TWI407886B - Printed circuit board fastening mechanism - Google Patents

Abstract

A printed circuit board fastening mechanism for fastening a printed circuit board is disclosed, which includes a first casing. The material of the first casing is metal. The first casing has a bottom surface and a holder disposed on the bottom surface. The holder has a pressing surface parallel to the bottom surface. A gap is formed between the pressing surface and the bottom surface. The printed circuit board is disposed in the gap and is touched by the pressing surface for being positioned.

Description

Circuit board fixing mechanism

This invention relates to a securing mechanism and, more particularly, to a circuit board securing mechanism.

With the development of technology, people's functions and requirements for computer systems are getting higher and higher. Since the complex integrated circuit design will consume a large amount of electric energy, and the consumed electric energy will be converted into heat to cause an increase in temperature, the temperature rise in the computer system is more serious. When heat is collected inside the casing and cannot be dissipated immediately, the electronic components will not work properly.

With the development of wireless communication technologies, communication technologies such as WiFi, Bluetooth, and GPS have become common auxiliary functions in notebook computers. Therefore, the notebook computer needs to be provided with a corresponding antenna circuit board to provide functions such as WiFi, Bluetooth, GPS, and the like. In order to consider the quality of the receiving, these antenna circuit boards are often disposed in the outer frame portion of the display casing. The existing antenna circuit boards are mostly fixed by screws and radiated by the heat sinks, which increases the number of parts and the assembly cost.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a circuit board securing mechanism for securing a circuit board without screws.

According to an embodiment of the invention, a circuit board fixing mechanism for fixing a circuit board includes a first housing, and the material of the first housing is metal. The first housing includes a bottom surface and a clamping member. The clamping member is disposed on the bottom surface, the clamping member has a pressing surface, the pressing surface is parallel to the bottom surface, and the pressing surface and the bottom surface are spaced apart, wherein the circuit board is accommodated in the interval, and the pressing surface contacts the circuit board for positioning.

The circuit board fixing mechanism further comprises at least one rib, the rib is disposed on the bottom surface, and the rib contacts the side of the circuit board for positioning. The circuit board contains a heating element, and the pressing surface contacts the heating element. The circuit board fixing mechanism may further comprise a thermal pad, and the thermal pad is disposed on a surface of the pressing surface contacting the circuit board. The circuit board includes a hole, and the first housing includes a bump disposed on the bottom surface, and the bump is engaged with the hole. The pressing surface may have a guiding bevel extending back to the bottom surface. The first housing may be a rear frame of the display of the notebook computer, and the circuit board is an antenna circuit board. The circuit board fixing mechanism further includes a second housing and a plurality of engaging portions. The engaging portions are respectively disposed on the first housing and the second housing, thereby engaging the first housing and the second housing. The second housing includes a plurality of retaining walls that extend toward the first housing. The second housing includes a plurality of bumps that engage the holes in the circuit board.

The first housing and the components on the upper part thereof can be integrally formed, the circuit board is sandwiched between the holding member and the bottom surface, and the circuit board is fixed through the rib, and the bump on the first housing can be connected to the circuit board. The hole is engaged with the positioning circuit board, and the invention can effectively reduce the cost of the parts and the assembly man-hours compared to the manner in which the screws are used to fix the circuit board on the housing. In addition, the pressing surface exchanges heat with the circuit board, so that the heat generated by the circuit board is dissipated through the first casing, thereby achieving heat dissipation without using an additional heat sink.

The spirit and scope of the present invention will be apparent from the following description of the preferred embodiments of the invention. The spirit and scope of the invention are not departed.

Referring to Fig. 1, there is shown a perspective view of an embodiment of a circuit board securing mechanism of the present invention. The circuit board fixing mechanism is for fixing a circuit board (not shown), and includes a first housing 100, wherein the first housing 100 has a bottom surface 110 and a clamping member 120. The clamping member 120 includes an associated supporting portion 122 and a pressing surface 124. The supporting portion 122 connects the pressing surface 124 and the bottom surface 110, and the pressing surface 124 and the bottom surface 110 have a gap g therebetween. The circuit board can be accommodated in this interval g, and the pressing surface 124 contacts the circuit board to limit the displacement of the circuit board in the z direction. The pressing surface 124 can further include a guiding slope 126 extending away from the bottom surface 110 to facilitate the entry of the circuit board into the gap g.

