CN106197100A - A kind of silica-based even-heating compound slab heat pipe soaking device - Google Patents
A kind of silica-based even-heating compound slab heat pipe soaking device Download PDFInfo
- Publication number
- CN106197100A CN106197100A CN201610512124.7A CN201610512124A CN106197100A CN 106197100 A CN106197100 A CN 106197100A CN 201610512124 A CN201610512124 A CN 201610512124A CN 106197100 A CN106197100 A CN 106197100A
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- silica
- soaking device
- vapor chamber
- heating compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
- F28F13/125—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation by stirring
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- General Induction Heating (AREA)
- Silicon Compounds (AREA)
Abstract
The invention discloses a kind of silica-based even-heating compound slab heat pipe soaking device, including upper cover plate, lower cover and the vapor chamber being arranged between upper cover plate and lower cover, the cavity that described upper cover plate, lower cover, vapor chamber surround is filled with working medium, described working medium is the nano-fluid containing magnetic-particle, and the inner peripheral surface of described vapor chamber is provided with magnetic susceptibility stirring bar.This silica-based even-heating compound slab heat pipe soaking device, can effectively prevent the gathering of nanoparticle, deposition, can produce again good turbulent effect simultaneously, reaches to improve the purpose of soaking device heat exchange property.Generally speaking, present configuration is simple, and heat transfer efficiency is high, has the highest practical value, it is easy to manufacture, and is suitable for large-scale production, is worth popularization in the field of business.
Description
Technical field
The invention belongs to the heat abstractor of microelectronic device, be specifically related to a kind of silica-based even-heating compound slab heat pipe equal
Hot device.
Background technology
Along with the fast development of electronic technology, electronic technology has obtained widely should in dual-use every field
With.In electronic equipment running, quite a few power attenuation is had to be converted into heat.The yardstick of electronic equipment is more and more less,
Integration degree is more and more higher, along with the improving constantly of integration density, packaging density and operating frequency of electronic equipment, makes hot-fluid
Density improves rapidly, causes components and parts, circuit board, assembly and equipment cisco unity malfunction at a higher temperature, i.e. can occur
" thermic inefficacy ".The normal operating temperature of electronic equipment generally-5 DEG C～+65 DEG C, exceedes the performance of this range electronic equipment
To be remarkably decreased.Research shows, the temperature of each semiconductor element often raises 10 DEG C, and its reliability will decline 50%.Therefore have
The solution heat dissipation problem of effect, it is ensured that electronic equipment properly functioning has become key technology urgently to be resolved hurrily.
Reason in terms of causing electronic equipment thermal failure mainly to have three below at present:
(1) developing rapidly along with microelectric technique, packaging density has obtained rapid raising, causes heat flow density the highest.
(2) along with the raising of components and parts integrated level, heat is concentrated, and electronic device works lost efficacy under hot environment.
(3) range of microelectronic device is increasingly extensive, uses environmental change very big, and some electronic equipments are often in
Ambient temperature is high, and difference variation is big, under condition exacting terms, thus causes its service behaviour and stability to be substantially reduced.
The purpose of Electronic cooling is to reduce temperature, is allowed to maintain in normal operating temperature range.Thus
Ensure stablizing of its performance.From radiating mode, Electronic cooling can be divided into passive type and active heat radiation two kinds.Before
The feature of person is need not consumed energy, and the latter then requires the expenditure of energy.The latter is more beneficial for improving the work of electronic equipment
Make performance, but need more energy consumption.Even-heating flat-plate heat pipe is a kind of passive device, is flat, a thin two-dimentional heat pipe.Heat
Measure the zonule from heat pipe central authorities incoming.This heat makes working medium evaporate, and steam moves from the mediad all directions of soaking plate.
Along with steam arrives region colder in soaking plate including its top board, steam condensation is also absorbed by liquid sucting core structure, then
It is transmitted back to heat source region.
In conventional art, general employing neat liquid is as the working media of heat pipe, in order to promote the heat conduction of heat pipe further
Efficiency adds nano-particle to strengthen convection current in hydraulic fluid, but in heat pipe work process, nanoparticle can be assembled,
Deposition, makes working fluid heat conductivility reduce.The most effectively preventing the gathering of nano-particle, deposition is to improve heat pipe for thermal conductivity
Efficiency urgent problem.
Summary of the invention
Present invention aim to address the problems referred to above, it is provided that a kind of silica-based even-heating compound slab heat pipe soaking device.
