CN109504956A - A kind of processing method improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant - Google Patents
A kind of processing method improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant Download PDFInfo
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- CN109504956A CN109504956A CN201811299085.2A CN201811299085A CN109504956A CN 109504956 A CN109504956 A CN 109504956A CN 201811299085 A CN201811299085 A CN 201811299085A CN 109504956 A CN109504956 A CN 109504956A
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- sucking core
- resistant
- hot plate
- heat pipe
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
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- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
The present invention relates to the processing methods of a kind of raising heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which comprises the following steps: (1), is activated, removes the copper oxide of workpiece surface；(2), Nickel Plating Treatment, in the laminated golden nickel layer of workpiece surface plating one.The present invention solves the problems, such as that copper surface is easy to oxidize, to guarantee that liquid-sucking core does not need progress high-temperature hydrogen reduction and can keep good capillary force, changes current liquid-sucking core preparation process flow, improves production efficiency, greatly reduce production cost.
Description
Technical field
The present invention relates to the manufactures of hot plate liquid-sucking core, and in particular to a kind of raising heat pipe, hot plate liquid-sucking core surface oxidation-resistant
Processing method.
Background technique
Pipe, hot plate are widely used as a kind of Thermal Conduction Equipment of electronic product, and wherein the liquid-sucking core inside hot plate contains
Abundant capillary structure, plays heat-transfer effect highly important.Liquid-sucking core mainly uses copper powder to be sintered at present, tube wall is slotted,
Copper mesh adherence method prepares liquid-sucking core, is as shown in Figure 1 the fluting copper wall-wick of tube wall fluting, is illustrated in figure 2 copper mesh
The copper mesh formula liquid-sucking core of attachment is illustrated in figure 3 the copper powder sintered type liquid-sucking core of copper powder sintering.The liquid-sucking core of these three modes is all
It is that the copper on surface and air directly contact, to prevent from aoxidizing, must all uses high-temperature hydrogen reduction before vacuumizing water filling, remove copper removal
The oxide skin on surface just can guarantee the wicking capacity of liquid-sucking core, obtain qualified heat pipe, hot plate.Use high-temperature hydrogen reduction copper
Surface needs up to 900 degrees Celsius of high temperature, and the time is long, and production efficiency is low.
Summary of the invention
In view of the deficiencies of the prior art, the present invention is intended to provide a kind of raising heat pipe, hot plate imbibition wicking surface antioxygen
The processing method of change solves the problems, such as that copper surface is easy to oxidize, to guarantee that liquid-sucking core does not need to carry out high-temperature hydrogen reduction
Good capillary force can be kept, current liquid-sucking core preparation process flow is changed, improves production efficiency, greatly reduce
Production cost.
Of the invention is achieved through the following technical solutions.
A kind of processing method improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which comprises the following steps:
(1), it is activated, removes the copper oxide of workpiece surface；
(2), Nickel Plating Treatment, in the laminated golden nickel layer of workpiece surface plating one.
Preferably, further include step (3) drying processing, dried up workpiece with cold wind
Specifically, the workpiece is fluting copper wall-wick, copper mesh formula liquid-sucking core or copper powder sintered type liquid-sucking core.
Preferably, the workpiece is fluting copper wall liquid-sucking core or copper mesh liquid-sucking core, is carried out at oil removing before step (1)
Reason, removes the greasy dirt of workpiece surface.
Specifically, the step (1) is sulfuric acid activated using weight ratio 5-20%, and 20-40 DEG C of temperature, time 5-10min.
Specifically, the step (2) uses chemical plating method nickel plating, nickel plating bath are as follows: sodium hypophosphite 25-30g/l,
Nickel sulfate 25-30g/l, lactic acid 20-25g/l, malic acid 5-10g/l, sodium acetate 15-25g/l, thiocarbamide 1.5-5mg/l, pH control
System is in 4-6.5, and 80-90 DEG C of temperature, time 1-15min.
Preferably, the nickel plating bath further includes glycine 2-5g/l.
Preferably, the nickel plating bath further includes ups:2-5mg/l.
Specifically, oil removal treatment solution are as follows: sodium carbonate 20-50g/l, sodium metasilicate 3-5g/l, tertiary sodium phosphate 10-20g/l,
Sodium hydroxide 10-20g/l, OP emulsifier 3-5ml/l, 80-85 DEG C of temperature, time 5-10min.