The first housing 100 further includes at least one rib 130 disposed on the bottom surface 110. The ribs 130 are disposed at positions corresponding to the board edges of the circuit board. After the board is placed in the gap g, the ribs 130 can contact the sides of the board to limit the displacement of the board in the x direction. A common circuit board is provided with a hole for screw locking. The first housing 100 of the present invention includes a bump 140 disposed on the bottom surface 110. The position of the bump 140 corresponds to a hole in the board to position the board when it is engaged with the hole during assembly.

Referring to Fig. 2, there is shown a perspective view of a circuit board fixing mechanism for placing a circuit board in Fig. 1. The circuit board 160 has been placed in the clamping member 120, particularly between the pressing surface 124 and the bottom surface 110. The pressing surface 124 is in contact with the circuit board 160 to limit the displacement of the circuit board 160 in the z direction. The ribs 130 are distributed around the circuit board 160 and are in contact with the sides of the circuit board 160 to limit the displacement of the circuit board 160 in the x direction. The circuit board 160 has a hole 162 therein, and the bump 140 is engaged with the hole 162 to position the circuit board 160.

The first housing 100 can be an integrally formed metal housing or a metal piece in the housing. The clamping member 120 is also made of a metal material. Therefore, when the pressing surface 124 is in contact with the circuit board 160, the pressing surface 124 can exchange heat with the circuit board 160. The heat generated by the circuit board 160 and the heat generating component thereon is sent to the first casing 100 via the pressing surface 124 in contact therewith. Since the material of the first casing 100 is a metal having good thermal conductivity and has a relatively large surface area, Therefore, heat can be dissipated by the first housing 100. In other words, the circuit board fixing mechanism has the function of dissipating heat in addition to the fixed circuit board 160.

Referring to Fig. 3, there is shown a cross-sectional view of the board fixing mechanism of Fig. 2. The clamping member 120 is similar to the L-shaped structure, and the guiding slope 126 and the supporting portion 122 are respectively located at opposite ends of the pressing surface 124. The circuit board 160 is guided between the pressing surface 124 and the bottom surface 110 by one end of the guiding slope 126. The pressing surface 124 can directly contact the circuit board 160 to position and dissipate the circuit board 160. Or, as in the embodiment, the circuit board fixing mechanism further has a thermal pad 170, and the thermal pad 170 is disposed on the pressing surface 124 to contact one surface of the circuit board 160, so that the pressing surface 124 contacts the circuit board 160 through the thermal pad 170, thereby improving heat conduction. s efficiency. The circuit board 160 has a heat generating component 164 that can contact the heat generating component 164 to instantly remove the heat generated by the heat generating component 164.

Referring to Figure 4, there is shown a schematic view of another embodiment of the circuit board securing mechanism of the present invention. The circuit board fixing mechanism is applied to the notebook computer 200, wherein the first housing 100 is a rear frame of the notebook computer display, in particular, a metal member of the rear frame. The liquid crystal display panel 210 is disposed in the first housing 100, and the circuit board 160 is located on the periphery of the liquid crystal display panel 210.

The first housing 100 has a bottom surface 110 and a clamping member 120. The clamping member 120 includes a pressing surface 124 with a spacing between the pressing surface 124 and the bottom surface 110. The circuit board 160 can be received in this interval, and the pressing surface 124 contacts the circuit board 160 to limit the displacement of the circuit board 160 in the z direction.

The first housing 100 further includes a rib 130 disposed on the bottom surface 110. The ribs 130 are disposed at positions corresponding to the board edges of the circuit board 160. After the circuit board 160 is placed in the gap g, the ribs 130 may contact the sides of the circuit board 160 to limit the displacement of the circuit board 160 in the x-direction. The circuit board 160 is provided with a hole 162, and the first housing 100 includes a bump 140 disposed on the bottom surface 110. The location of the bumps 140 corresponds to the apertures 162 in the circuit board 160 to engage the apertures 162 during assembly to position the circuit board 160.

