CN104406440A - Silicon-based miniature loop heat pipe cooler - Google Patents
Silicon-based miniature loop heat pipe cooler Download PDFInfo
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- CN104406440A CN104406440A CN201410619219.XA CN201410619219A CN104406440A CN 104406440 A CN104406440 A CN 104406440A CN 201410619219 A CN201410619219 A CN 201410619219A CN 104406440 A CN104406440 A CN 104406440A
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Abstract
The invention provides a silicon-based miniature loop heat pipe cooler, which comprises a semiconductor silicon wafer and a heat-resisting borosilicate glass sheet which are bonded together; an evaporator, a condenser, a liquid compensator, a liquid-phase channel, a vapor-phase channel and a vacuumizing/liquid injection micro-channel are etched on the surface, in contact with the borosilicate glass sheet, of the silicon wafer; two ends of the evaporator and two ends of the condenser are connected respectively through the liquid-phase channel and the vapor-phase channel to form a closed loop; a liquid storage cavity is arranged on the liquid-phase channel; the evaporator comprises small conduits; the condenser comprises a condensation serpentine channel; the evaporator is communicated with the vacuumizing/liquid injection micro-channel; a vacuumizing/liquid injection hole which can be communicated with the vacuumizing/liquid injection micro-channel is processed in the borosilicate glass sheet. The silicon-based miniature loop heat pipe cooler provided by the invention can be directly integrated with a semiconductor microelectronic chip, and therefore the temperature and the temperature gradient of the chip are effectively reduced, the 'hotspot' problem caused by local high heat flow is reduced and weakened, and the safe and reliable operation of the chip is ensured.
Description
Technical field
The invention belongs to the temperature control field of microelectronic chip, especially a kind of silicon-base miniature loop circuit heat pipe cooler.
Background technology
In recent years, along with each electronic device and equipment (as computer chip etc.) are to the development trend of high-performance and microminaturization, during their work, generation working heat load is increased and the problem causing caloric value excessive fast, have a strong impact on service behaviour and the security reliability of electronic device.Meanwhile, the heating inequality of microelectronic chip itself will produce " focus " in local surfaces, and it exists the key reason being considered to cause chip " thermal failure ", threatening security of system.The feature narrow and small for microelectronic chip cooling space, heat radiation is difficult, for controlling chip temperature in level of security and improving its uniform temperature, minimizing local " focus ", needs micro-cooling technology of Development of Novel badly.
In various heat dissipation from microelectronic devices cooling technology, microminiature loop circuit heat pipe (LPH), because its heat dispersion is remarkable and structural configuration receives publicity just day by day, is considered to a kind of very promising novel chilly but heat dissipation technology.At present, this heat pipe makes mainly through the connection of capillary and metallic plate (block) the U-shaped channel structure forming loop or the wick structure of directly processing on a metal plate for forming evaporimeter and condenser and realizes.As in " Design of miniature loop heat pipe " (design of small loop heat pipe) that Chu etc. delivers on " Heat Transfer-Asian Research " (33 volume 42-55 pages in 2004) the evaporimeter wick structure that proposes be separated from each other and the loop circuit heat pipe both are connected by pipeline with condenser; And patent No. US20130233521A1, name is called a kind of dull and stereotyped loop circuit heat pipe directly processing evaporimeter, condenser and loop structure on flat board disclosed in the United States Patent (USP) of " Loop heat pipe and electronic equipment using the same " (cooling device based on loop circuit heat pipe), and this dull and stereotyped loop circuit heat pipe can have multiple evaporimeter or condenser.Made the capillary pump loop obtained by said method, generally by direct contact the with microelectronic component, heat is taken out of, reduce its operating temperature thus.This radiating mode can introduce additional contact thermal resistance in connection procedure, reduces radiating efficiency, and also there is larger limitation in minimizing chip surface local " focus "; Meanwhile, the problem that thermal stress also may be caused because of material compatibility to concentrate, shows even more serious when device self-temperature skewness.