For solving above-mentioned technical problem, the technical scheme is that a kind of silica-based even-heating compound slab heat pipe soaking
Device, including upper cover plate, lower cover and the vapor chamber being arranged between upper cover plate and lower cover, described upper cover plate, lower cover, steaming
Being filled with working medium in the cavity that vapour chamber surrounds, described working medium is the nano-fluid containing magnetic-particle, and the inner peripheral surface of described vapor chamber sets
There is magnetic susceptibility stirring bar.
Preferably, described magnetic-particle accounts for the 0.1%～0.9% of working medium gross mass.
Preferably, the inner surface of described upper cover plate and lower cover is equipped with crisscross rectangular duct.
Preferably, described upper cover plate and lower cover, by doing layer of metal mask on the silicon chip of thermal oxide, then entered
ICP etching machine carries out deep etching to silicon and obtains.
Preferably, described vapor chamber uses polydimethylsiloxane to make.
Preferably, described vapor chamber is made by Soft lithograph method.
Preferably, oxygen plasma is utilized respectively with vapor chamber, upper cover plate, lower cover to be carried out surface modification treatment, it is achieved
Polydimethylsiloxane is bonded with silicon chip.
Preferably, described magnetic susceptibility stirring bar quantity is four, is distributed in the interior peripheric surface of vapor chamber.
Preferably, described magnetic susceptibility stirring bar uses the polydimethylsiloxane containing ferromagnetic particle to make.
The invention has the beneficial effects as follows: under alternating magnetic field, the edge under the influence of a magnetic field of the nano-fluid containing magnetic-particle
Magnetic direction back and forth movement, so can impact the bubble acceleration evaporation that lower cover produces, can impact again the water of upper cover plate condensation
Drip, accelerate backflow.Vapor chamber is provided with magnetic susceptibility stirring bar, under the action of a magnetic force, up-down vibration, is possible to prevent nanoparticle
Gathering, deposition, simultaneously can produce again good turbulent effect, reach to improve the purpose of soaking device heat exchange property.Generally speaking,
Present configuration is simple, and heat transfer efficiency is high, has the highest practical value, it is easy to manufacture, and is suitable for large-scale production, is worth in industry
Interior popularization.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention silica-based even-heating compound slab heat pipe soaking device；
Fig. 2 is the structural representation of the present invention silica-based even-heating compound slab heat pipe soaking device upper cover plate；
Fig. 3 is the structural representation of the present invention silica-based even-heating compound slab heat pipe soaking device vapor chamber；
Fig. 4 is the structural representation of the present invention silica-based even-heating compound slab heat pipe soaking device lower cover.
Description of reference numerals: 1, upper cover plate；2, vapor chamber；3, lower cover；4, magnetic susceptibility vibrating head.
Detailed description of the invention
The present invention is described further with specific embodiment below in conjunction with the accompanying drawings:
As it is shown in figure 1, the present invention silica-based even-heating compound slab heat pipe soaking device, including upper cover plate 1, vapor chamber 2 and
Lower cover 3.Vapor chamber 2 is arranged between upper cover plate 1 and lower cover 3, and upper cover plate 1, vapor chamber 2 and lower cover 3 surround
Cavity is filled with working medium, and working medium is the nano-fluid containing magnetic-particle.This silica-based even-heating compound slab heat pipe soaking device is at alternation
Work under magnetic field.
As shown in Figure 2, Figure 4 shows, the inner surface of upper cover plate 1 and lower cover 3 is equipped with crisscross rectangular duct.This rectangle
Conduit can increase contact area, accelerates the condensation of steam.As it is shown on figure 3, vapor chamber inner surface is provided with magnetic susceptibility stirring bar.
Below by way of specific embodiment, the present invention is described in further detail, further to show the present invention's
A little and principle: at the present embodiment, upper cover plate 1 is the same with lower cover 3 structure, all for by one side and surrounding on the side
The square structure that four sidewalls are formed, the inner surface in side has the rectangular duct that transverse and longitudinal is staggered.Upper cover plate 1, lower cover 3 lead to
Cross DEM (Deepetching, Electroforming, Microreplication) technology to obtain, i.e. by the silicon in thermal oxide
Do layer of metal mask on sheet, then entered ICP etching machine silicon is carried out deep etching obtain said structure upper cover plate 1, under
Cover plate 3.Vapor chamber 2 is the square structure with four sidewalls, uses polydimethylsiloxane.Magnetic susceptibility stirring bar 4 is tied for flat board
Structure, quantity is four, is respectively arranged on four sidewalls of vapor chamber 2.This magnetic susceptibility stirring bar 4 uses containing ferromagnetic particle
Polydimethylsiloxane is made.Vapor chamber 2 and the magnetic susceptibility stirring bar 4 being provided at its inner portion are all by Soft lithograph technology system
Become.So can make upper cover plate 1, lower cover 3 and the good key of vapor chamber and, magnetosensitive can be driven under the influence of a magnetic field to stir again
Mix rod vertical tremor.Being worth explanation, magnetic susceptibility stirring bar 4 quantity is not limited to four, can increase according to the actual requirements or less.
