CN201119229Y - Flat plate thermal tube integrated heat radiation device - Google Patents
Flat plate thermal tube integrated heat radiation device Download PDFInfo
- Publication number
- CN201119229Y CN201119229Y CNU2007201738297U CN200720173829U CN201119229Y CN 201119229 Y CN201119229 Y CN 201119229Y CN U2007201738297 U CNU2007201738297 U CN U2007201738297U CN 200720173829 U CN200720173829 U CN 200720173829U CN 201119229 Y CN201119229 Y CN 201119229Y
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- heat sink
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- plate
- heat pipe
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- 230000005855 radiation Effects 0.000 title description 3
- 238000001816 cooling Methods 0.000 claims abstract description 39
- 238000013461 design Methods 0.000 claims abstract description 38
- 239000007788 liquid Substances 0.000 claims abstract description 37
- 230000000694 effects Effects 0.000 abstract description 10
- 238000012546 transfer Methods 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 238000002791 soaking Methods 0.000 description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 229910052802 copper Inorganic materials 0.000 description 18
- 239000010949 copper Substances 0.000 description 18
- 238000001704 evaporation Methods 0.000 description 17
- 239000012530 fluid Substances 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 7
- 230000008020 evaporation Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a heat radiating device integrally designed together with a flat plate heating pipe, which belongs to the electronic device cooling field. The utility model aims at solving the defect that the thermal contact resistance of a traditional flat plate heating pipe thermal spreader and a heat sink in the splitting design is larger, and the whole device is formed by vertically welding an air cooling finned heat sink or a liquid cold type heat sink, and a bottom plate (5) of a flat plate heat pipe; the thermal contact resistance in the traditional splitting design can be eliminated, the heat released by a small-sized area heat source is uniformly deconcentrated to the bottom face of whole heat sin, and the heat exchange effect on the heat sink edge can be largely improved. In addition, a channel type capillary structure is designed inside the flat plate heating pipe, and the phase change heat exchange and the working substance cycle inside the flat plate heating pipe are enhanced advantageously. Simultaneously, a micro rib structure is designed in the broken line channel heat exchange channel of the liquid cold type heat sink, through the adoption of the design, not only the heat transfer area not only can be increased, but also the disturbance function can be performed to the flow of media, therefore, the convection heat transfer of flowing liquid is enhanced.
Description
Technical field
The utility model relates to a kind of and the heat abstractor flat-plate heat pipe integrated design, can be used to cooling electronic device.
Background technology
The application of microelectronic chip spreads all over each aspect of daily life, production and even national security, is playing the part of extremely important role in modern civilization.The trend of chip development is further to improve integrated level, reduce chip size and increase clock frequency.First chip of Intel Company's production in 1971 only contains 2300 transistors, and the now just is integrated with a forty-two million transistor on one piece of Intel Pentium-4 chip.High integration is favourable for the upgrading of computing power.Yet chip power consumption meanwhile and heat dissipation problem also show especially out.Electronic technology develops rapidly, and the intensive and miniaturization of the high frequency of electronic device, high speed and integrated circuit makes the heating power of electronic device and power density also sharply increase.The caloric value of cpu chip is by several years ago 10W/cm
2About till now 100W/cm nearly of surge
2Therefore, bad if dispel the heat, the excessive temperature that produces can reduce the job stability of chip, increases error rate, and formed thermal stress can directly have influence on electrical property, operating frequency, mechanical strength and the reliability of chip between while inside modules and its external environment condition.Therefore, the cooling technology of electronic device will be the key factor that influences the microelectric technique development.
The trend of electronic chip miniaturization and golf calorific value, make the heat radiation of electronic equipment show out following distinguishing feature especially: (1) local heat flux density is very big, and heat is assembled in the part easily, causes local temperature too high.(2) density of heat flow rate skewness, high heat flux mostly just is confined in the very little spatial dimension.(3) in the electronic equipment start-up course, occur instantaneous power easily and " rise violently ", burn out electronic equipment.(4) it is not very big needing lost total heat flow.So the key that solves the electronic equipment cooling is how to reduce too high local heat flux density, prevents focus and cause equipment fault.In order to strengthen radiating effect, generally all can on electronic chip, install one additional than much bigger heat sink of chip volume.Be easy to like this produce focus at chip surface.And make the heat sink bigger diffusion thermal resistance that has, and the density of heat flow rate on the inner section distributes very inhomogeneous, and heat sink radiating effect has been subjected to certain influence.