Compared with prior art, the invention has the advantages that the present invention solves the problems, such as that copper surface is easy to oxidize, to protect
Card liquid-sucking core, which does not need progress high-temperature hydrogen reduction, can keep good capillary force, change current liquid-sucking core preparation process
Process improves production efficiency, greatly reduces production cost.
Detailed description of the invention
Fig. 1 is the fluting copper wall-wick of existing tube wall fluting；
Fig. 2 is the copper mesh formula liquid-sucking core of existing copper mesh attachment；
Fig. 3 is the copper powder sintered type liquid-sucking core of existing copper powder sintering.
Specific embodiment
The present invention will be further explained below with reference to the attached drawings and specific examples, but not as the limitation of the invention.
Embodiment 1
A kind of processing method improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which comprises the following steps:
(1), oil removal treatment removes the greasy dirt of workpiece surface；The workpiece containing fluting copper wall-wick hung up properly by,
It is put into the greasy dirt that surface is removed in degreasing tank, specifically, oil removal treatment solution are as follows: sodium carbonate 20g/l, sodium metasilicate 3g/l, phosphoric acid
Trisodium 10g/l, sodium hydroxide 10g/l, OP emulsifier 3ml/l, 80-85 DEG C of temperature, time 10min；
(2), it is activated, removes the copper oxide of workpiece surface；Specifically, temperature sulfuric acid activated using weight ratio 5%
20-30 DEG C, time 10min；
(3), Nickel Plating Treatment, in the laminated golden nickel layer of workpiece surface plating one；Specifically, nickel plating bath are as follows: sodium hypophosphite
25g/l, nickel sulfate 25g/l, lactic acid 20g/l, malic acid 5g/l, sodium acetate 15g/l, glycine 2g/l, thiocarbamide 1.5mg/l,
Ups:2mg/l, pH control are 6.5,85-90 DEG C of temperature, time 5min；
(4), drying is handled, and is dried up workpiece with cold wind.
Embodiment 2
A kind of processing method improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which comprises the following steps:
(1), oil removal treatment removes the greasy dirt of workpiece surface；The workpiece containing fluting copper wall-wick hung up properly by,
It is put into the greasy dirt that surface is removed in degreasing tank, specifically, oil removal treatment solution are as follows: sodium carbonate 35g/l, sodium metasilicate 4g/l, phosphoric acid
Trisodium 15g/l, sodium hydroxide 15g/l, OP emulsifier 4ml/l, 80-85 DEG C of temperature, time 8min；
(2), it is activated, removes the copper oxide of workpiece surface；Specifically, temperature sulfuric acid activated using weight ratio 10%
20-30 DEG C, time 8min；
(3), Nickel Plating Treatment, in the laminated golden nickel layer of workpiece surface plating one；Specifically, nickel plating bath are as follows: sodium hypophosphite
28g/l, nickel sulfate 28g/l, lactic acid 22g/l, malic acid 7.5g/l, sodium acetate 20g/l, glycine 3.5g/l, thiocarbamide 2.2mg/
L, ups:3.5mg/l, pH control are 5.8,85-90 DEG C of temperature, time 3min；
(4), drying is handled, and is dried up workpiece with cold wind.
Embodiment 3
A kind of processing method improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which comprises the following steps:
(1), oil removal treatment removes the greasy dirt of workpiece surface；The workpiece containing fluting copper wall-wick hung up properly by,
It is put into the greasy dirt that surface is removed in degreasing tank, specifically, oil removal treatment solution are as follows: sodium carbonate 50g/l, sodium metasilicate 5g/l, phosphoric acid
Trisodium 20g/l, sodium hydroxide 20g/l, OP emulsifier 5ml/l, 80-85 DEG C of temperature, time 5min；
(2), it is activated, removes the copper oxide of workpiece surface；Specifically, temperature sulfuric acid activated using weight ratio 15%
20-30 DEG C, time 5min；
(3), Nickel Plating Treatment, in the laminated golden nickel layer of workpiece surface plating one；Specifically, nickel plating bath are as follows: sodium hypophosphite
30g/l, nickel sulfate 30g/l, lactic acid 25g/l, malic acid 10g/l, sodium acetate 25g/l, glycine 5g/l, thiocarbamide 3mg/l, ups:
5mg/l, pH control are 5,85-90 DEG C of temperature, time 1min；
(4), drying is handled, and is dried up workpiece with cold wind.