Upper cover plate 1, vapor chamber 2 and lower cover 3 set gradually from top to bottom and form the encapsulation cavity sealed, and are evacuated also inside it
It is packed into the nano fluid working medium containing magnetic-particle, utilizes the daughters such as oxygen respectively upper and lower cover plate and vapor chamber to be carried out surface and change
Property process, it is achieved being forever bonded of polydimethylsiloxane and silicon chip.Magnetic-particle accounts for the 0.1%～0.9% of working medium gross mass.
The operation principle of the present invention silica-based even-heating compound slab heat pipe soaking device is as follows:
Under conditions of alternating magnetic field, being filled with the working medium containing nano-particle in heat pipe, after heating, working medium is steamed at lower cover 3
Sending out, flow to upper cover plate 1 by vapor chamber 2, gas carries out condensing at upper cover plate 1 and is back to lower cover 3 again, formed an evaporation-
The cyclic process of condensation.Under alternating magnetic field, magnetic nanoparticle is under the influence of a magnetic field along magnetic direction back and forth movement, so
The bubble acceleration evaporation that lower cover produces can be impacted, the water droplet of upper cover plate condensation can be impacted again, accelerate backflow.Magnetic susceptibility simultaneously
Stirring bar 4 is up-down vibration under the action of a magnetic field, can prevent the gathering of nano-particle, deposition, can produce again good disorderly simultaneously
Stream effect, improves the heat exchange property of radiator.
In sum, the silica-based even-heating compound slab heat pipe soaking device that the present invention provides, upper cover plate is with rectangle in length and breadth
Conduit, be conducive to increasing contact area, accelerate condensation.Under alternating magnetic field, the nano-fluid containing magnetic-particle is in magnetic field
Along magnetic direction back and forth movement under effect, so can impact the bubble acceleration evaporation that lower cover produces, upper cover plate can be impacted again
The water droplet of condensation, accelerates backflow.Vapor chamber, with magnetic susceptibility stirring bar, under the action of a magnetic force, up-down vibration, is possible to prevent
The gathering of nanoparticle, deposition, can produce again good turbulent effect simultaneously, reaches to improve the purpose of soaking device heat exchange property.
Generally speaking, present configuration is simple, and heat transfer efficiency is high, has the highest practical value, it is easy to manufacture, and is suitable for extensive raw
Produce, be worth popularization in the field of business.
Those of ordinary skill in the art it will be appreciated that embodiment described here be to aid in reader understanding this
Bright principle, it should be understood that protection scope of the present invention is not limited to such special statement and embodiment.This area
It is each that those of ordinary skill can make various other without departing from essence of the present invention according to these technology disclosed by the invention enlightenment
Planting concrete deformation and combination, these deform and combine the most within the scope of the present invention.
Claims (9)
1. a silica-based even-heating compound slab heat pipe soaking device, it is characterised in that: include upper cover plate (1), lower cover (3) and
The vapor chamber (2) being arranged between upper cover plate (1) and lower cover (3), described upper cover plate (1), lower cover (3), vapor chamber (2) are enclosed
Being filled with working medium in the cavity become, described working medium is the nano-fluid containing magnetic-particle, and the inner peripheral surface of described vapor chamber (2) is provided with magnetic
Sensitive stirring bar (4).
Silica-based even-heating compound slab heat pipe soaking device the most according to claim 1, it is characterised in that: described magnetic-particle
Account for the 0.1%～0.9% of working medium gross mass.
Silica-based even-heating compound slab heat pipe soaking device the most according to claim 1, it is characterised in that: described upper cover plate
And the inner surface of lower cover (3) is equipped with crisscross rectangular duct (1).
4. according to the silica-based even-heating compound slab heat pipe soaking device described in claim 1-3, it is characterised in that: described upper cover plate
(1) and lower cover (3) is by doing layer of metal mask on the silicon chip of thermal oxide, then entered ICP etching machine and silicon was carried out deeply
Degree etching obtains.
Silica-based even-heating compound slab heat pipe soaking device the most according to claim 4, it is characterised in that: described vapor chamber
(2) polydimethylsiloxane is used to make.
Silica-based even-heating compound slab heat pipe soaking device the most according to claim 5, it is characterised in that: described vapor chamber
(2) it is made by Soft lithograph method.
