CN104132569B - A kind of silicon-base miniature pulsating heat pipe with function channel design - Google Patents
A kind of silicon-base miniature pulsating heat pipe with function channel design Download PDFInfo
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- CN104132569B CN104132569B CN201410025799.XA CN201410025799A CN104132569B CN 104132569 B CN104132569 B CN 104132569B CN 201410025799 A CN201410025799 A CN 201410025799A CN 104132569 B CN104132569 B CN 104132569B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
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- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to pulsating heat pipe, refer in particular to the miniature pulsating heat pipe described in a kind of silicon-base miniature pulsating heat pipe having function channel design and formed by a pair semi-conductor silicon chip and heat-resisting pyrex sheet bonding, described pyrex sheet is machined with evacuation/liquid injection hole；Described evacuation/liquid injection hole is corresponding with the apical position of the evacuation on semi-conductor silicon chip/fluid injection micro-channel, and described silicon chip is etched with some micro-channel, it is characterised in that: the width of described micro-channel linearly changes along heat pipe length direction.Instant invention overcomes common uiform section passage silicon-base miniature pulsating heat pipe internal working medium to be difficult to form global orientation shuttling movement and evaporator section deficiencies such as " dryouting " easily occurs, realize improving its cooling temperature-control performance and the ability of carrying thermic load by adjusting pulsating heat pipe channel cross-section size and heat pipe configuration.
Description
Technical field
The present invention relates to pulsating heat pipe, refer in particular to a kind of silicon-base miniature pulsating heat pipe having function channel design, can effectively promote
Enter the functional type channel design silicon-base miniature pulsating heat pipe of working medium circulation motion, have more preferably than normal miniature pulsating heat pipe
Heat-transfer effect, can be applicable to the efficiently cooling temperature control field of integrated IC electronic devices and components.
Background technology
Along with developing rapidly of microelectric technique and large scale integrated circuit, the calorific intensity of various microelectronic chips more comes
The biggest, if the heat of generation cannot be got rid of in time, the microelectronic element even service behaviour of whole system will be had a strong impact on and make
Use the life-span；Therefore, the microelectronics temperature control technology of development high-efficiency compact, to solve chip cooling technique narrow space, difficulty etc. of dispelling the heat is asked
Topic is that the urgent task faced is developed in this field current.
In various heat dissipation from microelectronic devices cooling technologies, pulsating heat pipe because of its simple in construction, without wick and solely
Special heat dispersion and good space adaptability are the most of increasing concern it is considered to be the novel of a kind of great development prospect dissipates
Hot cooling technology；But the overall dimensions of common pulsating heat pipe is relatively big, the microelectronic chip chi the most height-limited with heat-dissipating space
Little progress row is effectively matched becomes its key factor applied in this field of restriction, and recently, Qu etc. is at " International
Journal of Heat and Mass Transfer " send out on (international heat and mass magazine) (volume 55 in 2012,21-22 phase)
" Start-up, the heat transfer and flow characteristics of silicon-based micro of table
Pulsating heat pipes " (startup of silicon-base miniature pulsating heat pipe, heat transfer and flow behavior) literary composition proposes one
By MEMS technology by the miniature pulsating heat pipe technology of pyrex He the silicon chip processing and fabricating being etched with micro-channel, this technology
Can significantly reduce the overall dimensions of pulsating heat pipe, and it directly can be integrated with integrated chip, really realize chip-scale
(chip-level) refrigerating function, can effectively solve the thermal stress concentration problem caused because material is incompatible simultaneously；But research
Finding, along with the increase of heating power, miniature pulsating heat pipe evaporator section easily occurs that liquid phase volume share is gradually reduced, the most even
Being wholly absent the state presenting " dryouting ", liquid phase cannot be introduced into wherein being limited near condensation segment, and vibration is suppressed, heat transfer
Temperature control capacity is remarkably decreased；Meanwhile, this article points out that the generation of above-mentioned phenomenon is straight mainly due to miniature pulsating heat pipe passage waterpower
Footpath is little is within it difficult to be formed the overall shuttling movement of similar common compact pulsating heat pipe to working medium after certain size, and this is to raising
Its heat transfer temperature control capacity is totally unfavorable, easily causes the overheated of chip local temperature in actual application；Therefore, MEMS skill how is utilized
Art unique advantage in terms of micro Process suitably adjusts or improves the channel design of miniature pulsating heat pipe or even the overall structure of heat pipe
Type, also becomes the key point of this micro cooler development and application improving its carrying heat absorption ability and cooling temperature-control performance.