Now in order to prevent that electronic chip inside is owing to the basic means that heat accumulation produces focus is still the solid fine copper plate soaking device that has high thermal conductivity coefficient in the chip surface attaching, the inner heat that produces of electronic chip is drawn out on the heat radiator fin in heat conducting mode, and the convection action that relends fin and its surrounding air is imported heat in the air-flow into and is taken away.Solid fine copper plate soaking device can play to a certain extent heat flow is evenly distributed, and eliminates the effect of focus.But because the conductive coefficient of copper is limited, its equal thermal effect is not very obvious.If adopt the superconduction hot material of diamond and so on to make soaking device, its expensive price will make it be difficult to spread in the practical application.Therefore the flat plate heat pipe type soaking device has been proposed.
The flat plate heat pipe type soaking device can make density of heat flow rate be tending towards evenly to greatest extent, and this is because it has utilized the principle of heat pipe high-efficiency heat conduction.Heat pipe is known one of the most effective heat transfer element, and it can transmit a large amount of heats at a distance by very little sectional area and need not additionaling power.One end of heat pipe is an evaporation section, and the other end is a condensation segment.The vaporization of liquid evaporation when an end of heat pipe is heated in the capillary wick, steam flow to the other end and emit heat and condense into liquid under small pressure reduction, liquid flows back to evaporation section along porous material by the effect of capillary force again.So move in circles, heat reaches the other end by an end of heat pipe.Traditional heat pipe can be divided into according to the difference of inside heat pipe capillary structure: silk screen heat pipe, conduit heat pipe and sintered heat pipe in a tubular form.Flat-plate heat pipe soaking device is a kind of special-shaped heat pipe, and its condensation segment and evaporation section are replaced by two planes (evaporating surface and cryosurface), are called flat hot pipe again.In this heat pipe,, but be parallel to small-sized on the direction of heat flow bigger perpendicular to the size on the direction of heat flow.Distance between evaporating surface and the cryosurface generally has only several millimeters.
Present flat-plate heat pipe soaking device with heat sink all be to separate design and make, as shown in Figure 1.Flat-plate heat pipe upper cover plate 2 and flat-plate heat pipe base plate 5 welded seals form the flat-plate heat pipe cavity.During application, after smearing heat-conducting silicone grease, contact-making surface again flat-plate heat pipe soaking device is attached to heat sink bottom surface.Though processing and manufacturing is convenient in the split design, soaking device and heat sink between contact heat resistance bigger, influenced the service behaviour of entire heat dissipation device greatly.And it is heat sink that traditional design mainly is applied to flat-plate heat pipe soaking device the air cooling fin formula, also almost do not have and it is applied to the heat sink design of liquid-cooled.Liquid-cooled is heat sink in order to increase heat exchange area, and its volume too can be more much bigger than electronic chip surface area.On the convective heat transfer liquid face, also the non-uniform temperature phenomenon can occur, thereby influence the heat sink heat exchange efficiency of liquid-cooled.Therefore, flat-plate heat pipe soaking device and the integrated design that the air cooling fin formula is heat sink and liquid-cooled is heat sink will effectively reduce contact heat resistance, and the heat exchange surface temperature is tending towards evenly, thereby improve the heat exchange efficiency of electronic radiation device.
The utility model content
The utility model is intended to solve shortcomings such as contact heat resistance is bigger in traditional flat-plate heat pipe soaking device and the heat sink split design, to flat-plate heat pipe soaking device with heat sinkly carried out integrated design.And in the flat-plate heat pipe indoor design groove-type capillary structure, help the circulation of the phase-change heat-exchange of stiffened flat plate inside heat pipe and working medium.Simultaneously, also in the heat sink heat exchanger channels of liquid-cooled, adopted miniature rib structure, the heat convection efficient that raising liquid-cooled that can be bigger is heat sink.
The technical scheme that the utility model adopted is referring to Fig. 2.The entire heat dissipation device is welded up and down with flat-plate heat pipe base plate 5 by or liquid-cooled heat sink by the air cooling fin formula is heat sink.
