JP4998548B2 - Heat dissipation component - Google Patents

Heat dissipation component Download PDF

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JP4998548B2
JP4998548B2 JP2009501070A JP2009501070A JP4998548B2 JP 4998548 B2 JP4998548 B2 JP 4998548B2 JP 2009501070 A JP2009501070 A JP 2009501070A JP 2009501070 A JP2009501070 A JP 2009501070A JP 4998548 B2 JP4998548 B2 JP 4998548B2
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heat
radiating
fins
air
fan
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JPWO2008105067A1 (en
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英之 藤川
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Fujitsu Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4081Compliant clamping elements not primarily serving heat-conduction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

本発明は、隙間を空けて配列された複数枚の放熱フィンを備え、放熱フィンから、その放熱フィンの隙間を流れる空気に放熱する放熱部品に関する。   The present invention relates to a heat dissipating component that includes a plurality of heat dissipating fins arranged with a gap therebetween and radiates heat from the heat dissipating fins to the air flowing through the gaps of the heat dissipating fins.

近年の電子機器の益々の高機能化に伴い、電子機器内部に高い演算能力を有する大規模LSIが搭載され、その益々の演算能力の向上に伴って発熱量が益々増大し、その大規模LSIの放熱を担う放熱部品にも益々の放熱性能の高さが要求されてきている。この放熱部品には通常、隙間を空けて多数枚配列された放熱フィンが備えられており、その放熱フィンの隙間に空気を流して、その放熱フィンから空気に熱を伝え、温度が上昇した空気を機器外部に排出するという放熱構造が採用されている。特許文献1,2には、より高い放熱性能を実現するために放熱フィンの形状や配列が工夫された構造が示されている。
特開平8−88301号公報 特開平11−103183号公報
As electronic devices have become more sophisticated in recent years, large-scale LSIs with high computing power have been installed inside electronic devices, and as the computing power has further improved, the amount of heat generation has increased. Higher heat dissipation performance is also required for heat dissipation components responsible for heat dissipation. This heat dissipating part is usually provided with a large number of heat dissipating fins arranged with a gap, and air is passed through the heat dissipating fins to transfer heat from the heat dissipating fins to the air. The heat dissipation structure is used to discharge the air to the outside of the equipment. Patent Documents 1 and 2 show structures in which the shape and arrangement of the radiating fins are devised in order to realize higher heat radiating performance.
JP-A-8-88301 JP-A-11-103183

ここで、上記のような多数枚配列された放熱フィンを備えた放熱部品における1つの大きな問題は、その放熱部品を搭載した電子機器を長期間使っているうちに、その放熱フィンの、空気流入側端縁に塵埃が付着してしまい、空気の流れが悪くなって放熱性能が劣化し、その結果、例えば大規模LSI等の放熱対象の発熱部品が冷却されにくくなって高熱となり、その発熱部品の誤動作や劣化を引き起こし、ひいては、その発熱部品の破損、電子機器の動作停止を引き起こすおそれがあるという点である。   Here, one big problem with the heat dissipating component having a plurality of heat dissipating fins arranged as described above is that the air inflow of the heat dissipating fins while the electronic device equipped with the heat dissipating component is used for a long period of time. Dust adheres to the side edges, air flow becomes worse and heat dissipation performance deteriorates. As a result, for example, large-scale LSI and other heat-emitting components that are subject to heat dissipation become difficult to cool, resulting in high heat. This may cause malfunction or deterioration of the electronic device, which may cause damage to the heat-generating components and stop the operation of the electronic device.

ここで、放熱フィンへの塵埃の付着を低減するには、放熱フィンどうしの間隔を広げることや、風量を下げることなどが考えられるが、いずれも放熱性能の低下を来たすため、発熱部品の発熱量の増大に伴って放熱性能の益々の向上が求められている中ではこのような対策は好ましくない。   Here, in order to reduce the adhesion of dust to the radiating fins, it is conceivable to widen the gap between the radiating fins and reduce the air volume. Such countermeasures are not preferable in a situation where an increase in heat dissipation performance is required as the amount increases.

