201230929 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種固定機構，且特別是有關於一種 電路板固定機構。 【先前技術】 隨著科技的發展，人們對於電腦系統的功能以及的要 求均越來越高。由於複雜的積體電路設計將會消耗大量的 電能，而這些消耗的電能將會轉換成為熱量造成溫度的上 升，因此使得電腦系統中溫度上升更形嚴重。當熱量聚集 在機殼内部而無法即時散掉時，將造成電子元件無法正常 工作。 隨著無線通訊技術發展，如WiFi、藍牙、GPS等通訊 技術已經成為筆記型電腦中常見的輔助功能。因此，筆記 型電腦中需設置有對應的天線電路板，以提供如WiFi、藍 牙、GPS等功能。為了收訊品質的考量，這些天線電路板 往往是設置在顯示殼體的外框部分，現有的天線電路板多 是透過螺絲固定並使用散熱座對其散熱，會增加零件的數 量以及組裝成本。 【發明内容】 因此本發明的目的就是在提供一種電路板固定機構， 用以無螺絲固定電路板。 依照本發明一實施例，提出一種電路板固定機構，用 以固定一電路板，包含第一殼體，第一殼體之材料為金屬。 201230929 第一殼體包含底面以及夾持件。夾持件設置於底面上，夾 持件具有壓制面，壓制面平行於底面，壓制面與底面之間 具有間隔’其中電路板容置於間隔之中，壓制面接觸電路 板以定位。 面 件 墊 孔 電路板固定機構更包含至少一凸肋，凸肋設置於底 凸肋接觸電路板之側面以定位。電路板包含有發熱元 壓制面接觸發熱元件。電路板固定機構可更包含導熱 設置於壓制面接觸電路板之-面。電路板包含 喊體包含設置於底面之凸點，凸點與孔卡合。壓 有導引斜面背向底面延伸。其中第-殼體可為 = = 顯示器後框件，電路板為天線電路板。電路 別設置於m-^含有第二殼體以及多個卡合部。卡合部分 疫體。第/體與第二殼體，藉以卡合第一殼體與第二 體包含多個擋牆，擋牆延伸向第-殼體。第 -多個凸點，與電路板上之孔卡合。 ^ , , 、底面之間，並透過凸肋固定電路 =丄凸點可與電路板上之孔卡合以定位電路 方式，本發明了*:使用螺絲將電路板鎖固殼體上的固定 此之外，壓制面與電^零件^本以及組裝工時。除 量經由第一殼體^逸，仃熱父換，使電路板產生的熱 熱座。 月、，達成散熱的功效而不需額外使用散 【實施方式】 201230929 以下將以圖式及詳細說明清楚說明本發明之精神，任 何所屬技術領域中具有通常知識者在瞭解本發明之較佳實 • 施例後’當可由本發明所教示之技術，加以改變及修飾， • 其並不脫離本發明之精神與範圍。 參照第1圖’其繪示本發明之電路板固定機構一實施 例的立體視圖。電路板固定機構為用以固定一電路板（圖中 未繪示），其包含有第一殼體100，其中第一殼體1〇〇具有 底面110以及夾持件120。其中夾持件120包含有相連的 • 支標部122以及壓制面124 ’支樓部122連接壓制面124 與底面110,壓制面124與底面110之間具有間隔g。電路 板可以容置在此間隔g之中，壓制面124則是接觸電路板 以限制電路板在z方向的位移。壓制面124上可更包含有 導引斜面126，導引斜面126為背向底面11()延伸，以方 便電路板進入間隔g。 第一殼體100上更包含有至少一凸肋丨30，凸肋！ 設置於底面110上。凸肋130所設置的位置為對應於電路 • 板的板邊。當電路板置入間隔g之後，凸肋13〇可接觸電 路板的側面’以限制電路板在X方向的位移。—般的電路 板上多會δ又置有孔以供螺絲鎖固，本發明之第—咬體1 〇〇 上則包含有設置在底面110上的凸點14〇。凸點^)的位 置則是對應於電路板上的孔，以在組裝時與孔卡人而〜 電路板。 、σ疋位 參照第2圖，其繪示將電路板置入第丨圖之電路 定機構的立體視圖。電路板16〇已經放入失持件12〇 特別是容置於壓制面124與底面110之間。壓制面124與 201230929 電路板160接觸，以限制電路板160在z方向的位移。凸 肋130為分布在電路板16〇的周圍，且與電路板160的側 面接觸，以限制電路板16〇在X方向的位移。電路板160 上具有孔162，凸點14〇與孔162卡合以定位電路板160。 第一殼體100可以為一體成形的金屬殼體’或是殼體 中的金屬件。夾持件120亦為金屬材料，因此，當壓制面 124與電路板160接觸時，壓制面124可以與電路板160 進行熱交換。電路板16〇與其上之發熱元件所產生的熱量 經由與之接觸的壓制面124送到第一殼體1〇〇，由於第一 殼體100的材料為導熱性佳的金屬，且具有相當大的表面 積，因此熱量可以由第一殼體1〇〇散逸。換言之，此電路 板固定機構除可固定電路板160之外，更具有散熱的功效。 參照第3圖’其續^示第2圖中之電路板固定機構的剖 面圖。夾持件120近似於l形結構，導引斜面126與支樓 部122分別位於壓制面124的相對兩端。電路板160由導 引斜面126的一端進入壓制面124與底面110之間。壓制 面124可以直接接觸電路板16〇，以對電路板16〇進行定 位以及散熱。或者’如本實施例一般，電路板固定機構更 具有導熱墊Π0 ’導熱墊170設置於壓制面124接觸電路 板160之一面上’使得壓制面Π4透過導熱墊170接觸電 路板160，進而提升熱傳導的效率。電路板160上具有發 熱元件164，壓制面124可以接觸發熱元件164，以即時地 將發熱元件164所產生的熱量帶走。 參照第4圖’其繪示本發明之電路板固定機構另一實 施例的示意圖。電路板固定機構為應用在筆記型電腦200 201230929 之中，其中第一殼體100為筆記型電腦顯示器的後框，特 別是後框的金屬件。液晶顯示面板210設置在第一殼體100 之中，電路板160位於液晶顯示面板210的外圍。 . 第一殼體1〇〇具有底面110以及夾持件120。其中夾 持件120包含有壓制面124，壓制面124與底面110之間 具有間隔。電路板160可以容置在此間隔之中，壓制面124 則是接觸電路板160以限制電路板16〇在z方向的位移。 第一殼體100上更包含有凸肋130，凸肋130設置於 • 底面110上。凸肋130所設置的位置為對應於電路板ι6〇 的板邊。當電路板160置入間隔g之後，凸肋13〇可接觸 電路板160的侧面’以限制電路板160在X方向方向的位 移。電路板160上設置有孔162，第一殼體10〇上包含有 設置在底面110上的凸點14〇。凸點14〇的位置則是對應 於電路板160上的孔162，以在組裝時與孔162卡合而定 位電路板16〇。 同時參照第4圖與第5圖，第5圖繪示與第4圖中之 • 第一殼體1〇〇搭配的第二殼體180的示意圖。第二殼體180 上更具有多個擋牆182，擋牆182向第一殼體10〇之方向 延伸’擋牆182的位置可以與凸肋130的位置錯開，以在 組裝完成之後接觸電路板160之側面，以限制電路板160 在X方向與y方向的位移。第二殼體18〇上可更設置有凸 塊190 ’凸塊190之位置對應於電路板160上之孔162的 位置。凸塊190可在組裴時壓制電路板160，定位電路板 160。若搭配凸點140則有助於避免孔162因外力衝擊而脫 離凸點14〇。 [S] 7 201230929 由上述本發明較佳實施例可知，應用本發明具有下列 優點。第一殼體與其上之各部組件可以為一體成形地製 作，電路板夾持在挾持件與底面之間，並透過凸肋固定電 路板，第一殼體上的凸點可與電路板上之孔卡合以定位電 路板，相較於過去需要使用螺絲將電路板鎖固殼體上的固 定方式，本發明可以有效降低零件的成本以及組裝工時。 除此之外，壓制面與電路板進行熱交換，使電路板產生的 熱量經由第一殼體散逸，達成散熱的功效而不需額外使用 散熱座。 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明，任何熟習此技藝者，在不脫離本發明之精 神和範圍内，當可作各種之更動與潤飾，因此本發明之保 護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 第1圖繪示本發明之電路板固定機構一實施例的立體 視圖。 第2圖繪示將電路板置入第1圖之電路板固定機構的 立體視圖。 第3圖繪示第2圖中之電路板固定機構的剖面圖。 第4圖繪示本發明之電路板固定機構另一實施例的示 意圖。 201230929 第5圖繪示與第4圖中之第一殼體110搭配的第二殼 體180的示意圖。 【主要元件符號說明】 100 :第一殼體 110 :底面 120 :夾持件 122 :支撐部 124 :壓制面 126 :導引斜面 130 :凸肋 140 :凸點 160 :電路板 162 :孔 164 :發熱元件 170 :導熱墊 180 :第二殼體 182 :擋牆 190 :凸塊 200 :筆記型電腦 210 .