing is metal. The first housing includes a bottom surface and a clamping member. The clamping member is disposed on the bottom surface, the clamping member has a pressing surface, the pressing surface is parallel to the bottom surface, and the pressing surface and the bottom surface are spaced apart, wherein the circuit board is accommodated in the interval, and the pressing surface contacts the circuit board for positioning.
電路板固定機構更包含至少一凸肋，凸肋設置於底面，凸肋接觸電路板之側面以定位。電路板包含有發熱元件，壓制面接觸發熱元件。電路板固定機構可更包含導熱墊，導熱墊設置於壓制面接觸電路板之一面。電路板包含孔，第一殼體包含設置於底面之凸點，凸點與孔卡合。壓制面可具有導引斜面，背向底面延伸。其中第一殼體可為筆記型電腦之顯示器後框件，電路板為天線電路板。電路板固定機構更包含有第二殼體以及多個卡合部。卡合部分別設置於第一殼體與第二殼體，藉以卡合第一殼體與第二殼體。第二殼體包含多個擋牆，擋牆延伸向第一殼體。第二殼體包含多個凸點，與電路板上之孔卡合。The circuit board fixing mechanism further comprises at least one rib, the rib is disposed on the bottom surface, and the rib contacts the side of the circuit board for positioning. The circuit board contains a heating element, and the pressing surface contacts the heating element. The circuit board fixing mechanism may further comprise a thermal pad, and the thermal pad is disposed on a surface of the pressing surface contacting the circuit board. The circuit board includes a hole, and the first housing includes a bump disposed on the bottom surface, and the bump is engaged with the hole. The pressing surface may have a guiding bevel extending back to the bottom surface. The first housing may be a rear frame of the display of the notebook computer, and the circuit board is an antenna circuit board. The circuit board fixing mechanism further includes a second housing and a plurality of engaging portions. The engaging portions are respectively disposed on the first housing and the second housing, thereby engaging the first housing and the second housing. The second housing includes a plurality of retaining walls that extend toward the first housing. The second housing includes a plurality of bumps that engage the holes in the circuit board.
第一殼體與其上之各部組件可以為一體成形地製作，電路板夾持在挾持件與底面之間，並透過凸肋固定電路板，第一殼體上的凸點可與電路板上之孔卡合以定位電路板，相較於過去需要使用螺絲將電路板鎖固殼體上的固定方式，本發明可以有效降低零件的成本以及組裝工時。除此之外，壓制面與電路板進行熱交換，使電路板產生的熱量經由第一殼體散逸，達成散熱的功效而不需額外使用散熱座。The first housing and the components on the upper part thereof can be integrally formed, the circuit board is sandwiched between the holding member and the bottom surface, and the circuit board is fixed through the rib, and the bump on the first housing can be connected to the circuit board. The hole is engaged with the positioning circuit board, and the invention can effectively reduce the cost of the parts and the assembly man-hours compared to the manner in which the screws are used to fix the circuit board on the housing. In addition, the pressing surface exchanges heat with the circuit board, so that the heat generated by the circuit board is dissipated through the first casing, thereby achieving heat dissipation without using an additional heat sink.
以下將以圖式及詳細說明清楚說明本發明之精神，任何所屬技術領域中具有通常知識者在瞭解本發明之較佳實施例後，當可由本發明所教示之技術，加以改變及修飾，其並不脫離本發明之精神與範圍。The spirit and scope of the present invention will be apparent from the following description of the preferred embodiments of the invention. The spirit and scope of the invention are not departed.
參照第1圖，其繪示本發明之電路板固定機構一實施例的立體視圖。電路板固定機構為用以固定一電路板(圖中未繪示)，其包含有第一殼體100，其中第一殼體100具有底面110以及夾持件120。其中夾持件120包含有相連的支撐部122以及壓制面124，支撐部122連接壓制面124與底面110，壓制面124與底面110之間具有間隔g。電路板可以容置在此間隔g之中，壓制面124則是接觸電路板以限制電路板在z方向的位移。壓制面124上可更包含有導引斜面126，導引斜面126為背向底面110延伸，以方便電路板進入間隔g。Referring to Fig. 1, there is shown a perspective view of an embodiment of a circuit board securing mechanism of the present invention. The circuit board fixing mechanism is for fixing a circuit board (not shown), and includes a first housing 100, wherein the first housing 100 has a bottom surface 110 and a clamping member 120. The clamping member 120 includes an associated supporting portion 122 and a pressing surface 124. The supporting portion 122 connects the pressing surface 124 and the bottom surface 110, and the pressing surface 124 and the bottom surface 110 have a gap g therebetween. The circuit board can be accommodated in this interval g, and the pressing surface 124 contacts the circuit board to limit the displacement of the circuit board in the z direction. The pressing surface 124 can further include a guiding slope 126 extending away from the bottom surface 110 to facilitate the entry of the circuit board into the gap g.