Summary of the invention
Be difficult to effectively to solve microelectronic chip working heat load for existing LPH heat dissipation technology increase fast and cause the uneven problem producing local " focus " on surface of itself heating, the invention provides a kind of silicon-base miniature loop circuit heat pipe cooler, effectively can reduce the temperature at chip " focus " position, improve cooling efficiency, strengthen heat transfer temperature control capacity in conjunction with the self-characteristic of LPH and the advantage of micro heattransfer, make the service behaviour of microelectronic chip more safe and reliable.
For solving the problem, the present invention adopts following technical scheme.
A kind of silicon-base miniature loop circuit heat pipe cooler, is characterized in that, comprise the semi-conductor silicon chip be bonded together, heat-resisting pyrex sheet; The surface that described silicon chip contacts with pyrex sheet is etched with evaporimeter, condenser, liquid reservor, liquid channel, vapor phase channel and vacuumizes/reservoir channel; Described evaporimeter is connected with vapor phase channel respectively by liquid channel with the two ends of condenser, forms closed-loop path; Described liquid channel is provided with liquid storage cylinder; Described evaporimeter comprises microchannel; Described condenser comprises condensation serpentine channel; Evaporimeter with vacuumize/reservoir channel is communicated with, described pyrex sheet is processed with and vacuumizes/liquid injection hole, described in vacuumize/liquid injection hole can with vacuumize/fluid injection microchannel is communicated with.
Preferably, described condensation snake type passage is several equidistant arrangement and the U-shaped passage formation be communicated with.
Preferably, the microchannel structure of described evaporimeter is several through the evaporation microchannel between liquid channel, vapor phase channel, or be micro-rib array capillary structure, described micro-rib array capillary structure is multiple being formed through etching the micro-rib stayed on described silicon chip with arrayed, forms microchannel between micro-rib.
Preferably, the cross section of described micro-rib is rectangle, triangle or circle, the arrayed mode of described micro-rib is in-line arrangement or fork row, in described micro-rib array capillary structure, micro-rib width is 100 ~ 300 μm, length is 400 ~ 1200 μm, spacing between the micro-rib of two row is 50 ~ 300 μm, and the spacing between the micro-rib of two row is 50 ~ 300 μm.
Preferably, the cross section of described condensation serpentine channel is trapezoidal, and the passage hydraulic diameter of condensation serpentine channel is 500 ~ 2000 μm; The passage hydraulic diameter of the microchannel structure of evaporimeter gets 100 ~ 200 μm.
Preferably, the diameter of described liquid channel is less than the diameter of vapor phase channel.
Preferably, described vapor phase channel increases from evaporimeter to condenser dimension linear; Liquid channel reduces from liquid reservor to condenser dimension linear.
Preferably, vacuumize described in/fluid injection microchannel in liquid working substance fill that volume accounts for whole silica-based loop cumulative volume 25% ~ 40%.
Preferably, described filled liquid working substance is the one in water, ethanol, liquid cooled electronics FC-72.
Preferably, the silicon chip of described silica-based micro-cooler can directly and semiconductor microelectronic integrated chip be integrated.
The present invention is by semi-conductor silicon chip and heat-resisting pyrex sheet electrostatic bonding technology, by pyrex be etched with evaporimeter, condenser, liquid reservor, liquid channel, vapor phase channel and vacuumize/the semi-conductor silicon chip bonding of reservoir channel is integrated, formed by the silicon-base miniature loop circuit heat pipe cooler of glass capsulation.Evaporimeter described in the present invention is connected with liquid channel by liquid reservor, vapor phase channel with condenser, forms closed-loop path.Evaporimeter absorbs the heat produced from microelectronic chip work, and cooling working medium, after accepting heat, evaporative phase-change occurs, and becomes vapour phase from liquid phase.Under the effect of evaporimeter and condenser working medium pressure reduction, the vapour phase working medium that evaporation is formed is moved to condenser through vapour phase loop, after cooling, liquid phase is reverted to again at condenser place, under differential pressure action, cooling fluid enters liquid reservor along liquid-phase loop, and Returning evaporimeter, continue heat absorption evaporation, and so forth, periodic duty.
