201122786 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置，尤其涉及一種帶有固定架之 散熱裝置。 【先前技術·】 [0002] 隨著電子產業之迅速發展，電子元件如中央處理器等之 運算速度大幅度提高，其産生之熱量也隨之劇增，如何 將電子元件之熱量散發出去，以保證其正常運行，一直 係業界重視之問題。為有效散發中央處理器在運行過程 〇 中産生之熱量，業界通常在電子元件表面加裝一散熱器 ，從而使電子元件自身溫度維持在正常運行範圍内。 * ::變 .^Ί1ΙΙΙ-?;：'ν [0003] 將散熱器安裝到電路板上之常見手段很多，其中，可以 收容散熱器幷可固定到電路板上之固定架就係其中一種 ，然而，現有之固定架通常通過固定架自身上形成彈性 卡扣機構與散熱器預先扣接在一起。雖然這種固定結構 也較為簡單便捷，但是由於固定架作為結構支撑件，其 Q 強度較大。因此，該固定架需要加大之施加力來使其發 生彈性形變而與散熱器配合，使安裝散熱器之過程較為 困難，而且安裝完成後固定架之破損率比較高。 【發明内容】 [0004] 有鑒於此，實有必要提供一種組裝便捷、可靠之散熱裝 置。 [0005] —種散熱裝置，包括一散熱器和固定架，所述散熱器之 收容在該固定架内，所述固定架内侧設置有複數限位凸 部，所述散熱器收容於固定架内且所述散熱器周面上形 098145209 表單編號 Α0101 第 3 頁/共 20 頁 0982077271-0 201122786 成有供所述限位凸部穿過之複數凹陷部，所述散熱器處 於第一狀態時，所述限位凸部分別對應所述凹陷部；所 述散熱器處於第二狀態時，所述限位凸部錯離所述凹陷 部而抵在散熱器底部。 [0006] 上述散熱裝置之散熱器周面上設置之凹陷部可使固定架 内側之限位凸部無需變形便可由上而下通過該散熱器， 再通過旋轉散熱器就可完成散熱器、固定架以及風扇之 固定連接，而無需施加較大之力量便可使固定架與散熱 器緊固在一起，而不存在因為施力過大造成固定架損壞 f) 之可能，可見其組裝便捷、可靠。 【實施方式】 ’ [0007] 如圖1及圖2所示，本發明一些實施例中之散熱裝置可用 於對安裝在電路板40上之發熱電子元件42 (例如，電腦 CPU)進行散熱，該散熱裝置可包括一散熱器10 '用於將 散熱器10固定到電路板40上之固定架20。在一些實施例 中，該固定架20之頂部還安裝有一風扇30，以驅動散熱 器10周圍之空氣進行強制對流，而提高散熱效率。 ί [0008] 上述散熱器10在一些實施例中可呈圓柱狀，幷可采用成 本較為低廉之擠制（例如，銘擠、銅擠）成型，該散熱 器10可包括一導熱柱12和由導熱柱12周面向外發散延伸 之複數散熱片14。該導熱柱12可以為圓柱狀，導熱柱12 底端面向下凸出散熱片14,以與電子元件42接觸以吸熱 。所述散熱片14由導熱柱12之圓柱面均勻向外發散延伸 ，每一散熱片14之靠外側部分分叉形成二分支片140，以 增加散熱面積。所述散熱片14以及分支片140均向導熱柱 098145209 表單編號Α0101 第4頁/共20頁 0982077271-0 201122786 12外發散延伸之同時，朝順時針 該散熱器以周面上形成有複數向内=針之方向脊曲。 應每-凹陷部u之處相鄰多個散：之凹陷部16。對 小於其它散熱片14之長度，從“、14向外延伸之長度 應形成該凹陷部16。 散熱器10之周面上對 [0009] 上述風扇30具有—呈扁圓筒狀 緣向外延伸有四對相互間隔之凸二，該扇框32之周 部34關於風户,凸出部34。所述四對凸出 Ο 凸出邻34人$ W對稱分布於扇樞32之周緣 ，每一對 ㈣緣，其中靠近扇框町 ，之部34與蚊細配合，且細Mm之底面與 =之下緣齊平。每一凸出部34大致呈直角 三角形板 母凸出。P34之二直角邊向外凸出，每广凸出部34 上開設有與固定架2〇配合之—穿孔祕。201122786 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a heat sink, and more particularly to a heat sink with a mount. [Prior Art·] [0002] With the rapid development of the electronics industry, the computing speed of electronic components such as central processing units has been greatly improved, and the heat generated by them has also increased dramatically. How to dissipate the heat of electronic components to To ensure its normal operation, it has always been an issue of concern to the industry. In order to effectively dissipate the heat generated by the central processing unit during operation, the industry usually installs a heat sink on the surface of the electronic component to maintain the electronic component's own temperature within the normal operating range. *::变.^Ί1ΙΙΙ-?;:'ν [0003] There are many common ways to mount a heat sink on a circuit board. Among them, a mounting bracket that can accommodate a heat sink and can be fixed to a circuit board is one of them. However, the existing fixing frame is usually pre-attached to the heat sink by forming an elastic snap mechanism on the fixing frame itself. Although the fixing structure is also relatively simple and convenient, the Q strength is large due to the fixing frame as a structural support member. Therefore, the fixing frame needs to be increased in exerting force to elastically deform and cooperate with the heat sink, so that the process of installing the heat sink is difficult, and the damage rate of the fixing frame is relatively high after the installation is completed. