TW201705850A - Heat-dissipation buffering and shielding composite structure for mobile electronic device capable of integrating functions of heat dissipation, buffering and electric shielding to maintain reliability of mobile electronic device and save cost - Google Patents

Abstract

A heat-dissipation buffering and shielding composite structure for mobile electronic device comprises: an upper cover; an LCD module disposed under the upper cover; a middle shell support rack disposed under the LCD module; a circuit board disposed under the middle shell support rack and configured with at least one electronic chip thereon; and a back cover relatively combined at the bottom edge of the upper cover and having an accommodation space for receiving the aforementioned components. The present invention is characterized in that: the middle shell support rack uses aluminum-magnesium alloy embedded with a high thermal conductivity metal sheet as longitudinal heat-conduction and electromagnetism shielding medium, so as to improve the low heat conduction problem of the middle shell support rack. The heat generated by the chip is continuously transmitted along a longitudinal direction, in which the heat transmitted from the chip is longitudinally transmitted to a heat conduction film through an insulated heat dissipation sheet and a high thermal conductivity metal sheet, and then is distributed laterally and in parallel through the heat conduction film, so that the electronic device is provided with an even heat dissipation instead of local overheating. Moreover, the outer side of the heat conduction film is configured with a heat insulation film to prevent the heat from being continuously diffused out of the shell and thus avoid causing bad usage experience of overheat to the user. A foam layer is disposed on the outer side of the heat insulation film to provide cushioning buffering effect for protecting the LCD module. Thus, the present invention is able to integrate three functions of heat dissipation, buffering and electronic shielding, so as to maintain the reliability of mobile electronic device and save the cost.

Description

Thermal buffer shielding composite structure of mobile electronic device

The invention relates to a heat dissipation structure of a mobile electronic device, in particular to a composite structure combining three functions of heat dissipation, buffering and electronic shielding.

According to mobile electronic devices such as smart phones and tablet PCs, which have evolved from dual-core, quad-core, and eight-core... to increasingly higher processing clock processing chips; and the development of mobile electronic devices is designed to be short and light. Trends, so in order to achieve high computing efficiency and short and light requirements, the heat dissipation efficiency of mobile electronic devices is important.

Sub-press, the current heat dissipation method of mobile electronic devices mainly uses simple opening, heat conduction, heat convection, etc., but these heat dissipation methods can not load the heat energy generated by high-performance wafers today, so there is a problem of heat accumulation. The thermal energy cannot be evenly distributed, resulting in lowering the heat dissipation efficiency inside the mobile electronic device.

In addition, usually, the chip of the electronic device is the main heat source during operation, and the heat dissipation is not only to lower the temperature of the chip itself to ensure that it can work normally within the required temperature range, but also to prevent partial overheating of the casing when the heat is dissipated. Consumers experience a bad experience.

The invention discloses a heat dissipation structure of a mobile electronic device, which comprises an upper cover 11, a liquid crystal display module 12, a back cover 16 and a heat conducting component 15, and the liquid crystal display module 12 is provided on one side. The substrate 14 is provided with at least one electronic component 141. The back cover 16 has a receiving space 161, and a middle frame 13 is attached to the liquid crystal display module 12, and the substrate 14 is embedded in the substrate 14 In the middle frame 13, the heat conducting component 15 is disposed between the electronic component 141 and the back cover 16, the one side of the heat conducting component 15 correspondingly contacts the electronic component 141, and the other side correspondingly contacts the back cover 16; The thermal energy of the electronic component 121 is evenly distributed without generating heat. However, it is found that the heat-dissipating component 15 as the heat-dissipating component and the back cover 16 are respectively fabricated, and then the heat-conducting component 15 is bonded to the inner edge surface of the back cover 16, so that the heat dissipation efficiency or the electronic shielding function is still insufficient, and further, it is not The buffer structure for protecting the liquid crystal display module 12 is disclosed, so that there is still room for improvement.

Therefore, solving the above problems of the conventional mobile electronic device is a main subject of the present invention.

The main purpose of the present invention is to provide a heat-dissipating buffer conductive shielding structure for a mobile electronic device, which combines three functions of heat dissipation, buffering and electronic shielding, and has the capability of maintaining the reliability of the mobile electronic device and saving The cost of the effect.

