CN114791237A - Loop heat pipe - Google Patents
Loop heat pipe Download PDFInfo
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- CN114791237A CN114791237A CN202110105492.0A CN202110105492A CN114791237A CN 114791237 A CN114791237 A CN 114791237A CN 202110105492 A CN202110105492 A CN 202110105492A CN 114791237 A CN114791237 A CN 114791237A
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- plate
- phase channel
- heat pipe
- chamber
- loop heat
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
Abstract
The invention provides a loop heat pipe, which comprises a lower layer plate, a middle layer plate and an upper layer plate, wherein the middle layer plate is a framework of an internal structure of the loop heat pipe, the upper layer plate and the lower layer plate are packaged together, the lower layer plate is provided with a groove, the middle layer plate comprises five components, namely an evaporation chamber, a condensation chamber, a vapor phase channel, a liquid phase channel and a compensation chamber, the vapor phase channel and the liquid phase channel are connected between the evaporation chamber and the condensation chamber, the compensation chamber is connected with the evaporation chamber, the middle layer plate is embedded in the groove of the lower layer plate, the middle layer plate is a PMMA (polymethyl methacrylate) framework, and the PMMA framework can be produced in batches by adopting PMMA, so that the five components of the middle layer plate do not need to be etched on a silicon substrate. By adopting the internal structure frame which can be produced in batch, the invention can reduce the repeatability of high-precision processing and etching, thereby greatly reducing the manufacturing cost of the ultrathin loop heat pipe.
Description
Technical Field
The invention relates to a heat pipe technology, in particular to a loop heat pipe, and belongs to the field of F28d15/02 heat pipes.
Background
The heat pipe technology is a heat transfer element called a heat pipe invented by George Grover (George Grover) of national laboratory of Los Alamos (Los Alamos) in 1963, fully utilizes the heat conduction principle and the rapid heat transfer property of a phase change medium, quickly transfers the heat of a heating object to the outside of a heat source through the heat pipe, and the heat conduction capability of the heat transfer element exceeds the heat conduction capability of any known metal.
The heat pipe technology is widely applied to the industries of aerospace, military industry and the like, and since the heat pipe technology is introduced into the radiator manufacturing industry, people change the design idea of the traditional radiator, get rid of the single heat dissipation mode of obtaining better heat dissipation effect by only depending on a high-air-volume motor, adopt the heat pipe technology to ensure that the radiator obtains satisfactory heat exchange effect, and open up a new place in the heat dissipation industry. At present, the heat pipe is widely applied to various heat exchange devices, including the field of nuclear power, such as the utilization of waste heat of nuclear power.
The loop heat pipe refers to a loop-closed loop heat pipe. Typically consisting of an evaporator, a condenser, an accumulator, and vapor and liquid lines. The working principle is as follows: the heat load is applied to the evaporator, the working medium is evaporated on the outer surface of the capillary core of the evaporator, the generated steam flows out from the steam channel and enters the steam pipeline, then enters the condenser to be condensed into liquid and is supercooled, the backflow liquid enters the liquid main channel through the liquid pipeline to supply the capillary core of the evaporator, and the circulation of the working medium is driven by the capillary pressure generated by the capillary core of the evaporator without additional power. Because the condensing section and the evaporating section are separated, the loop type heat pipe is widely applied to the comprehensive application of energy and the recovery of waste heat.
In order to solve the problem that the heat transfer of the traditional heat pipe is limited by a long distance and the direction of a cold and heat source, Maidanik et al of the national academy of sciences of the former soviet union put forward the concept of a loop heat pipe in 1971 on the basis of the theory of the traditional heat pipe, and a first set of loop heat pipes is designed and processed in 1972. In the next decade, loop heat pipes have been developed in the former soviet union. In 1985, Maidanik et al patented such a heat pipe in the united states. The automatic heat transfer device which drives the working medium to circulate by means of capillary force is called a heat pipe, a heat pipe with heat parts and a heat pipe with heat parts successively until 1989, the heat pipe with the heat parts is firstly applied to a spacecraft thermal control system of the former soviet union, which is not widely concerned internationally until 1989, and is finally named a loop heat pipe, which is called a loop heat pipe in the domestic industry. After 90 years, loop heat pipes are widely concerned by relevant scholars and spacecraft thermal control design workers in various countries due to the advantages of the loop heat pipes, a large amount of funds are invested in many countries for research, and loop heat pipes of various structural forms and different working media are continuously on the aspect of relevant academic conferences. The research on the loop heat pipe mainly comprises three aspects of experimental research and analysis, mathematical modeling and application research.
