TWM482103U - Liquid gas shunt type heat exchange chamber - Google Patents
Liquid gas shunt type heat exchange chamber Download PDFInfo
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- TWM482103U TWM482103U TW103202759U TW103202759U TWM482103U TW M482103 U TWM482103 U TW M482103U TW 103202759 U TW103202759 U TW 103202759U TW 103202759 U TW103202759 U TW 103202759U TW M482103 U TWM482103 U TW M482103U
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Description
本創作係涉及一種電子產品的散熱裝置,尤指一種電腦、通訊產品的散熱裝置。The present invention relates to a heat sink for electronic products, and more particularly to a heat sink for computers and communication products.
現有技術的電子產品的散熱裝置,大部份運用到熱管,其包含有一管路通道,管路通道包含有一蒸發段及一冷凝段,蒸發段有液體(工作流體),當蒸發段受熱而使液體蒸發成氣體後,氣體在管路通道內從蒸發段向冷凝段移動,而氣體在管路通道內移動的過程中,會因為熱交換損失而逐漸變成液體,而該液體透過管壁的毛細結構,而沿著原路回到蒸發段,然後便可再次受熱而蒸發成氣體,如此便可成功將蒸發段所受的熱帶出。Most of the heat dissipation devices of the prior art electronic products are applied to a heat pipe, which comprises a pipeline passage, the pipeline passage includes an evaporation section and a condensation section, and the evaporation section has a liquid (working fluid), and when the evaporation section is heated, After the liquid evaporates into a gas, the gas moves from the evaporation section to the condensation section in the pipeline passage, and during the movement of the gas in the pipeline passage, the gas gradually becomes a liquid due to heat exchange loss, and the liquid passes through the capillary wall of the pipe wall. The structure returns to the evaporation section along the original path, and then can be heated again to evaporate into a gas, so that the tropical zone received by the evaporation section can be successfully discharged.
然而蒸發段的液體蒸發成氣體後壓力會變大,因此氣體在管路通道內變成液體後要從原路回來時,液氣交界面的剪力作用會產生額外阻力因此最大熱傳量、傳輸距離受到限制。However, when the liquid in the evaporation section evaporates into a gas, the pressure will become larger. Therefore, when the gas returns to the original path after the gas becomes liquid in the pipeline passage, the shear force of the liquid-gas interface will generate additional resistance, so the maximum heat transfer amount and transmission. Distance is limited.
因此現在便有業者將該管路通道的兩端連接到一腔體上,並希望氣體從腔體進入管路通道的一端,在管路通道內變成液體後再從管路通道的另一端回到腔體,形成單向循環的流動而沒有液氣界面上剪力作用所造成之壓力損失;然而,由於腔體內並無任何設計以阻止氣體進入管路通道的任一端,因此腔體內的氣體反而從兩端進入到管路通道內,而最後變成液體後,不論欲從原路或另一端回到腔體,都還是受到阻礙,因此仍然無法使液體流動順暢,而整體散熱效果仍不佳。Therefore, nowadays, the manufacturer connects the two ends of the pipeline passage to a cavity, and hopes that gas enters the end of the pipeline passage from the cavity, becomes liquid in the pipeline passage, and then returns from the other end of the pipeline passage. To the cavity, a one-way flow is created without the pressure loss caused by the shear action at the liquid-gas interface; however, since there is no design in the cavity to prevent gas from entering either end of the pipe passage, the gas in the chamber Instead, it enters the pipeline channel from both ends, and after it finally becomes a liquid, it is still hindered whether it is going back to the cavity from the original road or the other end, so the liquid flow is still not smooth, and the overall heat dissipation effect is still poor. .
有鑑於前述之現有技術的缺點及不足,本創作提供一種液氣分流式熱交換腔以可使迴路式管路通道內的液體流動順暢,進而改善整體散熱效果。In view of the above shortcomings and deficiencies of the prior art, the present invention provides a liquid-gas split heat exchange chamber to smooth the flow of liquid in the loop-type pipeline passage, thereby improving the overall heat dissipation effect.