Embodiment 4
Copper mesh formula liquid-sucking core is to form liquid-sucking core after the copper mesh of different size is welded to Copper substrate, carries out surface antioxygen to it
Change chemical plating, can first carry out, can also carry out after welding before welding, preferential selection carries out chemistry to copper mesh before welding
Plating, is cut into prescribed level again, is then welded on Copper substrate after having plated.
A kind of processing method improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which comprises the following steps:
(1), oil removal treatment removes the greasy dirt of workpiece surface；The workpiece containing copper mesh formula liquid-sucking core hung up properly by, is put into
The greasy dirt that surface is removed in degreasing tank, specifically, oil removal treatment solution are as follows: sodium carbonate 20g/l, sodium metasilicate 3g/l, tertiary sodium phosphate
10g/l, sodium hydroxide 10g/l, OP emulsifier 3ml/l.80-85 DEG C of temperature, time 10min；
(2), it is activated, removes the copper oxide of workpiece surface；Specifically, temperature sulfuric acid activated using weight ratio 10%
30-40 DEG C, time 10min；
(3), Nickel Plating Treatment, in the laminated golden nickel layer of workpiece surface plating one；Specifically, nickel plating bath are as follows: sodium hypophosphite: secondary
Sodium phosphite 25g/l, nickel sulfate 25g/l, lactic acid 20g/l, malic acid 5g/l, sodium acetate 15g/l, thiocarbamide 1.5mg/l, pH control
6.5,80-90 DEG C of temperature, time 5min；
(4), drying is handled, and is dried up workpiece with cold wind.
Embodiment 5
Copper mesh formula liquid-sucking core is to form liquid-sucking core after the copper mesh of different size is welded to Copper substrate, carries out surface antioxygen to it
Change chemical plating, can first carry out, can also carry out after welding before welding, preferential selection carries out chemistry to copper mesh before welding
Plating, is cut into prescribed level again, is then welded on Copper substrate after having plated.
A kind of processing method improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which comprises the following steps:
(1), oil removal treatment removes the greasy dirt of workpiece surface；The workpiece containing copper mesh formula liquid-sucking core hung up properly by, is put into
The greasy dirt that surface is removed in degreasing tank, specifically, oil removal treatment solution are as follows: sodium carbonate 35g/l, sodium metasilicate 4g/l, tertiary sodium phosphate
15g/l, sodium hydroxide 15g/l, OP emulsifier 4ml/l.80-85 DEG C of temperature, time 8min；
(2), it is activated, removes the copper oxide of workpiece surface；Specifically, temperature sulfuric acid activated using weight ratio 15%
30-40 DEG C, time 8min；
(3), Nickel Plating Treatment, in the laminated golden nickel layer of workpiece surface plating one；Specifically, nickel plating bath are as follows: sodium hypophosphite: secondary
Sodium phosphite 27g/l, nickel sulfate 27g/l, lactic acid 22g/l, malic acid 7g/l, sodium acetate 20g/l, thiocarbamide 2.2mg/l, pH control
6,80-90 DEG C of temperature, time 3min；
(4), drying is handled, and is dried up workpiece with cold wind.
Embodiment 6
Copper mesh formula liquid-sucking core is to form liquid-sucking core after the copper mesh of different size is welded to Copper substrate, carries out surface antioxygen to it
Change chemical plating, can first carry out, can also carry out after welding before welding, preferential selection carries out chemistry to copper mesh before welding
Plating, is cut into prescribed level again, is then welded on Copper substrate after having plated.
A kind of processing method improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which comprises the following steps:
(1), oil removal treatment removes the greasy dirt of workpiece surface；The workpiece containing copper mesh formula liquid-sucking core hung up properly by, is put into
The greasy dirt that surface is removed in degreasing tank, specifically, oil removal treatment solution are as follows: sodium carbonate 50g/l, sodium metasilicate 5g/l, tertiary sodium phosphate
20g/l, sodium hydroxide 20g/l, OP emulsifier 5ml/l.80-85 DEG C of temperature, time 5min；
(2), it is activated, removes the copper oxide of workpiece surface；Specifically, temperature sulfuric acid activated using weight ratio 20%
30-40 DEG C, time 5min；
(3), Nickel Plating Treatment, in the laminated golden nickel layer of workpiece surface plating one；Specifically, nickel plating bath are as follows: sodium hypophosphite: secondary
Sodium phosphite 30g/l, nickel sulfate 30g/l, lactic acid 25g/l, malic acid 10g/l, sodium acetate 25g/l, thiocarbamide 3mg/l, pH control
5.5,80-90 DEG C of temperature, time 1min；
(4), drying is handled, and is dried up workpiece with cold wind.
