CN113380737B - Y-shaped immersed capillary microchannel reinforced heat dissipation structure and manufacturing method thereof - Google Patents
Y-shaped immersed capillary microchannel reinforced heat dissipation structure and manufacturing method thereof Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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Abstract
The invention discloses a Y-shaped immersed capillary microchannel reinforced radiating structure and a manufacturing method thereof, the Y-shaped immersed capillary microchannel reinforced radiating structure comprises a radiating copper substrate, a plurality of Y-shaped microcolumns are arranged on the radiating copper substrate in an array manner, a main microchannel is formed between two adjacent Y-shaped microcolumns along the transverse direction, a side microchannel is formed between two adjacent Y-shaped microcolumns along the longitudinal direction, the main microchannel is perpendicular to the side microchannel, the Y-shaped microcolumns comprise a cube base which is integrally formed and plow-cut ribs which are positioned above the cube base, a liquid supplementing slit with uniform width is formed between the plow-cut ribs of the two adjacent Y-shaped microcolumns along the transverse direction, and a layer of uniform capillary liquid absorbing layer is attached to the bottom surface and the side surface of the main microchannel. The invention can further improve the working efficiency of boiling heat exchange under complex working conditions, is hopeful to break through the bottleneck of high heat flux heat dissipation of electronic components, and meets the increasingly-increased heat dissipation requirements of the electronic components.
Description
Technical Field
The invention belongs to a high heat flux density boiling enhanced heat exchange technology, relates to an efficient cooling technology suitable for high heat flux density microelectronic devices, and particularly relates to a Y-shaped immersed capillary microchannel enhanced heat dissipation structure and a manufacturing method thereof.
Background
With the continuous improvement of the processing precision of new generation electronic components represented by high-power integrated 5G chips, the smaller feature size increases the heat flux density of the chip surface, and heat dissipation has become a technical bottleneck in the development of electronic technology. It has been investigated that high temperature thermal failure has become the most significant cause of failure of microelectronic devices, and therefore the thermal management effect of the chip will directly affect the reliability of the electronic devices. Boiling heat exchange is used as a high-efficiency phase-change heat dissipation technology, and the internal energy of a high-temperature wall surface can be transferred in a convection mode, a vaporization mode and the like, so that the boiling heat exchange is widely applied to the field of electronic device cooling and achieves remarkable effects.
The traditional boiling heat dissipation structure has the problems of poor surface wettability, easy mixing of gas and liquid phases, less number of vaporization cores of a boiling wall surface and the like, and has two important indexes: both the heat convection coefficient (HTC) and the critical heat flux density (CHF) are not satisfactory at the present time.
Disclosure of Invention
The invention aims to provide a Y-shaped immersed capillary microchannel reinforced heat dissipation structure and a manufacturing method thereof, so as to solve the problems of insufficient liquid supplementing capability, mixed gas-liquid channels, difficult bubble separation and the like in the cooling technology of high heat flux electronic devices by the existing reinforced surface structure.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the utility model provides a Y font submergence formula capillary microchannel reinforces heat radiation structure, includes the heat dissipation copper base plate, is the array on the heat dissipation copper base plate and has arranged a plurality of Y font microcolumns, along the transverse direction, forms main microchannel between two adjacent Y font microcolumns, along the longitudinal direction, forms the side microchannel between two adjacent Y font microcolumns, main microchannel with the side microchannel is perpendicular, Y font microcolumn includes integrated into one piece's cube base and is located the plow cutting rib of cube base top, along the transverse direction, forms the even fluid infusion slit of width between the plow cutting rib of two adjacent Y font microcolumns, the bottom surface and the side of main microchannel adhere to the even capillary liquid absorbing layer of one deck.
Further, the total height h 1 of the Y-shaped immersed capillary microchannel reinforced heat dissipation structure is 5mm.
Further, the length and width dimensions l 1×w1 of the heat-dissipating copper substrate are 10mm×10mm.
Further, the main microchannel width l 2 is 1.2mm.
Further, the bottom surface thickness h 3 of the capillary liquid absorbent layer is 200-300 μm, and the side surface thickness l 4 is 150-200 μm.
Further, the width w 2 of the side microchannel is 500 μm.
Further, the total height h 2 of the Y-shaped micro-column is 1.2mm, and the width l 3 of the cube base is 400 mu m.
Further, the included angle theta 1 between the plough cutting ribs of the same Y-shaped microcolumn is 90 degrees, and the width w 3 and the height h 4 of each plough cutting rib are 850 mu m and 400 mu m respectively.