The upper surface of heat sink 4 bottom surface and flat-plate heat pipe base plate 5 all has micro-channel formula capillary structure.Heat sink 4 bottom surface is as the cryosurface and the flat-plate heat pipe base plate 5 common vapor chamber that form of flat-plate heat pipe.In the flat-plate heat pipe course of work, working medium is seethed with excitement on the capillary structure evaporating surface of flat-plate heat pipe base plate 5, and the gaseous working medium diffusion motion condenses to the whole cryosurface (heat sink bottom surface) and emits heat.Be evenly dispersed whole heat sink bottom surface by small size thermal source liberated heat, the heat exchange effect of the heat sink edge of improvement that can be bigger.The cryosurface of flat-plate heat pipe directly is used as heat sink 4 bottom surface in integrated design, can eliminate the contact heat resistance between traditional split design middle plateform heat pipe soaking device and the heat sink bottom surface.
The micro-channel capillary structure of flat-plate heat pipe inside is referring to Fig. 3.For the phase-change heat-exchange and the working medium circulation of stiffened flat plate inside heat pipe, evaporating surface and cryosurface (heat sink bottom surface) design has symmetrical crisscross micro-channel formula capillary structure 7.Evaporating surface and cryosurface edge leave implementation of port 6.The stability of flat-plate heat pipe shape has been strengthened in the global design of capillary structure and heat pipe wall, makes thinner that flat-plate heat pipe can do.The rib end face of channel structure contacts on evaporating surface and the cryosurface, has not only played supporting role, has also strengthened the axial thermal conductivity of flat-plate heat pipe.
The liquid flow path structure that liquid cooling is heat sink is referring to Fig. 4.The outlet of passage and the inlet side that coexists, passage are broken line type and arrange.For the heat convection effect of forced fluid device for cooling, on liquid cooling passage 9, designed miniature rib structure 8.Miniature rib structure 8 is identical with the height of passage.Miniature rib structure 8 can be various possible structures such as miniature column rib, miniature rectangular fin, miniature triangle rib, miniature needle-like rib.Its arrangement mode can be difference row or in-line arrangement.Miniature rib structure can not only increase heat transfer area, and can also be to the mobile perturbation action that plays of medium, thereby strengthens the heat convection of working fluid.
The beneficial effects of the utility model:
1. flat-plate heat pipe soaking device and heat sinkly carried out integrated design can be eliminated the contact heat resistance between traditional split design middle plateform heat pipe soaking device and the heat sink bottom surface.Small size thermal source liberated heat is evenly dispersed whole heat sink bottom surface, the heat exchange effect of the heat sink edge of improvement that can be bigger.
2. evaporating surface and cryosurface (heat sink bottom surface) design has symmetrical crisscross micro-channel structure, has strengthened the phase-change heat-exchange and the working medium circulation of flat-plate heat pipe inside.The stability of flat-plate heat pipe shape has been strengthened in the global design of capillary structure and heat pipe wall, makes thinner that flat-plate heat pipe can do.The rib end face of channel structure contacts on evaporating surface and the cryosurface, has not only played supporting role, has also strengthened the axial thermal conductivity of flat-plate heat pipe.
3. the heat sink liquid flow path of liquid cooling is the broken line type layout, and has designed miniature rib structure on fluid passage.This design can not only increase heat transfer area, and can also be to the mobile perturbation action that plays of medium, thereby strengthens the heat convection of working fluid.
Description of drawings
Fig. 1: the flat-plate heat pipe soaking device of split-type design and heat sink
Fig. 2: flat-plate heat pipe soaking device and heat sink integrated design;
Fig. 3: the micro-channel capillary structure on evaporating surface and the cryosurface;
Fig. 4: the liquid flow path that liquid cooling is heat sink;
Fig. 5: the integrated design that flat-plate heat pipe soaking device and liquid-cooled are heat sink;
Label is among Fig. 1～Fig. 5: 1. fin is heat sink, 2. flat-plate heat pipe upper cover plate, and 3. electronic chip is 4. heat sink, 5. flat-plate heat pipe base plate, 6. implementation of port, 7. micro-channel formula capillary structure, 8. miniature rib structure, 9. liquid cooling passage, the 10. heat sink base plate of liquid cooling, the heat sink upper cover plate of 11. liquid cooling.