The thermal conductance of LHP systems depends to a large extent on the heat exchange performance between the condenser and the heat sink. In the early research on LHP, most of the heat is released to the space heat sink in a radiation form by the condenser, so that the condenser is generally in a structure form of embedding a condenser pipeline into a condenser plate, a simple sleeve-type condenser can be adopted in a ground experiment, a constant temperature tank is used for simulating the heat sink, and a pump drives a refrigerant medium (such as water, ethanol and the like) to circularly flow in the sleeve to cool the condenser.
The evaporator is the core component of the LHP and has two important functions of absorbing heat from a heat source and providing power for the circulation of a working medium. Through decades of improvement and development, the evaporator body mainly comprises an evaporator shell, a capillary core and a liquid guide pipe. The axial channels on the outside of the capillary wick are called vapor channels (Vaporgroove) and the liquid trunk (Liquidcore or evaporiorcore) on the inside of the capillary wick.
The capillary core is a core element of the evaporator, provides working medium circulation power, provides a liquid evaporation interface, realizes liquid supply, and simultaneously prevents vapor generated outside the capillary core from entering a liquid storage device. The capillary core is formed by pressing and sintering micron-sized metal powder to form micron-sized pores.
The liquid main channel in the capillary core is arranged to ensure that liquid can uniformly supply liquid to the capillary core along the axial direction. Otherwise, the liquid supply resistance of the liquid from the liquid storage device to the capillary core along the axial direction is very large, so that the liquid supply is easy to be insufficient, the capillary core generates axial temperature difference, and even a local dry-out phenomenon occurs. The liquid guide pipe is arranged to directly guide the refluxed supercooled liquid into the center of the evaporator, so that on one hand, the cold carried by the refluxed liquid can be used for balancing the radial heat leakage of the evaporator through the capillary core; on the other hand, when bubbles are generated or non-condensable gas is accumulated in the liquid main channel due to heat leakage of the evaporator, the supercooled liquid flowing out of the liquid guide pipe can cool and eliminate the bubbles by virtue of cold energy carried by the supercooled liquid, and the non-condensable gas or bubbles are pushed out of the liquid main channel by virtue of the flow of the supercooled liquid, so that the phenomenon of air lock on the inner surface of the capillary core is prevented, and the operation stability of the evaporator is improved.
The thermal conductance of the condenser, LHP system, is largely dependent on the heat exchange performance between the condenser and the heat sink. In the early research on LHP, most of the space application backgrounds are concerned, and condensers release heat to space heat sinks mainly in a radiation mode, so that a structural form that condenser pipelines are embedded into condenser plates is generally adopted, a simple sleeve-type condenser can also be adopted in a ground experiment, a constant temperature tank is used for simulating heat sinks, and a pump drives refrigerant media (such as water, ethanol and the like) to circularly flow in the sleeve to cool the condensers.
The package-level heat dissipation becomes a new hot spot of thermal control research, a new generation of high-efficiency micro heat radiator represented by a loop heat pipe is gradually accepted in the industry, and along with the improvement of the package technical level, the package-level heat dissipation also becomes one of the development directions of heat dissipation devices, and has research value and market promotion value.
The existing heat pipe generally takes silicon as a substrate, the internal structure of the heat pipe is etched on the silicon substrate, the etching process is complex, high-precision and repeatable etching needs to be carried out on each manufactured silicon-based ultrathin heat pipe, the processing and manufacturing cost is high, and great challenges are brought to popularization and commercial use of the heat pipe. The invention provides a heat pipe with a novel structure, which adopts an internal structure frame capable of being produced in batch, and can reduce the repeatability of silicon-based high-precision processing and etching, thereby greatly reducing the manufacturing cost of a silicon-based ultrathin loop heat pipe.