Summary of the invention
It is an object of the invention to overcome common uiform section passage silicon-base miniature pulsating heat pipe internal working medium to be difficult to be formed whole
Easily there is deficiencies such as " dryouting " in the motion of body directed circulation and evaporator section, by adjusting pulsating heat pipe channel cross-section size and heat pipe structure
Type realizes improving its cooling temperature-control performance and the ability of carrying thermic load.
The operation principle of the present invention is as follows:
In the gradual change of channel cross-section size can make passage, liquid plug both sides produce asymmetric surface tension force, thus drive bubble
(vent plug) moves towards certain direction, and changing silicon-base miniature pulsating heat pipe channel cross-section size by the way of continuous gradation can be real
Existing identity function, in making heat pipe passage, arbitrary vent plug is formed under anisopleual surface tension effects and moves to certain direction
Effect.When this kind of effect can be formed internal vapour, liquid plug working medium global orientation circulating after whole heat pipe channel loop
Dynamic impetus, promotes the generation of its cyclic process.
Fig. 1 with local unit in the function channel design a certain passage of miniature pulsating heat pipe of steady operation for analyze object,
Give the steam binding both sides force analysis situation drawn according to above-mentioned principle.
Wherein, the pressure reduction between left side steam binding and liquid plug is:
(1)
Pressure reduction between right side steam binding and liquid plug is:
(2)
Owing in steam binding, the density of steam is less, in therefore supposing whole vent plug in Fig. 1, pressure is equal, according to formula (1) and
(2) can obtain vent plug both sides institute pressure difference is:
(3)
Ignore the thickness of liquid film in Fig. 1, then steam binding arranged on left and right sides radius r1And r2Can approximate and be considered as correspondence position channel width
The half (assuming that channel cross-section is rectangle) of degree.
In conjunction with Fig. 1, by formula (3) it appeared that steam binding is driven, i.e. in this variable section channel by capillary force from left to right
There is the active force moved to larger cross-section direction by small cross sections on middle vent plug, and drive adjacent liquid plug to produce motion together,
According to this principle, when the channel cross-section of silicon-base miniature pulsating heat pipe changes, the working medium in heat pipe passage can produce oneself
Driving force, promotes the formation of its global orientation (clockwise or counterclockwise) shuttling movement.
The variable cross-section miniature pulsating heat pipe of function channel design of the present invention is inheriting common uiform section Channel Micro pulsation heat
While pipe plurality of advantages, also have the advantage that
1. in the case of variable cross-section, the liquid plug in the arbitrary passage of pulsating heat pipe is adjacent both sides vent plug interfacial surface tension size
Difference, this influence of unbalance power can be ordered about liquid plug from the little side of channel cross-sectional area towards sectional area big side autonomic movement, thus be promoted heat
Vapour in pipe, liquid plug do directed circulation motion in whole loop, even if overcoming common miniature pulsating heat pipe at heating power relatively
Time high, its internal working medium is also difficult to be formed the deficiency of overall shuttling movement, strengthens heat-transfer capability.
2. the feature of the miniature pulsating heat pipe of variable section channel beneficially formation working medium directed circulation motion also can be in time to evaporation
The supplementary condensed fluid of section, hence it is evident that suppression evaporator section " dryouies " appearance of state, the strong ability promoting its carrying thermic load and cooling
Temperature-control performance, thus balances microelectronic chip " focus " temperature and strengthens its overall uniform temperature.
