CN106197100B - A kind of silicon substrate even-heating compound slab heat pipe soaking device - Google Patents

A kind of silicon substrate even-heating compound slab heat pipe soaking device Download PDF

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Publication number
CN106197100B
CN106197100B CN201610512124.7A CN201610512124A CN106197100B CN 106197100 B CN106197100 B CN 106197100B CN 201610512124 A CN201610512124 A CN 201610512124A CN 106197100 B CN106197100 B CN 106197100B
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CN
China
Prior art keywords
heat pipe
silicon substrate
substrate even
vapor chamber
heating compound
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201610512124.7A
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Chinese (zh)
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CN106197100A (en
Inventor
郝晓红
彭倍
张冰雪
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University of Electronic Science and Technology of China
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University of Electronic Science and Technology of China
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Priority to CN201610512124.7A priority Critical patent/CN106197100B/en
Publication of CN106197100A publication Critical patent/CN106197100A/en
Application granted granted Critical
Publication of CN106197100B publication Critical patent/CN106197100B/en
Expired - Fee Related legal-status Critical Current
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
    • F28F13/125—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation by stirring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08—Fluid driving means, e.g. pumps, fans

Abstract

The invention discloses a kind of silicon substrate even-heating compound slab heat pipe soaking device, including upper cover plate, lower cover and the vapor chamber being arranged between upper cover plate and lower cover, filled with working medium in the cavity that the upper cover plate, lower cover, vapor chamber surround, the working medium is the nano-fluid containing magnetic-particle, and the inner peripheral surface of the vapor chamber is provided with magnetic susceptibility stirring bar.The silicon substrate even-heating compound slab heat pipe soaking device, aggregation, the deposition of nano-particle can be effectively prevented, while and can produces good turbulent flow effect, reaches the purpose for improving soaking device heat exchange property.Generally speaking, the present invention is simple in construction, and heat transfer efficiency is high, has very high practical value, easily fabricated, is adapted to large-scale production, is worth popularization in the field of business.