Disclosure of Invention
The invention aims to provide a low-cost, tiny and efficient flat-plate loop heat pipe system, which improves the popularization and commercial application of heat dissipation of a heat source. In order to achieve the purpose, the technical scheme of the invention is as follows:
the utility model provides a loop heat pipe, includes lower plate, median plate and upper plate, be loop heat pipe inner structure frame at the median plate, the upper plate encapsulates with lower plate and is in the same place, the lower plate is opened flutedly, and the median plate includes five parts of evaporating chamber, condensing chamber, vapor phase channel, liquid phase channel and compensation chamber, connects vapor phase channel and liquid phase channel between evaporating chamber and the condensing chamber, and the evaporating chamber is connected to the compensation chamber, and the median plate is embedded in the recess of lower plate, its characterized in that, the median plate is PMMA material frame, but adopts PMMA batch production frame to make five parts of median plate need not etch on the silicon substrate.
Preferably, the evaporation apparatus further comprises a fixing plate disposed at an upper portion of the evaporation chamber, the liquid-phase channel, and the gas-phase channel.
Preferably, the fixing plates of the upper portions of the liquid phase channel and the gas phase channel are disposed perpendicular to the liquid phase channel and the gas phase channel.
Preferably, five parts of an evaporation chamber, a condensation chamber, a gas phase channel, a liquid phase channel and a compensation chamber of the loop heat pipe are integrated in the same frame, the periphery of each part is surrounded by the frame, and the upper surface and the lower surface of each part are hollowed out.
Preferably, the liquid phase channel is provided on one side of the vapor phase channel and is disposed in parallel with the vapor phase channel, and the liquid phase channel has one end connected to the condensing chamber, the other end connected to the evaporating chamber and the compensating chamber, and the other end disposed on a passage between the evaporating chamber and the compensating chamber.
Preferably, the middle layer frame plate is embedded into the lower layer plate in a mechanical matching mode, and after matching, the upper surfaces of the middle layer plate and the lower layer plate are located in the same plane.
Preferably, the lower plate embedded in the middle plate and the upper plate are packaged together in a bonding mode.
Preferably, the lower plate is provided with rectangular grooves with the length, width and height of 38mm multiplied by 16mm multiplied by 0.36 mm.
Preferably, a shallow cavity with the thickness of 4mm multiplied by 0.06mm is arranged at the corresponding position of the upper plate evaporator, and the thickness of the frame fixing plate is added, and the depth of the shallow cavity is 240 mu m.
Compared with the prior art, the invention has the following advantages:
1) by adopting the internal structure frame which can be produced in batch, the invention can reduce the repeatability of silicon-based high-precision processing and etching, thereby greatly reducing the manufacturing cost of the silicon-based ultrathin loop heat pipe.
2) Because the middle layer is of a hollow structure, working media in the novel heat pipe can be directly contacted with the upper surface and the lower surface of the shell, and the novel heat pipe has high heat exchange efficiency.
3) The internal frame structure made of PMMA is adopted, when the heat load input by the evaporator is higher, along with the expansion and contraction characteristics of the material, the heat load is higher, the micro-channel gap of the evaporator is smaller, the generated capillary suction force is larger, and when the heat is lower, the gap is gradually increased, so that the self-adaptive capacity of the loop heat pipe to the heat load is formed.
4) The invention is similar to the size of the original silicon-based ultrathin loop heat pipe, and the original silicon-based ultrathin loop heat pipe has higher heat dissipation capability through a plurality of tests, thereby proving the heat dissipation effect of the novel heat pipe.
