JP3081986U - Heat dissipation structure of central processing unit - Google Patents

Abstract

(57) [Problem] To provide a heat dissipation structure of a central processing unit having an enhanced heat dissipation effect. SOLUTION: The heat dissipation structure of the central processing unit includes a heat transfer base 11, a side wall 14 provided at an end on the heat transfer base 11, and a plurality of side walls provided between the side walls 14. A radiation fin 12; The radiating fins 14 are formed of a metal sheet bent in a U-shape, and the radiating fins 12 are welded to the heat transfer base 11. The heat energy absorbed by the heat transfer base 11 is transmitted to the radiating fins 12 and radiated.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a heat dissipation structure of a central processing unit, and more particularly, to a heat dissipation structure of a central processing unit having a large heat transfer area and capable of effectively dissipating heat.

[0002]

[Prior art]

 In recent years, with the progress of science and technology, facilities and components related to personal computers have been further developed. Related products include, for example, hard disks, interface cards, and central processing units. In these, the processing speed for information is gradually increasing with the increase in the amount of information.

[0005] However, the operating temperature of equipment and integrated electric circuit elements tends to increase inside personal computers due to the improvement in information processing speed. For example, even chips mounted on interface cards generate high heat when operating. Therefore, if the heat energy is not properly radiated, it may not operate properly. It can also reduce execution speed and adversely affect service life. Therefore, it is common general knowledge to provide a heat dissipation structure for a heat source (that is, a chip).

A general heat dissipation structure usually includes a fan and a heat dissipation fin. The heat dissipating structure is executed by the flow of air by a fan disposed above the heat dissipating fins, and dissipates heat energy by convection and radiation of the air. Incidentally, the heat energy that can be radiated increases in proportion to the area of the radiating fin.

[0005] A typical conventional heat radiation fin is manufactured by aluminum casting or die casting. These radiating fins generally lack a heat radiating area. Radiation fins made of cast aluminum have considerable thickness and spacing during molding of the fins due to limitations in production conditions. For this reason, the heat radiation area becomes insufficient, and the airflow resistance is large, and the flow speed of the air becomes slow. Therefore, heat cannot be effectively dissipated, and a favorable heat dissipating effect cannot be obtained. Similarly, heat-dissipating fins of die-casting have low airflow resistance, but also tend to lack heat-dissipating area. Therefore, it still does not have a favorable heat dissipation effect, and die casting is costly and has economic disadvantages.

As shown in FIG. 1, the heat dissipating piece A has a contact base A1. A plurality of sets of piece-like fins A2 are formed on the contact base A1, and a convection tank A3 forming a convection space is formed between the two fins A2.

[0007]

[Problems to be solved by the invention]

 When the heat radiating piece A is used for a long time, the heat radiating effect tends to be unable to be obtained effectively. The cause is that the area of the radiation fin A2 itself is insufficient. Therefore, even if one set of heat-dissipating fans is provided, the heat-dissipating effect is limited.

The present invention has been made to solve the above-described problem, and has as its object to provide a heat dissipation structure of a central processing unit having an enhanced heat dissipation effect.

It is another object of the present invention to provide a heat dissipation structure of a central processing unit having a fan engaging portion.

[0010]

[Means for Solving the Problems]

 In order to solve the above problems, the heat dissipation structure of the central processing unit of the present invention includes a heat transfer base, side walls provided on the heat transfer base, and a plurality of side walls provided between the side walls. These radiating fins are formed of a metal thin plate bent in a U-shape, and the radiating fins are welded to the heat transfer base, and the heat energy absorbed by the heat transfer base is: It is characterized in that it is conducted by the radiation fins and dissipated.

[0011] Further, the heat transfer base and the radiation fin are made of a heat conductive material.

[0012] Furthermore, a fan arrangement portion in which a fan is arranged is formed on both side walls of the heat transfer base and an upper edge of the radiation fin, and a predetermined number of fans are arranged on both side walls of the heat transfer base. And an engaging portion with which the engaging member is engaged is formed.