Embodiment
In actual applications, heat sink 4 described in of the present utility model can be that liquid-cooled is heat sink, the air cooling fin formula is heat sink or other floor space than big heat sink of thermal source area.
Specify embodiment of the present utility model below in conjunction with accompanying drawing:
Example one: flat-plate heat pipe soaking device and heat sink integrated design
Flat-plate heat pipe soaking device and heat sink integrated design structure are referring to Fig. 2.The entire heat dissipation device is heat sink by copper and a copper coin thick 1mm is welded.Bottom surface that copper is heat sink and copper coin surface measure-alike is all the square of length of side 70mm.The bottom surface that copper is heat sink is as the cryosurface of flat-plate heat pipe, and copper coin forms vapor chamber jointly as the evaporating surface of flat-plate heat pipe.The integrated design of example one is compared with traditional split design, eliminated fully the flat-plate heat pipe soaking plate and heat sink between contact heat resistance.Pressure between the quality of contact heat resistance and heat-conducting silicone grease and two contact surfaces is relevant, and in our experiment, contact heat resistance accounts for about 20% of entire radiator thermal resistance.Therefore, by to flat-plate heat pipe soaking device and heat sinkly carry out integrated design, eliminated fully soaking plate and heat sink between contact heat resistance, the axial thermal resistance of entire heat dissipation device is reduced about 20%.
Example two: adopt the flat-plate heat pipe soaking device of micro-channel capillary structure and heat sink integrated design
The micro-channel capillary structure as shown in Figure 3.The entire heat dissipation device is heat sink by copper and a copper coin thick 1mm is welded.Bottom surface that copper is heat sink and copper coin surface measure-alike is all the square of length of side 70mm.At copper coin upper surface (evaporating surface) and heat sink bottom surface (cryosurface) design of copper symmetrical crisscross micro-channel formula capillary structure is arranged.The bottom edge place that copper coin upper surface and copper are heat sink leaves implementation of port.The width of micro-channel, the degree of depth and separation are all 0.2mm.The stability of flat-plate heat pipe shape has been strengthened in the global design of capillary structure and heat pipe wall, makes thinner that flat-plate heat pipe can do.The rib end face of channel structure contacts on evaporating surface and the cryosurface, has not only played supporting role, has also strengthened the axial thermal conductivity of flat-plate heat pipe.The capillary structure of micro-channel structure has also been strengthened the phase-change heat-exchange and the working medium circulation of flat-plate heat pipe inside.The flat-plate heat pipe soaking device of describing in the example two also can operate as normal under the antigravity condition.
Example three: the flat-plate heat pipe soaking device and the heat sink integrated design of liquid cooling of adopting miniature rib structure that adopt the micro-channel capillary structure
The integrated design that the flat-plate heat pipe soaking device of employing micro-channel capillary structure and the liquid cooling of the miniature rib structure of employing are heat sink as shown in Figure 5.The entire heat dissipation device is welded by the fine copper plate of the heat sink upper cover plate 11 of liquid cooling, liquid cooling is heat sink base plate 10,5 three thick 1mm of flat-plate heat pipe base plate, and the shape on three plate surfaces is all the square of length of side 60mm.Liquid cooling is heat sink upper cover plate 11 is last, liquid cooling is heat sink base plate 10 in, flat-plate heat pipe base plate 5 is down.The lower surface of the upper surface of flat-plate heat pipe base plate 5 and liquid cooling are heat sink base plate 10 is processed with crisscross micro-channel structure as shown in Figure 3.The width of micro-channel, the degree of depth and separation are all 0.2mm.Flat-plate heat pipe base plate 5 and liquid cooling are heat sink to have formed the cavity body structure of flat-plate heat pipe between the base plate 10.The upper surface of flat-plate heat pipe base plate 5 is the evaporating surface of flat-plate heat pipe, and the lower surface of liquid cooling is heat sink base plate 10 is a cryosurface.The upper surface of liquid cooling is heat sink base plate 10 is processed with fluid channel structure as shown in Figure 4, by just having formed the heat sink flow channel of liquid cooling with heat sink upper cover plate 11 welding of liquid cooling.For the heat convection effect of forced fluid device for cooling, on the liquid cooling passage, designed miniature rib structure.Miniature rib structure is identical with the height of passage.Miniature rib is a diameter 0.2mm column rib.Arrangement mode is equilateral triangle difference row.The distance in each the column rib center of circle and the adjacent rib center of circle is 0.4mm.Miniature rib structure can not only increase heat transfer area, and can also be to the mobile perturbation action that plays of medium, thereby strengthens the heat convection of working fluid.Miniature rib structure described in example three has increased by 58.9% than the surface area of the unidimensional passage that does not have rib structure.Rib structure also can be strengthened heat exchange greatly to the perturbation action of working fluid simultaneously.
