CN1971195A - Flat heat pipe for thermal diffusion - Google Patents
Flat heat pipe for thermal diffusion Download PDFInfo
- Publication number
- CN1971195A CN1971195A CN 200610105108 CN200610105108A CN1971195A CN 1971195 A CN1971195 A CN 1971195A CN 200610105108 CN200610105108 CN 200610105108 CN 200610105108 A CN200610105108 A CN 200610105108A CN 1971195 A CN1971195 A CN 1971195A
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- fin
- heat pipe
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- heat
- wing
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Abstract
The invention relates to a flat heat pipe for thermal diffusion, comprising metal fin or fin-column radiator, and metal cover plate for sealing around. The top of metal fin or fin-column is connected with the inner wall of metal cover plate and liquid working media is set in the cavity formed by metal fin or fin-column radiator and metal cover plate. Capillary pumps for liquid return are set at the surface or base bottom of fin or fin-column, or on the inner wall of metal cover plate. The metal fin or fin-column can take an effect of strengthening the mechanical intensity of hot pipe and the capillary pump for liquid return on the surface can shorten the path of liquid return so as to improve heat transfer effect. In using heat generated by power device can make the liquid on the heating wall vaporize. The steam achieves the heat dissipation wall by channels connected with each other among fin or fin-column and condenses on the heat dissipation wall to discharge heat. Condensed liquid returns to the heating wall by capillary pump.
Description
Technical field
The present invention relates to the encapsulation and the heat dissipation technology of power model, the flat-plate heat pipe that particularly a kind of high heat density thermal diffusion is used.
Background technology
The progress of modern power electronics technology makes power electronic equipment integrated components and parts number in the confined space get more and more, and the function of device from strength to strength.Influence device performance and reliability, the major obstacles that confining device develops towards miniaturization, microminiaturized direction and become at the inner high heat flux that produces of device thereupon.The key of getting rid of this obstacle is to adopt heat abstractor efficiently, and the heat that high heat density thermal source produces is discharged.
Solving high heat density thermal source heat dissipation problem at first will diffuse to central heat source on the large tracts of land, have only and earlier central heat source is spread, could guarantee making full use of of radiator devices such as (air-cooled) water-cooleds, the effect of thermal diffusion greatly influences the radiating efficiency of radiator.In microelectronic circuit even adopt expensive goldleaf, diamond film to carry out thermal diffusion.High power device in the power model, for example the heat flow density of IGBT can reach 400W/cm
2, the thermal diffusion device of power model employing at present mainly is the metal substrate of high thermal conductivity, as copper coin, aluminium sheet etc.Though the thermal conductivity of metal substrate is higher, still there is the temperature difference in substrate bottom surface, and the efficient of radiator is lower.In addition, owing to be subjected to the restriction of the heat diffusion capabilities of metal substrate, the distance between the high power device can not be too near, in order to avoid cause heat to concentrate.Yet,, wish that again the distance between the power device is near more good more to reducing parasitic parameter.Therefore, adopt the thermal diffusion device that cost is low than metal substrate heat diffusion capabilities is stronger highly beneficial to the power and the electrical property that improve module.
Heat pipe also often is used to carry out the diffusion and the transmission of heat in power electronic equipment.Wherein the shape of flat-plate heat pipe is very beneficial for central heat source is spread.The structure of this flat-plate heat pipe is that the metal substrate core is made cavity, and cavity inner wall is provided with capillary structure, vacuumizes in the chamber, injects the working medium of a constant volume.The heat that thermal source produces makes near the liquid refrigerant gasification the heating wall, takes away heat, and steam condenses into liquid and emits heat on cooling wall, and liquid refrigerant relies on the effect of capillary force to get back on the heating wall, and so circulation just can be taken away the heat that thermal source produces.Because the equivalent speed conductance of heat pipe is far above metal, the heat diffusion capabilities of flat-plate heat pipe also far exceeds the entity metal substrate.When the thermal source heat flow density was higher, the temperature difference of flat-plate heat pipe heat-delivery surface is (Hong Yuping, Li Qiang, Xuan Yimin, mini flat heat pipe heat transfer experiment research, Institutes Of Technology Of Nanjing's journal, 2001,25 (1): 32-35) about 1 ℃ only.Flat-plate heat pipe miscellaneous has been proposed in some patent documentations, as described below:
Patent of invention " flat plate heat tube and supporting construction thereof the " (application number: 200410089845.9) of people such as Taida Electronic Industry Co Ltd's village pleasant virtue application, proposed a kind of flat-plate heat pipe, blazoned supporting construction in the vapor chamber of this heat pipe and peel off in order to avoid capillary structure.Supporting construction is the porous material of a multilayer or individual layer.Supporting construction not only can support capillary structure, reduces the thermal resistance of capillary structure and heat pipe inwall, and the steam flowing space can also be provided, and further provides capillary force that working fluid is refluxed.But, all be not so good as metal material aspect heat conduction and the mechanical strength because supporting construction is a porous material.