A manufacturing method of a Y-shaped immersed capillary microchannel reinforced heat dissipation structure comprises the following steps:
The first step: wire cutting and processing a main micro-channel on the upper surface of the heat dissipation copper substrate;
And a second step of: adhering a layer of shielding glue to the upper surface of the processed main micro-channel, cleaning and degreasing other surfaces, pickling, after rust removal and micro corrosion, extending the surfaces into an electrophoretic paint which is prepared in advance and contains a large number of copper particles with the particle size of 70 microns, connecting a power supply with a workpiece, then applying current, uniformly and flatly paving the micron-sized copper particles on the surface of the main micro-channel under the action of an electric field, and controlling the operation time to be within two minutes;
And a third step of: after each electrophoresis layer, carrying out surface cleaning, successively replacing electrophoresis paint containing copper particles with the particle diameters of 100 microns and 130 microns, and repeating the electrophoresis process of the second step until the surface of the main micro-channel is processed with three compact copper particle electrophoresis layers, at the moment, finally forming a millimeter-level capillary liquid absorption layer, and then dissolving out residual shielding glue attached to the upper surface;
fourth step: processing a side micro-channel on the side surface of the electrophoretically-good heat-dissipating copper substrate, and cleaning and polishing the surface of the obtained side micro-channel;
fifth step: carrying out air-cooled annealing heat treatment after the heat preservation of 280-320 ℃ on the workpiece obtained after the processing in the fourth step;
Sixth step: and (3) extruding the colter with a sharp corner at the bottom up and down, and uniformly and semi-extruding the square micropillars with the side surfaces wrapped with the capillary liquid absorbing layers after the fifth step of processing, so as to finally form the Y-shaped wool fine channel enhanced chip boiling heat exchange structure.
Further, the method further comprises a seventh step of: and (3) cleaning the finished product obtained in the sixth step, and then soaking the cleaned finished product in a hydrogen peroxide solution with the volume concentration of 30% for 1 hour.
Compared with the prior art, the invention has the following beneficial technical effects:
The invention provides a Y-shaped capillary immersed microchannel enhanced boiling heat exchange structure, the special microchannel shape design ensures that heat is difficult to transfer to the topmost end of a Y-shaped microcolumn, phase change bubble interference does not exist near a liquid supplementing slit, cooling liquid can more efficiently gush into liquid supplementing, and the cooling liquid can be driven by wall capillary force to deeply develop towards a main microchannel, so that liquid supplementing in the direction parallel to the outer surface of the main microchannel is more stable and sufficient. In addition, the capillary liquid absorption layer on the surface of the Y-shaped microcolumn makes bubbles generated by phase change difficult to stay in the microchannel, and simultaneously blocks the combination of the bubbles in the horizontal direction, and inhibits the generation of a wall air film, so that the critical heat flow density (CHF) is remarkably improved; the capillary liquid absorption layer obviously increases the number of nucleation sites on the heat exchange wall surface and the effective heat exchange area of the wall surface, so that the cooling liquid reaches a nucleate boiling phase transition starting point (ONB) in advance under a smaller supercooling degree, and the improvement of the phase transition evaporation efficiency of a thin liquid film between three phases under high heat flow is promoted, thereby improving the convection Heat Transfer Coefficient (HTC) during chip boiling heat exchange.
Further, because the steam is very sensitive to pressure resistance change of the fluid when overflows, the Y-shaped microcolumn is designed into the characteristics of large rough flow resistance of the wall surface of the main microchannel and small smooth flow resistance of the wall surface of the side microchannel, so that the steam can quickly overflow from the smooth side microchannel after phase change, the flow resistance near the fluid supplementing slit is obviously increased by two probe feet extending out of the top surface of the Y-shaped microcolumn formed after plough cutting, and the liquid insensitive to the fluid supplementing resistance can be continuously supplemented from the fluid supplementing slit, so that the high-efficiency phase change state that the channels of the gas-liquid channel are separated relatively to each other can be realized. In addition, the plow-cut rib lengthens the relative distance between adjacent liquid supplementing slits, prevents the horizontal combination and expansion of phase-change vapor at the bottom of the capillary liquid absorbing layer, prevents the vapor film from preventing the situation that liquid in the heat dissipating device is supplemented, and can meet the heat dissipating requirement of electronic components such as chips and the like under high critical heat flux.
Further, the capillary liquid-absorbing layers at the sides and bottom of the Y-shaped microcolumn serve to increase the number of boiling nucleation sites, buffer the cooling liquid and stably supply it to the phase change region. Through the processing of the multi-layer solution electrophoresis process, small-particle spherical copper particles are firstly electrophoretically deposited on the surface of a main micro-channel to form a thin layer, and then the electrophoresis solution is replaced for a plurality of times, so that the copper particles with gradually increased particle diameters are deposited on the surface of the main micro-channel from inside to outside, the capillary force of the liquid on the capillary liquid absorbing layer is continuously increased from outside to inside, and the cooling liquid is more fully contacted with the side surface of the Y-shaped micro-column.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention.
