CN106102414A - The parent of a kind of compound columnar microstructure/hydrophobic enhanced boiling heat transfer sheet - Google Patents
The parent of a kind of compound columnar microstructure/hydrophobic enhanced boiling heat transfer sheet Download PDFInfo
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- CN106102414A CN106102414A CN201610460020.6A CN201610460020A CN106102414A CN 106102414 A CN106102414 A CN 106102414A CN 201610460020 A CN201610460020 A CN 201610460020A CN 106102414 A CN106102414 A CN 106102414A
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- hydrophobic
- columnar microstructure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
The invention discloses the parent/hydrophobic enhanced boiling heat transfer sheet of a kind of compound columnar microstructure, hydrophobic region and smooth hydrophilic channel by columnar microstructure array form, for enhanced boiling heat transfer process.Micro structure array columnar microstructure during boiling heat transfer can capture incondensable gas and provide the nucleate boiling nucleus of boiling, steam bubble is stranded in hydrophilic channel in hydrophobic region growth sliding and collects merging, when steam bubble dia increases to the smooth hydrophilic channel width order of magnitude, and steam bubble will be rapidly separated at smooth surface.Therefore this surface retains the disengaging effectively facilitating steam bubble while the micro-knot of column changes surface high efficient heat exchanging performance, thus lowers wall superheat degree and delay the generation of boiling crisis phenomenon.
Description
Technical field
The invention belongs to electronic device thermal control field, be specifically related to the parent/hydrophobic strengthening of a kind of compound columnar microstructure
Boiling heat transfer sheet, effectively strengthens boiling heat transfer effect by changing heat exchanger fin surface morphological structure.
Background technology
Along with the development of micro-electronic mechanical skill, electronic device is integrated and high frequency degree improves constantly, characteristic size
Constantly reducing, the caloric value of unit volume constantly increases, and the design of facility compact makes again to dispel the heat more difficult.Boiling heat transfer
As a kind of phase-change heat-exchange mode, compared with traditional air-cooled and convective heat transfer liquid, the coefficient of heat transfer has the difference of the order of magnitude,
It it is a kind of very effective radiating mode.But high heat flux boiling heat transfer performance often severe exacerbation, its basic reason exists
It is difficult to depart from heating surface large sparkle and hinders liquid supply and evaporation.
The effectiveness of boiling phase-change heat transfer is heavily dependent on the physicochemical characteristic of heat exchange surface, particularly wettability,
Porous, roughness and effective heat exchange area.For above-mentioned technical barrier, by processing micro/nano structure energy at heat exchange surface
Significantly changing the physicochemical characteristic of heat exchange surface, thus change boiling initial temperature point, steam bubble produces frequency, size and density, shadow
Ring heat transfer property.But, existing heat exchange surface processes means and especially changes in surface contact angle technique, generally there is high temperature and loses
The unstable factors such as effect.Therefore, heat-transfer surface contacts with liquid and hot operation state lower surface character changes long-time
Become and be still one of its subject matter faced.
As it was previously stated, this method utilize that micromachined obtains on the basis of high efficient heat exchanging columnar microstructure, propose to dredge
Water columnar microstructure and the novel parent/hydrophobic surface micro structure of the alternate layout of hydrophilic surface, not only ensure that the stability of heat-transfer surface
Reduce electronic device surface temperature simultaneously, meet the work requirements of high-power electronic device heat exchange.
Summary of the invention
Present invention aim at providing a kind of heat exchange surface structure with enhanced boiling heat transfer performance, effectively strengthen boiling
While heat transfer effect delays boiling dry combustion method phenomenon, existing boiling enhanced heat exchange surface can be solved again and contact with liquid for a long time
And character changes problem under hot operation state.