The patent of invention of people such as Industrial Technology Research Institute Xu Jin city application " heat of plate heat pipe passes and strengthens structure " (application number: 200310121710.1), the higher temperature place is provided with several heating columns that is connected to upper and lower wall in the heat pipe cavity, with as heat conducting reinforcement structure, reduce the thermal resistance on the heat biography path.This structure emphasis in design considers and strengthens the heat conduction of wall up and down of heat pipe cavity, so heating column only is located at higher temperature place in the heat pipe cavity, and this structure is not done the consideration of shortening the opposing steam flow path and strengthening heat pipe mechanical strength aspect.
Summary of the invention
The object of the present invention is to provide a kind of mechanical strength that can either fully guarantee heat pipe, the return flow path of hydraulic fluid is reduced greatly, thereby improve a kind of thermal diffusion flat-plate heat pipe of Heat Transfer of Heat Pipe on Heat Pipe performance.
For achieving the above object, the technical solution used in the present invention is: comprise fin or wing post radiator and the metal cover board with sealing around it, be characterized in, the fin of said fin or wing post radiator or the top of wing post are connected with the metal cover board internal face, and in the cavity that fin or wing post radiator and metal cover board constitute, be provided with liquid working substance, on the surface of fin or wing post and with at the bottom of fin or the wing base for post, be equipped with the capillary wick that working medium for liquid refluxes on the metal cover board internal face.
Fin of the present invention or wing post are for having cylindrical wing post, square column type wing post or rectangular fin; Capillary wick is sintering metal powder, woven wire, heat conducting fiber, nanofiber or thin groove structure; Fin or wing post radiator are made by the metal of high thermal conductivity; The passage of metal fin or wing intercolumniation is interconnected; Liquid working substance is deionized water, ethanol or acetone.
Because fin of the present invention or wing post surface are provided with the capillary wick that refluxes for liquid, so both can shorten the path that liquid refluxes, improve heat-transfer effect, can play the effect of strengthening the heat pipe mechanical strength again.The heat that power device produces during use makes the liquid evaporation on the heating wall, the passage that steam is interconnected by fin or wing intercolumniation arrives the heat radiation wall, heat is emitted in condensation on the heat radiation wall, and the liquid of condensation is got back to heating wall by metal cover board internal face, fin or wing post surface and fin or the suprabasil capillary structure of wing post.Adopt this flat-plate heat pipe to replace metal substrate, both can improve the heat diffusion capabilities of substrate, improve the power density of power model, can reduce the weight of power model again.
Description of drawings
Fig. 1 is an overall structure schematic diagram of the present invention;
Fig. 2 is the structural representation of fin of the present invention or wing post radiator, and wherein Fig. 2 a is cylindrical wing column radiator, and Fig. 2 b is a square column type wing column radiator, and Fig. 2 c is a rectangular fin formula radiator;
Fig. 3 is the schematic diagram of power model of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and operation principle are described in further detail.
Referring to Fig. 1, the present invention includes metal fin or wing post radiator 8 and a metal cover board 9 with sealing around fin or the wing post radiator 8 by high thermal conductivity, in fin or wing post radiator 8, be provided with metal fin or wing post 802 that fractions not is not connected with fin or the substrate 801 of wing post radiator and metal cover board 9 internal faces, the passage that metal fin or wing post are 802 is interconnected, and in the cavity of fin or wing post radiator 8 and metal cover board 9 formations, be provided with deionized water, ethanol or acetone liquid working substance 10, on the surface of fin or wing post 802 and with at the bottom of fin or the wing base for post 801, be equipped with the capillary wick 11 of working medium 10 backflows for liquid on the metal cover board internal face 901, this capillary wick 11 is a sintering metal powder, woven wire, heat conducting fiber, nanofiber or thin groove structure.
