CN103242755B - Heat conduction diffusion sheet and preparation method thereof - Google Patents
Heat conduction diffusion sheet and preparation method thereof Download PDFInfo
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- CN103242755B CN103242755B CN201310163043.7A CN201310163043A CN103242755B CN 103242755 B CN103242755 B CN 103242755B CN 201310163043 A CN201310163043 A CN 201310163043A CN 103242755 B CN103242755 B CN 103242755B
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Abstract
The invention discloses a heat conduction diffusion sheet which comprises a heat conduction pressure-sensitive rubber layer (1), a metal heat diffusion layer (2), a heat conduction diffusion layer (3), a foaming heat insulation layer (4) and a polymer heat isolation layer (5) which are stacked in sequence, and the invention further discloses a preparation method of the heat conduction diffusion sheet. As the heat conduction pressure-sensitive rubber layer can be directly adhered on a heating unit, the contact heat resistance value between the heat conduction diffusion sheet and the heating unit is reduced, and the heat conducted from the heating unit to the metal heat diffusion layer and the heat conduction diffusion layer is accelerated; and moreover, as the foaming heat insulation layer is adopted, the heat diffusivity of the heat conduction diffusion sheet is enhanced. The heat conduction diffusion sheet disclosed by the invention has the advantages of simple structure, convenience and quickness in preparation, and obvious heat conduction diffusion effect.
Description
Technical field
The present invention relates to the heat sink material field of electronic devices and components, relate in particular to a kind of novel high thermal conductivity coefficient heat conduction diffusion sheet that replaces conventional graphite sheet and preparation method thereof.This thermal diffusion composite can be used for, such as, the diffusion of the heat that the heat generating components such as central processing unit (CPU) or integrated circuit (IC) or LED produce, avoids heat concentrate and cause damage.
Background technology
Existing heat conduction diffusion sheet be for by heat from electronic devices and components, the heat diffusion producing heaters such as central processing unit (CPU) or integrated circuit (IC) or LED, avoids heat concentrate and cause damage.This class heat conduction diffusion sheet is generally located between radiator or between electronic devices and components and shell, and the heat that heating element is produced conducts in radiator or shell, so that heat radiation.In the time that heating electronic component has certain distance apart from shell or radiator, heat conduction diffusion sheet directly can be bonded in heating electronic component, the heat that heating element produces directly spreads by heat conduction diffusion sheet.
At present, on market, major part is carried out thermal diffusion with graphite flake, and the thermal conductivity factor of conductive graphite sheet is in the direction parallel with surface, i.e. direction planar, be about 100W/mK～1800W/mK, at the thermal conductivity factor of the thickness direction of graphite flake, greatly about 5W/mK～80W/mK.But the intensity of this material of graphite flake own is lower, easily brittle failure, the poor easy interlaminar separation of interlaminar strength.Therefore the easy fragmentation of the graphite flake in electronic equipment or interlayer separate, thereby do not reach the object of heat conduction or thermal diffusion, and infringement electronic equipment.Meanwhile, because graphite-made technology for making threshold is higher, production cost is higher, so price is also higher.
Also have part user with pure metal film material, such as Copper Foil, aluminium foil or plating film material carry out thermal diffusion.But pure metal material carrys out thermal diffusion, may there is following problem, the electric conductivity of metal is very good, may make electronic devices and components be short-circuited.The heat conductivility of metal material belongs to isotropic simultaneously, and direction planar and thickness direction, be about 100W/mK to 400W/mK conventionally, and heat conductivility is pretty good, and in plane, heat sinking function is not good.
Summary of the invention
The present invention, for overcoming above-mentioned the deficiencies in the prior art, provides a kind of making simple, easy to use, with low cost, can directly stick on heat conduction diffusion sheet that can substitute on heating element conventional graphite sheet and preparation method thereof.This heat conduction diffusion sheet has excellent heat conductivility and heat sinking function, and manufacture method is simple, with low cost, is more suitable for heat spreading from heater, avoids using in the concentrated application of heat.