In order to achieve the above object, the technical means adopted by the present invention comprises: an upper cover having a transparent substrate; a liquid crystal display module disposed under the upper cover; and a middle case support disposed under the liquid crystal display module a circuit board disposed under the middle case bracket, at least one electronic component is disposed thereon; a battery is disposed under the middle case bracket; and a back cover is oppositely coupled to the bottom edge of the upper cover The utility model has an accommodating space for accommodating the foregoing component; the middle casing bracket is configured to form a shielding cover, and simultaneously fix the liquid crystal display module, fix the circuit board downward, and the middle casing bracket a high thermal conductive metal sheet is disposed on the circuit board; an insulating fin is disposed on the circuit board for providing heat dissipation of the electronic chip, and the high thermal conductive metal sheet is blocked from contacting the electronic chip to provide insulation; and the electronic chip contacts The insulating fin is configured to transfer the heat of the electronic chip upward in a vertical direction, and the heat generated by the electronic chip is transmitted; the high thermal conductive metal sheet is disposed above a layer of thermal conductive film, the heat transferred from the high thermal conductive metal sheet is horizontally dispersed; a thermal insulation film is disposed above the thermal conductive film to prevent the thermal conductive film from radiating heat outward; and the outer side of the thermal insulation film A foam layer is provided for buffering the liquid crystal display module.

By means of the above-mentioned technical means, the invention adopts the high-heat-conducting metal piece embedded in the middle shell bracket as a longitudinal heat transfer and electromagnetic shielding medium, improves the problem of poor heat conduction of the middle-shell bracket, and continuously transfers the heat emitted by the chip in the longitudinal direction, thereby further The heat transferred from the electronic chip is longitudinally transmitted to the heat conductive film through the heat sink and the high heat conductive metal sheet, and then uniformly dispersed by the heat conductive film being laterally parallelized; further, a heat insulating film is disposed outside the heat conductive film, Preventing the heat from continuing to spread out to the outside of the casing, so as to avoid a bad user experience of overheating, and protecting the liquid crystal display module with a foam layer on the outer side of the heat insulating film, thereby combining the heat dissipation, the buffering, and the like The three functions of electronic shielding are integrated, which has the effect of maintaining the reliability of the mobile electronic device and saving cost.

First, referring to FIG. 2 to FIG. 5, the heat dissipation buffer shielding structure of the mobile electronic device disclosed in the present invention includes a cover 20 having a transparent substrate 21 and a liquid crystal display module (LCD). 30 is disposed under the upper cover 20; a middle case holder 40 is disposed under the liquid crystal display module 30; a circuit board 50 is disposed under the middle case holder 40, and at least one is disposed thereon An electronic chip 51; a battery 60 is disposed under the middle case holder 40; and a back cover 70 is oppositely coupled to the bottom edge of the upper cover 20, and has an accommodation space 71 for receiving the aforementioned member; However, the above-mentioned components are prior art (Prior Art), and the patents of the present invention are not described herein.

The main feature of the present invention is that the middle case holder 40 is formed to form a shield cover, and the liquid crystal display module 30 is fixed upwardly, and the circuit board 50 is fixed downward. The middle case holder 40 is provided with a high thermal conductive metal piece 81. The high thermal conductive metal sheet 81 can be pasted by the thermal conductive adhesive or can be embedded in the middle housing bracket 40. In this embodiment, the middle housing bracket 40 can be formed of an aluminum-magnesium alloy to form an electronic shield. The electronic chip 51 is required to prevent the electronic interference. The liquid crystal display module 30 is fixed upward and the circuit board 50 is fixed downward. In this embodiment, the high thermal conductive metal sheet 81 can be made of copper, but is not limited thereto. Metals can also be implemented.

The circuit board 50 is provided with an insulating thermal pad 82, which may be made of alumina which may be added with silica gel to provide heat dissipation of the electronic chip 51 while blocking the high thermal conductive metal sheet 81. The electronic chip 51 is in contact to achieve insulation. The electronic chip 51 contacts the insulating fins 82, and functions to transfer the heat of the electronic chip 51 upward in the vertical direction (thermal conduction), and the heat generated by the electronic chip 51 is transmitted.

Further, a high-heat conductive metal sheet 81 is covered with a heat conductive film 83. The heat conductive film 83 can disperse heat from the high heat conductive metal sheet 81 horizontally to achieve uniform heat generation.

In addition, a thermal insulation film 84 is disposed on the thermal conductive film 83 for preventing the thermal conduction film 83 from radiating heat outward to prevent the user from feeling overheated.

Furthermore, a foam layer 85 is disposed on the outer side of the heat insulating film 84 for protecting the liquid crystal display module 30 to achieve the buffering effect.