Referring to Fig. 2, fin of the present invention or wing post 802 are cylindrical wing post, square column type wing post or rectangular fin.
Referring to Fig. 3, the flat-plate heat pipe that the present invention proposes can be used as the thermal diffusion substrate of high power device.High power device 12 is welded on the one side at the bottom of flat-plate heat pipe 13 fins or the wing base for post, and radiator 14 is contained on the another side relative with it, and flat-plate heat pipe 13 is connected with radiator 14 by screw 15.The heat that power device 12 produces makes the liquid evaporation on the heating wall, the passage that steam is interconnected by fin or 802 on wing post arrives the heat radiation wall, heat is emitted in condensation on the heat radiation wall, and the liquid of condensation is got back to heating wall by the capillary wick 11 on metal cover board internal face and fin or wing post surface.
Metal fin or wing post 802 can strengthen the mechanical strength of flat-plate heat pipe, and the capillary wick 11 on it can shorten the return flow path of liquid.Because the heat diffusion capabilities of flat-plate heat pipe is far above the entity metal substrate, the concentrated heat that the heat pipe substrate can make power device produce spreads efficiently, has solved the hot concentration problem of high heat density power model preferably.In addition, adopt flat-plate heat pipe to replace the entity metal substrate that the weight of module is reduced greatly.
Claims (6)
1, a kind of thermal diffusion flat-plate heat pipe, comprise fin or wing post radiator (8) and a metal cover board (9) with sealing around it, it is characterized in that: the fin of said fin or wing post radiator (8) or the top of wing post (802) are connected with metal cover board (9) internal face, and in the cavity that fin or wing post radiator (8) and metal cover board (9) constitute, be provided with liquid working substance (10), on the surface of fin or wing post (802) and with (801) at the bottom of fin or the wing base for post, be equipped with the capillary wick (11) of working medium (10) backflow for liquid on the metal cover board internal face (901).
2, a kind of thermal diffusion flat-plate heat pipe according to claim 1 is characterized in that: said fin or wing post (802) are for having cylindrical wing post, square column type wing post or rectangular fin.
3, a kind of thermal diffusion flat-plate heat pipe according to claim 1 is characterized in that: said capillary wick (11) is sintering metal powder, woven wire, heat conducting fiber, nanofiber or thin groove structure.
4, a kind of thermal diffusion flat-plate heat pipe according to claim 1 is characterized in that: said fin or wing post radiator (8) are made by the metal of high thermal conductivity.
5, a kind of thermal diffusion flat-plate heat pipe according to claim 1 is characterized in that: the passage between said metal fin or wing post (802) is interconnected.
6, a kind of thermal diffusion flat-plate heat pipe according to claim 1 is characterized in that: said liquid working substance (10) is deionized water, ethanol or acetone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610105108 CN1971195A (en) | 2006-12-01 | 2006-12-01 | Flat heat pipe for thermal diffusion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610105108 CN1971195A (en) | 2006-12-01 | 2006-12-01 | Flat heat pipe for thermal diffusion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1971195A true CN1971195A (en) | 2007-05-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610105108 Pending CN1971195A (en) | 2006-12-01 | 2006-12-01 | Flat heat pipe for thermal diffusion |
