CN201197251Y - Magnetofluid flat plate heat pipe soaking device - Google Patents

Magnetofluid flat plate heat pipe soaking device Download PDF

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Publication number
CN201197251Y
CN201197251Y CNU2008200807788U CN200820080778U CN201197251Y CN 201197251 Y CN201197251 Y CN 201197251Y CN U2008200807788 U CNU2008200807788 U CN U2008200807788U CN 200820080778 U CN200820080778 U CN 200820080778U CN 201197251 Y CN201197251 Y CN 201197251Y
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China
Prior art keywords
plate
heat pipe
magnetic
flat
magnetic fluid
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Expired - Fee Related
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CNU2008200807788U
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Chinese (zh)
Inventor
刘中良
张明
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Beijing University of Technology
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Beijing University of Technology
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Anticipated expiration legal-status Critical
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Abstract

The utility model relates to a thermal spreader for a magnetic fluid plate-type thermotube. The thermal spreader can be used in a cooling device for an electronic device. The aim of the utility model is to overcome the shortcomings in prior plate-type thermotube thermal spreader that capillary core is difficult to arrange and capillary force is not sufficient. The whole magnetic fluid plate-type thermotube is formed by welding of evaporating surface plate (2) and condensing surface plate (3); the inside of cavity of the plate-type thermotube has no capillary structure; after the air in the plate-type thermotube is extracted to make the plate-type thermotube become vacuum, magnetic fluid is filled in the plate-type thermotube as a working medium; and a magnet (5) is arranged near the electronic device outside the evaporating surface plate. The plate-type thermotube can save capillary wick, and the arrangement of additional magnetic field can not only reinforce the boiling of working medium, but also promote the effluence of the working medium and enable the magnetic fluid plate-type thermotube to work under antigravity condition.

