TWI390389B - Heat dissipation device - Google Patents

Description

Heat sink

The invention relates to a heat dissipating device, in particular to a heat dissipating device for dissipating heat of electronic components.

Electronic components such as a central processing unit generate a large amount of heat during operation. In order to prevent the electronic components from being unstable due to heat build-up, the electronic component usually needs to be equipped with a heat sink to assist in heat dissipation.

The conventional heat dissipating device comprises a plurality of heat sinks arranged in parallel and equidistantly spaced apart from each other, a substrate attached to the electronic component, a heat pipe connecting the substrate and the heat sink, and a fan mounted above the heat sink. The heat sink is spaced from the substrate. The heat pipe has an evaporation section received in the substrate, a condensation section penetrating the heat sink, and a connection section connecting the evaporation section and the condensation section. The condensation section supports and secures the fins. When the heat sink is operated for a period of time, the heat pipe is bent toward the opposite side of the connecting section due to the pressure of the fan and the frequent vibration and the pressure of the heat sink, thereby affecting the heat dissipation efficiency of the heat sink.

A heat dissipating device for dissipating heat to an electronic component fixed on a circuit board, the heat dissipating device comprising a substrate, a heat sink group disposed above the substrate and spaced apart from the substrate, and the first connecting the substrate and the heat sink group a heat pipe and a second heat pipe and a fan disposed above the heat sink group, the first heat pipe and the second heat pipe respectively comprise an evaporation section and a condensation section, wherein the evaporation sections of the first and second heat pipes are disposed in the substrate The first and second heat The condensation section of the tube is respectively disposed in the opposite heat sink group from the opposite direction to support the heat sink group.

Compared with the prior art, the heat pipe of the heat dissipating device of the present invention penetrates and supports the heat sink group from opposite sides of the heat sink group, thereby preventing the heat pipe from being bent to one side after being pressed, thereby improving the strength of the heat sink device, thereby Guarantee the heat dissipation efficiency of the heat sink.

As shown in FIG. 1 and FIG. 2, the heat dissipating device of the present invention is used for dissipating heat from an electronic component (not shown) fixed on a circuit board (not shown). The heat dissipating device comprises a substrate 20 in contact with the electronic component, a heat sink group disposed on the substrate 20 (not labeled), a heat pipe group 50 connecting the substrate 20 and the heat sink group, and a fan mounted above the heat sink group. 70. The fan assembly 60 connecting the fan 70 and the heat sink group and the two mounting brackets 10 connected to the substrate 20 to fix the substrate 20 on the circuit board, wherein the heat sink group includes the first heat sink group 30 and the second Heat sink set 40.

The heat pipe group 50 includes two first heat pipes 51 disposed on one side of the substrate 20 and two second heat pipes 53 disposed on the other side of the substrate 20. The first and second heat pipes 51 and 53 have the same structure and are U-shaped and each of the first heat pipes 51 is opposite to the U-shaped opening of each of the second heat pipes 53.

Each of the first heat pipes 51 includes an evaporation section 511, a condensation section 513 parallel to and away from the evaporation section 511, and a connection section 515 connecting the evaporation section 511 and the condensation section 513. The evaporation section 511 is parallel to the condensation section 513 and shorter than the condensation section 513. The evaporation sections 511 of the first heat pipe 51 are arranged side by side in parallel with each other in the substrate 20, and the condensation section 513 of the first heat pipe 51 is inserted into the first heat sink group 30. The distance between the two condensation sections 513 is greater than the two evaporation sections 511. The distance.

Each of the second heat pipes 53 includes an evaporation section 531, a condensation section 533 parallel to and away from the evaporation section 531, and a connection section 535 connecting the evaporation section 531 and the condensation section 533. The evaporation section 531 is parallel to the condensation section 533 and shorter than the condensation section 533. The evaporation sections 531 of the second heat pipes 53 are arranged side by side in parallel with each other in the substrate 20. The condensation sections 533 of the second heat pipes 53 are inserted into the second heat sink 40 group, and the distance between the two condensation sections 533 is equal to the two evaporation sections 531. The distance.

The first fin group 30 includes a plurality of fins 31 that are parallel to each other and equally spaced. The bottom of each fin 31 is substantially flush such that the first fin set 30 has a bottom plane 311. The top end of each of the fins 31 extends obliquely from the opposite sides toward the middle portion and the middle portion thereof is recessed downward so that the first fin group 30 has an arcuate recess portion 313. Two opposite holes 315 are punched into opposite ends of the recessed portion 313 of the first fin group 30. The two condensation sections 513 of the first heat pipe 51 respectively pass through the two through holes 315 and are welded and fixed to the first fin group 30. Two mounting holes 317 are respectively disposed above the opposite ends of the first fin group 30 and the two through holes 315 for fixing the fan holder 60.