本発明は、上記事情に鑑み、放熱性能を維持しつつ塵埃の付着の低減化が図られた放熱部品を提供することを目的とする。   In view of the above circumstances, an object of the present invention is to provide a heat dissipating component in which dust adhesion is reduced while maintaining heat dissipating performance.

上記目的を達成する本発明の放熱部品は、隙間を空けて配列された複数枚の放熱フィンを備え、放熱フィンから、その放熱フィンの隙間を流れる空気に熱を伝える放熱部品であって、放熱フィンの空気流入側端縁が、放熱フィンの配列方向に交互に又は循環的に異なる部分が切り欠かれた切欠形状を有することを特徴とする。   The heat dissipating part of the present invention that achieves the above object is a heat dissipating part that includes a plurality of heat dissipating fins arranged with a gap therebetween, and transfers heat from the heat dissipating fins to the air flowing through the gaps of the heat dissipating fins. The air inflow side edge of the fin has a notch shape in which different or circularly different portions are notched in the arrangement direction of the heat dissipating fins.

本発明の放熱部品は、放熱フィンの空気流入側端縁に上記の切欠形状を有するため、空気流入側端縁の空気流入開口が実質的に広がり、放熱性能を維持しつつ塵埃の付着が低減される。   Since the heat dissipating part of the present invention has the above-mentioned notch shape at the air inflow side edge of the heat dissipating fin, the air inflow opening at the air inflow side edge is substantially widened, and the adhesion of dust is reduced while maintaining the heat dissipating performance. Is done.

ここで、本発明の放熱部品において、放熱フィンの空気流入側端縁が上記切欠形状を有することに加え、さらに放熱フィンの空気流出側端縁が上記切欠形状を有することが好ましい。   Here, in the heat dissipating part of the present invention, it is preferable that the air inflow side edge of the heat dissipating fin has the notch shape, and further, the air outflow side edge of the heat dissipating fin has the notch shape.

放熱フィンの空気流出側端縁が上記切欠形状を有すると、その分放熱フィンの隙間を流れる空気の抵抗が減って空気の流れが円滑化され、放熱性能の向上に役立つ。   If the air outflow side edge of the radiating fin has the above-mentioned notch shape, the resistance of the air flowing through the gap between the radiating fins is reduced correspondingly, and the air flow is smoothed, which helps to improve the radiating performance.

また、本発明の放熱部品において、放熱フィンの、上記切欠形状を有する端縁を、その放熱フィンの配列方向に見たときに、隣接する放熱フィンの突出した部分どうしの間に隙間が形成されていることが好ましい。   Further, in the heat dissipating component of the present invention, a gap is formed between the protruding portions of adjacent heat dissipating fins when the edge of the heat dissipating fin is viewed in the arrangement direction of the heat dissipating fins. It is preferable.

この場合、隣接する放熱フィンどうしの空気流入側端縁の隙間が等価的にさらに広がり、塵埃の付着の一層の低減化が図られる。   In this case, the gap between the air inflow side edges of the adjacent radiating fins is further expanded equivalently, and the dust adhesion can be further reduced.

また、本発明の放熱部品において、冷却対象の発熱部品から吸熱する吸熱板を備え、放熱フィンがその吸熱板上に立設していることが好ましい。   Moreover, the heat radiating component of the present invention preferably includes a heat absorbing plate that absorbs heat from the heat generating component to be cooled, and the radiating fins are erected on the heat absorbing plate.

この構造を採用し、吸熱板が発熱部品から熱を吸収して放熱フィンに伝え、放熱フィンから空気に伝熱することによりその発熱部品からの放熱が行なわれる。   Adopting this structure, the heat absorbing plate absorbs heat from the heat generating component and transmits it to the heat radiating fin, and heat is transferred from the heat radiating fin to the air, so that heat is radiated from the heat generating component.

ここで、上記の吸熱板を備えた構造において、その吸熱板に接するとともに放熱フィンを貫通して吸熱板の熱を放熱フィンに伝える伝熱部材をさらに備えることが好ましい。   Here, it is preferable that the structure including the heat absorbing plate further includes a heat transfer member that contacts the heat absorbing plate and transmits heat of the heat absorbing plate to the heat radiating fin through the heat radiating fin.

