CN104634148A - Flat-plate heat tube with nanometer structure - Google Patents
Flat-plate heat tube with nanometer structure Download PDFInfo
- Publication number
- CN104634148A CN104634148A CN201510095893.7A CN201510095893A CN104634148A CN 104634148 A CN104634148 A CN 104634148A CN 201510095893 A CN201510095893 A CN 201510095893A CN 104634148 A CN104634148 A CN 104634148A
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- Prior art keywords
- flat
- heat pipe
- plate heat
- plate
- nanostructured
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a flat-plate heat tube with a nanometer structure. The flat-plate heat tube with the nanometer structure comprises a bottom plate, a top plate and a supporting plate, wherein the supporting plate is positioned between the top plate and the bottom plate; the bottom plate, the top plate and the supporting plate are hermetically connected to one another to form a hollow closed cavity; a body of the bottom plate which serves as an evaporation surface of the flat-plate heat tube is a brass sheet; a copper oxide film which has a nanometer structure, has a super-hydrophilic property and is formed by electrochemical displacement covers the inner surface of the bottom plate; a body of the top plate which serves as a condensation surface of the flat-plate heat tube is a brass sheet; an electro-nickelling layer which has a nanometer structure and has a super-hydrophobic property covers the inner surface of the top plate; and small through holes are formed in a side surface of the supporting plate and are connected with capillary tubes. The evaporation surface and the condensation surface of the flat-plate heat tube are subjected to super-hydrophilic and super-hydrophobic surface modification, the evaporation speed and the condensation speed are increased, the heat exchange performance of an evaporation region and the heat exchange performance of a condensation region are improved, the thermal homogeneity is high, working medium is guided to return, and the working medium returning speed is increased, so that the whole heat exchange capability is improved.
Description
Technical field
The present invention relates to heat dissipation from microelectronic devices technology, particularly relate to a kind of nanostructured flat-plate heat pipe for heat dissipation from microelectronic devices.
Background technology
Along with the develop rapidly of Electronic Encapsulating Technology, integrated level and the performance of electronic chip improve constantly, and cause chip power constantly to continue to increase.The mean heat flux on current chip surface has exceeded 100W/cm2, and has the trend continuing to increase.Meanwhile, " focus " problem that the chip ubiquity amount of localized heat after chip package completes is high, will cause chip local temperature sharply to raise, affect chip stability.
Raise in the solution of the chip failure caused for temperature, both comprised the conventional chilling modes such as air-cooled, liquid cooling, heat pipe, and also had the heat sinking mode such as such as semiconductor cooling, micro jet flow technology, liquid metal heat radiation, carbon fibre material heat radiation.But be limited by structure, space, cost, can safeguard, many-sided factor such as noise, traditional type of cooling can not meet the requirement of following high heat flux electronic element radiating, and emerging heat dissipation technology is because technology is immature etc., and reason still can not be applied on a large scale.
Flat-plate heat pipe (Vapor chamber) is a kind of heat sinking medium designed according to heat pipe operation principle, its primary structure has shell, liquid-sucking core, working medium etc., its operation principle is when heat is by the evaporating area of thermal source by flat-plate heat pipe, in the cavity of rough vacuum, worker quality liquid ebullition, gasification, under the effect of pressure differential, gas flow condensing zone, meet cold condensation heat, and to reflux back evaporating area along liquid-sucking core under the effect of capillary force, and the heat of cryosurface is taken away by flat-plate heat pipe other radiating modes outside.Although operation principle is similar, compared with the heat transfer type of heat pipe one-dimensional linear, the heat transfer type of flat-plate heat pipe is that two-dimensional surface conducts heat, and therefore has better heat transfer property and uniform temperature.But the main capillary force relying on liquid-sucking core to provide of existing flat-plate heat pipe working medium backflow, capillary limitation and the boiling limit of heat exchange are smaller, in addition due to the existence of liquid-sucking core, condensed liquid working substance near cryosurface can not reflux at once and be full of on the liquid-sucking core near cryosurface, heat transfer resistance is strengthened, in addition sintered wick structure itself needs to consume mass energy, and sintering quality is difficult to control.