Accompanying drawing explanation
Fig. 1 is that local unit is right for analyzing in the function channel design a certain passage of miniature pulsating heat pipe of steady operation
As, the steam binding both sides force analysis situation schematic diagram drawn.
Fig. 2 is a kind of function channel design silicon-base miniature pulsating heat pipe silicon chip structure chart of the present invention.
Fig. 3 is the second function channel design silicon-base miniature pulsating heat pipe silicon chip structure chart of the present invention.
Fig. 4 is the third function channel design silicon-base miniature pulsating heat pipe silicon chip structure chart of the present invention.
Fig. 5 is the pyrex chip architecture figure constituting silicon-base miniature pulsating heat pipe in the present invention.
Label declaration in figure: 1, evacuation/fluid injection micro-channel；2, silicon chip；3, the micro-channel on silica-based；4, evacuation/note
Fluid apertures；5, pyrex sheet.
Detailed description of the invention
For further appreciating that present disclosure, below in conjunction with Figure of description and specific embodiment, the present invention is carried out
Describe in detail.
The present invention passes through MEMS electrostatic bonding technology, pyrex and the silicon chip being etched with function channel structure is passed through
Anode linkage technology is integrated, and is formed by the function channel design silicon-base miniature pulsating heat pipe of glass capsulation.
Embodiment 1
As shown in figures 2 and 5, a kind of function channel design silicon-base miniature pulsating heat pipe is by a pair semi-conductor silicon chip 2 and heat-resisting
Pyrex sheet 5 bonding forms；The surface that wherein silicon chip 2 contacts with pyrex sheet is etched by plasma dry etching technology
There is the micro-channel 3 of square-section；Evacuation/liquid injection hole 4 it is machined with on pyrex sheet 5；Evacuation/liquid injection hole 4 with partly lead
The apical position of the evacuation on body silicon chip/fluid injection micro-channel 1 is corresponding, and evacuation/fluid injection micro-channel 1 accesses micro-channel 3, from
Described evacuation/liquid injection hole 4 fills the FC-72 of 50% volume fraction.
In Fig. 2, silicon chip size is 50 mm × 35 mm, and wherein heat pipe longitudinal length is 40 mm, and transverse width is 28 mm,
It is carved with the micro-channel that 16 centrage end edge circle long with silicon chip are parallel to each other on silicon chip, and respectively forms 8 U-shaped elbows in both sides；
The shape of cross section of micro-channel is rectangle, the degree of depth 280 μm, and width is continuously linear change along heat pipe channel-length direction, less
Side width is 350 μm, and bigger side is 700 μm, and corresponding passage two ends cross section equivalent diameter is respectively 321.3 μm
With 400 μm, the passage equivalent diameter between two ends the most linearly changes.
According to aforesaid operation principle, this function channel design silicon-base miniature pulsating heat pipe is changed by channel cross-section size
Become the trend making vapour in heat pipe passage, liquid plug have directed movement toward the clockwise direction, thus promote the higher situation of heating power
The formation of lower hot intraductal working medium global orientation shuttling movement, strengthens heat transfer temperature control capacity.
Embodiment 2
As shown in Figures 3 and 5, with embodiment 1, except that the microflute of this function channel design silicon-base miniature pulsating heat pipe
Road 3 and the existence certain difference in Fig. 2；This micro-channel shape of cross section is the most same as in Example 1 with the degree of depth, but adjacent in Fig. 3
Article two, the width of micro-channel only has one along heat pipe channel-length direction is continuously linear change, its less side equivalent diameter
Being 321.3 μm, bigger side equivalent diameter is 400 μm；And another micro-channel width 525 μm adjacent thereto keeps not
Becoming, equivalent diameter is 365.2 μm.
Equally, when heating power is higher vapour in this silicon-base miniature pulsating heat pipe passage under channel structure as shown in Figure 3,
Liquid plug also can realize directed movement toward the clockwise direction.