この伝熱部材を備えると、吸熱板の熱が一層効率的に放熱フィンに伝えられる。   When this heat transfer member is provided, the heat of the heat absorption plate is more efficiently transmitted to the radiation fins.

さらに、本発明の放熱部品において、放熱フィンの隙間に空気流を形成するファンを備えることが好ましい。   Furthermore, in the heat radiating component of the present invention, it is preferable to include a fan that forms an air flow in the gap between the heat radiating fins.

ファンを一体的に備えることにより、ファンの取付構造を別途設計したりファンを別途用意する必要がなくなり、好都合である。   By providing the fan integrally, there is no need to separately design a fan mounting structure or to prepare a fan separately, which is convenient.

その場合に、そのファンは、放熱フィンの隙間に空気を送り込むファンであってもよく、あるいは、そのファンは、放熱フィンの隙間から空気を送り出すファンであってもよい。   In that case, the fan may be a fan that sends air into the gap between the radiating fins, or the fan may be a fan that sends out air through the gap between the radiating fins.

以上説明したように、本発明によれば、放熱性能が維持され、かつ塵埃の付着が低減化される。   As described above, according to the present invention, the heat dissipation performance is maintained and the adhesion of dust is reduced.

本発明の第1実施形態としての放熱部品の斜視図である。It is a perspective view of the thermal radiation component as 1st Embodiment of this invention. 図1に示す放熱部品の上面図である。FIG. 2 is a top view of the heat dissipation component shown in FIG. 1. 図1に示す放熱部品の正面図である。It is a front view of the heat radiating component shown in FIG. 図1に示す放熱部品の側面図である。It is a side view of the heat radiating component shown in FIG. 図1に示す円R1の部分の拡大図である。FIG. 2 is an enlarged view of a portion of a circle R1 shown in FIG. 図3に示す円R2の部分の拡大図である。FIG. 4 is an enlarged view of a portion of a circle R2 shown in FIG. 本発明の第2実施形態としての放熱部品の斜視図である。It is a perspective view of the thermal radiation component as 2nd Embodiment of this invention. 図7に示す放熱部品の側面図である。It is a side view of the thermal radiation component shown in FIG. 図8に示す円R3の部分の拡大図である。FIG. 9 is an enlarged view of a portion of a circle R3 shown in FIG. 図7に示す放熱部品を構成する吸熱板の概略斜視図である。It is a schematic perspective view of the heat sink plate which comprises the heat radiating component shown in FIG. 図7に示す放熱部品を構成するヒートパイプの形状を示す概要図である。It is a schematic diagram which shows the shape of the heat pipe which comprises the thermal radiation component shown in FIG.

以下、本発明の実施形態について説明する。   Hereinafter, embodiments of the present invention will be described.

図1は、本発明の第1実施形態としての放熱部品の斜視図、図2は、図1に示す放熱部品の上面図、図3は、図1に示す放熱部品の正面図、図4は、図1に示す放熱部品の側面図である。   FIG. 1 is a perspective view of a heat dissipation component as a first embodiment of the present invention, FIG. 2 is a top view of the heat dissipation component shown in FIG. 1, FIG. 3 is a front view of the heat dissipation component shown in FIG. FIG. 2 is a side view of the heat dissipation component shown in FIG. 1.

また、図5は、図1に示す円R1の部分の拡大図、図6は、図3に示す円R2の部分の拡大図である。   5 is an enlarged view of a portion of a circle R1 shown in FIG. 1, and FIG. 6 is an enlarged view of a portion of a circle R2 shown in FIG.