Summary of the invention
For the deficiencies in the prior art, the technical problem to be solved in the present invention is to provide a kind of enhanced water evaporation condensation rate, guides and accelerates working medium back-flow velocity thus the nanostructured flat-plate heat pipe of raising overall heat exchange ability.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is: a kind of nanostructured flat-plate heat pipe, it comprises base plate, top board, gripper shoe between top board and base plate, and described base plate, top board, gripper shoe are tightly connected and form the closed cavity of hollow; Body as the base plate of the evaporating surface of flat-plate heat pipe is brass sheet, the CuO film that the electrochemical displacement with super hydrophilicity that described plate inner surface is coated with nanostructured is formed; Body as the top board of the cryosurface of flat-plate heat pipe is brass sheet, and described top board inner surface is coated with the electroless nickel layer with ultra-hydrophobicity of nanostructured, and described gripper shoe side has to be run through aperture and connect with capillary.
One as the technical scheme of nanostructured flat-plate heat pipe of the present invention is improved, the wick layer of the loose structure that described gripper shoe inner surface sintering is connected with described base plate with described top board.
One as the technical scheme of nanostructured flat-plate heat pipe of the present invention is improved, and uses perfluoro decyl triethoxysilane to carry out chemical modification inside described top board.
One as the technical scheme of nanostructured flat-plate heat pipe of the present invention is improved, and the inner surface of described top board is provided with the inclination angle of 5 ° that reduce laterally from center.
One as the technical scheme of nanostructured flat-plate heat pipe of the present invention is improved, and is filled with evaporation working medium in closed cavity.
One as the technical scheme of nanostructured flat-plate heat pipe of the present invention is improved, and described evaporation working medium is deionized water.
One as the technical scheme of nanostructured flat-plate heat pipe of the present invention is improved, and when described evaporation working medium is liquid, the liquid filled ratio of described flat-plate heat pipe is 35% ~ 45%.
One as the technical scheme of nanostructured flat-plate heat pipe of the present invention is improved, and the vacuum in the closed cavity of described flat-plate heat pipe is 12.33kPa.
One as the technical scheme of nanostructured flat-plate heat pipe of the present invention is improved, and the mode that the top board of described flat-plate heat pipe, base plate and gripper shoe are fitted by rubber seal is tightly connected.
One as the technical scheme of nanostructured flat-plate heat pipe of the present invention is improved, and is uniform-distribution with the support column conflicted with top board, base plate respectively in multiple two ends in described flat-plate heat pipe closed cavity.
Beneficial effect of the present invention is: the present invention is applicable to the flat-plate heat pipe that thermal source carries out dispelling the heat from bottom to top, base plate is flat-plate heat pipe evaporating surface, its inner surface adheres to the CuO film that one deck has the micro-nano hierarchical structure of Superhydrophilic, be conducive to fluid working substance liquid film to be uniformly distributed, enhance the uniform temperature on ground; The coarse structure that simultaneous oxidation copper film layer is formed defines many pits, finedraw, can be used as the nucleus of boiling of boiling heat transfer, enhances boiling heat transfer ability.Top board plating inner surface one deck nickel, has super-hydrophobicity, adopts super hydrophobic surface strengthening dropwise condensation, reduces heat transfer resistance, accelerate working medium circulation speed.This flat-plate heat pipe is by carrying out super hydrophilic, hydrophobic surface modification to evaporating surface, cryosurface, enhanced water evaporation condensation rate, improve the heat exchange property of evaporating area and condensing zone, there is good uniform temperature, guide and accelerate working medium back-flow velocity thus improve overall heat exchange ability.
Accompanying drawing explanation
Fig. 1 is the stereo decomposing structural representation of a kind of nanostructured flat-plate heat pipe of the present invention embodiment.
Fig. 2 is the perspective view of the assembled state of embodiment middle plateform heat pipe.
Detailed description of the invention
The specific embodiment of the present invention is further illustrated below in conjunction with accompanying drawing.