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Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102017825A (en) * | 2008-05-02 | 2011-04-13 | 丹福斯矽电有限责任公司 | Cooling device for a plurality of power modules |
| CN102345991A (en) * | 2010-07-25 | 2012-02-08 | 东莞市为开金属制品厂 | Heat pipe type radiator |
| CN101726203B (en) * | 2008-10-16 | 2012-10-17 | 杨政修 | Manufacturing method of capillary structure with high porosity |
| CN102778153A (en) * | 2012-07-16 | 2012-11-14 | 王宝根 | High-pressure-resistant super-heat-conduction tube |
| CN103335550A (en) * | 2013-06-08 | 2013-10-02 | 华南理工大学 | Compound imbibing core for thermal column array steam main line and manufacturing method thereof |
| CN104315905A (en) * | 2014-10-24 | 2015-01-28 | 芜湖长启炉业有限公司 | Double-end insertion type superconducting radiating column |
| CN104669984A (en) * | 2015-02-13 | 2015-06-03 | 陈春平 | Vehicle-mounted LNG (liquefied natural gas) heat exchanger and refrigeration transport vehicle provided with heat exchanger |
| CN104713395A (en) * | 2015-02-11 | 2015-06-17 | 上海卫星装备研究所 | High-pressure-resistant flat heat pipe and machining method thereof |
| CN104792206A (en) * | 2015-04-24 | 2015-07-22 | 江劲松 | Plate type heat pipe with special-shaped grooves |
| CN106160657A (en) * | 2015-04-02 | 2016-11-23 | 中海阳能源集团股份有限公司 | A kind of novel concentrator integrated photovoltaic electricity generation system |
| CN106558563A (en) * | 2015-09-29 | 2017-04-05 | 比亚迪股份有限公司 | Power model and the vehicle with which |
| CN106783366A (en) * | 2017-01-13 | 2017-05-31 | 中航宝胜电气股份有限公司 | 126kV cylinder vacuum breakers with high current carrying capacity |
| CN107466186A (en) * | 2017-07-31 | 2017-12-12 | 华中科技大学 | A kind of novel evaporator structure and its application |
| CN107771011A (en) * | 2017-09-28 | 2018-03-06 | 深圳市英威腾电气股份有限公司 | A kind of flexible phase-change heat radiating device |
| CN108323099A (en) * | 2018-01-16 | 2018-07-24 | 南昌大学 | Finned heat pipe coupling radiator |
| WO2018133308A1 (en) * | 2017-01-23 | 2018-07-26 | 中车大连机车研究所有限公司 | Air-cooled plate-fin type composite phase-change radiator having capillary groove |
| CN108562182A (en) * | 2018-04-01 | 2018-09-21 | 刘康 | A kind of uniform temperature type heat-pipe radiator and manufacturing method |
| CN111895521A (en) * | 2020-07-20 | 2020-11-06 | 青岛海尔空调电子有限公司 | Radiator and air condensing units |
| CN112203476A (en) * | 2020-10-12 | 2021-01-08 | 上海海事大学 | Porous medium liquid film small channel cooling device |
| CN112752474A (en) * | 2020-10-30 | 2021-05-04 | 天津七所精密机电技术有限公司 | Wetting modification processing method for case body and high-protection reinforced electronic equipment |
| CN113758327A (en) * | 2021-08-13 | 2021-12-07 | 中南大学 | Composite VC radiator containing copper/diamond sintered liquid absorption cores and preparation method thereof |
| CN113782503A (en) * | 2021-09-07 | 2021-12-10 | 纳芯半导体科技(浙江)有限公司 | Silicon carbide power device packaging structure and packaging method |
| CN114234735A (en) * | 2021-12-31 | 2022-03-25 | 上海博创空间热能技术有限公司 | Multi-stage energy storage device |
-
2006
- 2006-12-01 CN CN 200610105108 patent/CN1971195A/en active Pending
Cited By (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102017825B (en) * | 2008-05-02 | 2013-09-04 | 丹福斯矽电有限责任公司 | Cooling device for a plurality of power modules |
| CN102017825A (en) * | 2008-05-02 | 2011-04-13 | 丹福斯矽电有限责任公司 | Cooling device for a plurality of power modules |
| CN101726203B (en) * | 2008-10-16 | 2012-10-17 | 杨政修 | Manufacturing method of capillary structure with high porosity |
| CN102345991A (en) * | 2010-07-25 | 2012-02-08 | 东莞市为开金属制品厂 | Heat pipe type radiator |