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide a heat dissipating device that is easy to assemble and reliable. [0005] A heat dissipating device includes a heat sink and a fixing frame, wherein the heat sink is received in the fixing frame, and a plurality of limiting protrusions are disposed on the inner side of the fixing frame, and the heat sink is received in the fixing frame And the surface of the heat sink has a shape of 098145209, the form number Α0101, the third page, the total number of the recesses through which the limiting protrusion passes, and the heat sink is in the first state. The limiting protrusions respectively correspond to the recesses; when the heat sink is in the second state, the limiting protrusions are offset from the recesses to abut the bottom of the heat sink. [0006] The recessed portion disposed on the circumferential surface of the heat sink of the heat dissipating device can allow the limiting convex portion on the inner side of the fixing frame to pass through the heat sink from top to bottom without deformation, and then the radiator can be completed by rotating the heat sink. The fixed connection of the frame and the fan can be used to fasten the fixing frame and the heat sink without applying a large force, and there is no possibility that the fixing frame is damaged due to the excessive force applied, so that the assembly is convenient and reliable. [Embodiment] As shown in FIGS. 1 and 2, a heat sink device in some embodiments of the present invention can be used to dissipate heat generated electronic components 42 (eg, a computer CPU) mounted on a circuit board 40. The heat sink can include a heat sink 10' for securing the heat sink 10 to the mounting plate 20 on the circuit board 40. In some embodiments, a fan 30 is mounted on the top of the holder 20 to drive air around the radiator 10 for forced convection to improve heat dissipation efficiency. [0008] The heat sink 10 may be cylindrical in some embodiments, and may be formed by a relatively inexpensive extrusion (eg, extrusion, copper extrusion). The heat sink 10 may include a heat conducting column 12 and The heat conducting column 12 is circumferentially facing the plurality of fins 14 extending outward. The heat conducting column 12 may be cylindrical, and the bottom end surface of the heat conducting column 12 protrudes downward from the heat sink 14 to contact the electronic component 42 to absorb heat. The fins 14 are uniformly spread outward from the cylindrical surface of the heat conducting column 12, and the outer portions of each of the fins 14 are bifurcated to form two branch pieces 140 to increase the heat dissipating area. The heat sink 14 and the branch piece 140 are both extended to the outside of the hot column 098145209, the form number Α0101, the fourth surface, and the 20th page of the 0982077271-0 201122786 12, and the heat sink is formed clockwise on the circumferential surface. = the direction