Description

Magnetofluid flat plate hot pipe soaking device
Technical field
The utility model relates to a kind of magnetofluid flat plate hot pipe soaking device, can be used to the soaking device in the electronic component cooling device.
Background technology
The application of microelectronic chip spreads all over each aspect of daily life, production and even national security, is playing the part of extremely important role in modern civilization.The trend of chip development is further to improve integrated level, reduce chip size and increase clock frequency.First chip of Intel Company's production in 1971 only contains 2300 transistors, and the now just is integrated with a forty-two million transistor on one piece of Intel Pentium-4 chip.High integration is favourable for the upgrading of computing power.Yet chip power consumption meanwhile and heat dissipation problem also show especially out.Electronic technology develops rapidly, and the intensive and miniaturization of the high frequency of electronic device, high speed and integrated circuit makes the heating power of electronic device and power density also sharply increase.The caloric value of cpu chip is by several years ago 10W/cm 2About till now 100W/cm nearly of surge 2Therefore, bad if dispel the heat, the excessive temperature that produces can reduce the job stability of chip, increases error rate, and formed thermal stress can directly have influence on electrical property, operating frequency, mechanical strength and the reliability of chip between while inside modules and its external environment condition.Therefore, the cooling technology of electronic device will be the key factor that influences the microelectric technique development.
The trend of electronic chip miniaturization and golf calorific value, make the heat radiation of electronic equipment show out following distinguishing feature especially: (1) local heat flux density is very big, and heat is assembled in the part easily, causes local temperature too high.(2) density of heat flow rate skewness, high heat flux mostly just is confined in the very little spatial dimension.(3) in the electronic equipment start-up course, occur instantaneous power easily and " rise violently ", burn out electronic equipment.(4) it is not very big needing lost total heat flow.So the key that solves the electronic equipment cooling is how to reduce too high local heat flux density, prevents focus and cause equipment fault.In order to strengthen radiating effect, generally all can on electronic chip, install one additional than much bigger heat sink of chip volume.Be easy to like this produce focus at chip surface.And make the heat sink bigger diffusion thermal resistance that has, and the density of heat flow rate on the inner section distributes very inhomogeneous, and heat sink radiating effect has been subjected to certain influence.
Traditional solid copper coin soaking device can be drawn out to the inner heat that produces of electronic chip on the heat radiator fin in heat conducting mode, and the convection action that relends fin and its surrounding air is imported heat in the air-flow into and taken away.Solid fine copper plate soaking device can play to a certain extent heat flow is evenly distributed, and eliminates the effect of focus.But because the conductive coefficient of copper is limited, its equal thermal effect is not very obvious.If adopt the superconduction hot material of diamond and so on to make soaking device, its expensive price will make it be difficult to spread in the practical application.Therefore the flat plate heat pipe type soaking device has been proposed.
The flat plate heat pipe type soaking device can make density of heat flow rate be tending towards evenly to greatest extent, and this is because it has utilized the principle of heat pipe high-efficiency heat conduction.Heat pipe is known one of the most effective heat transfer element, and it can transmit a large amount of heats at a distance by very little sectional area and need not additionaling power.One end of heat pipe is an evaporation section, and the other end is a condensation segment.The vaporization of liquid evaporation when an end of heat pipe is heated in the capillary wick, steam flow to the other end and emit heat and condense into liquid under small pressure reduction, liquid flows back to evaporation section along porous material by the effect of capillary force again.So move in circles, heat reaches the other end by an end of heat pipe.Traditional heat pipe can be divided into according to the difference of inside heat pipe capillary structure: silk screen heat pipe, conduit heat pipe and sintered heat pipe in a tubular form.Flat-plate heat pipe soaking device is a kind of special-shaped heat pipe, and its condensation segment and evaporation section are replaced by two planes (evaporating surface and cryosurface), are called flat hot pipe again, and its operation principle as shown in Figure 1.In this heat pipe,, but be parallel to small-sized on the direction of heat flow bigger perpendicular to the size on the direction of heat flow.Distance between evaporating surface and the cryosurface generally has only several millimeters.
Because the flat-plate heat pipe volume inside is narrow and small, the layout of capillary structure is the difficult point that flat-plate heat pipe is made all the time, and traditional wick structure is difficult to utilize fully the effect of capillary force to make liquid refrigerant overcome the effect formation good reflux of gravity.The flat-plate heat pipe comparison difficulty of under the antigravity condition, working.
Magnetic fluid is meant that the magnetic nano-particle that surfactant is coated is dispersed in the highly stable and colloidal suspension liquid that have magnetic that forms in the base fluid.Magnetic fluid has combined the ferromagnetism of solid and the flowability of liquid dexterously, therefore has very unique character.Magnetic fluid is made up of magnetic particle, carrier fluid (or claiming base fluid) and surfactant.The performance of magnetic fluid depends primarily on the performance of magnetic particle and carrier fluid, to the selection of magnetic particle, carrier fluid, has determined the application and the scope of magnetic fluid.Tri-iron tetroxide, di-iron trioxide etc. are arranged the magnetic particle that is used to prepare magnetic fluid usually and novel magnetic is strong, the nitrided iron of good stability, FeB particulate.Carrier fluid can keep the liquid property of magnetic fluid, is generally fluids such as water, organic solvent, hydrocarbon, synthetic ester.The effect of surfactant is cohesion or the precipitation that prevents that magnetic particle is mutual, and it wraps up the surface of single magnetic particle, makes it to be separated from each other, and is suspended in the carrier fluid.Carrier fluid difference, then required surfactant are also different.Therefore the selection principle of surfactant is to adapt with carrier fluid, and has the special molecular structure of permanent absorption magnetic particle.
Magnetic fluid has the mobile of fluid and by the ability of magnetic field suction, and studies show that under no externally-applied magnetic field condition the reinforcement boiling heat transfer efficient that magnetic fluid just can be bigger in a large number.After adding external magnetic field, boiling heat transfer efficient can further be strengthened.By analyzing magnetic field to influence of air bubbles, the result shows that adding non-uniform magnetic field in the boiling process can change the bubble shape of diameter and bubble of breaking, thereby plays the effect of strengthening boiling.Therefore, magnetic fluid is used for flat-plate heat pipe working medium, under the effect of externally-applied magnetic field, phase-change heat-exchange efficient that not only can the enhanced water evaporation face, and help promoting the backflow of working medium, even can allow heat pipe under the antigravity condition, work.