為達到上述的創作目的,本創作所採用的技術手段為設計一種液氣分流式熱交換腔,其中包含至少一腔體單元,各腔體單元包含:一腔體,其具有一內部空間,腔體內設有一分隔部,分隔部將腔體的內部空間分隔成一受熱室及一回流室,分隔部上貫穿有至少一微細道,受熱室及回流室透過該等微細道而相通,分隔部為低導熱材質;一管路通道,其兩端皆連接腔體,且兩端分別與受熱室及回流室相通,管路通道的管徑大於各微細道的孔徑。In order to achieve the above-mentioned creative purpose, the technical means adopted in the present invention is to design a liquid-gas split heat exchange chamber, which comprises at least one cavity unit, each cavity unit comprises: a cavity having an internal space, a cavity The partition body defines a partition portion that divides the inner space of the cavity into a heat receiving chamber and a return chamber. The partition portion has at least one fine passage therethrough, and the heat receiving chamber and the return chamber communicate with each other through the fine passages, and the partition portion is low. The heat conduction material; a pipeline passage, the two ends of which are connected to the cavity, and the two ends are respectively communicated with the heating chamber and the return chamber, and the diameter of the pipeline passage is larger than the diameter of each microchannel.
本創作使用時,受熱室的位置對應於熱源的位置,或者是利用熱傳導材料將熱源的熱傳導至受熱室,因此受熱室內的液體受熱蒸發成氣體,而回流室內的液體並未直接受熱,因此受熱室溫度將大於回流室,再加上分隔部可減少自受熱室傳導至回流室的熱能損失,因此使受熱室及回流室產生足夠的溫度差,並進而產生不同的飽和蒸汽壓力,該壓力差便驅使氣體自受熱室流動至回流室,而由於分隔部的微細道此時會產生毛細壓力的作用,因此受熱室的高壓氣體將經由管路通道而不會經由分隔部向回流室流動,氣體於管路通道中冷卻成液體並回到回流室後,分隔部的微細道再次產生毛細壓力作用,而使回流室內的液體回填至受熱室受熱蒸發,本創作藉此達到使流動單向循環,進而增強熱交換及散熱效果之創作目的。In the present use, the position of the heat receiving chamber corresponds to the position of the heat source, or the heat transfer material is used to conduct heat of the heat source to the heat receiving chamber, so that the liquid in the heat receiving chamber is evaporated into gas by heat, and the liquid in the return chamber is not directly heated, so the heat is heated. The chamber temperature will be greater than the return chamber, and the partition portion can reduce the heat energy loss from the heat receiving chamber to the return chamber, thereby causing a sufficient temperature difference between the heated chamber and the return chamber, and thus generating different saturated vapor pressures, which are different. The gas is driven to flow from the heat receiving chamber to the return chamber, and since the fine passage of the partition portion generates capillary pressure at this time, the high pressure gas of the heat receiving chamber will flow through the pipeline passage without flowing through the partition portion to the return chamber. After cooling into a liquid in the pipeline passage and returning to the return chamber, the fine passage of the partition portion again generates capillary pressure, and the liquid in the return chamber is backfilled to the heated chamber to be heated and evaporated, thereby achieving a one-way circulation of the flow. In turn, the purpose of creating heat exchange and heat dissipation is enhanced.
以下配合圖式及本創作之較佳實施例,進一步闡述本創作為達成預定創作目的所採取的技術手段。The technical means adopted by the present invention for achieving the intended purpose of creation are further explained below in conjunction with the drawings and the preferred embodiment of the present invention.
請參閱圖1所示,本創作之液氣分流式熱交換腔之第一實施例包含有一腔體單元100,該腔體單元100包含一腔體10及一管路通道20。Referring to FIG. 1 , the first embodiment of the liquid-gas split heat exchange chamber of the present invention comprises a cavity unit 100 , which includes a cavity 10 and a pipeline passage 20 .