[0013]

[Embodiment of the invention]

 Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

As shown in FIG. 2, the heat radiation piece 1 has a plurality of sets of heat radiation fins 12 and a heat transfer base 11. The heat transfer base 11 is made of, for example, a copper material or an aluminum material having good heat conductivity. At the end of the heat transfer base 11, opposed side walls 14 are provided. A predetermined number of engaging portions 141 are formed on these side walls 14.

The heat radiation fins 12 are formed of a thin metal plate, and the thin metal plate is bent into a U-shape. The radiation fins 12 are erected and welded to the heat transfer base 11. As the welding technique at this time, conventional TIG welding or MIG welding may be adopted, but laser welding with high precision, low influence of heat energy, low deformation and low cost may be adopted. These heat dissipating fins 12 are all welded to the heat transfer base 11, and the area of the heat dissipating fins 12 is increased so as to produce a favorable heat transfer effect.

Therefore, in the present embodiment, the thickness of the radiation fins 12 is significantly reduced. Further, the gap between the radiating fins 12 and the width of the convection tank 13 are respectively reduced, and the number of the radiating fins 12 in the radiating piece 1 is greatly increased. For this reason, the area of the heat radiation fins 12 is enlarged, and the heat radiation effect can be improved. Further, the heat generated from the central processing unit can be quickly released by the fan 3 disposed on the heat radiation piece 1.

Incidentally, these side walls 14 are formed slightly higher than the radiation fins 12. A fan arrangement portion 15 is formed in a space between the side walls 14 and the radiation fins 12, and a convection tank 13 is formed between the radiation fins 12.

As shown in FIG. 3, the heat radiating piece 1 is arranged in the central processing unit 2, the fan 3 is housed in the fan arranging portion 15, and the engaging portion (not shown) of the fan 3 is Engage with 141.

Although the embodiments have been specifically described with reference to the drawings, the present invention is not limited to the above-described embodiments, and is carried out without departing from the gist thereof. Including all implementations.

Therefore, the following can be said about the heat dissipation structure of the central processing unit of the present invention.

The set of radiation fins is formed by bending a thin metal plate. A plurality of heat dissipating fins are adjacent to each other, and a height difference is provided between the upper edges of the heat dissipating fins of the plural sets and the upper edges of both side walls of the heat transfer base to form a fan arrangement part, A plurality of engaging portions for fixing the fan to the wall are formed. The set of radiating fins is fixed upright on the heat transfer base by welding, and the set of radiating fins and the heat transfer base are joined to each other, and a uniform heat dissipation effect can be exhibited. The heat radiation piece with high effect is formed.

[0022]

[Effect of the invention]

 As described above, according to the present invention, it is possible to provide a heat dissipation structure of a central processing unit having an enhanced heat dissipation effect.

Further, according to the present invention, it is possible to provide a heat dissipation structure of a central processing unit having an engagement portion of a fan.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the structure of a conventional heat radiation piece.

FIG. 2 is a schematic perspective view showing the structure of a heat radiation piece according to the embodiment.

FIG. 3 is a schematic perspective view showing a use state of the embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Heat radiation piece, 2 ... Central processing unit, 3 ... Fan, 11
... heat conduction base, 12 ... radiation fins, 13 ... convection tank, 14
... side wall, 15 ... fan arrangement part, 141 ... engagement part

Claims (3)

[Utility model registration claims] 1. A heat transfer base (11), a side wall (14) provided on the heat transfer base (11), and a plurality of radiating fins provided between the side walls (14). 1
2), and these radiating fins (14) are formed of a metal thin plate bent into a U-shape, and the radiating fins (12)
Is welded to the heat transfer base (11), and the heat energy absorbed by the heat transfer base (11) is
A heat radiating structure for the central processing unit, wherein the heat is radiated by being transmitted to the heat radiating fins (12). 2. The heat radiating structure of a central processing unit according to claim 1, wherein said heat transfer base and said heat radiating fins are made of a heat conductive material. 3. Both side walls (1) of said heat transfer base (11).
A fan arrangement part (15) in which a fan (3) is arranged is formed at the upper edge of the heat transfer fin (4) and the heat radiation fin (12). The heat dissipation structure of a central processing unit according to claim 1, wherein an engagement portion (141) with which a predetermined number of fans (3) are engaged is formed.