この放熱部品10は、吸熱板11と、隙間を空けて配列された多数枚の放熱フィン12とから構成されている。吸熱板11は、伝熱効率の高い金属、例えば銅などで作られており、その下面が発熱部品(図示せず)に当てがわれてその発熱部品から熱を吸収する役割りと、多数枚の放熱フィン12がかしめられてそれら多数枚の放熱フィン12を保持するとともにそれらの放熱フィン12に熱を伝える役割りとを担っている。放熱フィン12は、例えばアルミニウムや銅等、これも伝熱効率の高い材料で構成されている。発熱部品から吸熱板11に伝えられた熱はさらに放熱フィンに伝えられ、放熱フィン12の隙間を流れる空気に伝えられる。熱を吸収して高温になった空気は、発熱部品や放熱部品10が内蔵された電子機器等の外部に排出される。   The heat radiating component 10 includes a heat absorbing plate 11 and a plurality of heat radiating fins 12 arranged with a gap therebetween. The heat absorbing plate 11 is made of a metal having high heat transfer efficiency, for example, copper, and its lower surface is applied to a heat generating component (not shown) to absorb heat from the heat generating component. The heat radiating fins 12 are caulked to hold the large number of heat radiating fins 12 and to transfer heat to the heat radiating fins 12. The heat radiating fins 12 are made of a material having high heat transfer efficiency, such as aluminum and copper. The heat transmitted from the heat generating component to the heat absorbing plate 11 is further transmitted to the heat radiating fins and is transmitted to the air flowing through the gaps of the heat radiating fins 12. The air that has been heated to a high temperature is discharged to the outside of an electronic device or the like in which the heat generating component or the heat dissipation component 10 is built.

ここで、この放熱部品10を構成する多数枚の放熱フィン12の上端縁と両側の側端縁には図5に拡大して示すような切欠形状が形成されている。すなわち、1枚1枚の放熱フィンは、その端縁が凹凸を繰り返すように切り欠かれた形状を有し、かつ、ここに示す例では、隣接する放熱フィンどうしで凸部12a,12bが重ならずに、かつ図6に示すように凸部12a,12bどうしの間に隙間g,hが形成されるように、交互に異なる位置に凸部が形成されている。   Here, the notch shape which expands and shows in FIG. 5 is formed in the upper end edge of the many radiation fin 12 which comprises this thermal radiation component 10, and the side edge of both sides. That is, each of the radiating fins has a shape in which the edge is notched so as to repeat the unevenness, and in the example shown here, the protrusions 12a and 12b are overlapped by adjacent radiating fins. In addition, as shown in FIG. 6, the convex portions are alternately formed at different positions so that gaps g and h are formed between the convex portions 12a and 12b.

このため、放熱フィン12の隙間への空気流入端縁および放熱フィン12の隙間からの空気流出端縁の実質的な開口(図5に示す1枚おきの放熱フィンどうしの間隔dや隣接する放熱フィンの凸部どうしの間隔e)が広く形成され、空気流入端縁への塵埃の付着が低減化され、かつ放熱フィンの隙間を通る空気流の抵抗が低減されて空気流が一層スムーズに流れるため、この点も塵埃の付着防止に役立ち、さらに放熱性能の向上にもつながっている。   For this reason, the substantial opening of the air inflow end edge to the gap of the radiating fin 12 and the air outflow edge from the gap of the radiating fin 12 (the distance d between the radiating fins shown in FIG. The gap e) between the fin protrusions is formed wide, dust adhesion to the air inflow edge is reduced, and the resistance of the air flow through the gap of the heat radiating fin is reduced, so that the air flow flows more smoothly. Therefore, this point is also useful for preventing the adhesion of dust and further improving the heat dissipation performance.

尚、ここに示す例では、放熱フィンの配列方向に見たときに、図6に示すように凸部どうしの開口隙間g,hが形成されており、好ましい態様であるが、これらの隙間g,hが存在しないように、例えば凸部の一部どうしが重なるように交互に凸部が形成されていても、放熱フィンの空気流入端縁や空気流出端縁の全体としての実質的開口の広がりが確保されるため、それらの隙間g,hは必ずしも形成されている必要はない。   In the example shown here, when viewed in the arrangement direction of the heat radiating fins, the opening gaps g, h between the convex portions are formed as shown in FIG. , H, for example, even if the convex portions are alternately formed so that a part of the convex portions overlap each other, the substantial opening of the air inflow end edge and the air outflow end edge of the radiating fin is not reduced. Since the spread is ensured, the gaps g and h are not necessarily formed.