of the needle is curved. A plurality of recesses 16 are adjacent to each of the recesses u. For the length smaller than the other fins 14, the length extending outward from ", 14 should form the recess 16. The peripheral surface of the heat sink 10 has [0009] the fan 30 has a flat cylindrical edge extending outward. There are four pairs of mutually spaced convex two, the peripheral portion 34 of the fan frame 32 is about the wind, and the convex portion 34. The four pairs of convex ridges protrude from the periphery of the fan hub 32 symmetrically. A pair of (four) edges, which are close to the fan frame town, the part 34 is closely matched with the mosquito, and the bottom surface of the thin Mm is flush with the lower edge of the lower edge. Each of the convex portions 34 is substantially convex with a right-angled triangular plate. P34 bis The right-angled side protrudes outward, and each of the wide protrusions 34 is provided with a perforation secret with the fixing frame 2〇.
[0010] G :幷參閱圖3 ’上述固定架2〇在_些實施例中可由塑膠 材料體$成’其具有一收容散熱器10之筒體22，筒體 2在一實施例中可呈圓筒狀，其頂部可形成一通風孔 24 ’以供安裝麵㈣上之_30產生 之氣流向下吹向 散熱器10。該通風孔24之具體形狀可以由筒體22頂端緣 相内水平延伸之支撐板（未標號）來進行調整。所述筒 體22由其頂端緣之四均勻間隔處分別向外水平延伸有承 接板26，以將承接風扇30之四下緣凸出部34。每一承接 板26垂直向上延伸有—插入凸出部34穿孔34〇内之固定柱 260 ’每一承接板26還在固定柱26〇—侧垂直向上延伸有 一扣片262 ’所述扣片262之上端部内侧向内凸設有倒勾 狀卡扣部264 ’所述卡扣部264在'固定柱260插入下緣凸 098145209 表單編號A0101 第5頁/共20頁 0982077271-0 201122786 出部34穿孔綱之同時滑過所述下緣凸出部34而抵卡在下 緣凸出部34之頂面，從而將風扇3()固定在固定㈣上。 [0011] [0012] 上述筒體22底端部均勻、間隔向下設置有與該散熱器⑼ 凹陷部16對應之安裝脚28。在本實施例中，所述安裝脚 歸凹陷部16之數量對應為四。每—找脚加外設置 有一安裝筒280，每-安裝筒28〇内穿置_固定件⑽。 當所述固定件100向下穿過電路板4〇上位於電子元件42周 圍之安裝孔44，可將所述散熱裝置固定到電子元件42上 。每—安裝脚28内側向内凸出設置有_限位凸部25，該 限位凸部25靠近安裝脚28之底部，且在散熱器1〇收容於 該筒體22内時，該限位凸部25之頂部與散熱器10散熱片 14之底部齊平。 上述筒體22内壁向内凸伸有複數支撑凸部23 ’所述支撑 凸部23緊鄰筒體22頂部之支撑板，幷抵接在散熱器1〇散 熱片14之頂部。該筒體22内壁向内凸設有至少一對第一 凸條27、第二凸條29，每一對第一、第二凸條27、29相 互間隔幷垂直於筒瘇Ϊ2之頂部支撑板。每一對第一、第 二凸條27 ' 29位於二相鄰安裝脚28之間，其中第二凸條 29位於而二相鄰安裝脚28之中間位置，而第一凸條27位 於該第二凸條29與相鄰之一安裝脚28之間。本實施例中 ，設置有兩對第一、第二凸條27、29，其中，二第一凸 條27關於筒體22轴心對稱設置，二第二凸條29關於筒體 22軸心對稱設置。可以理解，在其他實施例中所述第一 、第二凸條27、29在筒體22内壁之位置可以根據具體情 况做其他變換。參閱圖3，本實施例中之每一第一凸條27 098145209 表單編號A0101 第6頁/共20頁 0982077271-0 201122786 在其一侧面上形成有—第—阻播面27〇，每一第二凸條 290在其側面上對應形成_第二阻擔面，其中每一 對第、第一凸條27、29之第一阻播面27〇和第二阻播面 29G之朝向相反’分別位於所述第—第二凸條η、相 反之側面上α限疋散熱器1〇在順時針和逆時針之不同 方向上之轉動。此外，每一第二凸條⑼與第二阻擔面29〇 相反之另一側面上形成弧形導引面292，以便於在散熱器 10¼轉時’所述散熱片14之末端部分從導引面292滑過。 上述第一凸條29之第二阻擋面290與導引面292之設置方 向與散熱片14之彎曲方向有關，例如，在本實施例中， 散熱片14朝逆時針方向彎曲，則導引面如朝向散熱片14 之彎曲面，既係，由第二阻撐面29〇到導引面292之方向 也為與散熱片14彎曲方向相同之逆時針方向，以便於散 熱片14從導引面292滑過後抵在第二阻擋面290上，而不 會回轉。 [0013]請同時參閱圖4至7，名裝散熱裝置時，先將風扇3〇放置 〇 在固定架20上卡扣固定；將固定架20套設到散熱器10上 面，使散熱器10上部分收谷在固定架2〇筒體22内，且所 述固定架20安裝脚28内侧之限位凸部25分別對應收容於 散熱器10周面上之凹陷部16内，所述固定架2〇内壁之第 一凸條27同時收容於凹陷部16内幷靠近凹陷部16之一側 ，而所述固定架20内壁之第二凸條29分別位於二相鄰敎 熱片14之間，此時如圖4和6所示，散熱器1〇與固定架2〇 處於未鎖固之狀態；然後，旋轉散熱器10使其從未與固 定架20鎖固之狀態（圖4和6所示）轉動到鎖固狀態，如 098145209 表單編號A0101 第7頁/共20頁 0982077271-0 201122786 圖5和7所示，此時，散熱器10上之凹陷部16錯離固定架 20内側之限位凸部25，而使限位凸部25之頂部抵在散熱 器10散熱片14之底部上，同時所述固定架20内壁之第一 凸條27從凹陷部16内緊靠其一側處轉到緊靠其另一侧之 位置，且與第二凸條29相鄰之部分散熱片14之末端部在 散熱器10轉動時，發生彈性彎曲後滑過該第二凸條29。 [0014] 由此可見，上述散熱器10周面上設置之凹陷部16可使固 定架20内侧之限位凸部25無需變形便可由上而下通過該 散熱器10，再通過旋轉散熱器10就可完成散熱器10、固 定架20以及風扇30之固定連接，而無需施加較大之力量 便可使固定架20與散熱器10緊固在一起。 [0015] 在散熱器10轉動時，該固定架20内壁之第一凸條27對應 從散熱器10凹陷部16内緊靠其一侧處轉到緊靠其另一側 之位置内固定，從而對散熱器10之轉動幅度有一定之預 警和限定之作用，同時也能防止散熱器10在使用過程中 在一個方向如順時針方向上之進一步轉動；此外，該第 二凸條29之夾設於二相鄰之散熱片14之間，且該第二凸 條29之第二阻擋面290與第一阻擋面270之方向相反，可 以防止散熱器10使用過程中在另一相反方向如逆時針方 向上之轉動。可見，上述第一凸條27和第二凸條29可以 防止散熱器10在使用中由於風扇30等高速運轉元件之振 動下發生轉動而從固定架20中意外脫落出來。 [0016] 此外，在散熱器10轉動時，所述相應之部分散熱片14末 端部分發生彈性變形後滑過所述對應之第二凸條29，使 所述第二凸條29始終夾置在二相鄰散熱片14之間，而且 098145209 表單編號A0101 第8頁/共20頁 0982077271-0 201122786 由於散熱片14為強度小、彈性好之鋁薄片體，因此不容 易在散熱器10安裝轉動時發生損壞，使散熱器10與固定 架20之整個組合過程安全可靠。 [0017] 最後，將散熱裝置放置到電路板40之電子元件42上，再 通過固定架20安裝脚28上之固定件100與電路板40上之 安裝孔44配合而將散熱裝置固定到電子元件42上。 [0018] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 〇 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0019] 圖1係本發明一實施例中散熱裝置安裝於一電路板之電子 元件上之立體組合圖。 [0020] 圖2係圖1中散熱裝置之分解圖。 [0021] 圖3係圖2中風扇固定架之倒置放大圖。 [0022] 圖4係圖1中散熱器與固定架處於未鎖固狀態之倒置視圖 [0023] 圖5係圖1中散熱器與固定架處於鎖固狀態之倒置視圖。 [0024] 圖6係圖4中散熱器與固定架處於未鎖固狀態之仰視圖。 [0025] 圖7係圖5中散熱器與固定架處於鎖固狀態之仰視圖。 【主要元件符號說明】 [0026] 散熱器10 098145209 表單編號A0101 第9頁/共20頁 0982077271-0 201122786 [0027] 導熱柱 12 [0028] 散熱片 14 [0029] 分支片 140 [0030] 凹陷部 16 [0031] 固定架 20 [0032] 筒體22 [0033] 支撑凸部23 [0034] 通風孔 24 [0035] 限位凸部25 [0036] 承接板 26 [0037] 固定柱 260 [0038] 扣片262 [0039] 卡扣部 264 [0040] 第一凸條27 [0041] 第一阻檔面270 [0042] 安裝脚 28 [0043] 安裝筒 280 [0044] 第二凸條29 [0045] 第二阻擋面290 098145209 表單編號 A0101 第 10 頁/共 20 頁 0982077271-0 201122786 [0046] [0047] [0048] [0049] [0050] [0051] [0052] Ο [0053] ' [0054] 導引面292 風扇3 0 扇框3 2 凸出部34 穿孔340 電路板40 電子元件42 安裝孔44 固定件100 Ο[0010] G: 幷 Referring to FIG. 3, the above-mentioned fixing frame 2 can be made of a plastic material body in some embodiments, and has a cylindrical body 22 for accommodating the heat sink 10. The cylindrical body 2 can be embodied in one embodiment. The cylindrical shape has a venting hole 24' formed at the top thereof for the airflow generated by the _30 on the mounting surface (4) to be blown downward toward the heat sink 10. The specific shape of the venting opening 24 can be adjusted by a support plate (not numbered) extending horizontally within the top edge of the barrel 22. The cylindrical body 22 has a receiving plate 26 extending horizontally outwardly from the four evenly spaced end edges thereof to receive the four lower edge projections 34 of the fan 30. Each of the receiving plates 26 extends vertically upwardly with a fixing post 260 that is inserted into the through hole 34 of the protruding portion 34. Each of the receiving plates 26 also has a cleat 262 in the vertical direction of the fixing post 26〇. A hook-shaped hooking portion 264 is protruded inwardly from the inner side of the upper end portion. The latching portion 264 is inserted into the lower edge of the fixing post 260. 