As shown in Figure 1 and Figure 2, a kind of nanostructured flat-plate heat pipe of the present invention, it comprises base plate 11, top board 12, gripper shoe 13 between top board 12 and base plate 11, and described base plate 11, top board 12, gripper shoe 13 are tightly connected and form the closed cavity of hollow; Body as the base plate 11 of the evaporating surface of flat-plate heat pipe is brass sheet, the CuO film that the electrochemical displacement with super hydrophilicity that described base plate 11 inner surface is coated with nanostructured is formed; Body as the top board 12 of the cryosurface of flat-plate heat pipe is brass sheet, and described base plate 12 inner surface is coated with the electroless nickel layer with ultra-hydrophobicity of nanostructured, and described gripper shoe 13 side has to be run through aperture and connect with capillary 15.The present invention is applicable to the flat-plate heat pipe that thermal source carries out dispelling the heat from bottom to top, base plate 11 is flat-plate heat pipe evaporating surface, the process that its inner surface dewaters through high-temperature oxydation, attachment one deck has the CuO film of the micro-nano hierarchical structure of Superhydrophilic, its contact angle is set to 15 ° for best, CuO film has special micron-nanometer hierarchical structure, is conducive to fluid working substance liquid film and is uniformly distributed, enhance the uniform temperature on ground; The coarse structure that simultaneous oxidation copper film layer is formed defines many pits, finedraw, can be used as the nucleus of boiling of boiling heat transfer, enhances boiling heat transfer ability.Top board 12 plating inner surface one deck nickel simultaneously, use perfluoro decyl triethoxysilane to carry out chemical modification inside top board 12, reduce its surface energy, make it have super-hydrophobicity, the contact angle of modification part may be selected to be 160 °, slide angle 3 °.Adopt super hydrophobic surface strengthening dropwise condensation, reduce heat transfer resistance, the flow-guiding channel of top board 12 fast by condensation water guide edge, can accelerate working medium circulation speed simultaneously.This flat-plate heat pipe is by carrying out super hydrophilic, hydrophobic surface modification to evaporating surface, cryosurface, enhanced water evaporation condensation rate, improve the heat exchange property of evaporating area and condensing zone, there is good uniform temperature, guide and accelerate working medium back-flow velocity thus improve overall heat exchange ability.To be connected with extraneous vavuum pump, impregnator by capillary 15 and can to realize the injection process of bleeding of flat-plate heat pipe.
More preferably, described gripper shoe 13 inner surface sintering has the wick layer of the loose structure be connected with described base plate 11 with described top board 12.This wick layer is formed by 800 object pure copper powder high temperature sinterings, and the loose structure that copper powder sintering is formed provides larger capillary force, effectively can promote that the condensation working medium of cryosurface is back to evaporating surface.
More preferably, described top board 12 inner surface is provided with and reduces and the inclination angle of be provided with 5 ° helps condensation working medium quick backflow as flow-guiding channel from center outward side edge.
More preferably, be filled with evaporation working medium in closed cavity, described evaporation working medium is deionized water, realizes rapid evaporation and condensation carries out heat exchange and quick backflow.When described evaporation working medium is liquid, the liquid filled ratio of described flat-plate heat pipe is 35% ~ 45%, is best, has enough working medium and evaporate, also have enough spaces and evaporate with 40%.
More preferably, the vacuum in the closed cavity of described flat-plate heat pipe is 12.33kPa, improves the speed of evaporation, ensures the condensation of working medium rapid evaporation, carries out recuperated cycle.
More preferably, the mode that the top board 12 of described flat-plate heat pipe, base plate 11 are fitted by rubber seal with gripper shoe 13 is tightly connected.Filling epoxy resin fluid sealant in the space particularly formed with base plate, top board outside gripper shoe, plays the effect of protection to the vacuum in airtight cavity, prevent because internal and external factors causes vacuum in cavity to be destroyed and refrigerant leakage.
More preferably, in described flat-plate heat pipe closed cavity, be uniform-distribution with the support column 14 conflicted with top board 12, base plate 11 respectively in multiple two ends, for preventing because External Force Acting makes flat-plate heat pipe surface deform.A kind of concrete mode evenly arranges four support columns 14 between top board 12 and base plate 11.