| CN102778153A (en) * | 2012-07-16 | 2012-11-14 | 王宝根 | High-pressure-resistant super-heat-conduction tube |
| CN103335550A (en) * | 2013-06-08 | 2013-10-02 | 华南理工大学 | Compound imbibing core for thermal column array steam main line and manufacturing method thereof |
| CN104315905A (en) * | 2014-10-24 | 2015-01-28 | 芜湖长启炉业有限公司 | Double-end insertion type superconducting radiating column |
| CN104713395A (en) * | 2015-02-11 | 2015-06-17 | 上海卫星装备研究所 | High-pressure-resistant flat heat pipe and machining method thereof |
| CN104669984B (en) * | 2015-02-13 | 2017-12-01 | 陈春平 | Vehicle-mounted LNG heat exchangers and the refrigerating transport vehicle for installing the heat exchanger |
| CN104669984A (en) * | 2015-02-13 | 2015-06-03 | 陈春平 | Vehicle-mounted LNG (liquefied natural gas) heat exchanger and refrigeration transport vehicle provided with heat exchanger |
| CN106160657A (en) * | 2015-04-02 | 2016-11-23 | 中海阳能源集团股份有限公司 | A kind of novel concentrator integrated photovoltaic electricity generation system |
| CN106160657B (en) * | 2015-04-02 | 2018-12-14 | 中海阳能源集团股份有限公司 | A kind of condensation photovoltaic integrated power generation system |
| CN104792206A (en) * | 2015-04-24 | 2015-07-22 | 江劲松 | Plate type heat pipe with special-shaped grooves |
| CN106558563A (en) * | 2015-09-29 | 2017-04-05 | 比亚迪股份有限公司 | Power model and the vehicle with which |
| CN106558563B (en) * | 2015-09-29 | 2020-03-31 | 比亚迪股份有限公司 | Power module and vehicle with same |
| CN106783366A (en) * | 2017-01-13 | 2017-05-31 | 中航宝胜电气股份有限公司 | 126kV cylinder vacuum breakers with high current carrying capacity |
| CN106783366B (en) * | 2017-01-13 | 2019-03-26 | 中航宝胜电气股份有限公司 | 126kV cylinder vacuum breaker with high current carrying capacity |
| WO2018133308A1 (en) * | 2017-01-23 | 2018-07-26 | 中车大连机车研究所有限公司 | Air-cooled plate-fin type composite phase-change radiator having capillary groove |
| CN107466186B (en) * | 2017-07-31 | 2019-09-13 | 华中科技大学 | A kind of novel evaporator structure and its application |
| CN107466186A (en) * | 2017-07-31 | 2017-12-12 | 华中科技大学 | A kind of novel evaporator structure and its application |
| CN107771011A (en) * | 2017-09-28 | 2018-03-06 | 深圳市英威腾电气股份有限公司 | A kind of flexible phase-change heat radiating device |
| CN108323099A (en) * | 2018-01-16 | 2018-07-24 | 南昌大学 | Finned heat pipe coupling radiator |
| CN108323099B (en) * | 2018-01-16 | 2024-03-29 | 南昌大学 | Fin type heat pipe coupling radiator |
| CN108562182A (en) * | 2018-04-01 | 2018-09-21 | 刘康 | A kind of uniform temperature type heat-pipe radiator and manufacturing method |
| CN111895521A (en) * | 2020-07-20 | 2020-11-06 | 青岛海尔空调电子有限公司 | Radiator and air condensing units |
| CN112203476A (en) * | 2020-10-12 | 2021-01-08 | 上海海事大学 | Porous medium liquid film small channel cooling device |
| CN112752474A (en) * | 2020-10-30 | 2021-05-04 | 天津七所精密机电技术有限公司 | Wetting modification processing method for case body and high-protection reinforced electronic equipment |
| CN113758327A (en) * | 2021-08-13 | 2021-12-07 | 中南大学 | Composite VC radiator containing copper/diamond sintered liquid absorption cores and preparation method thereof |
| CN113782503A (en) * | 2021-09-07 | 2021-12-10 | 纳芯半导体科技(浙江)有限公司 | Silicon carbide power device packaging structure and packaging method |
| CN113782503B (en) * | 2021-09-07 | 2024-06-11 | 纳芯半导体科技(浙江)有限公司 | Silicon carbide power device packaging structure and packaging method |
| CN114234735A (en) * | 2021-12-31 | 2022-03-25 | 上海博创空间热能技术有限公司 | Multi-stage energy storage device |
| CN114234735B (en) * | 2021-12-31 | 2024-05-14 | 上海博创空间热能技术有限公司 | Multi-stage energy storage device |
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