また、ここに示す例では、放熱フィンの、空気流入端縁と空気流出端縁との区別なしに、吸熱板11にかしめられた側の端縁を除く三方に切欠形状を有しているが、空気流入端縁と空気流出端縁があらかじめ分かっている場合は、空気流入端縁のみに上記の切欠形状を有していればよい。塵埃は、空気流入端縁に付着するため、空気流入端縁に上記の切欠形状を有していれば塵埃の付着の低減化が図られる。   Further, in the example shown here, the heat dissipating fin has a cutout shape in three directions except for the edge that is caulked to the heat absorbing plate 11 without distinguishing between the air inflow end edge and the air outflow end edge. When the air inflow edge and the air outflow edge are known in advance, only the air inflow edge may have the above-described notch shape. Since dust adheres to the air inflow end edge, if the air inflow end edge has the above-mentioned notch shape, the adhesion of dust can be reduced.

さらに、ここに示す例では、隣接する放熱フィンどうしで交互に異なる部分が切り欠かれているが、例えば放熱フィン3枚ごとあるいは4枚ごとに同じ位置に切り欠きが形成されるように、3枚あるいは4枚で一巡するように循環的に異なる位置に切り欠きが形成されていてもよい。   Furthermore, in the example shown here, different portions are alternately cut out between adjacent radiating fins. However, for example, 3 notches are formed at the same position every three or four radiating fins. Notches may be formed at cyclically different positions so as to make a round with four or four sheets.

図7は、本発明の第2実施形態としての放熱部品の斜視図、図8は、図7に示す放熱部品の側面図である。   7 is a perspective view of a heat dissipation component as a second embodiment of the present invention, and FIG. 8 is a side view of the heat dissipation component shown in FIG.

また、図9は、図8に示す円R3の部分の拡大図である。   FIG. 9 is an enlarged view of a portion of a circle R3 shown in FIG.

さらに、図10は、図7に示す放熱部品を構成する吸熱板の概略斜視図、図11は、図7に示す放熱部品を構成するヒートパイプの形状を示す概要図である。   10 is a schematic perspective view of a heat absorbing plate constituting the heat radiating component shown in FIG. 7, and FIG. 11 is a schematic diagram showing the shape of the heat pipe constituting the heat radiating component shown in FIG.

この第2実施形態としての放熱部品20には、その下端に吸熱板21が備えられている。   The heat radiating component 20 as the second embodiment is provided with a heat absorbing plate 21 at its lower end.

この吸熱板21は、図10に示すように発熱部品(図示せず)から熱を吸収する吸熱部211と、図7に示す放熱部品20を固定するための4本のアーム部212とで構成されている。   As shown in FIG. 10, the heat absorbing plate 21 includes a heat absorbing portion 211 that absorbs heat from a heat generating component (not shown) and four arm portions 212 for fixing the heat radiating component 20 shown in FIG. Has been.

この実施形態では、吸熱部211は良好な吸熱性を確保するために銅で形成されており、その4隅にアルミニウム製のアーム部212がかしめ接続されている。吸熱部211には、2本の長溝211aが形成されており、それら2本の長溝211a内には後述するヒートパイプ25(図11参照)が配置される。また、4本のアーム部212には、上下に貫通する取付穴212aが設けられている。その取付穴212aには、図7に示すように、ネジ部品22が貫通しており、それらのネジ部品22を使って、この伝熱部品20が、発熱部品の上面に吸熱部211の下面を押し当てた状態で電子機器の筐体等に固定される。尚、バネ部材23は、この伝熱部品20を吸熱部211の下面を発熱部品に当てがった状態で筐体等に安定的に取り付けることができるようにするための工夫である。   In this embodiment, the endothermic part 211 is made of copper in order to ensure good endothermic properties, and aluminum arm parts 212 are caulked and connected to the four corners thereof. Two long grooves 211a are formed in the heat absorbing portion 211, and a heat pipe 25 (see FIG. 11) described later is disposed in the two long grooves 211a. Further, the four arm portions 212 are provided with mounting holes 212a penetrating vertically. As shown in FIG. 7, screw parts 22 pass through the mounting holes 212 a, and by using these screw parts 22, the heat transfer part 20 attaches the lower surface of the heat absorbing part 211 to the upper surface of the heat generating part. In the pressed state, it is fixed to the casing of the electronic device. The spring member 23 is a device for allowing the heat transfer component 20 to be stably attached to a housing or the like in a state where the lower surface of the heat absorbing portion 211 is applied to the heat generating component.