請參閱圖1至圖4所示,前述之腔體10為矩形且具有一內部空間,腔體10內設有一分隔部11,分隔部11將腔體10的內部空間分隔成一矩形的受熱室12及一矩形的回流室13(如圖1及圖2所示),分隔部11上貫穿有複數微細道111,該等微細道111鄰接分隔部11的頂側且橫向間隔設置(如圖3所示),受熱室12及回流室13透過該等微細道111而相通,分隔部11為低導熱材質,在本實施例中,分隔部11為導熱係數低於100之材質,但不以此為限。Referring to FIG. 1 to FIG. 4, the cavity 10 is rectangular and has an internal space. The cavity 10 is provided with a partition 11 which partitions the internal space of the cavity 10 into a rectangular heat receiving chamber 12. And a rectangular reflow chamber 13 (as shown in FIG. 1 and FIG. 2), the partition portion 11 has a plurality of microchannels 111 penetrating therethrough, and the microchannels 111 are adjacent to the top side of the partition portion 11 and are laterally spaced apart (as shown in FIG. 3). The heat receiving chamber 12 and the return chamber 13 communicate with each other through the fine passages 111, and the partition portion 11 is made of a low heat conductive material. In the present embodiment, the partition portion 11 is made of a material having a thermal conductivity lower than 100, but not limit.
前述之管路通道20的兩端皆連接腔體10,且兩端分別與受熱室12及回流室13相通,管路通道20的管徑大於各微細道111的孔徑。Both ends of the pipeline passage 20 are connected to the cavity 10, and the two ends are respectively communicated with the heat receiving chamber 12 and the return chamber 13. The diameter of the pipeline passage 20 is larger than the diameter of each of the fine passages 111.
使用時,受熱室12的位置對應於熱源的位置,或者是利用熱傳導材料將熱源的熱傳導至受熱室12,而回流室13並未直接受熱,因此受熱室12溫度將比回流室13還要高,而分隔部11透過其低導熱材質而減少自受熱室12傳導至回流室13的熱能損失,以產生足夠溫度差,進而產生不同的飽和蒸汽壓力,而該壓力差便使得受熱室12的氣體欲移動至回流室13,但由於分隔部11內毛細壓力的作用,使得受熱室12的高壓高溫氣體無法通過分隔部11的微細道111流向回流室13,因此氣體便進入到管路通道20;氣體於管路通道20內變成液體後,同樣由於回流室13的壓力小於受熱室12的壓力,因此液體便會繼續朝向回流室13移動,液體移動至回流室13後,會透過分隔部11的微細道111逐漸滲透進受熱室12內,然後便可重新吸熱及蒸發;本創作藉由在管路通道20的兩端產生壓力差,而使管路通道20內的液體可單向且順暢地移動,並進而大幅增強熱交換及散熱效果。In use, the position of the heat receiving chamber 12 corresponds to the position of the heat source, or the heat of the heat source is transferred to the heat receiving chamber 12 by the heat conductive material, and the return chamber 13 is not directly heated, so the temperature of the heat receiving chamber 12 will be higher than that of the return chamber 13. And the partition 11 reduces the heat energy loss from the heat receiving chamber 12 to the return chamber 13 through its low heat conductive material to generate a sufficient temperature difference, thereby generating different saturated vapor pressures, and the pressure difference causes the gas in the heat receiving chamber 12 to be generated. To move to the return chamber 13, but due to the capillary pressure in the partition 11, the high pressure and high temperature gas of the heat receiving chamber 12 can not flow through the fine passage 111 of the partition 11 to the return chamber 13, so that the gas enters the pipeline passage 20; After the gas becomes liquid in the pipe passage 20, also because the pressure of the return chamber 13 is smaller than the pressure of the heat receiving chamber 12, the liquid continues to move toward the return chamber 13, and after the liquid moves to the return chamber 13, it passes through the partition portion 11. The fine track 111 gradually penetrates into the heat receiving chamber 12, and then can absorb heat and evaporate again; this creation makes the pipe pass by creating a pressure difference at both ends of the pipe passage 20. The liquid in the channel 20 can be moved unidirectionally and smoothly, and the heat exchange and heat dissipation effects are greatly enhanced.
請參閱圖5所示,以下為本創作之第二實施例,其與第一實施例大致相同,但腔體10A的分隔部11A的該等微細道111A並未鄰接分隔部11A的頂側,而係平均分佈於分隔部11A上,並且整齊排列設置;本第二實施例同樣可達到於管路通道20A的兩端產生壓力差,以使管路通道20A內的液體單向且順暢地移動之目的。Referring to FIG. 5, the following is a second embodiment of the present invention, which is substantially the same as the first embodiment, but the microchannels 111A of the partition 11A of the cavity 10A are not adjacent to the top side of the partition 11A. The average distribution is on the partition 11A and arranged neatly; the second embodiment can also achieve a pressure difference across the conduit passage 20A to allow the liquid in the conduit passage 20A to move unidirectionally and smoothly. The purpose.