FIG. 1 is a schematic three-dimensional structure diagram of a Y-shaped capillary microchannel enhanced boiling heat exchange structure of the invention;
FIG. 2 is a front view of the Y-shaped capillary microchannel enhanced boiling heat exchange structure of the present invention;
FIG. 3 is a side view of the Y-shaped capillary microchannel enhanced boiling heat exchange structure of the present invention.
Fig. 4 is a top view of the Y-shaped capillary microchannel enhanced boiling heat exchange structure of the present invention.
1, A heat dissipation copper substrate; 2. a capillary liquid-absorbing layer; 3. y-shaped microcolumns; 4. a main microchannel; 5. a side microchannel; 6. ploughing and cutting the rib; 7. a fluid supplementing slit.
Detailed Description
Embodiments of the invention are described in further detail below:
According to the Y-shaped capillary immersed microchannel enhanced boiling heat exchange structure and the manufacturing method thereof, on one hand, the capillary liquid absorbing layer 2 can obviously increase the vaporization core, and meanwhile, the main microchannel 4 and the side microchannel 5 formed by the Y-shaped microcolumn 3 can realize local flow resistance control, so that bubbles are easier to separate from the side microchannel 5 with small resistance, the vertical bubble separation frequency is obviously increased, and the convection heat exchange coefficient is improved; on the other hand, the Y-shaped microcolumn 3 can inhibit the formation of a gas film in the horizontal direction, and meanwhile, the capillary liquid suction layer contains a tiny liquid supplementing channel, so that liquid can be timely supplemented to the bottom of the main microchannel 4 in a high heat flow area in a capillary pumping mode, the wettability and the liquid supplementing capacity of the heat dissipating device under the high heat flow density are improved, local hot spots and dry spots generated after the liquid is not timely supplemented are avoided, and the heat transfer deterioration of the high heat flow area is prevented; in addition, the vapor after phase change overflows from the side micro-channel 5 surface with light and clean wall surface and smaller flow resistance, and the cooling liquid is filled in from the liquid filling slits 7 at the top ends of the two adjacent Y-shaped micro-columns 3, so that the relative separation of the gas-liquid channels is effectively formed, and finally, the critical heat flow density of the heat dissipation device is effectively improved.
Specifically, referring to the three-dimensional structure schematic diagram of fig. 1, a Y-shaped capillary microchannel enhanced boiling heat dissipation structure comprises a heat dissipation copper substrate 1, a capillary liquid absorption layer 2 and a plurality of Y-shaped microcolumns 3. The two sides of the Y-shaped micro column 3 are respectively provided with a main micro channel 4 and a side micro channel 5, the upper plow cutting ribs 6 are formed by extruding a special plow blade with a sharp corner at the lower part, and a neat liquid supplementing slit 7 is formed between the plow cutting ribs 6 which extend outwards. The capillary liquid absorbing layer 2 is positioned in the main micro channel 4 between the Y-shaped micro columns 3, plays roles of capillary pumping liquid to the high temperature wall surface, storing and transporting the liquid, increasing boiling nucleation sites and the like, and obviously improves the wall surface flow heat exchange coefficient (HTC) of the Y-shaped micro columns 3, so that the heat dissipation structure has excellent heat exchange stability and temperature uniformity.
As shown in fig. 2 and 3, the Y-shaped capillary microchannel enhanced boiling heat exchange structure has an overall height h 1 mm, and the heat dissipation copper substrate 1 has a length and width dimension l 1×w1 of 10mm×10mm. The width l 2 of the main microchannel 4 is 1.2mm, a layer of uniform capillary liquid absorption layer 2 is attached to the side surface and the bottom surface of the main microchannel, the thickness h 3 of the bottom surface of the capillary liquid absorption layer 2 is 200-300 mu m, and the thickness l 4 of the side surface is 150-200 mu m. The side microchannel 5 serves to timely discharge bottom vapor, and has a width w 2 of 500 μm. The total height h 2 of the Y-shaped micro-column 3 is 1.2mm, the root width l 3 is 400 mu m, the included angle theta 1 between the Y-shaped micro-column and the plow-cutting ribs 6 is 90 DEG, and the width w 3 and the height h 4 of each plow-cutting rib 6 are 850 mu m and 400 mu m respectively.