Drawings
FIG. 1 is an exploded view of a novel ultra-thin loop heat pipe of the present invention that allows for mass production of internal structural frames;
FIG. 2 is a schematic diagram of the upper plate of the novel ultra-thin loop heat pipe capable of mass production of internal structural frames according to the present invention;
FIG. 3 is a schematic cross-sectional view of the upper plate shallow cavity of the novel ultra-thin loop heat pipe with internal structural framework for mass production according to the present invention;
FIG. 4 is a schematic diagram of the novel ultra-thin loop heat pipe mid-plane (inner frame) with internal structural frames that can be mass produced in accordance with the present invention;
FIG. 5 is a partial schematic view of a novel ultra-thin loop heat pipe evaporator of the present invention with internal structural frames that can be mass produced;
FIG. 6 is a schematic view of the lower plate of the novel ultra-thin loop heat pipe for mass production of internal structural frames according to the present invention;
the reference numbers are as follows: 1 upper plate, 2 middle plate (internal structure frame), 3 lower plate, 1-1 upper plate shallow cavity, 2-1 middle plate working fluid filling port, 2-2 middle plate vacuum pumping port, 2-3 compensation chamber, 2-4 evaporation chamber fixing plate, 2-5 evaporation chamber, 2-6 gas phase channel clapboard fixing plate, 2-7 liquid phase channel clapboard fixing plate, 2-8 liquid phase channel, 2-9 gas phase channel, 2-10 condenser, 2-11 heat insulation through groove, 3-1 lower plate bottom surface, 3-2 lower plate vacuum pumping and working fluid filling port.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings.
As shown in fig. 1, a loop heat pipe comprises a lower plate 3, a middle plate 2 and an upper plate 1, wherein the middle plate 2 is an internal structural frame of the loop heat pipe, the upper plate 1 and the lower plate 3 are packaged together, the lower plate is provided with a groove, the middle plate comprises five parts, namely an evaporation chamber 2-5, a condensation chamber 2-10, a vapor phase channel 2-9, a liquid phase channel 2-8 and a compensation chamber 2-3, the vapor phase channel 2-9 and the liquid phase channel 2-8 are connected between the evaporation chamber 2-5 and the condensation chamber 2-10, the compensation chamber 2-3 is connected with the evaporation chamber 2-5, the middle plate 2 is embedded in the groove of the lower plate 3, as a modification, the middle layer plate 2 is a PMMA frame, and the frame can be produced in batch by adopting PMMA, so that five parts of the middle layer plate 2 do not need to be etched on a silicon substrate.
By adopting the internal structure frame which can be produced in batch, the invention can reduce the repeatability of silicon-based high-precision processing and etching, thereby greatly reducing the manufacturing cost of the silicon-based ultrathin loop heat pipe.
The invention adopts an internal frame structure made of PMMA material, when the heat load input by the evaporator is higher, along with the characteristic of expansion with heat and contraction with cold of the material, the heat load is higher, the clearance of the micro-channel of the evaporator is smaller, the generated capillary suction force is larger, and when the heat is lower, the clearance is gradually increased, thereby forming the self-adaptive capacity of the loop heat pipe to the heat load.
Preferably, the evaporation device further comprises a fixing plate disposed at an upper portion of the evaporation chamber, the liquid-phase channel, and the gas-phase channel.
Preferably, the evaporation chamber is provided with one fixed plate, and the liquid phase channel and the gas phase channel are both provided with 2 fixed plates.
Through setting up the fixed plate, can make evaporation chamber and liquid phase channel and gaseous phase channel position relatively fixed, avoid because the deformation etc. that the installation leads to.
Preferably, the fixing plates of the upper portions of the liquid phase channel and the gas phase channel are disposed perpendicular to the liquid phase channel and the gas phase channel. Through such setting, can make fixed more firm, it is more convenient to install.
Preferably, the upper surface and the lower surface of the liquid phase channel 2-8 are in a hollow state, and working fluid in the miniature ultrathin heat pipe can be directly contacted with the shell, so that the integral heat exchange efficiency is enhanced.
The upper plate is provided with a steam overflow cavity 1-1 (shown in figures 2 and 3), the middle plate (internal structural framework capable of being produced in batches) 2 is embedded into a groove of the lower plate 3, the upper cover plate 1 and the lower plate 3 are packaged together, and the lower plate 3 comprises a working fluid filling port and a vacuum pumping port 3-2 (figure 5); the middle plate 2 includes a working fluid filling port 2-1 and an evacuation port 2-2, a compensation chamber 2-3, an evaporation chamber 2-5, a condensation chamber 2-10, a vapor phase channel 2-9 and a liquid phase channel 2-8 (shown in fig. 4) connected between the evaporation chamber 2-3 and the condensation chamber 2-10. Through setting up two exhaust liquid injection holes, can realize that a hole fills liquid, a hole exhaust and liquid, quick realization heat pipe's exhaust and liquid filling can reduce the noncondensable gas in the heat pipe moreover, improve heat pipe heat exchange efficiency.