請參閱圖6所示,以下為本創作之第三實施例,其與第二實施例大致相同,但腔體10B的分隔部11B的該等微細道111B係隨機排列設置;本第三實施例同樣可達到於管路通道20B的兩端產生壓力差,以使管路通道20B內的液體單向且順暢地移動之目的。Referring to FIG. 6 , the following is a third embodiment of the present invention, which is substantially the same as the second embodiment, but the fine tracks 111B of the partition 11B of the cavity 10B are randomly arranged; the third embodiment It is also possible to create a pressure difference across the line passage 20B for the purpose of unidirectionally and smoothly moving the liquid in the line passage 20B.
請參閱圖7所示,以下為本創作之第四實施例,其與第一實施例大致相同,但具有兩個腔體單元100C,該兩腔體單元100C的腔體10C相連接,且該兩腔體單元100C的腔體10C的受熱室12C相鄰設置,並且一同設置於熱源上;本第四實施例可將熱量分散至兩組腔體單元100C的兩根管路通道20C上,並且於各管路通道20C的兩端產生壓力差,以使各管路通道20C內的液體單向且順暢地移動,進而同樣達到有效散熱之目的。Referring to FIG. 7, the following is a fourth embodiment of the present invention, which is substantially the same as the first embodiment, but has two cavity units 100C, and the cavity 10C of the two cavity units 100C is connected, and the The heat receiving chambers 12C of the cavity 10C of the two cavity unit 100C are disposed adjacent to each other and disposed together with the heat source; the fourth embodiment can dissipate heat to the two pipe passages 20C of the two sets of cavity units 100C, and A pressure difference is generated at both ends of each of the pipe passages 20C, so that the liquid in each of the pipe passages 20C moves unidirectionally and smoothly, thereby achieving the purpose of effective heat dissipation.
請參閱圖8所示,以下為本創作之第五實施例,其與第四實施例大致相同,但是該兩腔體單元100D的腔體10D的受熱室12D並非相鄰設置,藉此本第五實施例可設置在兩熱源上,並且同時對該兩熱源進行有效之散熱。Referring to FIG. 8, the following is a fifth embodiment of the present invention, which is substantially the same as the fourth embodiment, but the heat receiving chambers 12D of the cavity 10D of the two cavity unit 100D are not adjacently disposed, thereby The fifth embodiment can be disposed on two heat sources and at the same time effectively dissipate heat from the two heat sources.
請參閱圖9所示,以下為本創作之第六實施例,其與第一實施例大致相同,但具有四個腔體單元100E,該等腔體單元100E的腔體10E成矩形排列地相連接,且該等腔體單元100E的腔體10E的受熱室12E相鄰設置而集中在中央,該等受熱室12E一同設置於熱源上;本第六實施例可將熱量分散至四組腔體單元100E的四根管路通道20E上,並且各管路通道20E的兩端產生壓力差,以使各管路通道20E內的液體單向且順暢地移動,進而同樣達到有效散熱之目的;本第六實施例的受熱室12E亦可不相鄰設置,並進而可同時對複數熱源散熱,但技術原理與前述實施例相同,故在此不多贅述。Referring to FIG. 9, the following is a sixth embodiment of the present invention, which is substantially the same as the first embodiment, but has four cavity units 100E, and the cavities 10E of the cavity units 100E are arranged in a rectangular arrangement. Connected, and the heat receiving chambers 12E of the cavity 10E of the cavity unit 100E are disposed adjacent to each other and concentrated in the center, and the heat receiving chambers 12E are disposed together on the heat source; the sixth embodiment can disperse heat to the four groups of cavities The four pipeline passages 20E of the unit 100E, and the pressure difference between the two pipeline passages 20E, so that the liquid in each pipeline passage 20E moves unidirectionally and smoothly, thereby achieving the purpose of effective heat dissipation; The heat receiving chambers 12E of the sixth embodiment may not be disposed adjacent to each other, and may further dissipate heat from the plurality of heat sources at the same time. However, the technical principle is the same as that of the foregoing embodiment, and thus will not be further described herein.