A kind of heat conduction diffusion sheet providing of the present invention, it comprises: the heat conduction pressure-sensitive adhesive layer, metal fever diffusion layer, heat conduction diffusion layer, foam insulation and the polymer thermal insulating layer that stack gradually.
Wherein, described heat conduction pressure-sensitive adhesive layer can be made up of organic polymer and heat filling; The thickness of heat conduction pressure-sensitive adhesive layer is 3um～100um.
Described metal fever diffusion layer can be made by the one of copper material, aluminium, magnesium material, iron material, stainless steel or alloy material; The thickness of metal fever diffusion layer is 6um～100um; The thickness of described heat conduction diffusion layer is 2um～30um.
Described foam insulation is made by the one of polyacrylate, natural rubber, polyurethane, silicone rubber; The thickness of described foam insulation is 10um～40um.
Described polymer thermal insulating layer is made by the one of PETG, PEN, polyphenylene sulfide, polyethylene, polyvinyl chloride, polypropylene, polyimides; The thickness of insulated thermal insulating layer is 3um～100um.
Preferably, the outline of described foam insulation and polymer thermal insulating layer is greater than the outline of metal fever diffusion layer and heat conduction diffusion layer.
The preparation method of a kind of heat conduction diffusion sheet provided by the invention, step is as follows:
Step 1: the heat conduction diffusion layer that contains lamellar graphite powder at a surface-coated one of sheet metal, put into oven heat,, after dry five minutes, take out through the temperature of 130～140 ℃;
Step 2: fit with release liners or mould release membrance with pressure sensitive adhesive on another surface of described sheet metal;
Step 3: the composite construction of foam insulation and polymer thermal insulating layer is fitted in to described heat conduction diffusion layer surface.
Wherein, described heat conduction diffusion layer is by the material of following ratio of weight and number, and uniform stirring is formulated:
Solid content is 40% solvent type liquid thermosetting acrylate: curing agent: lamellar graphite powder=10: 1: 50.
Described with the release liners of pressure sensitive adhesive or the preparation of mould release membrance, step is as follows:
A, described pressure sensitive adhesive are by the material of following ratio of weight and number, and uniform stirring is formulated:
Solid content is 45% solvent type liquid thermosetting acrylate: curing agent: heat filling=100: 1: 45;
B, that the mixture of above-mentioned pressure sensitive adhesive is coated to a surface of release liners or mould release membrance is upper, then puts into oven heat, through dry five minutes of the temperature of 110～120 ℃, takes out;
C, will be on release liners or mould release membrance with the one side of pressure sensitive adhesive and described sheet metal laminating.
The preparation of described foam insulation and the composite construction of polymer thermal insulating layer, step is as follows:
The coating of a, described foam insulation is by the material of following ratio of weight and number, and uniform stirring is formulated:
Solid content is 45% solvent type liquid thermosetting acrylate: curing agent: foam powder=100: 1: 3.5;
B, the surface that above-mentioned coating is coated on to polymer thermal insulating layer form foam insulation, then put into oven heat,, after dry five minutes, take out through the temperature of 130～140 ℃;
C, again by the one side with foam insulation and the laminating of described heat conduction diffusion layer surface.
The present invention is stacked gradually and is formed by heat conduction pressure-sensitive adhesive layer, metal fever diffusion layer, heat conduction diffusion layer, foam insulation and polymer thermal insulating layer.Because heat conduction pressure-sensitive adhesive layer can directly be pasted on heater, the thermal contact resistance value between the present invention and heater is reduced, heater to the heat conduction of metal fever diffusion layer and heat conduction diffusion layer is accelerated.Owing to having adopted foam insulation, the heat diffusivity of metal fever diffusion layer and heat conduction diffusion layer is strengthened on in-plane again.Thereby, heat diffusivity of the present invention is enhanced.In addition, foam insulation and polymer thermal insulating layer are made up of the material with electrical insulating property, and cover on the surface of heat conduction diffusion layer, the outline of again outline of foam insulation and polymer thermal insulating layer being arranged to be greater than metal fever diffusion layer and heat conduction diffusion layer, makes the present invention have higher electrical insulating property.The present invention is simple in structure, and it is convenient to prepare, and heat conduction diffusion effect is obvious.