The technical solutions of the present invention will be clearly and completely described in connection with the embodiments, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention is based on the principle of enhancing wall wettability and liquid supplementing capability and separating liquid inlet from gas escape flow channels, and by processing special micro-channel shapes and capillary layers, bubbles are blocked from being combined in the horizontal direction to form a film, the separation frequency of the bubbles in the vertical direction is improved, the liquid supplementing capability under high heat flow is increased, and the relative separation of gas and liquid channels is realized, so that the convection heat exchange coefficient (HTC) and critical heat flow density (CHF) are improved, and the invention has great development potential in submerged cooling application in a micro space. The heat dissipation copper substrate comprises a square heat dissipation copper substrate 1, wherein the length l 1 and the width w 1 of the square heat dissipation copper substrate 1 are 10mm, and the top surface of the heat dissipation copper substrate 1 is provided with a capillary liquid absorption layer 2 and a Y-shaped micro-column 3 which are manufactured by utilizing processes such as linear cutting, electrophoresis, plough cutting and the like. The capillary liquid absorbing layer 2 is wrapped on the bottom surface and the side surface of the main micro-channel 4 with the width l 2 of 1.2mm, so that the number and wettability of boiling nucleation sites on the wall surface are obviously improved, and the convection heat exchange and evaporation of the fluid-solid surface are promoted. When the cooling liquid is fed into the micro-channel from the liquid feeding slit 7 above, the cooling liquid is stored in a narrow pore formed by sintering and bonding copper powder under the action of a capillary pump drive, continuously and stably spreads downwards along the capillary liquid absorbing layer 2, and finally is transported to the bottom surface of the capillary liquid absorbing layer 2 with the thickness h 3 of 200-300 mu m.
The plow-cut rib 6 will effectively change the local pressure resistance distribution because of the relatively sensitivity to pressure drop obstruction when gas is spilled. When the boiling phase transition of the heating wall surface is extremely severe, most vapor can be overflowed from the smooth and narrow side micro-channels 5, so that the vapor bubble separation rate is improved, and the situations of liquid supplementing capacity reduction, local hot spot temperature fluctuation abnormality and the like caused by mutual interference of gas-liquid flow are prevented. In addition, the multi-layer multi-particle-diameter copper particle electrophoresis process from inside to outside ensures that the capillary force of the capillary liquid absorbing layer 2 is stable under long-time working, and the connection strength among particles is reliable and is not easy to fall off; on the other hand, the capillary transport capacity of the liquid from outside to inside is enhanced, and the resistance of vapor from inside to outside is reduced.
The post-treatment process of the Y-shaped capillary microchannel enhanced boiling heat exchange structure comprises annealing heat treatment, hydrogen peroxide solution soaking and the like, so that the strength, the processing performance and the wall hydrophilicity of the heat dissipating device are improved, the stable working capacity can be further ensured when the high heat flow works, and the rough wall surface after processing is used for making bubbles difficult to gather and form a gas film covering the surface of the whole microchannel when the bubbles are severely generated.
The novel structure provided by the invention has the advantages of excellent boiling heat dissipation capability, mature theoretical model, low manufacturing cost, good development prospect and application capability, is expected to realize high heat flux density heat dissipation, and can be applied to a high-integration electronic component immersed cooling solution.
The manufacturing method of the Y-shaped capillary microchannel enhanced chip boiling heat exchange structure comprises the following steps:
The first step: the wider main micro-channel 4 is wire-cut on the upper surface of the heat dissipation copper substrate 1.
And a second step of: and (3) adhering a layer of very thin shielding glue to the upper surface of the processed main micro-channel 4, cleaning and degreasing other surfaces, then pickling, after rust removal and micro corrosion, extending the surfaces into electrophoretic paint which is prepared in advance and contains a large number of micron-sized copper particles, connecting a power supply with a workpiece, then applying current, uniformly and flatly paving the copper particles on the outer surface of the main micro-channel 4 under the action of an electric field, and controlling the operation time to be within two minutes to form the capillary liquid absorbing layer 2.
And a third step of: and (3) carrying out surface cleaning after each electrophoresis layer, then replacing electrophoresis paint with larger particle size, and repeating the electrophoresis process of the second step until three dense copper particle electrophoresis layers are processed on the surface of the main microchannel 4, and then dissolving out residual shielding glue attached to the upper surface.
Fourth step: machining the side micro-channel 5 on the electrophoresed side surface by using a CNC numerical control machine tool, and cleaning and polishing the surface of the obtained side micro-channel 5.
Fifth step: the workpiece is subjected to an annealing heat treatment of air cooling after heat preservation at 280-320 ℃ to release internal residual stress and improve surface hardness so as to improve the cold processing performance of brass.