By means of the above-mentioned technical means, the present invention uses the middle shell bracket 40 to inlay the high thermal conductive metal sheet 81 as a longitudinal heat transfer and electromagnetic shielding medium, thereby improving the problem of poor heat conduction of the middle shell bracket 40, and continuing the heat emitted by the electronic chip 51. The heat is transmitted longitudinally, and the heat transferred from the electronic chip 51 is longitudinally transmitted to the heat conductive film 83 through the insulating heat sink 82 and the high heat conductive metal sheet 81, and then spread laterally in parallel through the heat conductive film 83 to achieve uniform heat dissipation; Furthermore, a heat-insulating film 84 is disposed on the outer side of the heat-transmissive film 83 to prevent heat from continuing to diffuse outside the casing, so as to avoid a bad user experience of overheating, and provide a buffer with the foam layer 85 outside the heat-insulating film 84. The utility model protects the liquid crystal display module 30; thereby, the invention has three functions of combining heat dissipation, buffering and electronic shielding, and can not only maintain the reliability of the mobile electronic device but also save cost.

In summary, the structure disclosed by the present invention is unprecedented, and can indeed achieve the improvement of efficacy, and has industrial availability, fully conforms to the patent requirements of the invention, and invites the bureau to grant a patent to encourage innovation. There is no sense of morality.

The drawings and the descriptions of the present invention are merely preferred embodiments of the present invention, and those skilled in the art, which are subject to the spirit of the present invention, should be included in the scope of the patent application.

20‧‧‧Upper cover
21‧‧‧Transparent substrate
30‧‧‧LCD module
40‧‧‧Shed bracket
50‧‧‧ boards
51‧‧‧Electronic chip
60‧‧‧Battery
70‧‧‧Back cover
71‧‧‧ accommodating space
81‧‧‧High thermal conductivity metal sheet
82‧‧‧Insulated heat sink
83‧‧‧heat film
84‧‧‧Insulation film
85‧‧·bubble layer

1A is an exploded perspective view of a heat dissipation structure of a mobile electronic device. FIG. 1B is a perspective view showing a combination of a heat dissipation structure of a mobile electronic device. 1C is a cross-sectional view of a heat dissipation structure of a mobile electronic device. Figure 1D is an enlarged view of 1D in Figure 1C. Figure 2 is an exploded perspective view of a preferred embodiment of the present invention. Figure 3 is a combined perspective view of a preferred embodiment of the present invention. Figure 4 is a cross-sectional view of a preferred embodiment of the present invention. Figure 5 is an enlarged view of 5 in Figure 4.

20‧‧‧Upper cover

21‧‧‧Transparent substrate

30‧‧‧LCD module

40‧‧‧Shed bracket

50‧‧‧ boards

51‧‧‧Electronic chip

60‧‧‧Battery

70‧‧‧Back cover

71‧‧‧ accommodating space

81‧‧‧High thermal conductivity metal sheet

82‧‧‧Insulated heat sink

83‧‧‧heat film

84‧‧‧Insulation film

85‧‧·bubble layer

Claims (6)

The heat dissipation buffer shielding composite structure of the mobile electronic device comprises: an upper cover having a transparent substrate; a liquid crystal display module disposed under the upper cover; and a middle case support disposed under the liquid crystal display module a circuit board disposed under the middle housing bracket, at least one electronic chip is disposed thereon; a battery is disposed under the middle housing bracket; and a back cover is oppositely coupled to the bottom edge of the upper cover The utility model has an accommodating space for accommodating the foregoing component; the middle casing bracket is configured to form a shielding cover, and the liquid crystal display module is fixed upwardly, the circuit board is fixed downward, and the middle casing is fixed a high thermal conductive metal sheet is disposed on the circuit board; an insulating fin is disposed on the circuit board for providing heat dissipation of the electronic chip, and the high thermal conductive metal sheet is blocked from contacting the electronic chip to provide insulation; and the electronic chip contacts The insulating heat sink is configured to transfer the heat of the electronic chip upward in a vertical direction to transfer heat generated by the electronic chip; the high thermal conductivity metal a heat conducting film is disposed on the upper surface, and the heat transferred from the high heat conductive metal sheet is horizontally dispersed; the heat conducting film is provided with a heat insulating film for preventing the heat conducting film from radiating heat outward; and the heat insulating A foam layer is disposed on the outer side of the film for buffering the liquid crystal display module. The heat dissipation buffer shielding composite structure of the mobile electronic device according to claim 1, wherein the middle casing is made of an aluminum-magnesium alloy. The heat dissipation buffer shielding composite structure of the mobile electronic device according to claim 1, wherein the high thermal conductive metal sheet is made of copper. The heat-dissipating buffer shielding composite structure of the mobile electronic device according to the third aspect of the invention, wherein the high thermal conductive metal sheet can be fixed in the middle-shell bracket by a thermal adhesive. The heat dissipation buffer shielding composite structure of the mobile electronic device of claim 3, wherein the high thermal conductive metal sheet is insertably fitted into the middle housing bracket. The heat dissipation buffer shielding composite structure of the mobile electronic device according to claim 1, wherein the insulating heat sink is made of alumina added with silica gel.