For achieving the above object, the technical solution used in the present invention is:
The hydrophobic region that this heat exchanger fin surface is made up of microscopic dimensions columnar microstructure array and the light with macro-size
Sliding hydrophilic channel composition, the staggered hydrophobic region that is interspersed in of smooth hydrophilic channel is divided into block array, forms integral passage
Communicate, the heat exchanger fin surface that hydrophilic and hydrophobic, macro-size combines with microscopic dimensions everywhere.
Described hydrophobic region is the columnar microstructure array composition that micromachined is formed, its static contact angle is 135 ° ±
2 ° is hydrophobic surface.
Its rule of surface of hydrophobic region arrangement length of side and the micro structure square column that height is micron dimension height, in composition plane
Four direction interlocks the micro structure array communicated.
This smooth hydrophilic channel static contact angle is 77 ° ± 2 °, and the columnar microstructure array on passage both sides exists a low chi
The microchannel of very little order of magnitude width communicates therewith.
There is advantages that
1, the square column micro structure array that the micro-machining that the present invention uses is formed in electronics silicon chip surface etch with
And smooth passage has certain mechanical strength and chemical stability, compare existing sintering or close and distant water meter prepared by spraying coating process
Mask has the advantages such as high temperature resistant, anticorrosive, the most easy to wear, can effectively extend the service life of heat exchange components and parts.
2, the present invention uses hydrophobic surface that columnar microstructure formed and the design that smooth hydrophilic channel combines, tool
There is high efficient heat exchanging performance: both added effective nucleus of boiling quantity by columnar microstructure array, ensure that again steam bubble is in light slide-through
Road departs from the supply of guarantee fresh liquid in time thus reduces wall superheat degree and delay dry combustion method crisis.
3, utilize the present invention, only need to process hydrophilic channel in suitable position, hydrophobic enhanced heat exchange sheet surface, tool
Have that implementation is simple, the reliable advantage of operation logic.
Accompanying drawing explanation
Fig. 1 is exchange fin structure schematic diagram of the present invention.
Wherein: 1 is columnar microstructure array, 2 is smooth hydrophilic channel.
Fig. 2 is exchange fin structure detailed description of the invention schematic diagram of the present invention
Wherein: 1 is columnar microstructure array, 2 is smooth hydrophilic channel, and 3 is steam bubble, and 4 merge behavior for steam bubble.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention become apparent from clearly, below in conjunction with specific embodiment, and reference
The present invention is further illustrated for accompanying drawing.
The parent of a kind of compound columnar microstructure/hydrophobic enhanced boiling heat transfer sheet, including columnar microstructure hydrophobic region 1 and light
Sliding hydrophilic channel 2, hydrophobic region 1 is divided into hydrophobic array by smooth passage staggered interting.
Described columnar microstructure hydrophobic region 1, the height formed for dry corrosion and the length of side are at the post of the some tens of pm order of magnitude
Shape micro structure array forms, and the static contact angle using deionized water to record is 135 °, the micro-knot of column during boiling heat transfer
Structure can capture incondensable gas and provide the nucleate boiling nucleus of boiling thus reduce the wall superheat degree of onset of boiling, simultaneously
Columnar microstructure can significantly improve the effective heat exchange area on surface.
Micro-for column knot column split is become block array by described staggered the communicating of smooth hydrophilic channel 2, uses deionized water to record
Static contact angle be 77 °, relative to hydrophobic region 1, there is good liquid wellability.The steam bubble generated when hydrophobic region 1 is sliding
Move to region 1 to be besieged at the apparent height smooth domain relatively low relative to cylinder with during 2 edge, region, communicate due to staggered
Design makes steam bubble produce the phenomenon along the random sliding of passage all directions in passage 2, therefore adds what steam bubble merged
Probability, accelerates the growth of steam bubble volume.Passage 2 width is the empirical estimating by laboratory observation Bubble detachment diameter and obtains, and it is wide
Degree is slightly less than the average detachment frequency of steam bubble.Therefore, it is slightly larger than smooth passage width when two or more steam bubbles diameter after merging
When spending, under passage both sides micro structure contacts the effect that line capillary force and water-wetted surface liquid constantly infiltrate supply with shiny surface,
Depart from heat exchange surface.Relative to the micro-structure surface without smooth passage, the bubble departure difficulty that its surface is formed is substantially reduced: vapour
Bubble departs from the increase of frequency and the diabatic process between heat-transfer surface and working medium is strengthened, and effectively reduces wall superheat degree；Especially
Under high heat flux, locally steam bubble can not depart from the phenomenon of heat exchange surface in time and makes moderate progress, and therefore can effectively delay boiling
Dry combustion method phenomenon improves critical heat flux density.