Accompanying drawing explanation
Fig. 1 is the schematic cross-section of the embodiment of the present invention.
The specific embodiment
Below in conjunction with embodiment, figure and table, the present invention is further described.
As shown in Figure 1, a kind of heat conduction diffusion sheet that the embodiment of the present invention provides, it comprises: preferential and on the heat conduction pressure-sensitive adhesive layer 1, metal fever diffusion layer 2, heat conduction diffusion layer 3, foam insulation 4 and the polymer thermal insulating layer 5 that stack gradually.
The thickness of heat conduction pressure-sensitive adhesive layer 1 is elected 3um～100um as.If heat conduction pressure-sensitive adhesive layer 1 is blocked up, likely its thermal resistance value can become higher; If too low, may cause heat conduction pressure-sensitive adhesive layer 1 and heating electronic component bonding time, defective tightness contacts, and centre exists air layer, can make thermal contact resistance value greatly raise.
Heat conduction pressure-sensitive adhesive layer 1 is made up of organic polymer and heat filling, can to be that elastomeric material is composite form its polymer, there is good initial cohesiveness, also can be by the composite pressure-sensitive material forming of organosiloxane resins, can also be the composite pressure-sensitive material forming of acrylic resin, can be also the composite that polyurethanes has tack.Metallic particles, metal oxide, metal nitride, metal carbides and metal hydroxides all can be used as the heat filling here.Preferably adopt aluminium oxide, boron nitride, carborundum and aluminium hydroxide, magnesium hydroxide.The form of heat filling is specific restriction not, can be Powdered, graininess or fibrous.
Heat conduction pressure-sensitive adhesive layer 1 is directly bonded in heating electronic component, because heat conduction pressure-sensitive adhesive layer 1 has good tack and adhesive strength, can closely contacts with heating electronic component, avoid existing air layer, thereby reduce thermal contact resistance value.
Metal fever diffusion layer 2 can adopt metal material or alloy material, and it has high thermal diffusion performance.Metal fever diffusion layer 2 can be by copper material, aluminium, magnesium material, iron material, stainless steel or alloy material, as copper alloy, and aluminium alloy, any material of magnesium alloy and ferroalloy is made into thin slice.The thickness of metal fever diffusion layer 2 is 6um～100um, is preferably greater than 35um.Because in the time that the thickness of metal fever diffusion layer 2 is less than 6 microns, if the caloric value of heater is very large, the thermal capacitance of metal fever diffusion layer 2 may have saturated danger occurs.Even in the time that the thickness of metal fever diffusion layer 2 exceedes 100 microns, the thermal diffusion degree of this metal fever diffusion layer 2 also can not improve again.
Due to the characteristic of the metal material of metal fever diffusion layer 2, the heat conduction of metal fever diffusion layer 2 has isotropism, there is no difference at in-plane heat conductivility and vertical direction.Even in order to reach in plane integral heat sink, need to be coated with last layers be better than vertical direction heat conduction diffusion layer 3 at the heat conductivility of in-plane on metal fever diffusion layer 2 surfaces.The thickness of heat conduction diffusion layer 3 is 2um～30um, preferably selects thickness to be greater than 5um.Because in the time that the thickness of heat conduction diffusion layer 3 is less than 2 microns, if the caloric value of heater is very large, the heat sinking function of heat conduction diffusion layer 3 may be not good.Even in the time that the thickness of heat conduction diffusion layer 3 exceedes 30 microns, its thermal resistance is higher, and the thermal diffusion degree of heat conduction diffusion layer 3 also can not improve again.Heat conduction diffusion layer 3 can be chosen three kinds of thickness: 2um, 16um, 30um as embodiment.