Description

A kind of silicon substrate even-heating compound slab heat pipe soaking device
Technical field
The invention belongs to the heat abstractor of microelectronic device, and in particular to a kind of silicon substrate even-heating compound slab heat pipe is equal Hot device.
Background technology
With the fast development of electronic technology, electronic technology has obtained widely should in dual-use every field With.In electronic equipment running, there is quite a few power attenuation to be converted into heat.The yardstick of electronic equipment is less and less, Integration degree more and more higher, with the continuous improvement of the integration density of electronic equipment, packaging density and working frequency, make hot-fluid Density improves rapidly, causes component, circuit board, component and equipment cisco unity malfunction at a higher temperature, i.e., can occur " thermic failure ".The normal operating temperature of electronic equipment is generally -5 DEG C~+65 DEG C, more than the performance of this range electronic equipment It will be remarkably decreased.Research shows that the temperature of each semiconductor element often raises 10 DEG C, and its reliability will decline 50%.Therefore have The solution heat dissipation problem of effect, ensure the normal operation of electronic equipment turns into key technology urgently to be resolved hurrily.
Electronic equipment thermal failure is caused mainly to have the reason for following three aspects at present：
(1) developing rapidly with microelectric technique, packaging density have obtained rapid raising, cause heat flow density very high.
(2) as the raising of component integrated level, heat are concentrated, electronic device works fail under hot environment.
(3) use range of microelectronic device is increasingly extensive, and use environment changes very greatly, and some electronic equipments are often in Environment temperature is high, and difference variation is big, under condition exacting terms, so as to cause its service behaviour and stability to substantially reduce.
The purpose of Electronic cooling is to reduce temperature, is allowed to maintain in normal operating temperature range.So as to Ensure the stabilization of its performance.From radiating mode, Electronic cooling can be divided into passive type and active two kinds of radiating.Before The characteristics of person, is not needing consumed energy, and the latter then requires the expenditure of energy.The latter is more beneficial for improving the work of electronic equipment Make performance, but need more energy consumptions.Even-heating flat-plate heat pipe is a kind of passive device, is a flat, thin two-dimentional heat pipe.Heat Measure and be passed to from a zonule in heat pipe center.The heat evaporates working medium, and steam moves from the mediad all directions of soaking plate. Include its top plate region colder in interior soaking plate as steam reaches, steam is condensed and absorbed by liquid sucting core structure, then It is transmitted back to heat source region.
In conventional art, working media of the neat liquid as heat pipe typically is used, in order to further lift the heat conduction of heat pipe Efficiency adds nano particle to strengthen convection current in hydraulic fluid, but in the heat pipe course of work nano-particle can occur aggregation, Deposition, make the reduction of working fluid heat conductivility.Therefore how effectively to prevent the aggregation of nano particle, deposition is to improve heat pipe for thermal conductivity Efficiency urgent problem.
The content of the invention
Present invention aim to address above mentioned problem, there is provided a kind of silicon substrate even-heating compound slab heat pipe soaking device.
In order to solve the above technical problems, the technical scheme is that：A kind of silicon substrate even-heating compound slab heat pipe soaking Device, including upper cover plate, lower cover and the vapor chamber being arranged between upper cover plate and lower cover, the upper cover plate, lower cover, steaming Filled with working medium, the working medium it is the nano-fluid containing magnetic-particle in the cavity that vapour chamber surrounds, the inner peripheral surface of the vapor chamber is set There is magnetic susceptibility stirring bar.
Preferably, the magnetic-particle accounts for the 0.1%~0.9% of working medium gross mass.
Preferably, the inner surface of the upper cover plate and lower cover is equipped with crisscross rectangular duct.
Preferably, then the upper cover plate and lower cover were entered by doing layer of metal mask on the silicon chip of thermal oxide ICP etching machines carry out deep etching to silicon and obtained.
Preferably, the vapor chamber is made of dimethyl silicone polymer.
Preferably, the vapor chamber is made by Soft lithograph method.
Preferably, surface modification treatment is carried out to upper cover plate, lower cover and vapor chamber respectively using oxygen plasma, realized Dimethyl silicone polymer is bonded with silicon chip.
Preferably, the magnetic susceptibility stirring bar quantity is four, is distributed in the interior peripheric surface of vapor chamber.
Preferably, the magnetic susceptibility stirring bar is made of the dimethyl silicone polymer containing ferromagnetic particle.
The beneficial effects of the invention are as follows：Under alternating magnetic field, the edge under the influence of a magnetic field of the nano-fluid containing magnetic-particle Magnetic direction back and forth movement, it can so impact bubble caused by lower cover and accelerate evaporation, the water of and can impact upper cover plate condensation Drop, accelerate backflow.Vapor chamber is provided with magnetic susceptibility stirring bar, under the action of a magnetic force, up-down vibration, can prevent nano-particle Aggregation, deposition, while and can produces good turbulent flow effect, reaches the purpose for improving soaking device heat exchange property.Generally speaking, The present invention is simple in construction, and heat transfer efficiency is high, has very high practical value, easily fabricated, is adapted to large-scale production, is worth in industry Interior popularization.
Brief description of the drawings
Fig. 1 is the structural representation of silicon substrate even-heating compound slab heat pipe soaking device of the present invention；