098145209 Form No. A0101 Page 5 of 20 pages 0 927 727 727 - 2011 22786 The perforating frame slides over the lower edge projection 34 to abut against the top surface of the lower edge projection 34, thereby fixing the fan 3() to the fixed (four). [0012] The bottom end portion of the tubular body 22 is evenly disposed with a mounting leg 28 corresponding to the recessed portion 16 of the heat sink (9). In the present embodiment, the number of the mounting legs to the recessed portion 16 corresponds to four. Each of the search pins is provided with a mounting cylinder 280, and each of the mounting cylinders 28 is provided with a fixing member (10). The heat sink can be secured to the electronic component 42 as the fastener 100 passes down through the mounting holes 44 of the circuit board 4 around the electronic component 42. Each of the mounting legs 28 protrudes inwardly and has a _ limiting protrusion 25 disposed near the bottom of the mounting leg 28, and when the heat sink 1 is received in the barrel 22, the limit The top of the convex portion 25 is flush with the bottom of the heat sink 14 of the heat sink 10. The inner wall of the tubular body 22 protrudes inwardly with a plurality of supporting convex portions 23'. The supporting convex portions 23 are adjacent to the supporting plate at the top of the cylindrical body 22, and the weirs abut against the top of the heat sink 1 and the heat radiating fins 14. The inner wall of the cylinder 22 is convexly provided with at least a pair of first ribs 27 and second ribs 29, and each pair of first and second ribs 27, 29 are spaced apart from each other and perpendicular to the top support plate of the cartridge 2 . Each pair of first and second ribs 27' 29 are located between two adjacent mounting legs 28, wherein the second rib 29 is located at an intermediate position between two adjacent mounting legs 28, and the first rib 27 is located at the middle The two ribs 29 are between the adjacent one of the mounting legs 28. In this embodiment, two pairs of first and second ribs 27 and 29 are disposed, wherein the two first ribs 27 are axially symmetrically disposed with respect to the cylindrical body 22, and the second second ribs 29 are axially symmetrical with respect to the cylindrical body 22. Settings. It can be understood that in other embodiments, the positions of the first and second ribs 27, 29 on the inner wall of the cylinder 22 can be changed according to specific circumstances. Referring to FIG. 3, each of the first ribs 27 098145209 in the present embodiment, the form number A0101, the sixth page, the total number of pages, and the 20th page of the 0982077271-0 201122786 are formed on one side thereof. The two ribs 290 correspondingly form a second resisting surface on the side thereof, wherein the first blocking surface 27 〇 of the pair of first and first ribs 27, 29 and the second blocking surface 29G are opposite in direction respectively On the opposite side of the first and second ribs η, the α-limit heat sink 1 转动 rotates in different directions of clockwise and counterclockwise. In addition, an arcuate guiding surface 292 is formed on the opposite side of each of the second ribs (9) and the second resisting surface 29〇, so that the end portion of the heat sink 14 is guided from the side when the heat sink 101b is rotated. The lead 292 slides over. The direction in which the second blocking surface 290 and the guiding surface 292 of the first rib 29 are disposed is related to the bending direction of the heat sink 14. For example, in the embodiment, the heat sink 14 is bent counterclockwise, and the guiding surface is For example, toward the curved surface of the heat sink 14, the direction from the second resisting surface 29 to the guiding surface 292 is also the same counterclockwise direction as the bending direction of the heat sink 14, so that the heat sink 14 is guided from the guiding surface. 