Due to the good heat conductive performance of metal fever diffusion layer 2 and heat conduction diffusion layer 3, the awfully hot surface of easily passing to heat conduction diffusion layer 3 of heat that heater sends.When particularly caloric value is larger, the temperature on heat conduction diffusion layer 3 surfaces can be higher.If do not have foam insulation 4 to be covered in heat conduction diffusion layer 3 top layers, near electronic devices and components also can be heated, and cause temperature to raise, and normally work thereby affect it.Therefore, foam insulation 4 and polymer thermal insulating layer 5 are covered on heat conduction diffusion layer 3, the heat spreading all on the thickness direction of heat conduction diffusion layer 3 is conducted by foam insulation 4 block resistances, thereby metal fever diffusion layer 2 and heat conduction diffusion layer 3 thermal conductivity on in-plane is strengthened.Because making metal fever diffusion layer 2 and heat conduction diffusion layer 3, the characteristic of metal material there is electric conductivity, and be covered in after heat conduction diffusion layer 3 when foam insulation 4 and polymer thermal insulating layer 5, can be by the parts electrical isolation in the electronic equipment of metal fever diffusion layer 2 and heat conduction diffusion layer 3 and periphery, foam insulation 4 and polymer thermal insulating layer 5 have insulating effect.
Polymer thermal insulating layer 5 is made up of the material with electrical insulation characteristics.PETG (PET), PEN (PEN), polyphenylene sulfide (PPS), polyethylene (PE), polyvinyl chloride (PC), polypropylene (PP), polyimides (PI), PEN thermal conductivity factor is 0.12W/m.k or lower.The thermal conductivity factor of PET and PI is about 0.15W/m.k, and the thermal conductivity factor of PP is 0.12W/m.k, and the thermal conductivity factor of PC is about 0.19W/m.k, and the thermal conductivity factor of PE is about 0.50W/m.k, and the thermal conductivity factor of PPS is about 0.19W/m.k.Preferably, the thermal conductivity factor of polymer thermal insulating layer 5 is the smaller the better.Therefore, suggestion is using PET, PP, PI and PC as preferably.
The thickness of polymer thermal insulating layer 5 is 3um to 100um.Because in the thickness of polymer thermal insulating layer 5 is less than the situation of 3 microns, the thermal conductivity of heat conduction diffusion layer 3 can not be by block resistance fully at thickness direction, the thermal conductivity of heat conduction diffusion layer 3 can not fully strengthen in in-plane.In the thickness of polymer thermal insulating layer 5 exceedes the situation of 100 microns, heat gathers between heat conduction diffusion layer 3 and foam insulation 4, there will be heat may be not from the danger of heat conduction diffusion sheet diffusion into the surface.
In addition, for improving electrical insulation capability, the outline of foam insulation 4 and polymer thermal insulating layer 5 can be made to the outline that is greater than metal fever diffusion layer 2 and heat conduction diffusion layer 3.
Preparation method provided by the invention, refers to Fig. 1, and step is as follows:
Step 1: the heat conduction diffusion layer 3 that contains lamellar graphite powder at a surface-coated one of metal fever diffusion layer 2, put into oven heat, be dried five minutes through the temperature of 130～140 ℃, after allowing solvent evaporates completely also solidify completely, take out.
Wherein: metal fever diffusion layer 2 can adopt metal material or alloy material to fry batter in a thin layer, can choose three kinds of thickness: 6um, 53um, 100um as embodiment.
Heat conduction diffusion layer 3 is by the material of following ratio of weight and number, and uniform stirring is formulated:
Solid content is 40% solvent type liquid thermosetting acrylate: curing agent: lamellar graphite powder=10: 1: 50.
Heat conduction diffusion layer 3 can be chosen three kinds of thickness: 2um, 16um, 30um as embodiment.
Step 2: fit 6 with release liners or mould release membrance with pressure sensitive adhesive on another surface of metal fever diffusion layer 2.And with the release liners of pressure sensitive adhesive or the preparation of mould release membrance, step is as follows:
A, pressure sensitive adhesive are by the material of following ratio of weight and number, and uniform stirring is formulated:
Solid content is 45% solvent type liquid thermosetting acrylate: curing agent: heat filling=100: 1: 45.