Sixth step: and (3) extruding the square microcolumns containing the capillary liquid absorbing layer 2 up and down by using a coulter with the sharp angle of the bottom surface of 90 degrees to uniformly and semi-axially open the microcolumns, and finally forming the Y-shaped wool fine channel enhanced chip boiling heat exchange structure.
Seventh step: the finished product is cleaned and then put into hydrogen peroxide solution with the concentration of 30% to be soaked for 1 hour, so as to improve the wettability of the capillary liquid absorbing layer 2.
According to the invention, the dense capillary liquid absorbing layer 2 is uniformly paved on the surface of the main micro-channel in an electrophoresis mode, so that the heat exchange area is effectively expanded, the number of wall boiling nucleation sites is obviously increased, the fluid-solid coupling heat transfer effect can be improved in a capillary pumping mode, and the occurrence of local hot spots and dry spots of a heat dissipation structure is prevented, thereby being beneficial to increasing the convection heat exchange coefficient (HTC) of the wall of the boiling heat dissipation structure; the fins extending outwards are cut out by the plow, the difference of the density of the gas phase and the liquid phase and the difference of the sensitivity of the two phases to the resistance of the flow channel during the flowing are utilized, the exhaust flow channel and the liquid supplementing flow channel are separated relatively by changing the local fluid flow resistance, the overflow frequency of steam bubbles is increased, the phenomenon that steam gathers in the inner horizontal direction of the micro-channel to extend into a film and interfere with the liquid supplementation is avoided, and the critical heat flow density (CHF) of the wall surface of the boiling heat dissipation structure is increased.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (2)
1. A manufacturing method of a Y-shaped immersed capillary microchannel reinforced radiating structure comprises a radiating copper substrate (1), a plurality of Y-shaped microcolumns (3) are arranged on the radiating copper substrate (1) in an array manner, a main microchannel (4) is formed between two adjacent Y-shaped microcolumns (3) along the transverse direction, a side microchannel (5) is formed between two adjacent Y-shaped microcolumns (3) along the longitudinal direction, the main microchannel (4) is perpendicular to the side microchannel (5), the Y-shaped microcolumns (3) comprise a cube base formed integrally and plow-cutting ribs (6) positioned above the cube base, a liquid supplementing slit (7) with uniform width is formed between the plow-cutting ribs (6) of the two adjacent Y-shaped microcolumns (3) along the transverse direction, and a layer of uniform capillary liquid absorbing layer (2) is attached to the bottom surface and the side of the main microchannel (4);
the method is characterized by comprising the following steps of:
the first step: wire cutting and processing a main micro-channel (4) on the upper surface of the heat dissipation copper substrate (1);
and a second step of: adhering a layer of shielding glue to the upper surface of the processed main micro-channel (4), cleaning and degreasing other surfaces, pickling, after rust removal and micro corrosion, extending the surfaces into an electrophoretic paint which is prepared in advance and contains a large number of copper particles with the particle size of 70 microns, connecting a power supply with a workpiece, then applying current, uniformly and flatly paving the micron-sized copper particles on the surface of the main micro-channel (4) under the action of an electric field, and controlling the operation time to be within two minutes;
And a third step of: after each electrophoresis layer, carrying out surface cleaning, successively replacing electrophoresis paint containing copper particles with the particle diameters of 100 microns and 130 microns, and repeating the electrophoresis process of the second step until three dense copper particle electrophoresis layers are processed on the surface of the main microchannel (4), at the moment, finally forming a millimeter-sized capillary liquid absorption layer (2), and then dissolving out residual shielding glue attached to the upper surface;
Fourth step: processing a side micro-channel (5) on the side surface of the electrophoretically-good heat-dissipating copper substrate (1), and cleaning and polishing the surface of the obtained side micro-channel (5);
fifth step: carrying out air-cooled annealing heat treatment after the heat preservation of 280-320 ℃ on the workpiece obtained after the processing in the fourth step;
sixth step: and (3) extruding the colter with a sharp corner at the bottom up and down, and uniformly and semi-extruding square micropillars with the side surface wrapped by the capillary liquid absorbing layer (2) after the fifth step of processing, so as to finally form the Y-shaped wool fine channel enhanced chip boiling heat exchange structure.
2. The method for manufacturing a Y-shaped submerged capillary microchannel heat dissipation enhancing structure according to claim 1, further comprising the seventh step of: and (3) cleaning the finished product obtained in the sixth step, and then soaking the cleaned finished product in a hydrogen peroxide solution with the volume concentration of 30% for 1 hour.
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| CN113380737A (en) | 2021-09-10 |
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