Preferably, the liquid phase channel is provided on one side of the vapor phase channel and is disposed in parallel with the vapor phase channel, and the liquid phase channel has one end connected to the condensing chamber, the other end connected to the evaporating chamber and the compensating chamber, and the other end disposed on a passage between the evaporating chamber and the compensating chamber.
Preferably, the middle layer frame plate is embedded into the lower layer plate in a mechanical matching mode, and after matching, the upper surfaces of the middle layer plate and the lower layer plate are located in the same plane.
Preferably, the lower plate embedded in the middle plate and the upper plate are packaged together in a bonding mode.
Preferably, the middle plate is provided with a working fluid filling port 2-1 and a vacuum pumping port 2-2 which are respectively communicated with the evaporation channel 2-9 and the compensation chamber 2-3, wherein the working fluid filling port 2-1 and the vacuum pumping port 2-2 do not need to be etched on the silicon substrate.
Preferably, the middle layer plate is manufactured integrally, and mass production is realized.
Preferably, the evaporation chamber is provided with a capillary component, and the capillary component is arranged at the lower part of the evaporation chamber fixing plate. So as to ensure the stable and firm installation of the capillary component.
Preferably, the lower plate is provided with rectangular grooves with the length, width and height of 38mm multiplied by 16mm multiplied by 0.36 mm.
Preferably, a shallow cavity with the thickness of 4mm multiplied by 0.06mm is arranged at the corresponding position of the upper plate evaporator, and the thickness of the frame fixing plate is added, and the depth of the shallow cavity is 240 mu m.
Preferably, a shallow cavity (as shown in 1-1 of fig. 2 and 3) is formed in the corresponding position of the upper plate evaporator, the length, width and height of the shallow cavity are respectively 4mm × 4mm × 0.06mm, the depth of the upper plate shallow cavity is 60 μm, and in addition, the height of the micro-channel fixing plate (as shown in 2-4 of fig. 4) is 180 μm, and the height of the formed steam overflow cavity is 240 μm in total.
Preferably, the middle layer plate (inner frame) integrates the working fluid filling port 2-1, the evacuation port 2-2, the compensation chamber 2-3, the evaporation chamber 2-5, the condensation chamber 2-10, the vapor phase channel 2-9, and the liquid phase channel 2-8, improving operability in the entire device manufacturing process.
Preferably, the external dimension of the middle plate (internal frame) is 38mm × 16mm × 0.36mm, the external dimension fits the internal groove of the lower plate, the middle plate is embedded into the lower plate in a mechanical matching manner (the thermal expansion and contraction characteristics of PMMA material of the internal frame), the upper surfaces of the embedded middle plate and the lower plate are on the same horizontal plane, and then the upper plate (silicon) and the lower plate (silicon) are packaged in a direct bonding manner. The two silicon chips can be directly bonded together through high-temperature treatment without any adhesive or an external electric field, and the bonding technology is called silicon-silicon direct bonding technology. The method mainly comprises the following steps: (1) soaking two polished silicon wafers (oxidized or not oxidized) in a solution; (2) bonding the polished surfaces of the two silicon wafers together at room temperature; (3) the bonded silicon wafer is subjected to high-temperature treatment for several hours in an oxygen or nitrogen environment, so that good bonding is formed.
The working fluid filling port 2-1 and the vacuumizing port 2-2 (figure 4) of the middle layer plate (inner frame) correspond to the filling port and the vacuumizing port 3-2 (figure 6) of the lower layer plate, heat and mass transfer is carried out along a channel formed by the PMMA material enclosure after the working fluid enters the micro loop heat pipe, and the working fluid can carry out heat transfer with the upper layer plate and the lower layer plate silicon in the micro loop heat pipe.
As shown in FIG. 5, the capillary wick in the micro ultra-thin loop heat pipe evaporator is in the form of a rectangular array of parallel micro-channels, the overall size is 4mm × 4mm, the width of the micro-channel is 20 μm, the depth is 180 μm, and the width of the partition wall between the channels is 20 μm. Because the micro-channel is made of PMMA material, when the heat load input by the evaporator is higher, along with the characteristic of expansion with heat and contraction with cold of the material, the heat load is higher, the gap of the micro-channel of the evaporator is smaller, the generated capillary suction force is larger, and when the heat is lower, the gap is gradually increased, so that the self-adaptive capacity of the loop heat pipe to the heat load is formed.