The second fin group 40 includes a plurality of fins 41 arranged parallel to each other and equally spaced. The top of each fin 41 is substantially flush such that the second fin set 40 has a flat top surface 411. The bottom end of each of the fins 41 extends obliquely from the opposite sides toward the middle portion so that the second fin group 40 has an arcuate projection 413. The raised portion 413 is complementary in shape to the recessed portion 30 of the first fin set 30 and is received in the recessed portion 313 of the first fin set 30 but is not in contact with the recessed portion 313, that is, the raised portion 413 and the recessed portion A curved gap is formed between the portions 313 (not shown). Two opposite holes 415 are punched into opposite ends of the second fin group 40. The two condensation pipes 533 of the second heat pipe 53 respectively pass through the two through holes 415 and are welded and fixed to the second heat sink group 40. Second heat sink The two-way through hole 415 is opposite to the punching direction of the two through holes 315 of the first heat sink group 30. A mounting hole 417 is defined in the middle of the second heat sink group 40 for fixing the fan holder 60.

The substrate 20 is located below the first heat sink group 30 and spaced apart from the first heat sink group 30. The substrate 20 has a rectangular shape and is made of a metal having good thermal conductivity such as copper, aluminum or the like. The bottom of the substrate 20 is provided with four recessed grooves 27 which are spaced apart from each other. The middle two recesses 27 receive the two evaporation sections 511 of the first heat pipe 51, and the recesses 27 of the two sides accommodate the two evaporation sections 531 of the second heat pipe 53. A mounting portion 25 is formed at each end of the substrate 20. The mounting portion 25 is for engaging with a screw to fix the mounting bracket 10 to the base plate 20. A plurality of fins 29 extend vertically in the direction above the substrate 20 for dissipating heat absorbed by the substrate 20 into the air.

Each of the fan holders 60 is a bent metal sheet body, and includes a concave arc-shaped mounting portion 61 and a connecting portion 63 extending perpendicularly from the mounting portion 61. A mounting hole 611 is defined in each of the opposite ends of the mounting portion 61 for engaging the screw to fix the fan 70 to the fan holder 60. A three-part triangular connecting piece 631 is protruded downward from the connecting portion 63, and a protruding post 6311 is protruded from a middle portion of each connecting piece 631. The protrusions 6311 are disposed corresponding to the mounting holes 317 and 417 of the first and second fin groups 30 and 40 and penetrate the mounting holes 317 and 417 to fix the two fan holders 60 to the first and second fin groups. 30, 40 ends, therefore, the first and second fin groups 30, 40 are connected together.

The fan 70 has two rectangular frame frames 71 and 73 opposed to each other, and a mounting hole 731 corresponding to the mounting hole 611 of the fan holder 60 is formed at four corners of the fan frame 73 at the lower end. The screw (not shown) passes through the mounting hole 731 of the fan 70 The fan 70 is fixed to the fan holder 60 in cooperation with the mounting hole 611 of the fan holder 60.

Each of the mounting brackets 10 includes a mounting plate 11 corresponding to the mounting portion 25 of the base plate 20 and two positioning legs 13 extending from both sides of the mounting plate 11. Two screws (not shown) pass through the mounting plate 11 of a mounting frame 10 and cooperate with the mounting plate 25 of the substrate 20 to position the mounting bracket 10 on the substrate 20. The two fixing members 15 pass through the two positioning legs 13 of a mounting bracket 10 and cooperate with the circuit board to position the mounting bracket 10 on the circuit board.

Please refer to FIG. 3 and FIG. 4 at the same time. In the assembly, the condensation section 513 of the first heat pipe 51 is first fixed in the through hole 315 of the first heat sink group 30, and then the evaporation section 511 is fixed on the substrate 20 In the trench 27, the connecting sections 515 of the two first heat pipes 51 are disposed on the same side of the substrate 10; meanwhile, the condensation sections 533 of the second heat pipes 53 are fixed in the through holes 415 of the second heat sink group 40, The evaporation section 531 is fixed in the groove 27 on both sides of the substrate 20, wherein the connection section 535 of the two second heat pipes 53 is placed on the other side of the substrate 10. At this time, the U-shaped opening directions of the first and second heat pipes 51, 53 are opposite, that is, the condensing sections 513, 533 of the first and second heat pipes 51, 53 are oppositely disposed, and the first and second heat pipes 51, 53 are opposite. The evaporation sections 511, 531 are coplanar with the bottom surface of the projection 21 of the substrate 20 and are in contact with the electronic component. The condensation section 513 and the connection section 515 of the first heat pipe 51 support the entire first heat sink group 30, and the condensation section 533 and the connection section 535 of the second heat pipe 53 support the entire second heat sink group 40. The two evaporation sections 511 of the two first heat pipes 51 are located between the two evaporation sections 531 of the second heat pipes 53 , and the two condensation sections 533 of the two second heat pipes 53 are located between the two condensation sections 513 of the two first heat pipes 51 . . The protrusion 6311 of the two fan holder 60 penetrates into the mounting holes of the first and second fin groups 30 and 40. The first and second fin groups 30, 40 are joined together by 317, 417. The four screws pass through the mounting holes 731 of the fan 70 and cooperate with the mounting holes 611 of the fan holder 60 to fix the fan 70 to the fan holder 60. Finally, the two mounting brackets 10 are locked on the mounting portion 25 of the base plate 20. The fixing member 15 passes through the positioning legs 13 of the mounting bracket 10 and cooperates with the circuit board to lock the mounting bracket 10 on the circuit board.