Compared with prior art, beneficial effect of the present invention is:
(1) when using, silicon-base miniature loop circuit heat pipe cooler and semiconductor microelectronic integrated chip are integrated, " focus " position heat making chip temperature higher, through being passed to the lower position of temperature with its LPH directly integrated, realizes the effect reducing and balance the temperature difference; Silicon-base miniature loop circuit heat pipe cooler is made directly effectively to reduce the temperature at chip " focus " position, improve heat radiation, cooling effectiveness, strengthen heat transfer temperature control capacity in conjunction with the self-characteristic of silicon-base miniature loop circuit heat pipe cooler and the advantage of micro heattransfer, make the service behaviour of microelectronic chip more safe and reliable.
(2) the silicon-base miniature loop circuit heat pipe cooler inside described in the present invention comprises micro-rib array capillary structure, this micro-rib array capillary structure is multiple being formed by described silicon chip etching the micro-rib stayed with arrayed, interval between the micro-rib of two rows is less, the abundant development in boundary layer can be destroyed, make whole microchannel mean boundary-layer thickness along its length thinning with this, thus play the effect of enhanced heat exchange.Meanwhile, this micro-rib array capillary structure can reduce Working fluid flow resistance, and significantly the described LPH evaporimeter of enhancing is wetting/from wetting effect, postpone the problem of dryouting that it causes because working medium is not enough under higher thermal load condition, improve the heat transport limitation of heat pipe.
(3) silica-based LPH cooler of the present invention, owing to having the heat conduction reinforced advantage under the feature of traditional LPH and minute yardstick, it is made effectively to overcome the function having again enhanced heat exchange while traditional heat-dissipating mode is difficult to tackle " chip-scale cooling " deficiency concurrently.
(4) connect the vapor phase channel of evaporimeter and condenser and the diameter change of liquid channel in the present invention, the vapour-liquid two-phase working substance be conducive to because of not liquefaction or vaporization is completely the periodic duty of Taylor's stream mode in vapour/liquid channel.
(5) in the present invention by silica-based LPH and microelectronic chip integrated be made in one, can effectively reduce traditional cooling cost, reduce energy consumption, and can improve chip cooling effect and carrying thermic load ability.
Accompanying drawing explanation
Fig. 1 is a kind of embodiment schematic diagram of etching structure on described semi-conductor silicon chip surface.
Fig. 2 is the another kind of embodiment schematic diagram of etching structure on described semi-conductor silicon chip surface.
Fig. 3 is described heat-resisting pyrex structure chart.
In figure:
1-semi-conductor silicon chip, 2-evaporimeter, 3-condenser, 4-liquid reservor, 5-liquid channel, 6-vapor phase channel, 7-evaporates microchannel, 8-condensation serpentine channel, 9-vacuumizes/fluid injection microchannel, 10-micro-rib array capillary structure, and the heat-resisting pyrex sheet of 11-, 12-vacuumizes/liquid injection hole.
Detailed description of the invention
Below in conjunction with accompanying drawing and specific embodiment, the present invention is further illustrated, but protection scope of the present invention is not limited to this.