Embodiment 3
With embodiment 1 and embodiment 2, the micro-channel shape of cross section of function channel design silicon-base miniature pulsating heat pipe is with deep
Spending the most same as in Example 1, heat pipe longitudinal length is 40 mm, and transverse width is 24.5mm, and silicon chip is carved with 14 micro-channel,
And 7 U-shaped elbows are respectively formed in both sides；The shape of cross section of micro-channel is rectangle, the degree of depth 280 μm, except that its microflute
Road is as shown in Fig. 43；The now change of micro-channel width be by the border in micro-channel along channel-length direction in continuously
Linear change, another border is then parallel with silicon chip border, and the least side width is 280 μm, and bigger side is 770 μ
M, corresponding passage two end section equivalent diameter is respectively 280 μm and 410 μm.
In the case of this kind, the most similar to embodiment 1 structure, working medium same energy in heat pipe circuit when heating power is higher
Enough realize global orientation shuttling movement, improve cooling temperature control capacity.
Claims (8)
1. a function channel design silicon-base miniature pulsating heat pipe, described miniature pulsating heat pipe is by a pair semi-conductor silicon chip and resistance to
Hot pyrex sheet bonding forms, and described pyrex sheet is machined with evacuation/liquid injection hole；Described evacuation/
Liquid injection hole is corresponding with the apical position of the evacuation on semi-conductor silicon chip/fluid injection micro-channel, described silicon chip is etched with some
Micro-channel, it is characterised in that: the width of described micro-channel linearly changes along heat pipe length direction, leads to by adjusting pulsating heat pipe
Road sectional dimension and heat pipe configuration realize improving its cooling temperature-control performance and the ability of carrying thermic load；In described micro-channel
Heart line end edge circle long with silicon chip is parallel to each other, and micro-channel two edge passage length linearly increases or reduces；Or described micro-channel
In, it is that continuously linear becomes along heat pipe channel-length direction that the width of adjacent two micro-channel only has the both sides of a micro-channel
Changing, the centrage of this micro-channel end edge circle long with silicon chip is parallel to each other；Another micro-channel width keeps constant, the two of micro-channel
Limit end edge circle long with silicon chip is parallel to each other；Or the border in described micro-channel is that continuously linear becomes along channel-length direction
Changing, another border is then parallel with silicon chip border.
A kind of function channel design silicon-base miniature pulsating heat pipe the most according to claim 1, it is characterised in that: described is micro-
The width of conduit linearly increases along heat pipe length direction or reduces.
A kind of function channel design silicon-base miniature pulsating heat pipe the most according to claim 1, it is characterised in that: heat pipe is longitudinally
A length of 40mm, transverse width is 28mm, and silicon chip is carved with the micro-channel that 16 centrage end edge circle long with silicon chip are parallel to each other,
And 8 U-shaped elbows are respectively formed in both sides；The shape of cross section of micro-channel is rectangle, the degree of depth 280 μm, and width is long along heat pipe passage
Degree direction is continuously linear change, and less side width is 350 μm, and bigger side is 700 μm, corresponding passage two ends cross section
Equivalent diameter is respectively 321.3 μm and 400 μm, and the passage equivalent diameter between two ends the most linearly changes.