First, the heat-exchange working medium selected in an experiment is non-conductive perfluor cold-producing medium FC-72, and its boiling point is 56 DEG C.Reference
Experiment experience FC-72 is at the order of magnitude of the detachment frequency of silicon chip surface steam bubble, and the width design of the smooth hydrophilic band 2 of the present invention is
0.3mm, the length of side of micro structure array 1 is 0.7mm.Wherein in micro structure array, the length of side of every single square column is 30 μm, a height of 60 μ
m。
When normally working, described micro structure array 1 can provide the effective nucleus of boiling in an experiment, increases effective heat exchange
Area.The single one-level generated is steeped oneself-meeting and is produced random sliding, owing to the micro structure array length of side and steam bubble dia are in equal number
Level, the probability therefore arriving array edges in slipping is bigger.The steam bubble of microstructured edge can be besieged light subsequently
In sliding hydrophilic band 2 and the most at faster speed to up and down or left and right sliding, the steam bubble being trapped in 2 is at the light communicated that interlocks
Constantly being enriched with in sliding surface, two or more one-level bubbles collide merging in region 2, form bigger steam bubble.When formed
When two grades of steam bubble dias grow into the channel width order of magnitude, water-wetted surface there will be the active supply of liquid, under external force
Promote bubble departure, thus reach accelerate bubble departure and alleviate the effect of chip dry combustion method crisis.
Novel reinforced Boiling Heat Transfer Surfaces is obtained according to above step design, through FC-72 subcooled pool boiling experimental verification,
Result shows to use above surface heat exchanging compared with smooth surface, and under 35K degree of supercooling, the wall superheat degree of onset of boiling drops
Low 8 DEG C, critical heat flux density improves 140%, at 15W/cm2Heat flow density lower wall surface temperature reduces by 16 DEG C；With without smooth passage
Square column micro-structure surface compare heat exchange area reduce 20%, but the wall superheat degree of onset of boiling reduce by 6 DEG C, critical heat
Current density improves 25%, at 30W/cm2Heat flow density lower wall surface temperature reduces by 8 DEG C.
The above specific embodiment, has been carried out the purpose of the present invention, technical scheme and beneficial effect the most in detail
Illustrating, the heat exchange surface that hydrophobe provided by the present invention combines, composition is simple, operation principle is reliable, can effectively solve to change
Lost efficacy the problem that the system ability to work caused declines in hot-zone, can be widely applied to the field such as electronic device cooling, chemical refrigeration,
Cost performance is the best with industrialization prospect.
Claims (5)
1. the parent of a compound columnar microstructure/hydrophobic enhanced boiling heat transfer sheet, it is characterised in that this heat exchanger fin surface is by microcosmic
Size columnar microstructure array constitute hydrophobic region (1) and have macro-size smooth hydrophilic channel (2) form, smooth parent
The staggered hydrophobic region (1) that is interspersed in of aquaporin (2) is divided into block array, forms integral passage and communicates everywhere, hydrophilic with
The heat exchanger fin surface that hydrophobic, macro-size combines with microscopic dimensions.
The parent of a kind of compound columnar microstructure the most according to claim 1/hydrophobic enhanced boiling heat transfer sheet, its feature exists
In, described hydrophobic region (1) is the columnar microstructure array composition that micromachined is formed, and its static contact angle is 135 ° ± 2 °
For hydrophobic surface.