The utility model content
The utility model is intended to solve capillary wick difficult arrangement in traditional flat-plate heat pipe soaking device, and shortcomings such as capillary force deficiency have proposed magnetofluid flat plate hot pipe.This flat-plate heat pipe can be removed the design of capillary wick fully, not only can strengthen the working medium boiling by settling externally-applied magnetic field, and can promote working medium to reflux, and can allow flat-plate heat pipe work under the antigravity condition.
To achieve these goals, the utility model has been taked following technical scheme.The utility model includes the dull and stereotyped and cryosurface flat board of the evaporating surface that welds together, is filled with magnetic fluid in the cavity that evaporating surface flat board and cryosurface flat board surround.Layout around the electronic device 1 in the evaporating surface flat board outside magnet 5.
Described magnet 5 is annular magnet.
Under the effect of externally-applied magnetic field, liquid magnetofluid working medium accumulates in the thermal source near zone on the evaporating surface and constantly boiling, and the gaseous working medium diffusion motion that phase transformation produces condenses to the whole cryosurface and emits heat.At this moment, most liquid refrigerant accumulates under the effect of magnetic field force on the evaporating surface near the zone the thermal source, therefore can not produce the motion of gaseous working medium and hinder influence, the diffusion motion that helps gaseous working medium condenses to whole cryosurface, reaches better all thermal effects.The liquid refrigerant that freeze-outs is got back to again under the effect of magnetic field force near the evaporating surface thermal source the zone, thereby finishes the shuttling movement of working medium.Simultaneously externally-applied magnetic field has the effect of strengthening the magnetic fluid boiling, and the phase-change heat-exchange efficient in the time of therefore can increasing flat-plate heat pipe work improves the performance of flat-plate heat pipe greatly.
The beneficial effects of the utility model:
1. externally-applied magnetic field has stronger attraction force acts to magnetic fluid, can promote not have the circulation of magnetic fluid working medium in the capillary wick flat-plate heat pipe, and can make no capillary wick flat-plate heat pipe operate as normal under the antigravity condition.
2. most liquid refrigerant accumulates under the effect of magnetic field force on the evaporating surface near the zone the thermal source, therefore can not produce and hinder influence the motion of gaseous working medium, the diffusion motion that helps gaseous working medium, and on whole cryosurface, condense, reach better all thermal effects.
3. externally-applied magnetic field has the effect of strengthening the magnetic fluid boiling, and the phase-change heat-exchange efficient in the time of therefore can increasing flat-plate heat pipe work improves the performance of flat-plate heat pipe greatly.
Description of drawings
Fig. 1: flat-plate heat pipe fundamental diagram
Fig. 2: the schematic diagram of magnetic fluid flat-plate heat pipe structure
Fig. 3: magnetofluid flat plate hot pipe is temperature variation diagram in time under the antigravity condition
Fig. 4: the level board heat pipe is temperature variation diagram in time under the antigravity condition
Label is among Fig. 1~Fig. 4: 1. electronic chip, 2. evaporating surface flat board, 3. cryosurface flat board, 4. capillary layer, 5. magnet, 6, magnetic fluid.
Embodiment
Specify embodiment of the present utility model below in conjunction with accompanying drawing:
Present embodiment is welded by evaporating surface dull and stereotyped 2 and cryosurface flat board 3.The flat-plate heat pipe cavity is interior without any capillary structure.Charge into magnetic fluid as working medium after flat-plate heat pipe vacuumized.Near the electronic device 1 in the evaporating surface flat board outside, arranged that magnet 5 is as externally-applied magnetic field.
The concrete structure schematic diagram of magnetic fluid flat-plate heat pipe as shown in Figure 2 in the present embodiment.The diameter of dish-like flat-plate heat pipe is 85mm, and material is a red copper.The internal cavity height is 1mm, and inside cavity is without any wick structure.The thickness of evaporating surface of flat-plate heat pipe dull and stereotyped 2 and cryosurface flat board 3 all is 3mm.Be mounted with an annular magnet 5 in dull and stereotyped 3 outsides of evaporating surface, its material is a neodymium iron boron, and interior ring diameter is 25mm, and outer ring diameter is 40mm, highly is 10mm, and the axial magnetic induction is 4000Gs.The density that is used as the water-based magnetic fluid of flat-plate heat pipe working medium is 1.28g/cm3, and magnetic saturation intensity is 320Gs.
In order to simulate the state of magnetic fluid when working under externally-applied magnetic field, we are placed on a quartz glass plate on the annular magnet, and magnetic fluid is poured on the quartz glass plate.Can see that the black non transparent magnetic fluid is uniform annular spread under the attraction of annular magnet on quartz glass plate.Even after the quartz glass plate inversion, magnetic fluid can not drip yet, but continue to keep annular to be distributed on the quartz glass plate.Can imagine, when we are placed in annular magnet near the evaporating surface of flat-plate heat pipe.Most liquid magnetofluid working medium in the chamber accumulate near the annular region of thermal source, are heated to take place after evaporation or the boiling, and steam is taken away the heat of evaporating surface and condensed on whole cryosurface.Because the distance between evaporating surface and the cryosurface has only 1mm, under the effect of externally-applied magnetic field, the liquid refrigerant that gets off that condenses can be easy to come back near the annular region of thermal source.Under the antigravity condition, because the effect of externally-applied magnetic field makes the flat-plate heat pipe of this no capillary wick have the possibility that overcomes gravity work.
By the magnetofluid flat plate hot pipe in the present embodiment is carried out performance test.Magnetofluid flat plate hot pipe and level board heat pipe under the antigravity condition temperature in time variation diagram shown in Fig. 3 and 4.Can see that magnetofluid flat plate hot pipe can overcome the effect of gravity and operate as normal.We are changed to water with working medium, and have carried out experimental study, find that the level board heat pipe is squeezed back cisco unity malfunction all under various liquid filled ratios.This is because the distance of evaporating surface and cryosurface only is 1mm, and the magnetic fluid liquid refrigerant under cryosurface condenses can return evaporating surface under the effect of externally-applied magnetic field, thus make flat-plate heat pipe can be under the antigravity condition operate as normal.