A kind of function channel design silicon-base miniature pulsating heat pipe the most according to claim 1, it is characterised in that: heat pipe is longitudinally
A length of 40mm, transverse width is 28mm, and silicon chip is carved with the micro-channel that 16 centrage end edge circle long with silicon chip are parallel to each other,
And 8 U-shaped elbows are respectively formed in both sides；The shape of cross section of micro-channel is rectangle, the degree of depth 280 μm, adjacent two micro-channel
It is continuously linear change that width only has one along heat pipe channel-length direction, and its less side equivalent diameter is 321.3 μm, relatively
Big side equivalent diameter is 400 μm；And another micro-channel width 525 μm adjacent thereto keeps constant, equivalent diameter is
365.2μm。
A kind of function channel design silicon-base miniature pulsating heat pipe the most according to claim 1, it is characterised in that: heat pipe is longitudinally
A length of 40mm, transverse width is 24.5mm, silicon chip is carved with 14 micro-channel, and respectively forms 7 U-shaped elbows in both sides；Micro-
The shape of cross section of conduit is rectangle, the degree of depth 280 μm, and the change of micro-channel width is along passage by the border in micro-channel
Length direction is continuously linear change, and another border is then parallel with silicon chip border, and the least side width is 280 μm, relatively
Big side is 770 μm, and corresponding passage two end section equivalent diameter is respectively 280 μm and 410 μm.
A kind of function channel design silicon-base miniature pulsating heat pipe the most according to claim 1, it is characterised in that: described is micro-
Conduit shape of cross section is rectangle, trapezoidal or part trapezoidal portions triangle.
A kind of function channel design silicon-base miniature pulsating heat pipe the most according to claim 1, it is characterised in that: described takes out
In vacuum/fluid injection micro-channel, liquid working substance fills volume and accounts for the 35%～65% of whole heat pipe circuit cumulative volume；Filled liquid
Working medium is environmental protection lower boiling phase-change working substance FC-72, FC7100 or R141b.
A kind of function channel design silicon-base miniature pulsating heat pipe the most according to claim 1 cools down in heat dissipation from microelectronic devices
Purposes.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111457768A (en) * | 2020-03-24 | 2020-07-28 | 东南大学 | Be applied to frozen low temperature phase transition heat exchanger of cell vitrification |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104406440A (en) * | 2014-11-06 | 2015-03-11 | 江苏大学 | Silicon-based miniature loop heat pipe cooler |
| CN105161473A (en) * | 2015-07-09 | 2015-12-16 | 江苏中圣压力容器装备制造有限公司 | Micro silicon-based capillary pump loop cooler |
| CN106643243A (en) * | 2016-12-14 | 2017-05-10 | 江苏大学 | Silicon-based micro pulse heat pipe with micro/nano composite structures |
| TWI738602B (en) * | 2020-01-22 | 2021-09-01 | 訊凱國際股份有限公司 | Multi-channel thin heat exchanger |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6977010B2 (en) * | 2000-02-01 | 2005-12-20 | Komatsu Denshi Kinzoku Kabushiki Kaisha | Apparatus for pulling single crystal by CZ method |
| CN101266110A (en) * | 2008-04-24 | 2008-09-17 | 上海交通大学 | Preparation method of micro heat pipe array chip possessing functional surface |
| CN103442541A (en) * | 2013-07-29 | 2013-12-11 | 江苏大学 | Micro cooling device of silicon-substrate capillary pump loop |
-
2014
- 2014-01-21 CN CN201410025799.XA patent/CN104132569B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6977010B2 (en) * | 2000-02-01 | 2005-12-20 | Komatsu Denshi Kinzoku Kabushiki Kaisha | Apparatus for pulling single crystal by CZ method |
| CN101266110A (en) * | 2008-04-24 | 2008-09-17 | 上海交通大学 | Preparation method of micro heat pipe array chip possessing functional surface |
| CN103442541A (en) * | 2013-07-29 | 2013-12-11 | 江苏大学 | Micro cooling device of silicon-substrate capillary pump loop |
Non-Patent Citations (1)
| Title |
|---|
| 微型硅基振荡热管传热特性;屈健等;《化工学报》;20111130;第62卷(第11期);3046～3052 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111457768A (en) * | 2020-03-24 | 2020-07-28 | 东南大学 | Be applied to frozen low temperature phase transition heat exchanger of cell vitrification |
| CN111457768B (en) * | 2020-03-24 | 2021-04-06 | 东南大学 | Be applied to frozen low temperature phase transition heat exchanger of cell vitrification |
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| CN104132569A (en) | 2014-11-05 |
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