液晶顯不面板 g :間隔 9201230929 VI. Description of the Invention: [Technical Field] The present invention relates to a fixing mechanism, and more particularly to a circuit board fixing mechanism. [Prior Art] With the development of technology, people's functions and requirements for computer systems are getting higher and higher. Since the complex integrated circuit design will consume a large amount of electric energy, and the consumed electric energy will be converted into heat, the temperature rises, which makes the temperature rise in the computer system more serious. When heat is collected inside the casing and cannot be dissipated immediately, the electronic components will not work properly. With the development of wireless communication technologies, communication technologies such as WiFi, Bluetooth, and GPS have become common auxiliary functions in notebook computers. Therefore, a corresponding antenna circuit board should be provided in the notebook computer to provide functions such as WiFi, Bluetooth, and GPS. In order to consider the quality of the receiving, these antenna boards are often disposed in the outer frame portion of the display housing. The existing antenna circuit boards are mostly fixed by screws and radiated by the heat sinks, which increases the number of parts and the assembly cost. SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a circuit board securing mechanism for securing a circuit board without screws. In accordance with an embodiment of the invention, a circuit board securing mechanism is provided for securing a circuit board including a first housing, the material of the first housing being metal. 201230929 The first housing includes a bottom surface and a clamping member. The clamping member is disposed on the bottom surface, the clamping member has a pressing surface, the pressing surface is parallel to the bottom surface, and the pressing surface is spaced apart from the bottom surface. The circuit board is accommodated in the space, and the pressing surface contacts the circuit board for positioning. The surface pad fixing mechanism further includes at least one rib disposed on the side of the bottom rib contacting the circuit board for positioning. The circuit board contains a heating element to press the surface contact heating element. The circuit board fixing mechanism may further comprise a heat conducting surface disposed on the surface of the pressing surface contacting the circuit board. The board includes a body that includes a bump disposed on the bottom surface, and the bump is engaged with the hole. The pressure has a guiding bevel extending back to the bottom surface. The first housing may be == the rear frame of the display, and the circuit board is the antenna circuit board. The circuit is disposed at m-^ and includes a second housing and a plurality of engaging portions. The part of the card is infected. The first body and the second housing are configured to engage the first housing and the second body to include a plurality of retaining walls, and the retaining wall extends toward the first housing. The first plurality of bumps are engaged with the holes on the circuit board. Between ^, , and between the bottom surfaces, and through the rib fixing circuit = 丄 bumps can be engaged with the holes on the circuit board to locate the circuit, the present invention *: the use of screws to lock the circuit board on the housing fixed In addition, the pressing surface and the electric parts and assembly work hours. The amount of removal is changed by the first housing, and the heat is replaced by a hot parent. </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; • The invention may be modified and modified by the teachings of the present invention without departing from the spirit and scope of the invention. Referring to Fig. 1 which is a perspective view showing an embodiment of a circuit board fixing mechanism of the present invention. The circuit board fixing mechanism is for fixing a circuit board (not shown), and includes a first housing 100, wherein the first housing 1 has a bottom surface 110 and a clamping member 120. The clamping member 120 includes a connecting portion of the supporting portion 122 and a pressing surface 124. The branch portion 122 connects the pressing surface 124 and the bottom surface 110. The