第一殼體100上更包含有至少一凸肋130，凸肋130設置於底面110上。凸肋130所設置的位置為對應於電路板的板邊。當電路板置入間隔g之後，凸肋130可接觸電路板的側面，以限制電路板在x方向的位移。一般的電路板上多會設置有孔以供螺絲鎖固，本發明之第一殼體100上則包含有設置在底面110上的凸點140。凸點140的位置則是對應於電路板上的孔，以在組裝時與孔卡合而定位電路板。The first housing 100 further includes at least one rib 130 disposed on the bottom surface 110. The ribs 130 are disposed at positions corresponding to the board edges of the circuit board. After the board is placed in the gap g, the ribs 130 can contact the sides of the board to limit the displacement of the board in the x direction. A common circuit board is provided with a hole for screw locking. The first housing 100 of the present invention includes a bump 140 disposed on the bottom surface 110. The position of the bump 140 corresponds to a hole in the board to position the board when it is engaged with the hole during assembly.
參照第2圖，其繪示將電路板置入第1圖之電路板固定機構的立體視圖。電路板160已經放入夾持件120中，特別是容置於壓制面124與底面110之間。壓制面124與電路板160接觸，以限制電路板160在z方向的位移。凸肋130為分布在電路板160的周圍，且與電路板160的側面接觸，以限制電路板160在x方向的位移。電路板160上具有孔162，凸點140與孔162卡合以定位電路板160。Referring to Fig. 2, there is shown a perspective view of a circuit board fixing mechanism for placing a circuit board in Fig. 1. The circuit board 160 has been placed in the clamping member 120, particularly between the pressing surface 124 and the bottom surface 110. The pressing surface 124 is in contact with the circuit board 160 to limit the displacement of the circuit board 160 in the z direction. The ribs 130 are distributed around the circuit board 160 and are in contact with the sides of the circuit board 160 to limit the displacement of the circuit board 160 in the x direction. The circuit board 160 has a hole 162 therein, and the bump 140 is engaged with the hole 162 to position the circuit board 160.
第一殼體100可以為一體成形的金屬殼體，或是殼體中的金屬件。夾持件120亦為金屬材料，因此，當壓制面124與電路板160接觸時，壓制面124可以與電路板160進行熱交換。電路板160與其上之發熱元件所產生的熱量經由與之接觸的壓制面124送到第一殼體100，由於第一殼體100的材料為導熱性佳的金屬，且具有相當大的表面積，因此熱量可以由第一殼體100散逸。換言之，此電路板固定機構除可固定電路板160之外，更具有散熱的功效。The first housing 100 can be an integrally formed metal housing or a metal piece in the housing. The clamping member 120 is also made of a metal material. Therefore, when the pressing surface 124 is in contact with the circuit board 160, the pressing surface 124 can exchange heat with the circuit board 160. The heat generated by the circuit board 160 and the heat generating component thereon is sent to the first casing 100 via the pressing surface 124 in contact therewith. Since the material of the first casing 100 is a metal having good thermal conductivity and has a relatively large surface area, Therefore, heat can be dissipated by the first housing 100. In other words, the circuit board fixing mechanism has the function of dissipating heat in addition to the fixed circuit board 160.
參照第3圖，其繪示第2圖中之電路板固定機構的剖面圖。夾持件120近似於L形結構，導引斜面126與支撐部122分別位於壓制面124的相對兩端。電路板160由導引斜面126的一端進入壓制面124與底面110之間。壓制面124可以直接接觸電路板160，以對電路板160進行定位以及散熱。或者，如本實施例一般，電路板固定機構更具有導熱墊170，導熱墊170設置於壓制面124接觸電路板160之一面上，使得壓制面124透過導熱墊170接觸電路板160，進而提升熱傳導的效率。電路板160上具有發熱元件164，壓制面124可以接觸發熱元件164，以即時地將發熱元件164所產生的熱量帶走。Referring to Fig. 3, there is shown a cross-sectional view of the board fixing mechanism of Fig. 2. The clamping member 120 is similar to the L-shaped structure, and the guiding slope 126 and the supporting portion 122 are respectively located at opposite ends of the pressing surface 124. The circuit board 160 is guided between the pressing surface 124 and the bottom surface 110 by one end of the guiding slope 126. The pressing surface 124 can directly contact the circuit board 160 to position and dissipate the circuit board 160. Or, as in the embodiment, the circuit board fixing mechanism further has a thermal pad 170, and the thermal pad 170 is disposed on the pressing surface 124 to contact one surface of the circuit board 160, so that the pressing surface 124 contacts the circuit board 160 through the thermal pad 170, thereby improving heat conduction. s efficiency. The circuit board 160 has a heat generating component 164 that can contact the heat generating component 164 to instantly remove the heat generated by the heat generating component 164.