Embodiment 1
A kind of silicon-base miniature loop circuit heat pipe cooler comprises the semi-conductor silicon chip 1 and heat-resisting pyrex sheet 11 that are bonded together, and described semi-conductor silicon chip 1 can be integrated with semiconductor microelectronic integrated chip.As shown in Figure 1, the surface etch that described silicon chip 1 contacts with described pyrex sheet 11 has evaporimeter 2, condenser 3, liquid reservor 4, liquid channel 5, vapor phase channel 6 and vacuumizes/reservoir channel 9.Described evaporimeter 2 is connected with vapor phase channel 6 respectively by liquid channel 5 with the two ends of condenser 3, forms closed-loop path.Liquid storage cylinder 4 is positioned on described liquid channel 5, near the position of evaporimeter 2.Described condensation snake type passage 8 is several equidistant arrangement and the U-shaped passage be communicated with is formed.Described U-shaped port number is 2 ~ 8 and is suitable for, and the passage hydraulic diameter of condensation serpentine channel 8 is 500 ~ 2000 μm and is suitable for.The microchannel structure of described evaporimeter 2 is severally to form through the evaporation microchannel 7 between liquid channel 5, vapor phase channel 6.The passage hydraulic diameter of the microchannel structure of evaporimeter 2 is got 100 ~ 200 μm and is suitable for.Evaporimeter 2 with vacuumize/reservoir channel 9 is communicated with.As shown in Figure 3, heat-resisting pyrex sheet 11 is processed with vacuumizes/liquid injection hole 12; Vacuumize/liquid injection hole 12 be positioned at can with vacuumize/the position that is connected of the apical position of fluid injection microchannel 9.Described to vacuumize/fluid injection microchannel 9 in fill volume and account for the water of 25% ~ 40% of whole silica-based loop cumulative volume, ethanol or liquid cooled electronics FC-72.
The diameter of described liquid channel 5 is less than the diameter of vapor phase channel 6.Particularly, in the present embodiment, the width of liquid channel 5 is 500 μm, and the width of vapor phase channel 5 is 800 μm.Condenser includes and is 900 μm, equidistantly arrangement and the U-shaped passage be communicated with forms condensation snake type passage 8 by 3 channel widths.Wide 200 μm and through the evaporation microchannel 7 between liquid channel 5, vapor phase channel 6 containing 15 in evaporimeter 2.
The microchannel dry etching degree of depth is 200 μm, and the hydraulic diameter of the liquid channel 5 of the square-section formed thus, vapor phase channel 6, evaporation microchannel 7 and the U-shaped passage 8 of condensation is respectively 285.7 μm, 320 μm, 200 μm and 327.3 μm.The liquid reservor 4 be positioned on liquid channel 5 is the rectangle of 8000 μm × 2750 μm, the evaporation capacity of evaporimeter worker quality liquid under different thermic load effectively can be controlled by liquid reservor 4, and bear the task of regulating condenser 3 cooling heat dissipation area, the operating temperature of control chip thus.
Described silica-based LPH cooler can be directly integrated with microelectronic chip, realizes eliminating function to the direct cooling of chip and " focus " by the phase transformation of water in loop and vapour, liquid two-phase shuttling movement.
Embodiment 2
As shown in Figure 2, the microchannel structure of described evaporimeter 2 as different from Example 1.In the present embodiment, the microchannel structure of evaporimeter 2 is that micro-rib array capillary structure 10 is formed.Described micro-rib array capillary structure 10 is multiple being formed through etching the micro-rib stayed on described silicon chip with arrayed, forms microchannel between micro-rib.Micro-rib width is 100 ~ 300 μm, length is 400 ~ 1200 μm, and the spacing between the micro-rib of two row is 50 ~ 300 μm, and the spacing between the micro-rib of two row is 50 ~ 300 μm.The cross section of described micro-rib is rectangle, triangle or circle, and the arrayed mode of described micro-rib is in-line arrangement or fork row.
Particularly, in the present embodiment, described micro-rib array capillary structure 10 array way is in-line arrangement, comprise transversely arranged 15 row, longitudinal arrangement 7 row, the width of the micro-rib of rectangle is 200 μm, length is 1000 μm, and the spacing between the micro-rib of two row is 300 μm, and the spacing between the micro-rib of two row is 300 μm.