Above disclosedly be only the preferred embodiments of the present invention, certainly can not limit the interest field of the present invention with this, therefore according to the equivalent variations that the present patent application the scope of the claims is done, still belong to the scope that the present invention is contained.
Claims (10)
1. a nanostructured flat-plate heat pipe, is characterized in that: comprise base plate, top board, gripper shoe between top board and base plate, and described base plate, top board, gripper shoe are tightly connected and form the closed cavity of hollow; Body as the base plate of the evaporating surface of flat-plate heat pipe is brass sheet, the CuO film that the electrochemical displacement with super hydrophilicity that described plate inner surface is coated with nanostructured is formed; Body as the top board of the cryosurface of flat-plate heat pipe is brass sheet, and described top board inner surface is coated with the electroless nickel layer with ultra-hydrophobicity of nanostructured, and described gripper shoe side has to be run through aperture and connect with capillary.
2. nanostructured flat-plate heat pipe according to claim 1, is characterized in that: the wick layer of the loose structure that described gripper shoe inner surface sintering is connected with described base plate with described top board.
3. nanostructured flat-plate heat pipe according to claim 1, is characterized in that: use perfluoro decyl triethoxysilane to carry out chemical modification inside described top board.
4. nanostructured flat-plate heat pipe according to claim 1, is characterized in that: the inner surface of described top board is provided with the inclination angle of 5 ° that reduce laterally from center.
5. nanostructured flat-plate heat pipe according to claim 1, is characterized in that: be filled with evaporation working medium in closed cavity.
6. nanostructured flat-plate heat pipe according to claim 5, is characterized in that: described evaporation working medium is deionized water.
7. nanostructured flat-plate heat pipe according to claim 5, is characterized in that: when described evaporation working medium is liquid, the liquid filled ratio of described flat-plate heat pipe is 35% ~ 45%.
8. nanostructured flat-plate heat pipe according to claim 1, is characterized in that: the vacuum in the closed cavity of described flat-plate heat pipe is 12.33kPa.
9. nanostructured flat-plate heat pipe according to claim 1, is characterized in that: the mode that the top board of described flat-plate heat pipe, base plate and gripper shoe are fitted by rubber seal is tightly connected.
10. nanostructured flat-plate heat pipe according to claim 1, is characterized in that: be uniform-distribution with the support column conflicted with top board, base plate respectively in multiple two ends in described flat-plate heat pipe closed cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510095893.7A CN104634148B (en) | 2015-03-04 | 2015-03-04 | A kind of nanostructured flat-plate heat pipe |
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| CN201510095893.7A CN104634148B (en) | 2015-03-04 | 2015-03-04 | A kind of nanostructured flat-plate heat pipe |
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| CN104634148A true CN104634148A (en) | 2015-05-20 |
| CN104634148B CN104634148B (en) | 2016-08-17 |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105973044A (en) * | 2016-07-25 | 2016-09-28 | 上海交通大学 | Gravity assisted heat pipe device and preparation method |
| CN106091765A (en) * | 2016-06-15 | 2016-11-09 | 广东工业大学 | A kind of flat-plate heat pipe and preparation method thereof |
| CN106197100A (en) * | 2016-07-01 | 2016-12-07 | 电子科技大学 | A kind of silica-based even-heating compound slab heat pipe soaking device |
| CN106679473A (en) * | 2016-12-27 | 2017-05-17 | 山东海晶电子科技有限公司 | Double-layer multi-channel panel nano-surface pulsating heat pipe and preparation method thereof |