請參閱圖10所示,以下為本創作之第七實施例,其與第六實施例大致相同,但是該各腔體單元100F的腔體10F的分隔部11F延伸至腔體10F的斜對角,因此使腔體10F的受熱室12F及回流室13F皆改為三角形;此外,其中兩腔體單元100F的受熱室12F相鄰設置,另兩腔體單元100F的受熱室12F亦相鄰設置,如此可對兩熱源進行散熱,但不以此為限,本第七實施例的受熱室12F亦可以其他方式排列,並進而用以對三個或四個熱源進行散熱。Referring to FIG. 10, the following is a seventh embodiment of the present invention, which is substantially the same as the sixth embodiment, but the partition portion 11F of the cavity 10F of each cavity unit 100F extends to the diagonally opposite corner of the cavity 10F. Therefore, the heat receiving chambers 12F and the returning chambers 13F of the cavity 10F are all changed to a triangle shape; in addition, the heat receiving chambers 12F of the two cavity units 100F are disposed adjacent to each other, and the heat receiving chambers 12F of the other two cavity units 100F are also disposed adjacent to each other. Therefore, the heat dissipation of the two heat sources can be performed, but the heat-receiving chambers 12F of the seventh embodiment can be arranged in other manners, and further used to dissipate heat from three or four heat sources.
在其他實施例中,各腔體單元亦可僅有單一微細道,其可鄰接分隔部的頂側,或設於分隔部的中央皆可,如此同樣可達到本創作之提高散熱功效之創作目的。In other embodiments, each cavity unit may have only a single microchannel, which may be adjacent to the top side of the partition, or may be disposed at the center of the partition, so as to achieve the purpose of improving the heat dissipation effect of the present creation. .
在其他實施例中,腔體亦可不為矩形,而受熱室及回流室亦可不為矩形或三角形,腔體、受熱室及回流室皆可依各種情形而改為其他形狀。In other embodiments, the cavity may not be rectangular, and the heated chamber and the return chamber may not be rectangular or triangular, and the cavity, the heated chamber, and the return chamber may be changed to other shapes according to various situations.
以上所述僅是本創作的較佳實施例而已,並非對本創作做任何形式上的限制,雖然本創作已以較佳實施例揭露如上,然而並非用以限定本創作,任何所屬技術領域中具有通常知識者,在不脫離本創作技術方案的範圍內,當可利用上述揭示的技術內容作出些許更動或修飾為等同變化的等效實施例,但凡是未脫離本創作技術方案的內容,依據本創作的技術實質對以上實施例所作的任何簡單修改、等同變化與修飾,均仍屬於本創作技術方案的範圍內。The above description is only a preferred embodiment of the present invention, and does not impose any form limitation on the present invention. Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit the present creation, and has any technical field. A person skilled in the art can make some modifications or modifications to equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. The technical essence of the creation Any simple modification, equivalent change and modification of the above embodiments are still within the scope of the technical solution of the present invention.
100‧‧‧腔體單元
10‧‧‧腔體
11‧‧‧分隔部
111‧‧‧微細道
12‧‧‧受熱室
13‧‧‧回流室
20‧‧‧管路通道
10A‧‧‧腔體
11A‧‧‧分隔部
111A‧‧‧微細道
20A‧‧‧管路通道
10B‧‧‧腔體
11B‧‧‧分隔部
111B‧‧‧微細道
20B‧‧‧管路通道
100C‧‧‧腔體單元
10C‧‧‧腔體
12C‧‧‧受熱室
20C‧‧‧管路通道
100D‧‧‧腔體單元
10D‧‧‧腔體
12D‧‧‧受熱室
100E‧‧‧腔體單元
10E‧‧‧腔體
12E‧‧‧受熱室
20E‧‧‧管路通道
100F‧‧‧腔體單元
10F‧‧‧腔體
11F‧‧‧分隔部
12F‧‧‧受熱室
13F‧‧‧回流室100‧‧‧ cavity unit
10‧‧‧ cavity
11‧‧‧Departure
111‧‧‧Micro-channel
12‧‧‧heated room
13‧‧‧Return room
20‧‧‧pipeway
10A‧‧‧ cavity
11A‧‧‧Departure
111A‧‧‧ micro-channel
20A‧‧‧pipe channel
10B‧‧‧ cavity
11B‧‧‧Departure
111B‧‧‧ micro-channel
20B‧‧‧pipeway
100C‧‧‧ cavity unit
10C‧‧‧ cavity