pressing surface 124 and the bottom surface 110 have a gap g therebetween. The circuit board can be accommodated in this interval g, and the pressing surface 124 contacts the circuit board to limit the displacement of the circuit board in the z direction. The pressing surface 124 may further include a guiding slope 126 extending away from the bottom surface 11 () to facilitate entry of the circuit board into the gap g. The first housing 100 further includes at least one rib 30, a rib! It is disposed on the bottom surface 110. The rib 130 is disposed at a position corresponding to the edge of the board of the circuit board. After the board is placed in the gap g, the ribs 13A can contact the side of the board to limit the displacement of the board in the X direction. In general, the board has a hole δ which is provided with a hole for screw locking. The first bite body 1 of the present invention includes a bump 14 设置 disposed on the bottom surface 110. The position of the bump ^) is corresponding to the hole on the board, so as to be assembled with the hole and ~ the board. σ 疋 参照 Referring to Figure 2, a perspective view of the circuit board in which the circuit board is placed in the second diagram is shown. The circuit board 16A has been placed in the holding member 12, and is particularly placed between the pressing surface 124 and the bottom surface 110. The pressing surface 124 is in contact with the 201230929 circuit board 160 to limit the displacement of the circuit board 160 in the z direction. The ribs 130 are distributed around the circuit board 16A and are in contact with the side faces of the circuit board 160 to limit the displacement of the circuit board 16 in the X direction. The circuit board 160 has a hole 162 therein, and the bump 14 is engaged with the hole 162 to position the circuit board 160. The first housing 100 can be an integrally formed metal housing 'or a metal piece in the housing. The clamping member 120 is also of a metallic material so that the pressing surface 124 can exchange heat with the circuit board 160 when the pressing surface 124 is in contact with the circuit board 160. The heat generated by the circuit board 16 and the heat generating component thereon is sent to the first casing 1 via the pressing surface 124 in contact therewith, since the material of the first casing 100 is a metal having good thermal conductivity and has a considerable The surface area, so heat can be dissipated by the first housing 1〇〇. In other words, the circuit board fixing mechanism has the function of dissipating heat in addition to the fixed circuit board 160. Referring to Fig. 3, a cross-sectional view of the circuit board fixing mechanism in Fig. 2 is continued. The clamping member 120 is similar to the 1-shaped structure, and the guiding slope 126 and the branch portion 122 are respectively located at opposite ends of the pressing surface 124. The circuit board 160 is guided between the pressing surface 124 and the bottom surface 110 by one end of the guiding slope 126. The pressing surface 124 can directly contact the circuit board 16A to position and dissipate the circuit board 16A. Or, as in the embodiment, the circuit board fixing mechanism further has a thermal pad Π0. The thermal pad 170 is disposed on the pressing surface 124 to contact one surface of the circuit board 160. The pressing surface 4 contacts the circuit board 160 through the thermal pad 170, thereby improving heat conduction. s efficiency. The circuit board 160 has a heat generating element 164 which contacts the heat generating element 164 to immediately remove the heat generated by the heat generating element 164. Referring to Fig. 4, there is shown a schematic view of another embodiment of the circuit board fixing mechanism of the present invention. The board fixing mechanism is applied to the notebook computer 200 201230929, wherein the first housing 100 is a rear frame of the notebook computer display, in particular, a metal member of the rear frame. The