CN106163227A - Heat radiation lamination structure and manufacture method thereof - Google Patents
Heat radiation lamination structure and manufacture method thereof Download PDFInfo
- Publication number
- CN106163227A CN106163227A CN201510570493.7A CN201510570493A CN106163227A CN 106163227 A CN106163227 A CN 106163227A CN 201510570493 A CN201510570493 A CN 201510570493A CN 106163227 A CN106163227 A CN 106163227A
- Authority
- CN
- China
- Prior art keywords
- heat radiation
- lamination structure
- copper
- composite wood
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The present invention relates to dispel the heat lamination structure and manufacture method thereof.The present invention discloses the manufacture method of a kind of lamination structure that dispels the heat, comprise the following steps: first, it is provided that composite wood, it includes aluminium base and at least one copper clad layers being positioned on the surface of this aluminium base；Then, this composite wood is carried out cold rolling, so that being formed with mechanical link between this aluminium base and this copper clad layers；Then, under protective atmosphere, this composite wood is heated, so that this mechanical link occurs melted；Finally, this composite wood being carried out hot rolling, including alloyed copper atom and aluminum atom so that being formed between this aluminium base and this copper clad layers in diffusion welding layer, and this diffusion welding layer.Use the heat radiation lamination structure made by the manufacture method of the present invention to have good very property, and the heat dissipation under Natural Convection Conditions is more preferably.
Description
Technical field
The present invention relates to the manufacture method of a kind of heat radiation composite structure, and espespecially one includes roughing and essence
Roll the manufacture method of the heat radiation lamination structure of two procedures, and utilize dissipating made by this manufacture method
Hot lamination structure.
Background technology
Press, when radiator structure is for exploitation electronic installation or design electronic building brick, as guaranteeing that product is reliable
One of means that degree and prolongation life of product are used.Along with electronic installation (such as: ultra-thin note-book type meter
Calculation machine, tablet PC, intelligent mobile phone, portable game machine etc.) and electronic building brick (such as:
Processor, Power IC etc.) towards miniaturization, high performance development, electronic building brick must be at limited sky
Arrange in the way of the most intensive and full blast between, and under usefulness guides, promote its work frequency
Rate, causes the temperature of electronic building brick easily to raise, and then produces heat dissipation problem.
In practice, radiator structure is often installed in electronic building brick or the electronics dress of heating in the way of the contact of face
Put, for its caloric value (Power Dissipation) is outwards conducted.At present dissipating the most more typically
Heat structure has nonmetal/metal compound heat dispersion sheet and bimetallic (such as: aluminum bronze) heat sink compound, wherein
Carbon back/metal compound heat dispersion sheet generally comprises metal base and the insulating heat-conductive being formed on metal base
Layer, bimetallic heat sink compound is usually and is fitted tightly together by the double layer of metal that heat conductivity is different
And formed.
But, the thermal insulation layer in nonmetal/metal compound heat dispersion sheet is mainly by high-molecular organic material
Formed with being mixed into heat-conducting medium therein, and the heat conductivity of thermal insulation layer is far away from aluminium and copper
Material, therefore can form heat and pass obstacle；Additionally, thermal insulation layer is due to the characteristic of material itself, its with
The joint of metal base there may be fine clearance, causes integral heat sink usefulness to reduce.On the other hand,
Double layer of metal in bimetallic heat sink compound must utilize heat-conducting medium (such as: heat-conducting glue) to be engaged,
It is generally difficult to be formed heat-conducting glue in uniform thickness between two hard surfaces therein, only increases and lead
The thickness of hot glue, otherwise cannot be in close contact with heat generating component completely；Therefore the bimetallic of routine is compound scattered
The size of backing may be restricted, it is impossible to meets the requirement of lighter and thinner miniaturization.
Summary of the invention
Present invention is primarily targeted at offer one to need not between layers carry out with heat-conducting medium
The manufacture method of the heat radiation lamination structure of laminating.
For reaching above-mentioned purpose, the present invention by the following technical solutions: the manufacture of a kind of lamination structure that dispels the heat
Method, comprises the following steps: first, it is provided that composite wood, and this composite wood includes aluminium base and at least
Copper clad layers on the individual surface being positioned at this aluminium base；Then, this composite wood is carried out cold rolling, so that should
The cross-sectional area of composite wood reduces about 50 to 70%, is wherein formed between this aluminium base and this copper clad layers
There is mechanical link；Then, under protective atmosphere, this composite wood after cold rolling is heated, so that
This mechanical link occurs melted；Finally, this composite wood after heated is carried out hot rolling, so that this is multiple
The cross-sectional area closing material reduces about 10 to 20%, is wherein formed between this aluminium base and this copper clad layers and expands
Scattered welding layer, and this diffusion welding layer include alloyed copper atom and aluminum atom (locks together
Copper atom and aluminum atom).