292 slides over the second blocking surface 290 without turning. [0013] Please refer to FIG. 4 to FIG. 7 at the same time, when the heat dissipating device is installed, the fan 3〇 is placed on the fixing frame 20 and fastened; the fixing frame 20 is sleeved on the heat sink 10 to make the heat sink 10 A plurality of valleys are disposed in the fixed frame 2, and the limiting protrusions 25 on the inner side of the mounting brackets 20 are respectively received in the recesses 16 on the circumferential surface of the heat sink 10. The fixing frame 2 The first ribs 27 of the inner wall of the cymbal are simultaneously received in the recess 16 and adjacent to one side of the recess 16 , and the second ribs 29 of the inner wall of the fixing frame 20 are respectively located between the two adjacent heat sheets 14 . As shown in FIGS. 4 and 6, the heat sink 1 and the holder 2 are in an unlocked state; then, the heat sink 10 is rotated so as not to be locked with the holder 20 (shown in FIGS. 4 and 6). ) Rotate to the locked state, such as 098145209 Form No. A0101 Page 7 / Total 20 pages 0827772721-0 201122786 As shown in Figures 5 and 7, at this time, the recess 16 on the heat sink 10 is offset from the limit of the inside of the holder 20 The convex portion 25 is such that the top of the limiting convex portion 25 abuts against the bottom of the heat sink 14 of the heat sink 10 while the inner wall of the fixing frame 20 is The rib 27 is moved from the side of the recessed portion 16 to the position immediately adjacent to the other side thereof, and the end portion of the portion of the fin 14 adjacent to the second rib 29 is generated when the heat sink 10 is rotated. After the elastic bending, the second rib 29 is slid. [0014] It can be seen that the recessed portion 16 disposed on the circumferential surface of the heat sink 10 allows the limiting protrusion 25 on the inner side of the fixing frame 20 to pass through the heat sink 10 from top to bottom without deformation, and then rotates the heat sink 10 The fixed connection of the heat sink 10, the holder 20 and the fan 30 can be completed without the need to apply a large force to fasten the holder 20 to the heat sink 10. [0015] When the heat sink 10 rotates, the first rib 27 of the inner wall of the fixing frame 20 is correspondingly fixed from the one side of the recessed portion 16 of the heat sink 10 to the other side thereof, thereby being fixed. The rotation amplitude of the heat sink 10 has a certain early warning and limitation function, and at the same time, the heat sink 10 can be prevented from further rotating in one direction, such as a