The parent of a kind of compound columnar microstructure according to claim 1 the most according to claim 1 and 2/hydrophobic is by force
Change boiling heat transfer sheet, it is characterised in that hydrophobic region (1) its rule of surface arrangement length of side is the micro-of micron dimension height with height
Structure square column, in composition plane, four direction interlocks the micro structure array communicated.
The parent of a kind of compound columnar microstructure the most according to claim 1/hydrophobic enhanced boiling heat transfer sheet, its feature exists
In, smooth hydrophilic channel (2) static contact angle is 77 ° ± 2 °, and the columnar microstructure array on passage both sides exists a low size number
The microchannel of magnitude width communicates therewith.
The parent of a kind of compound columnar microstructure the most according to claim 1/hydrophobic enhanced boiling heat transfer sheet, its feature exists
In, its smooth hydrophilic channel width is suitable with the working medium boiling Bubble detachment diameter order of magnitude.
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| CN201610460020.6A CN106102414B (en) | 2016-06-22 | 2016-06-22 | A kind of parent of compound columnar microstructure/hydrophobic enhanced boiling heat transfer piece |
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| CN201610460020.6A CN106102414B (en) | 2016-06-22 | 2016-06-22 | A kind of parent of compound columnar microstructure/hydrophobic enhanced boiling heat transfer piece |
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| CN106102414A true CN106102414A (en) | 2016-11-09 |
| CN106102414B CN106102414B (en) | 2019-01-15 |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106802095A (en) * | 2017-01-20 | 2017-06-06 | 中国石油大学(华东) | A kind of microchannel cooling |
| CN108020105A (en) * | 2017-11-17 | 2018-05-11 | 华南理工大学 | A kind of shell-and-tube heat exchanger of super-hydrophobic/water-wetted surface |
| CN108072292A (en) * | 2018-01-04 | 2018-05-25 | 钦州学院 | The augmentation of heat transfer microelectronics heat exchanger of imitative Rice Leaf micro-structure surface |
| CN108321135A (en) * | 2018-01-24 | 2018-07-24 | 西安交通大学 | A kind of columnar chip enhanced boiling heat transfer micro-structure of combined type and its manufacturing method |
| CN108844992A (en) * | 2018-06-21 | 2018-11-20 | 西安交通大学 | A kind of drawing-in type electronic chip cooling boiling enhanced heat transfer experimental device and method |
| CN108878388A (en) * | 2018-06-21 | 2018-11-23 | 西安交通大学 | It is a kind of to strengthen the device and its manufacturing method that boiling surface bubble is rapidly separated |
| CN109099741A (en) * | 2018-06-05 | 2018-12-28 | 东南大学 | A kind of heat exchange structure for strengthening boiling |
| CN109295431A (en) * | 2018-09-29 | 2019-02-01 | 西安交通大学 | A kind of non-homogeneous wetting surface and preparation method thereof with fractal property |
| CN110425914A (en) * | 2019-06-28 | 2019-11-08 | 中国空间技术研究院 | A kind of low-resistance augmentation of heat transfer structure surpassing wetting interface based on nanometer |
| CN111223826A (en) * | 2020-01-19 | 2020-06-02 | 中南大学 | Enhanced boiling heat transfer surface utilizing synergistic effect of microstructure and composite wettability |
| CN111834309A (en) * | 2020-07-21 | 2020-10-27 | 西安科技大学 | Mixed wettability micro-nano composite enhanced heat exchange structure and preparation method thereof |
| CN112857118A (en) * | 2021-01-08 | 2021-05-28 | 厦门大学 | Method and device for regulating and controlling hydrophilicity and hydrophobicity of surface of carbon nanotube array based on external electric field/plasma for enhancing phase change heat exchange |