Fig. 2 is the structural representation of silicon substrate even-heating compound slab heat pipe soaking device upper cover plate of the present invention；
Fig. 3 is the structural representation of silicon substrate even-heating compound slab heat pipe soaking device vapor chamber of the present invention；
Fig. 4 is the structural representation of silicon substrate even-heating compound slab heat pipe soaking device lower cover of the present invention.
Description of reference numerals：1st, upper cover plate；2nd, vapor chamber；3rd, lower cover；4th, magnetic susceptibility vibrating head.
Embodiment
The present invention is described further with specific embodiment below in conjunction with the accompanying drawings：
As shown in figure 1, silicon substrate even-heating compound slab heat pipe soaking device of the present invention, including upper cover plate 1, vapor chamber 2 and Lower cover 3.Vapor chamber 2 is arranged between upper cover plate 1 and lower cover 3, and upper cover plate 1, vapor chamber 2 and lower cover 3 surround For cavity filled with working medium, working medium is the nano-fluid containing magnetic-particle.The silicon substrate even-heating compound slab heat pipe soaking device is in alternation Worked under magnetic field.
As shown in Figure 2, Figure 4 shows, the inner surface of upper cover plate 1 and lower cover 3 is equipped with crisscross rectangular duct.The rectangle Conduit can increase contact area, accelerate the condensation of steam.As shown in figure 3, steam inner cavity surface is provided with magnetic susceptibility stirring bar.
The present invention is described in further detail below by way of specific embodiment, shows the present invention's with further A little and principle：In the present embodiment, upper cover plate 1 is as the structure of lower cover 3, for by one side and positioned at side surrounding The square structure that four side walls are formed, the inner surface in side have the rectangular duct that transverse and longitudinal is interlocked.Upper cover plate 1, lower cover 3 are logical Cross DEM (Deepetching, Electroforming, Microreplication) technology to obtain, that is, pass through the silicon in thermal oxide Layer of metal mask is done on piece, then entered ICP etching machines to silicon carry out deep etching obtain said structure upper cover plate 1, under Cover plate 3.Vapor chamber 2 is the square structure with four side walls, using dimethyl silicone polymer.Magnetic susceptibility stirring bar 4 is flat board knot Structure, quantity are four, are respectively arranged in four side walls of vapor chamber 2.The magnetic susceptibility stirring bar 4, which uses, contains ferromagnetic particle Dimethyl silicone polymer is made.Vapor chamber 2 and the magnetic susceptibility stirring bar 4 being provided at its inner portion are by Soft lithograph technology system Into.Can so make upper cover plate 1, lower cover 3 and the good key of vapor chamber and, and can drives magnetosensitive to stir under the influence of a magnetic field Mix rod vertical tremor.It is worth explanation, the quantity of magnetic susceptibility stirring bar 4 is not limited to four, can increase according to the actual requirements or less. Upper cover plate 1, vapor chamber 2 and lower cover 3 set gradually the encapsulation cavity to form sealing from top to bottom, are evacuated simultaneously inside it The nano fluid working medium containing magnetic-particle is packed into, carrying out surface with vapor chamber to upper and lower cover plate respectively using daughters such as oxygen changes Property processing, realize that dimethyl silicone polymer is bonded with the permanent of silicon chip.Magnetic-particle accounts for the 0.1%~0.9% of working medium gross mass.
The operation principle of silicon substrate even-heating compound slab heat pipe soaking device of the present invention is as follows：
The working medium containing nano particle is filled with conditions of alternating magnetic field, in heat pipe, working medium is steamed in lower cover 3 after heating Hair, upper cover plate 1 is flowed to by vapor chamber 2, and gas is condensed in upper cover plate 1 is back to lower cover 3 again, and one evaporation of formation- The cyclic process of condensation.Under alternating magnetic field, magnetic nanoparticle is under the influence of a magnetic field along magnetic direction back and forth movement, so Bubble caused by lower cover can be impacted and accelerate evaporation, the water droplet of and can impact upper cover plate condensation, accelerate backflow.Magnetic susceptibility simultaneously The up-down vibration under magnetic fields of stirring bar 4, aggregation, the deposition of nano particle can be prevented, while and can produces well disorderly Effect is flowed, improves the heat exchange property of radiator.
In summary, silicon substrate even-heating compound slab heat pipe soaking device provided by the invention, upper cover plate carry rectangle in length and breadth Conduit, be advantageous to increase contact area, accelerate condensation.Under alternating magnetic field, the nano-fluid containing magnetic-particle is in magnetic field Along magnetic direction back and forth movement under effect, it can so impact bubble caused by lower cover and accelerate evaporation, and can impact upper cover plate The water droplet of condensation, accelerate backflow.Vapor chamber carries magnetic susceptibility stirring bar, under the action of a magnetic force, up-down vibration, can prevent The aggregation of nano-particle, deposition, while and can produces good turbulent flow effect, reaches the purpose for improving soaking device heat exchange property. Generally speaking, the present invention is simple in construction, and heat transfer efficiency is high, has very high practical value, easily fabricated, is adapted to extensive raw Production, it is worth popularization in the field of business.
One of ordinary skill in the art will be appreciated that embodiment described here is to aid in reader and understands this hair Bright principle, it should be understood that protection scope of the present invention is not limited to such especially statement and embodiment.This area Those of ordinary skill can make according to these technical inspirations disclosed by the invention various does not depart from the other each of essence of the invention The specific deformation of kind and combination, these deform and combined still within the scope of the present invention.