Embodiment 7
Copper powder sintered wicks be different size copper powder at high temperature it is micro- thawing be interconnected with one another to form capillary channel
As liquid-sucking core.Because copper powder is sintered at high temperature, surface does not have greasy dirt, therefore, when carrying out surface oxidation-resistant processing, no
Need oil removal treatment.Since sintered copper powder surface area is very big, in chemical plating, tank liquor activity is mainly controlled, it is general to stablize
Agent content is higher than generalization plating.
A kind of processing method improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which comprises the following steps:
(1), it is activated, removes the copper oxide for the workpiece surface that work contains copper powder sintered type liquid-sucking core；Specifically, using
Weight ratio 10% is sulfuric acid activated, and 30-40 DEG C of temperature, time 10min；
(2), Nickel Plating Treatment, in the laminated golden nickel layer of workpiece surface plating one；Specifically, nickel plating bath are as follows: sodium hypophosphite: secondary
Sodium phosphite 25g/l, nickel sulfate 25g/l, lactic acid 20g/l, malic acid 5g/l, sodium acetate 15g/l, thiocarbamide 3mg/l, ups:2mg/
L, pH control are 6,85-95 DEG C of temperature, time 15min；
(3), drying is handled, and is dried up workpiece with cold wind.
Embodiment 8
Copper powder sintered wicks be different size copper powder at high temperature it is micro- thawing be interconnected with one another to form capillary channel
As liquid-sucking core.Because copper powder is sintered at high temperature, surface does not have greasy dirt, therefore, when carrying out surface oxidation-resistant processing, no
Need oil removal treatment.Since sintered copper powder surface area is very big, in chemical plating, tank liquor activity is mainly controlled, it is general to stablize
Agent content is higher than generalization plating.
A kind of processing method improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which comprises the following steps:
(1), it is activated, removes the copper oxide for the workpiece surface that work contains copper powder sintered type liquid-sucking core；Specifically, using
Weight ratio 15% is sulfuric acid activated, and 30-40 DEG C of temperature, time 8min；
(2), Nickel Plating Treatment, in the laminated golden nickel layer of workpiece surface plating one；Specifically, nickel plating bath are as follows: sodium hypophosphite: secondary
Sodium phosphite 27g/l, nickel sulfate 27g/l, lactic acid 22g/l, malic acid 7g/l, sodium acetate 20g/l, thiocarbamide 4mg/l, ups:
3.5mg/l, pH control are 5,85-95 DEG C of temperature, time 8min；
(3), drying is handled, and is dried up workpiece with cold wind.
Embodiment 9
Copper powder sintered wicks be different size copper powder at high temperature it is micro- thawing be interconnected with one another to form capillary channel
As liquid-sucking core.Because copper powder is sintered at high temperature, surface does not have greasy dirt, therefore, when carrying out surface oxidation-resistant processing, no
Need oil removal treatment.Since sintered copper powder surface area is very big, in chemical plating, tank liquor activity is mainly controlled, it is general to stablize
Agent content is higher than generalization plating.
A kind of processing method improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which comprises the following steps:
(1), it is activated, removes the copper oxide for the workpiece surface that work contains copper powder sintered type liquid-sucking core；Specifically, using
Weight ratio 20% is sulfuric acid activated, and 30-40 DEG C of temperature, time 5min；
(2), Nickel Plating Treatment, in the laminated golden nickel layer of workpiece surface plating one；Specifically, nickel plating bath are as follows: sodium hypophosphite: secondary
Sodium phosphite 30g/l, nickel sulfate 30g/l, lactic acid 25g/l, malic acid 10g/l, sodium acetate 25g/l, thiocarbamide 5mg/l, ups:
5mg/l, pH control are 4,85-95 DEG C of temperature, time 1min；
(3), drying is handled, and is dried up workpiece with cold wind.
The present invention carries out surface to sintered copper powder, fluting copper wall and copper mesh using chemical plating and is modified, and deposits one on copper surface
Laminated gold nickel layer, this alloy nickel layer can preferably prevent copper surface oxidation, while have preferable parent using nickel surface and water
Outlet capacity, liquid-sucking core obtained not pass through high-temperature hydrogen reduction, so that it may vacuumize water filling, and be able to maintain preferable capillary energy
Power.Therefore there is high production efficiency using liquid-sucking core made from the method for the present invention, feature at low cost can be given birth on a large scale
It produces.