| US11098960B2 (en) | 2018-12-04 | 2021-08-24 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling devices including a variable angle contact surface and methods for cooling heat-generating devices with a cooling device |
| CN113380737A (en) * | 2021-04-28 | 2021-09-10 | 西安交通大学 | Y-shaped immersed capillary micro-channel enhanced heat dissipation structure and manufacturing method thereof |
| CN113731771A (en) * | 2021-08-20 | 2021-12-03 | 南京理工大学 | Micro-channel with three-dimensional composite wettability surface and preparation method thereof |
| CN114653951A (en) * | 2022-03-17 | 2022-06-24 | 西安交通大学 | Hydrophilic-hydrophobic coupling porous medium array structure and preparation method thereof |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106802095A (en) * | 2017-01-20 | 2017-06-06 | 中国石油大学(华东) | A kind of microchannel cooling |
| CN108020105A (en) * | 2017-11-17 | 2018-05-11 | 华南理工大学 | A kind of shell-and-tube heat exchanger of super-hydrophobic/water-wetted surface |
| CN108072292A (en) * | 2018-01-04 | 2018-05-25 | 钦州学院 | The augmentation of heat transfer microelectronics heat exchanger of imitative Rice Leaf micro-structure surface |
| CN108321135A (en) * | 2018-01-24 | 2018-07-24 | 西安交通大学 | A kind of columnar chip enhanced boiling heat transfer micro-structure of combined type and its manufacturing method |
| CN109099741A (en) * | 2018-06-05 | 2018-12-28 | 东南大学 | A kind of heat exchange structure for strengthening boiling |
| CN108844992A (en) * | 2018-06-21 | 2018-11-20 | 西安交通大学 | A kind of drawing-in type electronic chip cooling boiling enhanced heat transfer experimental device and method |
| CN108878388A (en) * | 2018-06-21 | 2018-11-23 | 西安交通大学 | It is a kind of to strengthen the device and its manufacturing method that boiling surface bubble is rapidly separated |
| CN109295431A (en) * | 2018-09-29 | 2019-02-01 | 西安交通大学 | A kind of non-homogeneous wetting surface and preparation method thereof with fractal property |
| US11098960B2 (en) | 2018-12-04 | 2021-08-24 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling devices including a variable angle contact surface and methods for cooling heat-generating devices with a cooling device |
| CN110425914A (en) * | 2019-06-28 | 2019-11-08 | 中国空间技术研究院 | A kind of low-resistance augmentation of heat transfer structure surpassing wetting interface based on nanometer |
| CN111223826A (en) * | 2020-01-19 | 2020-06-02 | 中南大学 | Enhanced boiling heat transfer surface utilizing synergistic effect of microstructure and composite wettability |
| CN111223826B (en) * | 2020-01-19 | 2021-08-27 | 中南大学 | Enhanced boiling heat transfer surface utilizing synergistic effect of microstructure and composite wettability |
| CN111834309A (en) * | 2020-07-21 | 2020-10-27 | 西安科技大学 | Mixed wettability micro-nano composite enhanced heat exchange structure and preparation method thereof |
| CN112857118A (en) * | 2021-01-08 | 2021-05-28 | 厦门大学 | Method and device for regulating and controlling hydrophilicity and hydrophobicity of surface of carbon nanotube array based on external electric field/plasma for enhancing phase change heat exchange |
| CN113380737A (en) * | 2021-04-28 | 2021-09-10 | 西安交通大学 | Y-shaped immersed capillary micro-channel enhanced heat dissipation structure and manufacturing method thereof |
| CN113380737B (en) * | 2021-04-28 | 2024-05-07 | 西安交通大学 | Y-shaped immersed capillary microchannel reinforced heat dissipation structure and manufacturing method thereof |
| CN113731771A (en) * | 2021-08-20 | 2021-12-03 | 南京理工大学 | Micro-channel with three-dimensional composite wettability surface and preparation method thereof |
| CN114653951A (en) * | 2022-03-17 | 2022-06-24 | 西安交通大学 | Hydrophilic-hydrophobic coupling porous medium array structure and preparation method thereof |
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