Claims (2)

1. magnetofluid flat plate hot pipe soaking device includes evaporating surface flat board (2) and cryosurface flat board (3); It is characterized in that: be filled with magnetic fluid (6) in the cavity that evaporating surface flat board (2) and cryosurface flat board (3) surround, electronic device (1) arranged around in the evaporating surface flat board outside has magnet (5).
2. magnetofluid flat plate hot pipe soaking device according to claim 1 is characterized in that: described magnet (5) is annular magnet.
CNU2008200807788U 2008-05-23 2008-05-23 Magnetofluid flat plate heat pipe soaking device Expired - Fee Related CN201197251Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008200807788U CN201197251Y (en) 2008-05-23 2008-05-23 Magnetofluid flat plate heat pipe soaking device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008200807788U CN201197251Y (en) 2008-05-23 2008-05-23 Magnetofluid flat plate heat pipe soaking device

Publications (1)

Publication Number Publication Date
CN201197251Y true CN201197251Y (en) 2009-02-18

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103687455A (en) * 2013-12-31 2014-03-26 上海交通大学 Vapor chamber
CN108878375A (en) * 2018-06-25 2018-11-23 中国电子科技集团公司第四十研究所 A kind of floor structure suitable for microwave power chip welding
CN110505793A (en) * 2019-08-23 2019-11-26 昆明理工大学 A kind of micro-channel device and method of the reinforcing heat convection based on magnetic force

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103687455A (en) * 2013-12-31 2014-03-26 上海交通大学 Vapor chamber
CN103687455B (en) * 2013-12-31 2016-06-01 上海交通大学 A kind of vapor chamber
CN108878375A (en) * 2018-06-25 2018-11-23 中国电子科技集团公司第四十研究所 A kind of floor structure suitable for microwave power chip welding
CN110505793A (en) * 2019-08-23 2019-11-26 昆明理工大学 A kind of micro-channel device and method of the reinforcing heat convection based on magnetic force

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C14 Grant of patent or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090218

Termination date: 20110523

C17 Cessation of patent right