また、図7,図8に示す放熱部品20には、吸熱部211にかしめ固定された多数枚の放熱フィン24が配列されている。これらの放熱フィン24の、ファン26によって覆われた上面、および両側面は、図9に示すような切欠形状を有している。この切欠形状自体は前述の第1実施形態の放熱部品10を構成する放熱フィン12の切欠形状と同一であり、ここでの重複説明は省略する。   Further, in the heat dissipating component 20 shown in FIGS. 7 and 8, a large number of heat dissipating fins 24 that are caulked and fixed to the heat absorbing portion 211 are arranged. The upper surface and both side surfaces of these radiating fins 24 covered by the fan 26 have a notch shape as shown in FIG. This notch shape itself is the same as the notch shape of the heat radiating fins 12 constituting the heat radiating component 10 of the first embodiment described above, and redundant description here is omitted.

また、この放熱部品20には、図11に示すような形状のヒートパイプ25が備えられている。このヒートパイプ25の一端側は、吸熱板21の吸熱部211に形成された長溝211aに嵌入され、そこから延在しカーブを描いて折り返して放熱フィン24の配列方向に延びて多数板の放熱フィン24を貫通している。   The heat radiating component 20 is provided with a heat pipe 25 having a shape as shown in FIG. One end side of the heat pipe 25 is fitted into a long groove 211a formed in the heat absorbing portion 211 of the heat absorbing plate 21, extends from there, folds in a curved shape, extends in the arrangement direction of the heat radiating fins 24, and dissipates heat from a large number of plates. The fin 24 is penetrated.

このヒートパイプ25の存在により、発熱部品から吸熱部211で吸収した熱が、そのヒートパイプ25を通って放熱フィン24に効率的に伝えられる。   Due to the presence of the heat pipe 25, the heat absorbed by the heat absorbing portion 211 from the heat generating component is efficiently transmitted to the heat radiating fins 24 through the heat pipe 25.

さらに、図7,図8に示す放熱部品20には、放熱フィン24の上端縁を覆う位置にファン26が備えられている。このファン26は、放熱フィン24の上端縁から放熱フィン24に向かって送風するものであり、ファン26により放熱フィン24の上端縁から放熱フィン24の隙間に送り込まれた空気は放熱フィン24の隙間を通る間に放熱フィン24から熱を吸収し、さらに吸熱板21に当たって吸熱板21からも直接に熱を吸収して放熱フィン24の両側縁から排気される。   Further, the heat dissipating component 20 shown in FIGS. 7 and 8 is provided with a fan 26 at a position covering the upper end edge of the heat dissipating fin 24. The fan 26 blows air from the upper edge of the radiating fin 24 toward the radiating fin 24, and the air sent from the upper edge of the radiating fin 24 to the gap between the radiating fins 24 by the fan 26 is the gap between the radiating fins 24. The heat is absorbed from the heat radiating fins 24 while passing through the heat sink, and further, the heat is absorbed directly from the heat absorbing plate 21 by hitting the heat absorbing plate 21 and exhausted from both side edges of the heat radiating fins 24.

この放熱フィン24の上端縁も、その放熱フィン24の側端縁に形成されている切欠形状と同様の切欠形状を有し、したがってその放熱フィン24の上端縁である空気流入側端縁への塵埃の付着が低減される。   The upper end edge of the radiating fin 24 also has a notch shape similar to the notch shape formed on the side edge of the radiating fin 24, and therefore, the upper end edge of the radiating fin 24 extends to the air inflow side edge. Dust adhesion is reduced.