The present invention separately provides a kind of by the heat radiation lamination structure made by above-mentioned manufacture method, and it includes aluminum
Substrate and the first copper clad layers, this aluminium base have the first composition surface and relative to this first composition surface
Two composition surfaces, this first copper clad layers by first diffusion welding layer to be engaged on this first composition surface,
Wherein this first diffusion welding layer includes alloyed copper atom and aluminum atom.
The method have the advantages that the present invention from the size of reduction radiator structure and promotes simultaneously
The angle of its heat dissipation is set out, and disclosed technology contents is mainly describing a kind of novelty of constructing
Heat radiation lamination structure, it is because can provide prominent engineering properties via cold rolling and hot rolling technology,
And good metallurgical link can also be formed with between aluminium and copper material to increase bond strength and fall
Low interface thermal contact resistance；Furthermore, heat radiation lamination structure provided by the present invention has the heat radiation of excellence
The slimming of product structure is also ensured that while usefulness；Not only such, heat radiation provided by the present invention is amassed
Rotating fields the heat dissipation Billy under free convection environment be combined aluminium with copper material with laminating type
Heat radiating fin structure more preferably.
In order to be able to be further understood that technology, method and the merit that the present invention is taked by reaching set purpose
Effect, refers to below in connection with detailed description of the invention, accompanying drawing, it is believed that the purpose of the present invention, feature
With feature, when can thus be goed deep into and concrete understanding, but appended accompanying drawing and adnexa only provide ginseng
Examine and use is described, being not used for the present invention person of being any limitation as.
Accompanying drawing explanation
Fig. 1 is the structural representation () of the heat radiation lamination structure of the present invention.
Fig. 2 is the structural representation (two) of the heat radiation lamination structure of the present invention.
Fig. 3 is the partial enlarged drawing of the part A in Fig. 2.
Fig. 4 is the structural representation (three) of the heat radiation lamination structure of the present invention.
Fig. 5 is the structural representation (four) of the heat radiation lamination structure of the present invention.
Fig. 6 is that the heat radiation lamination structure of the present invention is applied to the schematic diagram of circuit substrate.
Fig. 7 is the schematic flow sheet of the manufacture method of the heat radiation lamination structure of the present invention.
Fig. 8 is the process schematic representation of the manufacture method of the heat radiation lamination structure of the present invention.
Symbol description
100,100 ' heat radiation lamination structure
101 base portions
102 kinks
1 aluminium base
11 first composition surfaces
12 second composition surfaces
2 first copper clad layers
3 first diffusion welding layers
4 first thermal diffusion radiating layers
41 resin materials
42 carbon composites
43 heat conduction powders
5 second copper-clad layers
6 second diffusion welding layers
7 second thermal diffusion radiating layers
200 circuit substrates
210 electronic building bricks
300 cold press devices
400 heaters
500 hot-press arrangements
C composite wood
P machining path
Detailed description of the invention
A preferred embodiment cited below particularly, and coordinate appended accompanying drawing that embodiments of the present invention are described,
Those skilled in the art can be understood advantages of the present invention and effect by the content disclosed by this specification.Separately
Outward, the present invention can be implemented by other different specific embodiment or be applied, say, that this theory
Every details in bright book also can carry out various based on different viewpoints and application under the spirit of the present invention
Modify and change.Additionally, appended accompanying drawing is only as simple illustrative purposes, not retouching according to actual size
Paint, first give chat bright.
Refer to Fig. 1, for the knot of the heat radiation lamination structure of a preferred embodiment of the present invention
Structure schematic diagram.As it can be seen, heat radiation lamination structure 100 provided by the present invention wraps
Including aluminium base 1 and one first copper clad layers 2, wherein aluminium base 1 has relative
One composition surface 11 and the second composition surface 12, the first copper clad layers 2 is engaged in the first joint
On face 11.