Heat conduction pressure-sensitive adhesive layer 1 is the mixture of organic polymer and heat filling, can choose three kinds of thickness: 3um, 52um, 100um as embodiment.
B, that the mixture of pressure sensitive adhesive is coated to a surface of release liners or mould release membrance 6 is upper, then puts into oven heat, through dry five minutes of the temperature of 110～120 ℃, allows solvent evaporates completely and after solidifying, takes out.
C, the one side with pressure sensitive adhesive on release liners or mould release membrance 6 is fitted with metal fever diffusion layer 2, to form the release liners of heat conduction diffusion sheet or the composite construction of mould release membrance 6, heat conduction pressure-sensitive adhesive layer 1, metal fever diffusion layer 2 and heat conduction diffusion layer 3.
Step 3: the composite construction of foam insulation 4 and polymer thermal insulating layer 5 is fitted in to above-mentioned heat conduction diffusion layer 3 surfaces.
Wherein, the preparation of the composite construction of foam insulation 4 and polymer thermal insulating layer 5, step is as follows:
The coating of a, foam insulation is by the material of following ratio of weight and number, and uniform stirring is formulated:
Solid content is 45% solvent type liquid thermosetting acrylate: curing agent: foam powder=100: 1: 3.5.
B, the surface that above-mentioned coating is coated on to polymer thermal insulating layer 5 form foam insulation 4, then put into oven heat, through the temperature of 130～140 ℃ after dry five minutes, after allowing solvent evaporates completely and solidifying completely, take out.Foam insulation 4 can be chosen three kinds of thickness: 10um, 55um, 100um as embodiment.Polymer thermal insulating layer 5 can be chosen three kinds of thickness: 3um, 52um, 100um as embodiment.
C, by the one side with foam insulation 4 and the 3 surface laminatings of above-mentioned heat conduction diffusion layer.
Also after can being dried, being first fitted in the one side with foam insulation 4 with a release protective layer and protecting, form the foam insulation 4 of heat conduction diffusion sheet and the composite construction of polymer thermal insulating layer 5.
When use, more release protective layer is peelled off, and fitted in the one side with foam insulation 4 and above-mentioned heat conduction diffusion layer 3 surfaces.Release protective layer can be release liners or mould release membrance.
Below, test relatively by comparative example of the present invention and an existing product:
Comparative example of the present invention, it is the metal fever diffusion layer 2 of 50 microns that the heat conduction pressure-sensitive adhesive layer 1 that is 25 microns by thickness fits in thickness---on Copper Foil.Heat conduction diffusion coating 3 thickness are 10 microns.In addition, the thickness of foam insulation 4 is 20 microns, and the thickness of insulated thermal insulating layer 5---PET is 15 microns.
Adopt the SS-400 of Graftech as existing product, its structure is release liners or mould release membrance, pressure sensitive adhesive, graphite thermal diffusion layer, formation of pressure-sensitive adhesive layer and the PET film insulating barrier stacking gradually.
Adopt the heat conduction diffusion sheet of 100 millimeters × 100 millimeters of comparative example and existing product as test block.
Utilize the constent temperature heater feedwater of determining in a glass container to heat, and keep water temperature at 80 ℃, then above-mentioned test block is covered respectively on the openning of glass container, keep sealing state, adopt thermocouple to measure the central point Z of test block and the temperature at marginal point C place, then calculate the difference Z-C of the temperature of central point and marginal point.For different Measuring Time, be recorded in table 1, to show the heat conduction diffusivity of test block.