As shown in FIG. 4, the microchannel fixing plate 2-4 has a fixing function on one hand for the rectangular parallel microchannel array, and on the other hand prevents the working medium gas in the evaporator from reversely evaporating and reflowing, thereby having a hydraulic lock function. The fixing plates 2 to 4 preferably have a length, width and height of 4mm × 1.2mm × 0.18mm, respectively.
The 8 gas phase pipelines of the miniature ultrathin loop heat pipe are formed by separating 7 PMMA material channels, the size of the PMMA separating channel is 11.95mm multiplied by 0.25mm multiplied by 0.18mm, and the 7 gas phase channel separating grooves are supported and fixed by 2 fixing plates with the size of 6.55mm multiplied by 1mm multiplied by 0.18 mm.
4 liquid phase pipelines of the miniature ultrathin loop heat pipe are formed by separating 3 PMMA material channels, and the size of each PMMA separating channel is 19.48mm multiplied by 0.25mm multiplied by 0.18 mm; 19.63mm by 0.25mm by 0.18 mm; 19.78mm × 0.25mm × 0.18mm, and 3 liquid phase channels are supported and fixed by 2 fixing plates with the size of 1.35mm × 1mm × 0.18 mm.
As shown in fig. 4, a heat insulation through groove 2-11 is further provided on the middle plate (inner frame) for separating the high temperature gas phase pipeline from the lower temperature liquid phase pipeline, so as to avoid heat transfer therebetween, if the temperature of the liquid phase pipeline rises due to heat leakage of the gas phase pipeline, so that the working medium returned from the liquid phase pipeline cannot reach the required supercooling degree when entering the inlet of the evaporator, which may cause rapid failure of the micro ultra-thin loop heat pipe, and the size of the heat insulation through groove in the middle plate (inner frame) is 18.25mm × 0.4mm × 0.36 mm.
Although the present invention has been described with reference to the preferred embodiments, it is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. The utility model provides a loop heat pipe, includes lower plate, median plate and upper plate, be loop heat pipe inner structure frame at the median plate, the upper plate encapsulates with lower plate and is in the same place, the lower plate is opened flutedly, and the median plate includes five parts of evaporating chamber, condensing chamber, vapor phase channel, liquid phase channel and compensation chamber, connects vapor phase channel and liquid phase channel between evaporating chamber and the condensing chamber, and the evaporating chamber is connected to the compensation chamber, and the median plate is embedded in the recess of lower plate, its characterized in that, the median plate is PMMA material frame, but adopts PMMA batch production frame to make five parts of median plate need not etch on the silicon substrate.
2. A loop heat pipe as claimed in claim 1, further comprising a fixing plate provided at an upper portion of the evaporation chamber, the liquid-phase channel and the vapor-phase channel.
3. A loop heat pipe as claimed in claim 2, wherein the fixing plates of the upper portions of the liquid phase channel and the vapor phase channel are disposed perpendicularly to the liquid phase channel and the vapor phase channel.
4. The loop heat pipe of claim 1, wherein the evaporation chamber, the condensation chamber, the gas phase channel, the liquid phase channel, and the compensation chamber of the loop heat pipe are integrated in a frame, and the frame surrounds the five components and is hollow on the upper and lower surfaces.
5. A loop heat pipe as set forth in claim 1, wherein the liquid-phase channel is provided on one side of the vapor-phase channel in parallel with the vapor-phase channel, one end of the liquid-phase channel being connected to the condensing chamber, the other end thereof being connected to the evaporating chamber and the compensating chamber, and the other end thereof being provided on a passage between the evaporating chamber and the compensating chamber.
6. A loop heat pipe as claimed in claim 1, wherein the middle frame plate is embedded in the lower plate by mechanical engagement, and when engaged, the upper surfaces of the middle plate and the lower plate are in the same plane.
7. A loop heat pipe as claimed in claim 1, wherein the lower plate embedded in the middle plate is bonded and packaged with the upper plate.