Silica-based even-heating compound slab heat pipe soaking device the most according to claim 5, it is characterised in that: utilize oxygen plasma
Body carries out surface modification treatment to upper cover plate (1), lower cover (3) with vapor chamber (2) respectively, it is achieved polydimethylsiloxane and silicon
The bonding of sheet.
8. according to the arbitrary described silica-based even-heating compound slab heat pipe soaking device of claim 1-3, it is characterised in that: described magnetic
Sensitive stirring bar (4) quantity is four, is distributed in the interior peripheric surface of vapor chamber (2).
Silica-based even-heating compound slab heat pipe soaking device the most according to claim 8, it is characterised in that: described magnetic susceptibility stirs
Dynamic rod (4) uses the polydimethylsiloxane containing ferromagnetic particle to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610512124.7A CN106197100B (en) | 2016-07-01 | 2016-07-01 | A kind of silicon substrate even-heating compound slab heat pipe soaking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610512124.7A CN106197100B (en) | 2016-07-01 | 2016-07-01 | A kind of silicon substrate even-heating compound slab heat pipe soaking device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106197100A true CN106197100A (en) | 2016-12-07 |
| CN106197100B CN106197100B (en) | 2018-02-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610512124.7A Expired - Fee Related CN106197100B (en) | 2016-07-01 | 2016-07-01 | A kind of silicon substrate even-heating compound slab heat pipe soaking device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106197100B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109520345A (en) * | 2018-11-08 | 2019-03-26 | 大连理工大学 | A kind of bonding technology of sandwich structure silica glass micro heat pipe |
| CN109974337A (en) * | 2018-11-28 | 2019-07-05 | 浙江工业大学 | A kind of even heat tubesheet phase transformation microcooler and its manufacturing method |
| CN118442865A (en) * | 2024-06-05 | 2024-08-06 | 北京工业大学 | Micro-channel-nano porous film composite core silicon-based ultrathin heat pipe and manufacturing method thereof |
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|---|---|---|---|---|
| US6588498B1 (en) * | 2002-07-18 | 2003-07-08 | Delphi Technologies, Inc. | Thermosiphon for electronics cooling with high performance boiling and condensing surfaces |
| CN101141871A (en) * | 2007-10-26 | 2008-03-12 | 北京工业大学 | Integration designed heat radiator with flat heat pipe spreader |
| CN101232794A (en) * | 2007-01-24 | 2008-07-30 | 富准精密工业(深圳)有限公司 | Soaking plate and heat radiating device |
| US20130168054A1 (en) * | 2012-01-04 | 2013-07-04 | Asia Vital Components Co., Ltd. | Heat pipe and method for manufacturing the same |
| CN204115535U (en) * | 2014-07-11 | 2015-01-21 | 周来好 | A kind of soaking plate |
| CN104634148A (en) * | 2015-03-04 | 2015-05-20 | 广东工业大学 | Flat-plate heat tube with nanometer structure |
-
2016
- 2016-07-01 CN CN201610512124.7A patent/CN106197100B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6588498B1 (en) * | 2002-07-18 | 2003-07-08 | Delphi Technologies, Inc. | Thermosiphon for electronics cooling with high performance boiling and condensing surfaces |
| CN101232794A (en) * | 2007-01-24 | 2008-07-30 | 富准精密工业(深圳)有限公司 | Soaking plate and heat radiating device |
| CN101141871A (en) * | 2007-10-26 | 2008-03-12 | 北京工业大学 | Integration designed heat radiator with flat heat pipe spreader |
| US20130168054A1 (en) * | 2012-01-04 | 2013-07-04 | Asia Vital Components Co., Ltd. | Heat pipe and method for manufacturing the same |
| CN204115535U (en) * | 2014-07-11 | 2015-01-21 | 周来好 | A kind of soaking plate |
| CN104634148A (en) * | 2015-03-04 | 2015-05-20 | 广东工业大学 | Flat-plate heat tube with nanometer structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109520345A (en) * | 2018-11-08 | 2019-03-26 | 大连理工大学 | A kind of bonding technology of sandwich structure silica glass micro heat pipe |
| CN109974337A (en) * | 2018-11-28 | 2019-07-05 | 浙江工业大学 | A kind of even heat tubesheet phase transformation microcooler and its manufacturing method |
| CN109974337B (en) * | 2018-11-28 | 2023-11-17 | 浙江工业大学 | Uniform heat pipe plate phase change micro refrigerator and manufacturing method thereof |
| CN118442865A (en) * | 2024-06-05 | 2024-08-06 | 北京工业大学 | Micro-channel-nano porous film composite core silicon-based ultrathin heat pipe and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106197100B (en) | 2018-02-06 |
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Granted publication date: 20180206 Termination date: 20200701 |