Claims (3)
1, with the heat abstractor of flat-plate heat pipe integrated design, it is characterized in that: whole device is heat sink or liquid-cooled is heat sink is welded up and down with flat-plate heat pipe base plate (5) by the air cooling fin formula.
2, the heat abstractor of according to claim 1 and flat-plate heat pipe integrated design, it is characterized in that: the upper surface of above-mentioned heat sink (4) bottom surface and flat-plate heat pipe bottom surface (5) all is processed with symmetrical crisscross micro-channel formula capillary structure (7), and micro-channel formula capillary structure (7) edge leaves implementation of port (6).
3, the heat abstractor of according to claim 1 and flat-plate heat pipe integrated design is characterized in that: when heat sink employing liquid-cooled is heat sink, be welded successively by the heat sink upper cover plate of liquid cooling (11), the heat sink base plate of liquid cooling (10), flat-plate heat pipe base plate (5); The upper surface of the heat sink base plate of liquid cooling (10) is processed with liquid cooling passage (9) structure, liquid cooling passage (9) is broken line type and arranges, processed miniature rib structure (8) on the liquid cooling passage (9), miniature rib structure (8) is identical with the height of liquid cooling passage (9), and arranges with difference row or in-line arrangement mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201738297U CN201119229Y (en) | 2007-10-26 | 2007-10-26 | Flat plate thermal tube integrated heat radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201738297U CN201119229Y (en) | 2007-10-26 | 2007-10-26 | Flat plate thermal tube integrated heat radiation device |
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| Publication Number | Publication Date |
|---|---|
| CN201119229Y true CN201119229Y (en) | 2008-09-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201738297U Expired - Fee Related CN201119229Y (en) | 2007-10-26 | 2007-10-26 | Flat plate thermal tube integrated heat radiation device |
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| Country | Link |
|---|---|
| CN (1) | CN201119229Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109883225A (en) * | 2019-01-03 | 2019-06-14 | 奇鋐科技股份有限公司 | Radiator |
| CN110035642A (en) * | 2019-05-21 | 2019-07-19 | 广东工业大学 | A kind of liquid-cooled heat-conducting block and water-cooling type radiator |
| CN111902032A (en) * | 2020-08-19 | 2020-11-06 | 扬州船用电子仪器研究所(中国船舶重工集团公司第七二三研究所) | Air-cooled plate type pulsating heat pipe |
| US11092383B2 (en) | 2019-01-18 | 2021-08-17 | Asia Vital Components Co., Ltd. | Heat dissipation device |
-
2007
- 2007-10-26 CN CNU2007201738297U patent/CN201119229Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109883225A (en) * | 2019-01-03 | 2019-06-14 | 奇鋐科技股份有限公司 | Radiator |
| CN109883225B (en) * | 2019-01-03 | 2021-08-24 | 奇鋐科技股份有限公司 | Heat sink device |
| US11092383B2 (en) | 2019-01-18 | 2021-08-17 | Asia Vital Components Co., Ltd. | Heat dissipation device |
| CN110035642A (en) * | 2019-05-21 | 2019-07-19 | 广东工业大学 | A kind of liquid-cooled heat-conducting block and water-cooling type radiator |
| CN111902032A (en) * | 2020-08-19 | 2020-11-06 | 扬州船用电子仪器研究所(中国船舶重工集团公司第七二三研究所) | Air-cooled plate type pulsating heat pipe |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080917 Termination date: 20101026 |