In use, the evaporation section 511 of the first heat pipe 51 absorbs most of the heat of the electronic component and transmits the absorbed heat to the opposite sides of the first heat sink group 30 above the substrate 20 through the condensation section 513. Moreover, since the high wind pressure regions on both sides of the fan 70 correspond to the first heat pipe 51 of the first heat sink group 30, the airflow generated by the fan 70 flows through the first heat sink group and then the first heat sink group 30 The heat is taken away to ensure good heat dissipation of the heat sink.

In the heat dissipating device of the present invention, the entire heat dissipating device has a symmetrical structure, and the condensation sections 513 and 533 of the first and second heat pipes 51 and 53 are respectively disposed from opposite sides of the fin group, and the first and second heat pipes 51 are respectively disposed. The connecting sections 515 and 535 of the 53 respectively support the opposite sides of the heat sink group, and can improve the strength of the heat dissipating device, and prevent the first heat pipe 51 or the second heat pipe 53 from causing the first heat pipe 51 due to the pressure and frequent vibration of the fan 70. Or the second heat pipe 53 is bent toward the opposite side of the connecting section 515 or the connecting section 535 to ensure the heat dissipation performance of the heat sink.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application.

10‧‧‧ Mounting frame

11‧‧‧Installation board

13‧‧‧ positioning feet

15‧‧‧Fixed parts

20‧‧‧Substrate

25, 61‧‧‧ Installation Department

27‧‧‧ trench

29, 31, 41‧‧ ‧ heat sink

30‧‧‧First heat sink set

311‧‧‧ bottom plane

313‧‧‧Depression

315, 415‧‧‧through holes

317, 417, 611, 731‧‧‧ mounting holes

40‧‧‧Second heat sink

411‧‧‧ top surface

413‧‧‧ raised parts

50‧‧‧Heat management group

51‧‧‧First heat pipe

511, 531‧‧Evaporation section

513, 533‧‧ ‧ Condensation section

515, 535‧‧‧ connection segments

53‧‧‧second heat pipe

63‧‧‧Connecting Department

60‧‧‧Fan holder

631‧‧‧Connecting piece

6311‧‧‧Bump

70‧‧‧fan

71, 73‧‧‧ fan frame

1 is an exploded perspective view of a heat sink of the present invention.

Figure 2 is an inverted view of Figure 1.

FIG. 3 is an assembled view of the heat dissipating device of FIG. 1 after the fan is removed.

4 is a front view of the heat dissipating device of FIG. 1 assembled.

10‧‧‧ Mounting frame

20‧‧‧Substrate

30‧‧‧First heat sink set

40‧‧‧Second heat sink

51‧‧‧First heat pipe

53‧‧‧second heat pipe

70‧‧‧fan

Claims (7)

A heat dissipating device for dissipating heat to an electronic component fixed on a circuit board, the heat dissipating device comprising a substrate, a heat sink group disposed above the substrate and spaced apart from the substrate, and the first connecting the substrate and the heat sink group The heat pipe and the second heat pipe and the fan disposed above the heat sink group are improved in that the first and second heat pipes respectively comprise an evaporation section and a condensation section, and the evaporation sections of the first and second heat pipes are disposed In the substrate, the condensation sections of the first and second heat pipes are respectively disposed in the opposite heat sink group from the opposite direction for supporting the heat sink group, wherein the heat sink group includes the first heat sink group and the first heat sink group a second heat sink group connected to the heat sink group, the condensation section of the first heat pipe pierces and supports the first heat sink group, and the condensation section of the second heat pipe penetrates and supports the second heat sink group, wherein the first heat sink A concave portion is formed in a middle portion of the top end of the group, and the second heat sink group is received in the concave portion. The heat dissipating device of claim 1, wherein the first and second heat pipes further comprise a connecting section connecting one of the evaporation section and the condensation section, wherein the connecting sections of the first and second heat pipes are located in the heat sink group Relative sides. The heat dissipating device of claim 2, wherein the first and second heat pipes are U-shaped and the U-shaped opening directions of the first and second heat pipes are opposite. The heat sink of claim 1, further comprising a fan holder that connects the two fin sets and fixes the fan. The heat dissipation device of claim 1, wherein the number of the first and second heat pipes is two, and the two evaporation segments of the first heat pipe are located between two evaporation segments of the second heat pipe, the second The second condensation section of the heat pipe is located between the two condensation sections of the first heat pipe. The heat sink of claim 5, wherein the distance between the two condensation sections of the second heat pipe is equal to the distance between the two evaporation sections. The heat dissipating device of claim 6, wherein each of the first and second heat pipes further comprises a connecting portion connecting the evaporation section and the condensation section, wherein the connecting portion of the first heat pipe is located on one side of the heat sink group, and the second The connecting sections of the heat pipes are located on the opposite side of the heat sink group.