First it should be noted that the first copper clad layers 2 of stacking is led to aluminium base 1
Cross roughing and finish rolling two procedures densification and compacting and be consolidated, and first covers
The effect of metallurgical, bond can be produced, to increase joint between layers of copper 2 and aluminium base 1
Intensity and reduction interface contact heat resistance；Specifically, felicity condition (such as: temperature,
Pressure, compression stress etc.) under, one can be entered between the first copper clad layers 2 and aluminium base 1
Step is formed with one first diffusion welding layer 3, and comprises conjunction in the first diffusion welding layer 3
Gold copper atom and aluminum atom.In the present embodiment, the thickness of heat radiation lamination structure 100
2mm, the wherein the thinnest then overall heat radiation of the thickness of the first copper clad layers 2 can be less than
Effect is the best；Considering copper and the heat absorption of aluminum and rate of heat release, best design is the
One copper clad layers 2 is 1:8 with the thickness proportion of aluminium base 1.
Refer to Fig. 2, for the knot of the another embodiment of heat radiation lamination structure 100
Structure schematic diagram.As it can be seen, can optionally be formed with one in the first copper clad layers 2
One thermal diffusion radiating layer 4；As its name suggests, the first thermal diffusion radiating layer 4 has heat expansion concurrently
Dissipating and thermal-radiating ability, it is equal that the lamination structure 100 that thereby dispels the heat can reach large area
The effect of even heat radiation.Specifically, the first thermal diffusion radiating layer 4 includes resin
Material 41 and carbon composite 42, idealized conditions is that the content of carbon composite is relative to 100 weights
This resin material of amount part (PHR) is about 30 to 70 weight portions；First thermal diffusion radiating layer
In 4 and can optionally include conduction powder 43, idealized conditions is the content phase of conduction powder
This resin material for 100 weight portions (PHR) is about 5 to 20 weight portions.
Referring to Fig. 3, in the present embodiment, above-mentioned resin material can be listed below: asphalt mixtures modified by epoxy resin
Fat, acrylic resin, amido formate system resin, silicone rubber system resin, poly-to ring diformazan benzene series
Resin, BMI system resin and polyimide resin.The choosing of above-mentioned carbon composite is freely bored
One or more among stone, Delanium, Graphene, CNT, carbon black, carbon fiber
Combination.Above-mentioned conduction powder comprises the one or two among the powders such as metal, oxide, nitride
Plant above combination；Above-mentioned metal can be but be not limited to gold, silver, copper, nickel and/or aluminum, above-mentioned oxygen
Compound can be but be not limited to aluminium oxide and/or zinc oxide, above-mentioned nitride can be but be not limited to boron nitride and
/ or aluminum nitride particle.
Refer to Fig. 4 and Fig. 5, be respectively the another enforcement of the lamination structure 100 that dispels the heat
Mode and the structural representation of a further embodiment.As shown in Figure 4, heat radiation lamination structure
100 ' can farther include a second copper-clad layer 5, and it is engaged on the second composition surface 12；
Consider copper and the heat absorption of aluminum and rate of heat release, best design be the first copper clad layers 2,
Aluminium base 1 is 1:8:1 with the thickness proportion of second copper-clad layer 5.Similarly, stacking
First and second copper clad layers 2,5 and aluminium base 1 are by roughing and finish rolling two procedures
Densification and compacting are also consolidated, and the first and second copper clad layers 2,5 and aluminum bases
All can produce the effect of metallurgical, bond between plate 1, that is the first copper clad layers 2 with
One first diffusion welding layer 3, second copper-clad layer 5 and aluminum base it is formed with between aluminium base 1
One second diffusion welding layer 6 it is formed with between plate 1.
Incidentally, as it is shown in figure 5, also can optionally shape on second copper-clad layer 5
Cheng Youyi the second thermal diffusion radiating layer 7.Material and property due to the second diffusion welding layer 6
Can be identical with above-mentioned first diffusion welding layer 3, the material of the second thermal diffusion radiating layer 7
Expect identical with above-mentioned first thermal diffusion radiating layer 4 with performance, therefore do not add at this to go to live in the household of one's in-laws on getting married
State.
Referring to shown in Fig. 6, the heat radiation lamination structure 100 (100 ') of the present invention is in use
Time, can directly contact with high temperature heat source.For example, can be by the lamination structure that dispels the heat
100 (100 ') directly against overlay on an electronic building brick 210 being located at circuit substrate 200 (such as:
Chip unit) on；Accordingly, when running, produced heat can be straight for electronic building brick 210
Connect conduction and uniformly diffuse to lamination structure 100 (100 ') entirety of dispelling the heat, passing through the most again
The mode of convection current and radiation spills in environment.Best design is heat radiation lamination knot
Structure 100 (100 ') is substantially in U-shaped, and it includes that a base portion 101 and at least two are by base portion
The opposite sides of 101 extends the kink 102 formed, and such air-flow can be more direct
The hot type derived is gone out by ground, makes radiating efficiency more promote.