The foregoing is merely preferred embodiments of the present invention, are not intended to limit embodiments of the present invention and protection model
It encloses, to those skilled in the art, should can appreciate that all with made by description of the invention and diagramatic content
Equivalent replacement and obviously change obtained scheme, should all be included within the scope of the present invention.
Claims (9)
1. a kind of processing method for improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which comprises the following steps:
(1), it is activated, removes the copper oxide of workpiece surface；
(2), Nickel Plating Treatment, in the laminated golden nickel layer of workpiece surface plating one.
2. the processing method according to claim 1 for improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which is characterized in that
Further include step (3) drying processing, is dried up workpiece with cold wind.
3. the processing method according to claim 1 for improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which is characterized in that
The workpiece is fluting copper wall-wick, copper mesh formula liquid-sucking core or copper powder sintered type liquid-sucking core.
4. the processing method according to claim 3 for improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which is characterized in that
The workpiece is fluting copper wall liquid-sucking core or copper mesh liquid-sucking core, and oil removal treatment is carried out before step (1), removes workpiece surface
Greasy dirt.
5. the processing method according to any one of claims 1 to 4 for improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant,
It being characterized in that, the step (1) is sulfuric acid activated using weight ratio 5-20%, and 20-40 DEG C of temperature, time 5-10min.
6. the processing method according to any one of claims 1 to 4 for improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant,
It is characterized in that, the step (2) uses chemical plating method nickel plating, nickel plating bath are as follows: sodium hypophosphite 25-30g/l, nickel sulfate
25-30g/l, lactic acid 20-25g/l, malic acid 5-10g/l, sodium acetate 15-25g/l, thiocarbamide 1.5-5mg/l, pH control is in 4-
6.5,80-90 DEG C of temperature, time 1-15min.
7. the processing method according to claim 6 for improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which is characterized in that
The nickel plating bath further includes glycine 2-5g/l.
8. the processing method according to claim 6 for improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which is characterized in that
The nickel plating bath further includes ups:2-5mg/l.
9. the processing method according to claim 4 for improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant, which is characterized in that
Oil removal treatment solution are as follows: sodium carbonate 20-50g/l, sodium metasilicate 3-5g/l, tertiary sodium phosphate 10-20g/l, sodium hydroxide 10-20g/l,
OP emulsifier 3-5ml/l, 80-85 DEG C of temperature, time 5-10min.
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| CN201811299085.2A CN109504956A (en) | 2018-11-02 | 2018-11-02 | A kind of processing method improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant |
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| CN201811299085.2A CN109504956A (en) | 2018-11-02 | 2018-11-02 | A kind of processing method improving heat pipe, hot plate liquid-sucking core surface oxidation-resistant |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110319724A (en) * | 2019-07-03 | 2019-10-11 | 江西华度电子新材料有限公司 | A method of restoring liquid-sucking core capillary performance |
| CN113950232A (en) * | 2019-08-30 | 2022-01-18 | 荣耀终端有限公司 | Manufacturing method of heat conduction device, heat conduction device and terminal equipment |
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| JPS60140100A (en) * | 1983-12-27 | 1985-07-24 | Sanyo Electric Co Ltd | Surface treatment of heat transfer pipe of absorption type refrigerating machine |
| CN101956185A (en) * | 2010-09-03 | 2011-01-26 | 广东工业大学 | Scale-inhibiting copper-based heat exchange surface and manufacturing method thereof |
| CN102445097A (en) * | 2011-09-20 | 2012-05-09 | 华东理工大学 | High-efficiency gravity heat pipe and manufacturing method thereof |
| CN105200403A (en) * | 2014-06-26 | 2015-12-30 | 江苏格业新材料科技有限公司 | Method for improving interface combination through surface silver deposition of foamy copper for heat pipe or vapor chamber |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110319724A (en) * | 2019-07-03 | 2019-10-11 | 江西华度电子新材料有限公司 | A method of restoring liquid-sucking core capillary performance |
| CN113950232A (en) * | 2019-08-30 | 2022-01-18 | 荣耀终端有限公司 | Manufacturing method of heat conduction device, heat conduction device and terminal equipment |
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