Table 1
| Testing time | 10s | 20s | 30s | 40s | 50s | 60s | 70s | 80s | 90s |
| SS-400 central point (℃) | 56.8 | 63.5 | 67.5 | 69.5 | 71.2 | 71.7 | 72.3 | 72.7 | 73.0 |
| SS-400 marginal point (℃) | 26.4 | 27.9 | 30.9 | 35.5 | 36.6 | 38.1 | 40.5 | 41.9 | 45.7 |
| The Z-C of SS-400 (℃) | 30.4 | 35.6 | 36.6 | 34.0 | 34.6 | 33.6 | 31.8 | 30.8 | 27.3 |
| Comparative example's central point (℃) | 56.6 | 63.0 | 66.7 | 68.7 | 69.9 | 70.9 | 71.8 | 71.8 | 72.2 |
| Comparative example's marginal point (℃) | 27.0 | 29.6 | 32.6 | 36.8 | 39.2 | 41.7 | 44.2 | 46.2 | 48.1 |
| Comparative example's Z-C (℃ | 29.6 | 33.4 | 34.1 | 31.9 | 30.7 | 29.2 | 27.6 | 25.6 | 24.1 |
| Testing time | 100s | 110s | 120s | 130s | 140s | 150s | 160s | 170s | 180s |
| SS-400 central point (℃) | 73.2 | 73.2 | 73.2 | 73.3 | 73.3 | 73.3 | 73.4 | 73.4 | 73.4 |
| SS-400 marginal point (℃) | 47.2 | 46.7 | 49.4 | 50.7 | 51.3 | 52.1 | 52.4 | 53.0 | 53.5 |
| SS-400Z-C(℃) | 26.0 | 26.5 | 23.8 | 22.6 | 22.0 | 21.2 | 21.0 | 20.4 | 19.9 |
| Comparative example's central point (℃) | 72.2 | 72.2 | 72.3 | 72.3 | 72.4 | 72.4 | 72.5 | 72.5 | 72.6 |
| Comparative example's marginal point (℃) | 49.6 | 50.7 | 51.8 | 53.5 | 54.0 | 54.2 | 54.8 | 55.1 | 55.1 |
| Comparative example's Z-C (℃ | 22.6 | 21.5 | 20.5 | 18.8 | 18.4 | 18.2 | 17.7 | 17.4 | 17.5 |
As shown in table 1, can find out, at each time point, the temperature of comparative example's of the present invention central point temperature all outline lower than existing product--the corresponding temperature of SS-400; Comparative example's marginal point temperature all will be higher than existing product--the corresponding temperature of SS-400; And comparative example 1 central point and the temperature difference of marginal point all will be higher than existing products--the corresponding temperature of SS-400 is poor.Therefore, be not difficult to find that comparative example is than existing product--SS-400, can spread the heat from container more effectively.That is to say, comparative example's heat dispersion is better than existing product--the heat dispersion of SS-400.Based on judging above, comparative example of the present invention is more suitable for spreads the heat of heater.
Above-described embodiment is only for illustrating the specific embodiment of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and variation, these distortion and variation all should belong to protection scope of the present invention.
Claims (3)
1. a preparation method for heat conduction diffusion sheet, is characterized in that,
Described heat conduction diffusion sheet comprises the heat conduction pressure-sensitive adhesive layer (1), metal fever diffusion layer (2), heat conduction diffusion layer (3), foam insulation (4) and the polymer thermal insulating layer (5) that stack gradually;
Described preparation method comprises the steps:
Step 1: the heat conduction diffusion layer (3) that contains lamellar graphite powder at a surface-coated one of sheet metal, put into oven heat,, after dry five minutes, take out through the temperature of 130-140 ℃;
Step 2: fit with release liners or mould release membrance with pressure sensitive adhesive on another surface of described sheet metal;
Step 3: the composite construction of foam insulation and polymer thermal insulating layer is fitted in to described heat conduction diffusion layer surface;
Described heat conduction diffusion layer (3) is by the material of following ratio of weight and number, and uniform stirring is formulated:
Solid content is 40% solvent type liquid thermosetting acrylate: curing agent: lamellar graphite powder=10:1:50;
The thickness of described heat conduction diffusion layer (3) is 2 μ m～30 μ m, and described heat conduction diffusion layer (3) is better than the heat conductivility of vertical direction at the heat conductivility of in-plane;
Described heat conduction pressure-sensitive adhesive layer (1) is made up of organic polymer and heat filling, and the thickness of heat conduction pressure-sensitive adhesive layer (1) is 3 μ m～100 μ m;
Described metal fever diffusion layer (2) is made by the one in copper material, aluminium, magnesium material, iron material or alloy material; The thickness of metal fever diffusion layer (2) is 6 μ m～100 μ m;
Described foam insulation (4) is made by the one in polyacrylate, natural rubber, polyurethane, silicone rubber; The thickness of described foam insulation (4) is 10 μ m～40 μ m;
Described polymer thermal insulating layer (5) is made by the one in PETG, PEN, polyphenylene sulfide, polyethylene, polyvinyl chloride, polypropylene, polyimides; The thickness of insulated thermal insulating layer (5) is 3 μ m～100 μ m.