liquid crystal display panel 210 is disposed in the first housing 100, and the circuit board 160 is located on the periphery of the liquid crystal display panel 210. The first housing 1 has a bottom surface 110 and a clamping member 120. The holding member 120 includes a pressing surface 124 having a space between the pressing surface 124 and the bottom surface 110. The circuit board 160 can be received in this interval, and the pressing surface 124 contacts the circuit board 160 to limit the displacement of the circuit board 16 in the z direction. The first housing 100 further includes a rib 130 disposed on the bottom surface 110. The rib 130 is disposed at a position corresponding to the board edge of the circuit board ι6〇. After the circuit board 160 is placed in the gap g, the ribs 13A can contact the side of the circuit board 160 to limit the displacement of the board 160 in the X direction. The circuit board 160 is provided with a hole 162, and the first housing 10 includes a bump 14 provided on the bottom surface 110. The position of the bump 14 is corresponding to the hole 162 in the circuit board 160 to engage the hole 162 during assembly to position the circuit board 16A. Referring to Figures 4 and 5, FIG. 5 is a schematic view showing the second housing 180 in combination with the first housing 1 in FIG. The second housing 180 further has a plurality of retaining walls 182. The position of the retaining wall 182 extending toward the first housing 10 ' can be offset from the position of the ribs 130 to contact the circuit board after assembly is completed. The side of 160 limits the displacement of circuit board 160 in the X and y directions. The second housing 18 may be further provided with a projection 190' where the projection 190 corresponds to the position of the aperture 162 in the circuit board 160. The bumps 190 can press the circuit board 160 and position the circuit board 160 during assembly. If the bump 140 is matched, it helps to prevent the hole 162 from coming off the bump 14 due to an external force. [S] 7 201230929 From the above-described preferred embodiments of the present invention, the application of the present invention has the following advantages. The first housing and the components on the upper part thereof can be integrally formed, the circuit board is sandwiched between the holding member and the bottom surface, and the circuit board is fixed through the rib, and the bump on the first housing can be connected to the circuit board. The hole is engaged with the positioning circuit board, and the invention can effectively reduce the cost of the parts and the assembly man-hours compared to the manner in which the screws are used to fix the circuit board on the housing. In addition, the pressing surface exchanges heat with the circuit board, so that the heat generated by the circuit board is dissipated through the first housing, thereby achieving heat dissipation without using an additional heat sink. Although the present invention has been described above in terms of a preferred embodiment, it is not intended to limit the invention, and it is obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. A perspective view of an embodiment. Fig. 2 is a perspective view showing the circuit board being placed in the circuit board fixing mechanism of Fig. 1. Fig. 3 is a cross-sectional view showing the circuit board fixing mechanism in Fig. 2. Fig. 4 is a view showing another embodiment of the circuit board fixing mechanism of the present invention. 201230929 Fig. 5 is a schematic view showing the second housing 180 in combination with the first housing 110 of Fig. 4. [Main component symbol description] 100: First housing 110: bottom surface 120: clamping member 122: support portion 124: pressing surface 126: guiding slope 130: rib 140: bump 160: circuit board 162: hole 164: Heating element 170: thermal pad 180: second housing 182: retaining wall 190: bump 200: notebook computer 210. liquid crystal display panel g: interval 9