參照第4圖，其繪示本發明之電路板固定機構另一實施例的示意圖。電路板固定機構為應用在筆記型電腦200之中，其中第一殼體100為筆記型電腦顯示器的後框，特別是後框的金屬件。液晶顯示面板210設置在第一殼體100之中，電路板160位於液晶顯示面板210的外圍。Referring to Figure 4, there is shown a schematic view of another embodiment of the circuit board securing mechanism of the present invention. The circuit board fixing mechanism is applied to the notebook computer 200, wherein the first housing 100 is a rear frame of the notebook computer display, in particular, a metal member of the rear frame. The liquid crystal display panel 210 is disposed in the first housing 100, and the circuit board 160 is located on the periphery of the liquid crystal display panel 210.
第一殼體100具有底面110以及夾持件120。其中夾持件120包含有壓制面124，壓制面124與底面110之間具有間隔。電路板160可以容置在此間隔之中，壓制面124則是接觸電路板160以限制電路板160在z方向的位移。The first housing 100 has a bottom surface 110 and a clamping member 120. The clamping member 120 includes a pressing surface 124 with a spacing between the pressing surface 124 and the bottom surface 110. The circuit board 160 can be received in this interval, and the pressing surface 124 contacts the circuit board 160 to limit the displacement of the circuit board 160 in the z direction.
第一殼體100上更包含有凸肋130，凸肋130設置於底面110上。凸肋130所設置的位置為對應於電路板160的板邊。當電路板160置入間隔g之後，凸肋130可接觸電路板160的側面，以限制電路板160在x方向方向的位移。電路板160上設置有孔162，第一殼體100上包含有設置在底面110上的凸點140。凸點140的位置則是對應於電路板160上的孔162，以在組裝時與孔162卡合而定位電路板160。The first housing 100 further includes a rib 130 disposed on the bottom surface 110. The ribs 130 are disposed at positions corresponding to the board edges of the circuit board 160. After the circuit board 160 is placed in the gap g, the ribs 130 may contact the sides of the circuit board 160 to limit the displacement of the circuit board 160 in the x-direction. The circuit board 160 is provided with a hole 162, and the first housing 100 includes a bump 140 disposed on the bottom surface 110. The location of the bumps 140 corresponds to the apertures 162 in the circuit board 160 to engage the apertures 162 during assembly to position the circuit board 160.
同時參照第4圖與第5圖，第5圖繪示與第4圖中之第一殼體100搭配的第二殼體180的示意圖。第二殼體180上更具有多個擋牆182，擋牆182向第一殼體100之方向延伸，擋牆182的位置可以與凸肋130的位置錯開，以在組裝完成之後接觸電路板160之側面，以限制電路板160在x方向與y方向的位移。第二殼體180上可更設置有凸塊190，凸塊190之位置對應於電路板160上之孔162的位置。凸塊190可在組裝時壓制電路板160，定位電路板160。若搭配凸點140則有助於避免孔162因外力衝擊而脫離凸點140。Referring to FIGS. 4 and 5 simultaneously, FIG. 5 is a schematic view showing the second housing 180 mated with the first housing 100 of FIG. 4. The second housing 180 further has a plurality of retaining walls 182 extending toward the first housing 100. The position of the retaining wall 182 may be offset from the position of the ribs 130 to contact the circuit board 160 after assembly is completed. The side faces to limit the displacement of the board 160 in the x and y directions. The second housing 180 may be further provided with a bump 190 corresponding to the position of the hole 162 on the circuit board 160. The bumps 190 can press the circuit board 160 and position the circuit board 160 during assembly. If the bump 140 is matched, it helps to prevent the hole 162 from coming off the bump 140 due to an external force.