Referring to FIGS. 4 and 5 simultaneously, FIG. 5 is a schematic view showing the second housing 180 mated with the first housing 100 of FIG. 4. The second housing 180 further has a plurality of retaining walls 182 extending toward the first housing 100. The position of the retaining wall 182 may be offset from the position of the ribs 130 to contact the circuit board 160 after assembly is completed. The side faces to limit the displacement of the board 160 in the x and y directions. The second housing 180 may be further provided with a bump 190 corresponding to the position of the hole 162 on the circuit board 160. The bumps 190 can press the circuit board 160 and position the circuit board 160 during assembly. If the bump 140 is matched, it helps to prevent the hole 162 from coming off the bump 140 due to an external force.

It will be apparent from the above-described preferred embodiments of the present invention that the application of the present invention has the following advantages. The first housing and the components on the upper part thereof can be integrally formed, the circuit board is sandwiched between the holding member and the bottom surface, and the circuit board is fixed through the rib, and the bump on the first housing can be connected to the circuit board. The hole is engaged with the positioning circuit board, and the invention can effectively reduce the cost of the parts and the assembly man-hours compared to the manner in which the screws are used to fix the circuit board on the housing. In addition, the pressing surface exchanges heat with the circuit board, so that the heat generated by the circuit board is dissipated through the first casing, thereby achieving heat dissipation without using an additional heat sink.

Although the present invention has been described above in terms of a preferred embodiment, it is not intended to limit the invention, and it is obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100. . . First housing

110. . . Bottom

120. . . Clamping piece

122. . . Support

124. . . Pressed surface

126. . . Guided slope

130. . . Rib

140. . . Bump

160. . . Circuit board

162. . . hole

164. . . Heating element

170. . . Thermal pad

180. . . Second housing

182. . . Retaining wall

190. . . Bump

200. . . Notebook computer

210. . . LCD panel

g. . . interval

The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.

FIG. 1 is a perspective view showing an embodiment of a circuit board fixing mechanism of the present invention.

Fig. 2 is a perspective view showing the circuit board fixing mechanism of the circuit board placed in Fig. 1.

Fig. 3 is a cross-sectional view showing the circuit board fixing mechanism in Fig. 2.

FIG. 4 is a schematic view showing another embodiment of the circuit board fixing mechanism of the present invention.

FIG. 5 is a schematic view showing the second housing 180 in combination with the first housing 110 in FIG. 4.

100. . . First housing

110. . . Bottom

120. . . Clamping piece

122. . . Support

124. . . Pressed surface

126. . . Guided slope

130. . . Rib

140. . . Bump

g. . . interval

Claims (7)

A circuit board fixing mechanism for fixing a circuit board, wherein the circuit board comprises a heating element, the circuit board fixing mechanism comprises: a first housing, comprising: a bottom surface; and a clamping member disposed on the bottom surface The holding member has a pressing surface parallel to the bottom surface, and the pressing surface has a space between the pressing surface and the bottom surface, wherein the circuit board is received in the space, and the pressing surface contacts the circuit board The heating element is positioned. The circuit board fixing mechanism of claim 1, further comprising at least one rib disposed on the bottom surface, the at least one rib contacting the side of the circuit board for positioning. The circuit board fixing mechanism of claim 1, further comprising a thermal pad disposed on the pressing surface to contact one side of the circuit board. The circuit board fixing mechanism of claim 1, wherein the circuit board comprises a hole, and the first housing comprises a bump disposed on the bottom surface, the bump being engaged with the hole. The circuit board fixing mechanism of claim 1, wherein the pressing mask has a guiding slope extending away from the bottom surface. The circuit board fixing mechanism of claim 1, further comprising a second housing, wherein the second housing comprises a plurality of retaining walls extending toward the first housing and contacting the The side of the board is positioned. The circuit board securing mechanism of claim 6, wherein the circuit board comprises a plurality of holes, and the second housing comprises a plurality of bumps, the bumps corresponding to the positions of the holes.