Referring to Fig. 7 and Fig. 8, the respectively heat radiation of a preferred embodiment of the present invention is amassed
The schematic flow sheet of the manufacture method of Rotating fields and process schematic representation.The present invention is carried
The manufacture method of confession includes: step S100, it is provided that composite wood C, and composite wood C includes aluminium base
1 and at least one copper clad layers being positioned on the surface of aluminium base 1 (can be the first copper clad layers 2 and/or
Two copper clad layers 3)；Step S102, carries out cold rolling to composite wood C, so that the cross section of composite wood C
Long-pending minimizing about 50 to 70%, is wherein respectively formed between aluminium base 1 and the first and second copper clad layers 2,5
There is mechanical link；Step S104, heats the composite wood C after cold rolling under protective atmosphere,
Occur melted so that being mechanically linked；And step S106, the composite wood C after heated is carried out heat
Roll so that the cross-sectional area of composite wood C reduces about 10 to 20%, wherein aluminium base 1 and first and
Diffusion welding layer 3,6, and diffusion welding layer 3,6 it is respectively formed with between second copper-clad layer 2,5
In include alloyed copper atom and aluminum atom.
Seeing also Fig. 1, Fig. 4, Fig. 7 and Fig. 8, step S100 is in actual embodiment
Time, first by aluminium base 1 and the first and second copper clad layers 2,5 rolling rolling respectively, and lead to
Crossing a pay-off (sign) to be transported on machining path P, wherein first and second cover
Layers of copper 2,5 is coated on the first and second composition surfaces 11,12 of aluminium base 1 respectively,
To form a composite wood C；Step S102 is when actual embodiment, and above-mentioned composite wood C is in adding
First pass through in work path P a cold press device 300 (such as: wheels of colding pressing) carry out cold rolling (or
Claim roughing), make the cross-sectional area of composite wood C reduce about 50 to 70% (the most above-mentioned multiple
Close the lower thickness of base material), and the first and second copper clad layers 2,5 and the first of aluminium base 1
With second be each formed with good mechanical link between composition surface 11,12.
Step S104 is when actual embodiment, and the composite wood C after cold rolling then passes through a heating
Device 400 (such as: heating furnace), and in protective atmosphere and the temperature range of 600 °F to 1000 °F
Under heat, wherein protective atmosphere refers to be full of noble gas, hydrogen or the environment of nitrogen, makes
First and second composition surfaces 11,12 of the first and second copper clad layers 2,5 and aluminium base 1 it
Between mechanical link melted by high temperature；Step S106 is in actual embodiment
Time, heated after composite wood C on machining path P again by a hot-press arrangement 500
(such as: hot pressing wheels) carries out hot rolling (or claiming finish rolling), long-pending to form the heat radiation of the present invention
Rotating fields 100 (100 '), wherein the first and second copper clad layers 2,5 and aluminium base 1 it
Between there is the effect of good metallurgical, bond；After completing above-mentioned action, pass through
One pay-off (sign) will heat radiation lamination structure 100 (100 ') rolling rolling.
(possible effect of embodiment)
The present invention is from the size reducing radiator structure the angle promoting its heat dissipation, institute simultaneously
The technology contents disclosed mainly is describing a kind of heat radiation lamination structure constructing novelty, itself because via
Cold rolling and hot rolling technology and prominent engineering properties can be provided, and all right between aluminium and copper material
It is formed with good metallurgical link to increase bond strength and to reduce interface contact heat resistance；Furthermore, this
Bright provided heat radiation lamination structure also ensures that product structure while having the heat dissipation of excellence
Slimming；Not only such, heat radiation lamination structure provided by the present invention is under free convection environment
The heat radiating fin structure that aluminium is combined with laminating type by heat dissipation Billy with copper material is more preferably.
The only above the most feasible embodiment that above are only the present invention, the non-the most i.e. limitation present invention's
The scope of the claims, therefore the equivalent structure such as using description of the invention of the present invention and diagramatic content to do becomes
Change, be the most in like manner contained in invention scope of the present invention, close and give Chen Ming.