| CN106802095A (en) * | 2017-01-20 | 2017-06-06 | 中国石油大学(华东) | A kind of microchannel cooling |
| CN106992161A (en) * | 2017-05-19 | 2017-07-28 | 广东工业大学 | A kind of soaking plate and the microelectronic component with the soaking plate |
| CN108626705A (en) * | 2018-07-17 | 2018-10-09 | 安徽建筑大学 | A kind of pulsating heat pipe lighting electronic cooler based on interfacial effect |
| CN109504956A (en) * | 2018-11-02 | 2019-03-22 | 江西华度电子新材料有限公司 | A kind of processing method improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant |
| CN109539846A (en) * | 2018-11-23 | 2019-03-29 | 西安交通大学 | A kind of flat-plate heat pipe with gradient wetting structure |
| CN111380389A (en) * | 2020-03-25 | 2020-07-07 | 中国科学院理化技术研究所 | Vapor chamber |
| US10935325B2 (en) | 2018-09-28 | 2021-03-02 | Microsoft Technology Licensing, Llc | Two-phase thermodynamic system having a porous microstructure sheet with varying surface energy to optimize utilization of a working fluid |
| US10962298B2 (en) | 2018-09-28 | 2021-03-30 | Microsoft Technology Licensing, Llc | Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid |
| CN113008060A (en) * | 2021-03-16 | 2021-06-22 | 北京航空航天大学 | Flat heat pipe with one-way heat conduction and controllable opening degree |
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| CN111964501A (en) * | 2020-08-10 | 2020-11-20 | 哈尔滨工业大学（深圳） | Flat heat pipe, preparation method thereof and heat exchanger |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106091765A (en) * | 2016-06-15 | 2016-11-09 | 广东工业大学 | A kind of flat-plate heat pipe and preparation method thereof |
| CN106197100A (en) * | 2016-07-01 | 2016-12-07 | 电子科技大学 | A kind of silica-based even-heating compound slab heat pipe soaking device |
| CN106197100B (en) * | 2016-07-01 | 2018-02-06 | 电子科技大学 | A kind of silicon substrate even-heating compound slab heat pipe soaking device |
| CN105973044B (en) * | 2016-07-25 | 2018-01-30 | 上海交通大学 | A kind of gravity assisted heat pipe device and preparation method |
| CN105973044A (en) * | 2016-07-25 | 2016-09-28 | 上海交通大学 | Gravity assisted heat pipe device and preparation method |
| CN106679473B (en) * | 2016-12-27 | 2020-06-12 | 山东飞龙制冷设备有限公司 | Double-layer multi-channel flat plate nanometer surface pulsating heat pipe and preparation method thereof |
| CN106679473A (en) * | 2016-12-27 | 2017-05-17 | 山东海晶电子科技有限公司 | Double-layer multi-channel panel nano-surface pulsating heat pipe and preparation method thereof |
| CN106802095A (en) * | 2017-01-20 | 2017-06-06 | 中国石油大学(华东) | A kind of microchannel cooling |
| CN106992161A (en) * | 2017-05-19 | 2017-07-28 | 广东工业大学 | A kind of soaking plate and the microelectronic component with the soaking plate |
| CN106992161B (en) * | 2017-05-19 | 2024-02-09 | 广东工业大学 | Soaking plate and microelectronic device with same |
| CN108626705A (en) * | 2018-07-17 | 2018-10-09 | 安徽建筑大学 | A kind of pulsating heat pipe lighting electronic cooler based on interfacial effect |
| US10935325B2 (en) | 2018-09-28 | 2021-03-02 | Microsoft Technology Licensing, Llc | Two-phase thermodynamic system having a porous microstructure sheet with varying surface energy to optimize utilization of a working fluid |
| US10962298B2 (en) | 2018-09-28 | 2021-03-30 | Microsoft Technology Licensing, Llc | Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid |
| CN109504956A (en) * | 2018-11-02 | 2019-03-22 | 江西华度电子新材料有限公司 | A kind of processing method improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant |
| CN109539846A (en) * | 2018-11-23 | 2019-03-29 | 西安交通大学 | A kind of flat-plate heat pipe with gradient wetting structure |
| CN111380389A (en) * | 2020-03-25 | 2020-07-07 | 中国科学院理化技术研究所 | Vapor chamber |
| CN113008060A (en) * | 2021-03-16 | 2021-06-22 | 北京航空航天大学 | Flat heat pipe with one-way heat conduction and controllable opening degree |
| CN113008060B (en) * | 2021-03-16 | 2022-01-11 | 北京航空航天大学 | Flat heat pipe with one-way heat conduction and controllable opening degree |
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