Embodiment 3
On the basis of embodiment 1 or embodiment 2, in the present embodiment, the sectional dimension of liquid channel 5 and vapor phase channel 6 linearly changes along channel direction, wherein liquid channel 5 reduces from liquid reservor 4 to condenser 3 dimension linear, and vapor phase channel 6 then increases from evaporimeter 2 to condenser 3 dimension linear.The sectional area of liquid channel 5 linearly reduces change from liquid storage cylinder 4 to condenser 3 direction, channel width is reduced to 300 μm by 600 μm, and respective channel hydraulic diameter is reduced to 240 μm by 300 μm; And vapor phase channel 6 width is increased to 1000 μm by 500 μm, respective channel hydraulic diameter is increased to 333.3 μm by 285.7 μm.Through above adjustment, be conducive to strengthening the spontaneous capillary moving effect of vapour-liquid two-phase cooling working medium in liquid channel 5 and vapor phase channel 6 of failing to liquefy completely or vaporize, reduce flow resistance, thus make the flowing of working medium in whole miniature loop heat pipe cooler more unimpeded, improve its runnability.
Embodiments of the present invention are not restricted to the described embodiments, and wherein in liquid channel 5 and vapor phase channel 6 width and condenser 2, in serpentine channel and evaporimeter 3, the width of microchannel and quantity can adjust according to actual needs.And the etching depth of microchannel equally also can adjust.
Described embodiment is preferred embodiment of the present invention; but the present invention is not limited to above-mentioned embodiment; when not deviating from flesh and blood of the present invention, any apparent improvement that those skilled in the art can make, replacement or modification all belong to protection scope of the present invention.
Claims (10)
1. a silicon-base miniature loop circuit heat pipe cooler, is characterized in that, comprises the semi-conductor silicon chip (1), the heat-resisting pyrex sheet (11) that are bonded together; The surface that described silicon chip (1) contacts with pyrex sheet (11) is etched with evaporimeter (2), condenser (3), liquid reservor (4), liquid channel (5), vapor phase channel (6) and vacuumizes/reservoir channel (9); Described evaporimeter (2) is connected with vapor phase channel (6) respectively by liquid channel (5) with the two ends of condenser (3), forms closed-loop path; Described liquid channel (5) is provided with liquid storage cylinder (4); Described evaporimeter (2) comprises microchannel; Described condenser (3) comprises condensation serpentine channel (8); Evaporimeter (2) with vacuumize/reservoir channel (9) and be communicated with, described pyrex sheet (11) is processed with and vacuumizes/liquid injection hole (12), described in vacuumize/liquid injection hole (12) can with vacuumize/fluid injection microchannel (9) be communicated with.
2. silicon-base miniature loop circuit heat pipe cooler according to claim 1, is characterized in that, described condensation snake type passage (8) for several equidistant arrangement and the U-shaped passage be communicated with form.
3. silicon-base miniature loop circuit heat pipe cooler according to claim 1, it is characterized in that, the microchannel structure of described evaporimeter (2) is several through the evaporation microchannel (7) between liquid channel (5), vapor phase channel (6), or be micro-rib array capillary structure (10), described micro-rib array capillary structure (10) is multiple being formed through etching the micro-rib stayed on described silicon chip with arrayed, forms microchannel between micro-rib.
4. silicon-base miniature loop circuit heat pipe cooler according to claim 3, it is characterized in that, the cross section of described micro-rib is rectangle, triangle or circle, the arrayed mode of described micro-rib is in-line arrangement or fork row, in described micro-rib array capillary structure (10), micro-rib width is 100 ~ 300 μm, length is 400 ~ 1200 μm, spacing between the micro-rib of two row is 50 ~ 300 μm, and the spacing between the micro-rib of two row is 50 ~ 300 μm.
5. silicon-base miniature loop circuit heat pipe cooler according to claim 1, is characterized in that, the cross section of described condensation serpentine channel is trapezoidal, and the passage hydraulic diameter of condensation serpentine channel (8) is 500 ~ 2000 μm; The passage hydraulic diameter of the microchannel structure of evaporimeter (2) gets 100 ~ 200 μm.
6. silicon-base miniature loop circuit heat pipe cooler according to claim 1, is characterized in that, the diameter of described liquid channel (5) is less than the diameter of vapor phase channel (6).
7. silicon-base miniature loop circuit heat pipe cooler according to claim 6, is characterized in that, described vapor phase channel (6) increases from evaporimeter (2) to condenser (3) dimension linear; Liquid channel (5) reduces from liquid reservor (4) to condenser (3) dimension linear.