clockwise direction, during use; in addition, the second ridge 29 is sandwiched. Between two adjacent fins 14, and the second blocking surface 290 of the second rib 29 is opposite to the first blocking surface 270, the opposite direction of the heat sink 10 during use, such as counterclockwise, can be prevented. Rotation in the direction. It can be seen that the first rib 27 and the second rib 29 prevent the heat sink 10 from accidentally falling out of the holder 20 due to the rotation of the high speed running member such as the fan 30 during use. [0016] In addition, when the heat sink 10 rotates, the end portion of the corresponding portion of the fin 14 is elastically deformed and then slides over the corresponding second rib 29 so that the second rib 29 is always sandwiched. Between two adjacent heat sinks 14, and 098,145,209, Form No. A0101, Page 8 / Total 20 pages, 0827072721-0 201122786 Since the heat sink 14 is an aluminum sheet having low strength and good elasticity, it is not easy to mount when the heat sink 10 is rotated. Damage occurs, making the entire assembly process of the heat sink 10 and the mount 20 safe and reliable. [0017] Finally, the heat sink is placed on the electronic component 42 of the circuit board 40, and the heat sink is fixed to the electronic component by the fixing member 100 on the mounting post 28 of the mounting bracket 20 mating with the mounting hole 44 on the circuit board 40. 42. [0018] In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0019] FIG. 1 is a perspective assembled view of a heat sink mounted on an electronic component of a circuit board in accordance with an embodiment of the present invention. 2 is an exploded view of the heat sink of FIG. 1. 3 is an inverted enlarged view of the fan holder of FIG. 2. [0022] FIG. 4 is an inverted view of the heat sink and the mounting bracket in the unlocked state of FIG. 1. [0023] FIG. 5 is an inverted view of the heat sink and the mounting bracket in the locked state of FIG. 6 is a bottom view of the heat sink and the mounting bracket in the unlocked state of FIG. 4. 7 is a bottom view of the heat sink and the fixing frame in the locked state in FIG. 5. [Description of main component symbols] [0026] Heat sink 10 098145209 Form No. A0101 Page 9 / Total 20 pages 0982077271-0 201122786 [0027] Heat transfer column 12 [0028] Heat sink 14 [0029] Branch piece 140 [0030] 16 [0031] Fixing frame 20 [0032] Cylinder 22 [0033] Supporting projection 23 [0034] Venting hole 24 [0035] Limiting projection 25 [0036] Receiving plate 26 [0037] Fixing post 260 [0038] Buckle Sheet 262 [0039] Bucking portion 264 [0040] First rib 27 [0041] First blocking surface 270 [0042] Mounting foot 28 [0043] Mounting barrel 280 [0044] Second rib 29 [0045] Two blocking surfaces 290 098145209 Form No. A0101 Page 10 of 20 0982077271-0 201122786 [0046] [0049] [0051] [0054] [0054] Guide Face 292 Fan 3 0 Sector 3 2 Projection 34 Perforation 340 Board 40 Electronics 42 Mounting Holes 44 Mounting 100 Ο
098145209 表單編號Α0101 第11頁/共20頁 0982077271-0098145209 Form NumberΑ0101 Page 11 of 20 0982077271-0