8. A loop heat pipe as claimed in claim 1, wherein the lower plate is formed with rectangular grooves having a length, a width and a height of 38mm x 16mm x 0.36mm, respectively.
9. A loop heat pipe as claimed in claim 1, wherein the upper plate evaporator is formed with a shallow cavity of 4mm x 0.06mm at a position corresponding thereto, and the frame fixing plate has a thickness of 240 μm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110105492.0A CN114791237A (en) | 2021-01-26 | 2021-01-26 | Loop heat pipe |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110105492.0A CN114791237A (en) | 2021-01-26 | 2021-01-26 | Loop heat pipe |
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| CN114791237A true CN114791237A (en) | 2022-07-26 |
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101266112A (en) * | 2008-04-01 | 2008-09-17 | 哈尔滨工业大学 | SOG structure micro heat pipe and its manufacture method |
| CN102692002A (en) * | 2012-06-13 | 2012-09-26 | 华南理工大学 | Heat radiating device of high-power LED (light-emitting diode) |
| CN104089509A (en) * | 2014-07-21 | 2014-10-08 | 厦门大学 | Capillary pumped loop |
| CN104406440A (en) * | 2014-11-06 | 2015-03-11 | 江苏大学 | Silicon-based miniature loop heat pipe cooler |
| CN105222630A (en) * | 2015-11-04 | 2016-01-06 | 天津商业大学 | A kind of flat type loop heat pipe |
| CN105890415A (en) * | 2016-05-26 | 2016-08-24 | 西安交通大学 | Integrated loop heat pipe cooling device with boiling pool |
| CN106767070A (en) * | 2017-01-12 | 2017-05-31 | 山东大学 | A kind of flat type loop heat pipe evaporator and loop circuit heat pipe |
| CN107094361A (en) * | 2017-02-15 | 2017-08-25 | 山东大学 | A kind of upper cover plate sets the flat-plate minitype loop circuit heat pipe of chamber |
| CN107094360A (en) * | 2017-02-15 | 2017-08-25 | 山东大学 | A kind of flat-plate minitype loop circuit heat pipe system |
| US20190285357A1 (en) * | 2018-03-19 | 2019-09-19 | Asia Vital Components Co., Ltd. | Middle member of heat dissipation device and the heat dissipation device |
| CN112179190A (en) * | 2020-09-29 | 2021-01-05 | 西安交通大学 | Ultrathin flat-plate loop heat pipe of coupling ejector |
-
2021
- 2021-01-26 CN CN202110105492.0A patent/CN114791237A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101266112A (en) * | 2008-04-01 | 2008-09-17 | 哈尔滨工业大学 | SOG structure micro heat pipe and its manufacture method |
| CN102692002A (en) * | 2012-06-13 | 2012-09-26 | 华南理工大学 | Heat radiating device of high-power LED (light-emitting diode) |
| CN104089509A (en) * | 2014-07-21 | 2014-10-08 | 厦门大学 | Capillary pumped loop |
| CN104406440A (en) * | 2014-11-06 | 2015-03-11 | 江苏大学 | Silicon-based miniature loop heat pipe cooler |
| CN105222630A (en) * | 2015-11-04 | 2016-01-06 | 天津商业大学 | A kind of flat type loop heat pipe |
| CN105890415A (en) * | 2016-05-26 | 2016-08-24 | 西安交通大学 | Integrated loop heat pipe cooling device with boiling pool |
| CN106767070A (en) * | 2017-01-12 | 2017-05-31 | 山东大学 | A kind of flat type loop heat pipe evaporator and loop circuit heat pipe |
| CN107094361A (en) * | 2017-02-15 | 2017-08-25 | 山东大学 | A kind of upper cover plate sets the flat-plate minitype loop circuit heat pipe of chamber |
| CN107094360A (en) * | 2017-02-15 | 2017-08-25 | 山东大学 | A kind of flat-plate minitype loop circuit heat pipe system |
| US20190285357A1 (en) * | 2018-03-19 | 2019-09-19 | Asia Vital Components Co., Ltd. | Middle member of heat dissipation device and the heat dissipation device |
| CN112179190A (en) * | 2020-09-29 | 2021-01-05 | 西安交通大学 | Ultrathin flat-plate loop heat pipe of coupling ejector |
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