2. the preparation method of heat conduction diffusion sheet as claimed in claim 1, is characterized in that, described with the release liners of pressure sensitive adhesive or the preparation of mould release membrance, comprises the steps:
A, described pressure sensitive adhesive are by the material of following ratio of weight and number, and uniform stirring is formulated:
Solid content is 45% solvent type liquid thermosetting acrylate: curing agent: heat filling=100:1:45;
B, that the mixture of above-mentioned pressure sensitive adhesive is coated to a surface of release liners or mould release membrance is upper, then puts into oven heat, through dry five minutes of the temperature of 110-120 ℃, takes out;
C, the one side with pressure sensitive adhesive on release liners or mould release membrance is fitted with described sheet metal.
3. the preparation method of heat conduction diffusion sheet as claimed in claim 1, is characterized in that, the preparation of the composite construction of described foam insulation and polymer thermal insulating layer, comprises the steps:
The coating of a, described foam insulation is by the material of following ratio of weight and number, and uniform stirring is formulated:
Solid content is 45% solvent type liquid thermosetting acrylate: curing agent: foam powder=100:1:3.5;
B, the surface that above-mentioned coating is coated on to polymer thermal insulating layer form foam insulation, then put into oven heat,, after dry five minutes, take out through the temperature of 130-140 ℃;
C, by the one side with foam insulation and the laminating of described heat conduction diffusion layer surface.
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| JP6023885B2 (en) * | 2013-06-19 | 2016-11-09 | アモグリーンテック カンパニー リミテッド | Hybrid heat insulating sheet and electronic device equipped with the same |
| JP6435507B2 (en) * | 2014-07-18 | 2018-12-12 | パナソニックＩｐマネジメント株式会社 | COMPOSITE SHEET, ITS MANUFACTURING METHOD, AND ELECTRONIC DEVICE USING COMPOSITE SHEET |
| JP6566554B2 (en) * | 2014-08-20 | 2019-08-28 | 昭和電工株式会社 | LAMINATED SHEET AND METHOD FOR PRODUCING LAMINATED SHEET |
| CN104441830A (en) * | 2014-12-17 | 2015-03-25 | 衡山县佳诚新材料有限公司 | Heat conduction film structure of electronic product |
| TWI691254B (en) * | 2015-07-28 | 2020-04-11 | 大陸商東莞錢鋒特殊膠黏製品有限公司 | Heat-dissipation buffer shielding composite structure of mobile electronic device |
| CN106566429A (en) * | 2016-10-21 | 2017-04-19 | 昆山汉品电子有限公司 | Insulating shading heat dissipation adhesive tape and making method |
| CN106764579A (en) * | 2016-11-30 | 2017-05-31 | 陈清 | A kind of flashlight |
| CN106675433B (en) * | 2017-01-12 | 2019-09-13 | 深圳市美信电子有限公司 | A kind of explosion-proof easily-disassembled safe adhesive tape and preparation method thereof |
| CN109181570A (en) * | 2018-08-09 | 2019-01-11 | 安徽天念材料科技有限公司 | A kind of insulation floor waterproof hot melt film and preparation method thereof |
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| CN101247715A (en) * | 2007-02-15 | 2008-08-20 | 保力马科技株式会社 | Thermal diffusion sheet and manufacturing method of the same |
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