12C‧‧‧heated room
20C‧‧‧pipe channel
100D‧‧‧ cavity unit
10D‧‧‧ cavity
12D‧‧‧heating room
100E‧‧‧ cavity unit
10E‧‧‧ cavity
12E‧‧‧heating room
20E‧‧‧pipe channel
100F‧‧‧ cavity unit
10F‧‧‧ cavity
11F‧‧‧Departure
12F‧‧‧heating room
13F‧‧‧Return room
圖1係本創作之第一實施例之立體外觀示意圖。圖2係本創作之第一實施例之上視剖面示意圖。圖3係本創作之第一實施例之側視剖面示意圖。圖4係本創作之第一實施例之前視剖面示意圖。圖5係本創作之第二實施例之側視剖面示意圖。圖6係本創作之第三實施例之側視剖面示意圖。圖7係本創作之第四實施例之上視示意圖。圖8係本創作之第五實施例之上視示意圖。圖9係本創作之第六實施例之上視示意圖。圖10係本創作之第七實施例之上視示意圖。Figure 1 is a perspective view of the first embodiment of the present invention. Figure 2 is a schematic cross-sectional view of the first embodiment of the present invention. Figure 3 is a side cross-sectional view of the first embodiment of the present invention. Figure 4 is a schematic cross-sectional view of the first embodiment of the present invention. Figure 5 is a side cross-sectional view of a second embodiment of the present invention. Figure 6 is a side cross-sectional view showing a third embodiment of the present invention. Figure 7 is a top plan view of a fourth embodiment of the present invention. Figure 8 is a top plan view of a fifth embodiment of the present invention. Figure 9 is a top plan view of a sixth embodiment of the present invention. Figure 10 is a top plan view of a seventh embodiment of the present invention.
100‧‧‧腔體單元 100‧‧‧ cavity unit
10‧‧‧腔體 10‧‧‧ cavity
11‧‧‧分隔部 11‧‧‧Departure
12‧‧‧受熱室 12‧‧‧heated room
13‧‧‧回流室 13‧‧‧Return room
20‧‧‧管路通道 20‧‧‧pipeway
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103202759U TWM482103U (en) | 2014-02-18 | 2014-02-18 | Liquid gas shunt type heat exchange chamber |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103202759U TWM482103U (en) | 2014-02-18 | 2014-02-18 | Liquid gas shunt type heat exchange chamber |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM482103U true TWM482103U (en) | 2014-07-11 |
Family
ID=51724201
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103202759U TWM482103U (en) | 2014-02-18 | 2014-02-18 | Liquid gas shunt type heat exchange chamber |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM482103U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI602496B (en) * | 2015-07-15 | 2017-10-11 | 宏碁股份有限公司 | Heat dissipation assembly |
TWI626414B (en) * | 2017-08-18 | 2018-06-11 | 雙鴻科技股份有限公司 | Loop heat pipe |
CN109579585A (en) * | 2019-01-10 | 2019-04-05 | 中国科学院上海技术物理研究所 | A kind of multi-evaporator loop heat pipe |
TWI721344B (en) * | 2017-12-13 | 2021-03-11 | 雙鴻科技股份有限公司 | Thermosyphon heat exchanger |
-
2014
- 2014-02-18 TW TW103202759U patent/TWM482103U/en unknown
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI602496B (en) * | 2015-07-15 | 2017-10-11 | 宏碁股份有限公司 | Heat dissipation assembly |
TWI626414B (en) * | 2017-08-18 | 2018-06-11 | 雙鴻科技股份有限公司 | Loop heat pipe |
TWI721344B (en) * | 2017-12-13 | 2021-03-11 | 雙鴻科技股份有限公司 | Thermosyphon heat exchanger |
CN109579585A (en) * | 2019-01-10 | 2019-04-05 | 中国科学院上海技术物理研究所 | A kind of multi-evaporator loop heat pipe |
CN109579585B (en) * | 2019-01-10 | 2023-09-12 | 中国科学院上海技术物理研究所 | Multi-evaporator loop heat pipe |
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