Claims (12)
1. a heat radiation lamination structure, it is characterised in that this heat radiation lamination structure includes:
Aluminium base, this aluminium base have the first composition surface and relative to this first composition surface
Two composition surfaces；And
First copper clad layers, this first copper clad layers by the first diffusion welding layer be engaged in this
On one composition surface, wherein this first diffusion welding layer includes alloyed copper atom and aluminum atom.
Heat radiation lamination structure the most according to claim 1, wherein this first copper clad layers and this aluminum base
The thickness proportion of plate is 1:8.
Heat radiation lamination structure the most according to claim 1, also includes the first thermal diffusion radiating layer,
This first thermal diffusion radiating layer is formed in this first copper clad layers.
Heat radiation lamination structure the most according to claim 1, still further comprises second copper-clad layer,
This second copper-clad layer is engaged on this second composition surface by the second diffusion welding layer, and this
Two diffusion welding layers include alloyed copper atom and aluminum atom.
Heat radiation lamination structure the most according to claim 4, wherein this first copper clad layers, this aluminum base
Plate is 1:8:1 with the thickness proportion of this second copper-clad layer.
Heat radiation lamination structure the most according to claim 4, also includes the second thermal diffusion radiating layer,
This second thermal diffusion radiating layer is formed on this second copper-clad layer.
7. according to the heat radiation lamination structure described in claim 3 or 6, wherein this first thermal diffusion radiation
Layer and this second thermal diffusion radiating layer each include resin material and carbon composite, and should
The content of carbon composite is 30 to 70 weight relative to this resin material of 100 weight portions
Part.
Heat radiation lamination structure the most according to claim 7, wherein this carbon composite selected from diamond,
The group that Delanium, Graphene, CNT, carbon black and carbon fiber are formed.
Heat radiation lamination structure the most according to claim 1, the wherein thickness of this heat radiation lamination structure
Less than 2mm.
Heat radiation lamination structure the most according to claim 1, wherein this heat radiation lamination structure includes base
Portion and at least two kinks formed by the opposite sides extension of this base portion respectively.
The manufacture method of 11. 1 kinds of lamination structures that dispel the heat, it is characterised in that the system of this heat radiation lamination structure
The method of making comprises the following steps:
There is provided composite wood, this composite wood include aluminium base and at least one be positioned at this aluminium base
Copper clad layers on surface；
This composite wood is carried out roughing, so that the cross-sectional area of this composite wood reduces 5 to 20%,
Wherein it is formed with mechanical link between this aluminium base and this copper clad layers；
Under protective atmosphere, this composite wood after roughing is heated, so that this machinery is even
Bind up one's hair raw melted；And
This composite wood after heated is carried out finish rolling, so that the cross-sectional area of this composite wood subtracts
Few at least 20%, wherein form diffusion welding layer between this aluminium base and this copper clad layers, and should
Diffusion welding layer includes alloyed copper atom and aluminum atom.
The manufacture method of 12. heat radiation lamination structures according to claim 11, wherein at protective atmosphere
Under in step that this composite wood after roughing is heated, this composite wood after roughing
It is heated between 600 °F to 1000 °F.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562160705P | 2015-05-13 | 2015-05-13 | |
| US62/160,705 | 2015-05-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106163227A true CN106163227A (en) | 2016-11-23 |
Family
ID=57348259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510570493.7A Pending CN106163227A (en) | 2015-05-13 | 2015-09-09 | Heat radiation lamination structure and manufacture method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106163227A (en) |
| TW (1) | TW201639706A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108347859A (en) * | 2017-01-23 | 2018-07-31 | 赖芋苍 | High heat conductive insulating electromagnetism interference radiating shell |
| CN110541142A (en) * | 2019-09-05 | 2019-12-06 | 庄狄烽 | preparation method of modified graphene composite aluminum alloy |