由上述本發明較佳實施例可知，應用本發明具有下列優點。第一殼體與其上之各部組件可以為一體成形地製作，電路板夾持在挾持件與底面之間，並透過凸肋固定電路板，第一殼體上的凸點可與電路板上之孔卡合以定位電路板，相較於過去需要使用螺絲將電路板鎖固殼體上的固定方式，本發明可以有效降低零件的成本以及組裝工時。除此之外，壓制面與電路板進行熱交換，使電路板產生的熱量經由第一殼體散逸，達成散熱的功效而不需額外使用散熱座。It will be apparent from the above-described preferred embodiments of the present invention that the application of the present invention has the following advantages. The first housing and the components on the upper part thereof can be integrally formed, the circuit board is sandwiched between the holding member and the bottom surface, and the circuit board is fixed through the rib, and the bump on the first housing can be connected to the circuit board. The hole is engaged with the positioning circuit board, and the invention can effectively reduce the cost of the parts and the assembly man-hours compared to the manner in which the screws are used to fix the circuit board on the housing. In addition, the pressing surface exchanges heat with the circuit board, so that the heat generated by the circuit board is dissipated through the first casing, thereby achieving heat dissipation without using an additional heat sink.
雖然本發明已以一較佳實施例揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been described above in terms of a preferred embodiment, it is not intended to limit the invention, and it is obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100．．．第一殼體100. . . First housing
110．．．底面110. . . Bottom
120．．．夾持件120. . . Clamping piece
122．．．支撐部122. . . Support
124．．．壓制面124. . . Pressed surface
126．．．導引斜面126. . . Guided slope
130．．．凸肋130. . . Rib
140．．．凸點140. . . Bump
160．．．電路板160. . . Circuit board
162．．．孔162. . . hole
164．．．發熱元件164. . . Heating element
170．．．導熱墊170. . . Thermal pad
180．．．第二殼體180. . . Second housing
182．．．擋牆182. . . Retaining wall
190．．．凸塊190. . . Bump
200．．．筆記型電腦200. . . Notebook computer
210．．．液晶顯示面板210. . . LCD panel
g．．．間隔g. . . interval
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之詳細說明如下：The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.
第1圖繪示本發明之電路板固定機構一實施例的立體視圖。FIG. 1 is a perspective view showing an embodiment of a circuit board fixing mechanism of the present invention.
第2圖繪示將電路板置入第1圖之電路板固定機構的立體視圖。Fig. 2 is a perspective view showing the circuit board fixing mechanism of the circuit board placed in Fig. 1.
第3圖繪示第2圖中之電路板固定機構的剖面圖。Fig. 3 is a cross-sectional view showing the circuit board fixing mechanism in Fig. 2.
第4圖繪示本發明之電路板固定機構另一實施例的示意圖。FIG. 4 is a schematic view showing another embodiment of the circuit board fixing mechanism of the present invention.
第5圖繪示與第4圖中之第一殼體110搭配的第二殼體180的示意圖。FIG. 5 is a schematic view showing the second housing 180 in combination with the first housing 110 in FIG. 4.
100．．．第一殼體100. . . First housing
110．．．底面110. . . Bottom
120．．．夾持件120. . . Clamping piece
122．．．支撐部122. . . Support
124．．．壓制面124. . . Pressed surface
126．．．導引斜面126. . . Guided slope
130．．．凸肋130. . . Rib
140．．．凸點140. . . Bump
g．．．間隔g. . . interval
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100100367A TWI407886B (en) | 2011-01-05 | 2011-01-05 | Printed circuit board fastening mechanism |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100100367A TWI407886B (en) | 2011-01-05 | 2011-01-05 | Printed circuit board fastening mechanism |
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| Publication Number | Publication Date |
|---|---|
| TW201230929A TW201230929A (en) | 2012-07-16 |
| TWI407886B true TWI407886B (en) | 2013-09-01 |
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| US9535463B2 (en) | 2013-10-14 | 2017-01-03 | Getac Technology Corporation | Circuit board assembling structure, electronic device having the same and assembling method of electronic device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200942139A (en) * | 2008-03-28 | 2009-10-01 | Au Optronics Corp | Frame structure and circuit board assembly |
| TW201008219A (en) * | 2008-08-15 | 2010-02-16 | Fih Hong Kong Ltd | Headphone fixing structure |
-
2011
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200942139A (en) * | 2008-03-28 | 2009-10-01 | Au Optronics Corp | Frame structure and circuit board assembly |
| TW201008219A (en) * | 2008-08-15 | 2010-02-16 | Fih Hong Kong Ltd | Headphone fixing structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201230929A (en) | 2012-07-16 |
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