8. silicon-base miniature loop circuit heat pipe cooler according to claim 1, is characterized in that, described in vacuumize/fluid injection microchannel (9) interior liquid working substance fill that volume accounts for whole silica-based loop cumulative volume 25% ~ 40%.
9. silicon-base miniature loop circuit heat pipe cooler according to claim 8, is characterized in that, described filled liquid working substance is the one in water, ethanol, liquid cooled electronics FC-72.
10. silicon-base miniature loop circuit heat pipe cooler according to any one of claim 1 to 9, is characterized in that, described silicon chip can directly and semiconductor microelectronic integrated chip be integrated.
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| CN201410619219.XA CN104406440A (en) | 2014-11-06 | 2014-11-06 | Silicon-based miniature loop heat pipe cooler |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105161473A (en) * | 2015-07-09 | 2015-12-16 | 江苏中圣压力容器装备制造有限公司 | Micro silicon-based capillary pump loop cooler |
| CN106643243A (en) * | 2016-12-14 | 2017-05-10 | 江苏大学 | Silicon-based micro pulse heat pipe with micro/nano composite structures |
| CN111578756A (en) * | 2020-04-02 | 2020-08-25 | 南方科技大学 | Gradient wettability loop heat pipe |
| CN113423237A (en) * | 2021-05-13 | 2021-09-21 | 东南大学 | 5G basic station phase transition heat abstractor |
| CN113446888A (en) * | 2021-06-30 | 2021-09-28 | 华中科技大学 | Multi-evaporator flat-plate loop heat pipe system suitable for long-distance heat transmission |
| CN114791237A (en) * | 2021-01-26 | 2022-07-26 | 山东大学 | Loop heat pipe |
| CN115087295A (en) * | 2021-03-12 | 2022-09-20 | 北京小米移动软件有限公司 | Middle frame assembly, manufacturing method of middle frame assembly and mobile terminal |
| CN115876010A (en) * | 2022-03-18 | 2023-03-31 | 山东大学 | Loop heat pipe formed by combination |
| CN116007416A (en) * | 2022-03-18 | 2023-04-25 | 山东大学 | Loop heat pipe of manifold evaporator |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105161473A (en) * | 2015-07-09 | 2015-12-16 | 江苏中圣压力容器装备制造有限公司 | Micro silicon-based capillary pump loop cooler |
| CN106643243A (en) * | 2016-12-14 | 2017-05-10 | 江苏大学 | Silicon-based micro pulse heat pipe with micro/nano composite structures |
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| CN114791237A (en) * | 2021-01-26 | 2022-07-26 | 山东大学 | Loop heat pipe |
| CN114791237B (en) * | 2021-01-26 | 2024-05-17 | 山东大学 | Loop heat pipe |
| CN115087295A (en) * | 2021-03-12 | 2022-09-20 | 北京小米移动软件有限公司 | Middle frame assembly, manufacturing method of middle frame assembly and mobile terminal |
| CN113423237A (en) * | 2021-05-13 | 2021-09-21 | 东南大学 | 5G basic station phase transition heat abstractor |
| CN113446888B (en) * | 2021-06-30 | 2022-05-20 | 华中科技大学 | Multi-evaporator flat-plate loop heat pipe system suitable for long-distance heat transfer |
| CN113446888A (en) * | 2021-06-30 | 2021-09-28 | 华中科技大学 | Multi-evaporator flat-plate loop heat pipe system suitable for long-distance heat transmission |
| CN115876010A (en) * | 2022-03-18 | 2023-03-31 | 山东大学 | Loop heat pipe formed by combination |
| CN116007416A (en) * | 2022-03-18 | 2023-04-25 | 山东大学 | Loop heat pipe of manifold evaporator |
| CN115876010B (en) * | 2022-03-18 | 2024-05-10 | 山东大学 | Loop heat pipe formed by combination |
| CN116007416B (en) * | 2022-03-18 | 2024-05-10 | 山东大学 | Loop heat pipe of manifold evaporator |
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