| CN114799180A (en) * | 2022-04-10 | 2022-07-29 | 武汉华材表面科技有限公司 | Sheathed hot-rolled sintered metal-based composite material wear-resistant body and manufacturing method thereof |
| TWI777760B (en) * | 2021-08-09 | 2022-09-11 | 頎邦科技股份有限公司 | Flexible printed circuit board with heat-dissipation plate and heat-dissipation plate thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112655085A (en) * | 2018-09-07 | 2021-04-13 | 积水保力马科技株式会社 | Thermally conductive sheet |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1313638A (en) * | 2000-03-10 | 2001-09-19 | 昭和铝株式会社 | Aluminium-copper alloy workpiece and manufacture thereof and radiator therewith |
| CN102555340A (en) * | 2010-12-28 | 2012-07-11 | 常州碳元科技发展有限公司 | High heat dissipation membrane composite structure and manufacturing method thereof |
| TW201442609A (en) * | 2013-04-26 | 2014-11-01 | Cheng-En Tsai | Heat spreader and method for fabricating the same |
| US20140356580A1 (en) * | 2013-05-28 | 2014-12-04 | Hugetemp Energy Ltd. | Compound heat sink |
-
2015
- 2015-08-24 TW TW104127473A patent/TW201639706A/en unknown
- 2015-09-09 CN CN201510570493.7A patent/CN106163227A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1313638A (en) * | 2000-03-10 | 2001-09-19 | 昭和铝株式会社 | Aluminium-copper alloy workpiece and manufacture thereof and radiator therewith |
| CN102555340A (en) * | 2010-12-28 | 2012-07-11 | 常州碳元科技发展有限公司 | High heat dissipation membrane composite structure and manufacturing method thereof |
| TW201442609A (en) * | 2013-04-26 | 2014-11-01 | Cheng-En Tsai | Heat spreader and method for fabricating the same |
| US20140356580A1 (en) * | 2013-05-28 | 2014-12-04 | Hugetemp Energy Ltd. | Compound heat sink |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108347859A (en) * | 2017-01-23 | 2018-07-31 | 赖芋苍 | High heat conductive insulating electromagnetism interference radiating shell |
| CN110541142A (en) * | 2019-09-05 | 2019-12-06 | 庄狄烽 | preparation method of modified graphene composite aluminum alloy |
| TWI777760B (en) * | 2021-08-09 | 2022-09-11 | 頎邦科技股份有限公司 | Flexible printed circuit board with heat-dissipation plate and heat-dissipation plate thereof |
| US11503698B1 (en) | 2021-08-09 | 2022-11-15 | Chipbond Technology Corporation | Flexible circuit board and heat spreader thereof |
| CN114799180A (en) * | 2022-04-10 | 2022-07-29 | 武汉华材表面科技有限公司 | Sheathed hot-rolled sintered metal-based composite material wear-resistant body and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201639706A (en) | 2016-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106163227A (en) | Heat radiation lamination structure and manufacture method thereof | |
| CN103059761B (en) | High-heat conductivity coefficient graphite heat-radiation adhesive tape | |
| CN103547441B (en) | The complex of high-termal conductivity/low thermal coefficient of expansion | |
| JP2006504272A5 (en) | ||
| CN102534331B (en) | Method for preparing high conductivity diamond/aluminum composite material | |
| CN107164647A (en) | High heat conduction rigidity graphene/copper nano composite material fin and preparation method thereof | |
| CN203446165U (en) | Composite radiating fin | |
| CN105015094A (en) | Graphene heat dissipation structure | |
| CN103171207B (en) | Heat sink material and preparation method thereof | |
| CN103981382A (en) | Preparation method of high heat-conducting diamond/copper-based composite material | |
| CN102555340B (en) | A kind of high heat dissipation membrane composite structure and manufacture method thereof | |
| CN108925108A (en) | The conductive structure and its manufacturing method of aluminium alloy are inlayed in a kind of graphene-based composite substrate | |
| CN103906418A (en) | Cooling fin and manufacturing method thereof | |
| CN202135441U (en) | Composite radiating fin | |
| CN203912425U (en) | Thin type heat dissipating sheet and thermoelectricity device thereof | |
| CN201785338U (en) | Composite heat-dissipating graphite material | |
| CN107602915A (en) | A kind of composite heat-conducting silicone grease | |
| CN203884121U (en) | Radiating fin | |
| CN206525068U (en) | The radiating fire-retardant film of portable electronic devices | |
| CN202069420U (en) | High heat conduction kitchen utensil | |
| CN105399083B (en) | Aluminum-graphite composite preparation process | |
| CN203884122U (en) | radiating fin structure and radiating shell | |
| CN108156752A (en) | A kind of manufacturing method of circuit board, mobile terminal and circuit board | |
| CN202071443U (en) | Composite structure of high heat dissipation film | |
| Munakata et al. | Ag Nanoparticle-Based Aerogel-like Films for Interfacial Thermal Management |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161123 |