尚、この第2実施形態のファン26は、放熱フィン24に向かって送風するファンであると説明したが、このファン26は、放熱フィン24から空気を吸い出す方向に送風するファンであってもよい。その場合、放熱フィン24の両側端縁が空気流入端縁となるが、この放熱フィン24は、その両側端縁にも切欠形状を有しており、したがってこの場合も、その空気流入端縁である両側端縁への塵埃の付着の低減化が図られる。   In addition, although the fan 26 of this 2nd Embodiment demonstrated that it was a fan which blows toward the radiation fin 24, this fan 26 may be a fan which ventilates in the direction which sucks out air from the radiation fin 24. . In this case, both side edges of the radiating fin 24 become air inflow edges, but the radiating fin 24 also has a notch shape on both side edges, and therefore in this case as well, at the air inflow edge. It is possible to reduce the adhesion of dust to both side edges.

Claims (8)

隙間を空けて配列された複数枚の放熱フィンを備え、該放熱フィンから、該放熱フィンの隙間を流れる空気に熱を伝える放熱部品において、
前記放熱フィンの空気流入側端縁が、該放熱フィンの配列方向に交互に又は循環的に異なる部分が切り欠かれた切欠形状を有することを特徴とする放熱部品。
In a heat dissipating part comprising a plurality of heat dissipating fins arranged with a gap between them, and transferring heat from the heat dissipating fins to the air flowing through the gaps of the heat dissipating fins,
An air inflow side edge of the radiating fin has a notch shape in which different or cyclically different portions are cut out in the arrangement direction of the radiating fin.
前記放熱フィンの空気流入側端縁が前記切欠形状を有することに加え、さらに該放熱フィンの空気流出側端縁が、前記切欠形状を有することを特徴とする請求項1記載の放熱部品。  2. The heat radiating component according to claim 1, wherein, in addition to the air inflow side edge of the heat radiating fin having the notch shape, the air outflow side edge of the heat radiating fin further has the notch shape. 前記放熱フィンの、前記切欠形状を有する端縁を該放熱フィンの配列方向に見たときに、隣接する放熱フィンの突出した部分どうしの間に隙間が形成されていることを特徴とする請求項1記載の放熱部品。  The clearance gap is formed between the protruding portions of adjacent radiating fins when the edge having the cutout shape of the radiating fin is viewed in the arrangement direction of the radiating fins. 1. A heat dissipating component according to 1. 冷却対象の発熱部品から吸熱する吸熱板を備え、前記放熱フィンが該吸熱板上に立設していることを特徴とする請求項1記載の放熱部品。  The heat radiating component according to claim 1, further comprising a heat absorbing plate that absorbs heat from a heat generating component to be cooled, wherein the heat radiating fins are erected on the heat absorbing plate. 前記吸熱板に接するとともに前記放熱フィンを貫通して該吸熱板の熱を前記放熱フィンに伝える伝熱部材をさらに備えたことを特徴とする請求項4記載の放熱部品。  The heat radiating component according to claim 4, further comprising a heat transfer member that is in contact with the heat absorbing plate and penetrates the heat radiating fin to transmit heat of the heat absorbing plate to the heat radiating fin. 前記放熱フィンの隙間に空気流を形成するファンを備えたことを特徴とする請求項1記載の放熱部品。  The heat radiating component according to claim 1, further comprising a fan that forms an air flow in the gap between the heat radiating fins. 前記ファンが、前記放熱フィンの隙間に空気を送り込むファンであることを特徴とする請求項6記載の放熱部品。  The heat radiating component according to claim 6, wherein the fan is a fan that sends air into a gap between the heat radiating fins. 前記ファンが、前記放熱フィンの隙間から空気を送り出すファンであることを特徴とする請求項6記載の放熱部品。  The heat dissipating component according to claim 6, wherein the fan is a fan that sends out air from a gap between the heat dissipating fins.
JP2009501070A 2007-02-27 2007-02-27 Heat dissipation component Expired - Fee Related JP4998548B2 (en)

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