Claims (9)

  1. A kind of 1. silicon substrate even-heating compound slab heat pipe soaking device, it is characterised in that：Including upper cover plate (1), lower cover (3) and The vapor chamber (2) being arranged between upper cover plate (1) and lower cover (3), the upper cover plate (1), lower cover (3), vapor chamber (2) are enclosed Into cavity in filled with working medium, the working medium is the nano-fluid containing magnetic-particle, and the inner peripheral surface of the vapor chamber (2) is provided with magnetic Sensitive stirring bar (4).
  2. 2. silicon substrate even-heating compound slab heat pipe soaking device according to claim 1, it is characterised in that：The magnetic-particle Account for the 0.1%~0.9% of working medium gross mass.
  3. 3. silicon substrate even-heating compound slab heat pipe soaking device according to claim 1, it is characterised in that：The upper cover plate (1) and the inner surface of lower cover (3) is equipped with crisscross rectangular duct.
  4. 4. according to any described silicon substrate even-heating compound slab heat pipe soaking devices of claim 1-3, it is characterised in that：On described Then cover plate (1) and lower cover (3) entered ICP etching machines and silicon were entered by doing layer of metal mask on the silicon chip of thermal oxide Row deep etching obtains.
  5. 5. silicon substrate even-heating compound slab heat pipe soaking device according to claim 4, it is characterised in that：The vapor chamber (2) it is made of dimethyl silicone polymer.
  6. 6. silicon substrate even-heating compound slab heat pipe soaking device according to claim 5, it is characterised in that：The vapor chamber (2) it is made by Soft lithograph method.
  7. 7. silicon substrate even-heating compound slab heat pipe soaking device according to claim 5, it is characterised in that：Utilize oxygen plasma Body carries out surface modification treatment to upper cover plate (1), lower cover (3) and vapor chamber (2) respectively, realizes dimethyl silicone polymer and silicon The bonding of piece.
  8. 8. according to any described silicon substrate even-heating compound slab heat pipe soaking devices of claim 1-3, it is characterised in that：The magnetic Sensitive stirring bar (4) quantity is four, is distributed in the interior peripheric surface of vapor chamber (2).
  9. 9. silicon substrate even-heating compound slab heat pipe soaking device according to claim 8, it is characterised in that：The magnetic susceptibility stirs Dynamic rod (4) is made of the dimethyl silicone polymer containing ferromagnetic particle.
CN201610512124.7A 2016-07-01 2016-07-01 A kind of silicon substrate even-heating compound slab heat pipe soaking device Expired - Fee Related CN106197100B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109520345B (en) * 2018-11-08 2020-09-25 大连理工大学 Bonding process of sandwich structure silica glass micro heat pipe
CN109974337B (en) * 2018-11-28 2023-11-17 浙江工业大学 Uniform heat pipe plate phase change micro refrigerator and manufacturing method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6588498B1 (en) * 2002-07-18 2003-07-08 Delphi Technologies, Inc. Thermosiphon for electronics cooling with high performance boiling and condensing surfaces
CN101141871A (en) * 2007-10-26 2008-03-12 北京工业大学 Integration designed heat radiator with flat heat pipe spreader
CN101232794A (en) * 2007-01-24 2008-07-30 富准精密工业(深圳)有限公司 Soaking plate and heat radiating device
CN204115535U (en) * 2014-07-11 2015-01-21 周来好 A kind of soaking plate
CN104634148A (en) * 2015-03-04 2015-05-20 广东工业大学 Flat-plate heat tube with nanometer structure

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130168054A1 (en) * 2012-01-04 2013-07-04 Asia Vital Components Co., Ltd. Heat pipe and method for manufacturing the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6588498B1 (en) * 2002-07-18 2003-07-08 Delphi Technologies, Inc. Thermosiphon for electronics cooling with high performance boiling and condensing surfaces
CN101232794A (en) * 2007-01-24 2008-07-30 富准精密工业(深圳)有限公司 Soaking plate and heat radiating device
CN101141871A (en) * 2007-10-26 2008-03-12 北京工业大学 Integration designed heat radiator with flat heat pipe spreader
CN204115535U (en) * 2014-07-11 2015-01-21 周来好 A kind of soaking plate
CN104634148A (en) * 2015-03-04 2015-05-20 广东工业大学 Flat-plate heat tube with nanometer structure

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