CN111902032A - Air-cooled plate type pulsating heat pipe - Google Patents
Air-cooled plate type pulsating heat pipe Download PDFInfo
- Publication number
- CN111902032A CN111902032A CN202010837384.8A CN202010837384A CN111902032A CN 111902032 A CN111902032 A CN 111902032A CN 202010837384 A CN202010837384 A CN 202010837384A CN 111902032 A CN111902032 A CN 111902032A
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- Prior art keywords
- heat pipe
- air
- flow channel
- cover plate
- pulsating heat
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- 238000003466 welding Methods 0.000 claims abstract description 39
- 238000009434 installation Methods 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 11
- 238000005219 brazing Methods 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 14
- 238000012546 transfer Methods 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract description 6
- 230000008859 change Effects 0.000 abstract description 3
- 230000004907 flux Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Abstract
The invention relates to an air-cooled plate type pulsating heat pipe. The pulsating heat pipe comprises a fin bottom plate and a flow channel cover plate, wherein the fin bottom plate is used as a heat sink of the air cooling plate type pulsating heat pipe, one side of the fin bottom plate is a bottom plate welding surface, and the other side of the fin bottom plate is provided with a first fin for increasing the convection heat exchange area of an air side; the flow channel cover plate is used as an installation carrier of the electronic device, one surface of the flow channel cover plate is a cover plate welding surface, the cover plate welding surface is provided with a pulsating heat pipe flow channel which is concave inwards, and the other surface of the flow channel cover plate is used for installing the electronic device; the welding surface of the bottom plate and the welding surface of the cover plate are welded into a whole, and are processed and molded after heat treatment; and a second fin is additionally arranged in a non-electronic device mounting area on one side of the runner cover plate for mounting the electronic device. The invention combines the good phase change heat transfer performance of the pulsating heat pipe with the air-cooled cold plate with compact structure, effectively solves the heat dissipation problem of electronic devices with high heat consumption and high heat flow density which are limited by the use environment, improves the limit heat flow density of the heat dissipation of the air-cooled cold plate by more than ten times, and expands the application range of the air-cooled cold plate.
Description
Technical Field
The invention relates to the technical field of vapor chambers, in particular to an air-cooled plate type pulsating heat pipe.
Background
With the rapid development of electronic technology, the problems of high heat consumption and high heat flux density of electronic devices are increasingly highlighted. The high heat loss and the high heat flow density obviously increase the junction temperature of the chip of the electronic device, and generate uneven temperature distribution in the device and the shell, and generate thermal stress and thermal deformation, thereby influencing the electrical property and the working stability of the electronic device and equipment.
Studies have shown that the reliability of individual electronic components decreases by 50% for every 10 ℃ above the nominal temperature, and that over 55% of failure modes of electronic equipment are caused by excessive temperatures. In some occasions or narrow spaces (such as military vehicles and unmanned devices) where liquid cooling is limited in use, heat dissipation of electronic devices is more difficult, and the existing conventional air-cooling heat dissipation technology is difficult to meet the heat dissipation requirements of electronic devices with high heat consumption and high heat flow density.
Disclosure of Invention
The invention aims to provide an air cooling plate type pulsating heat pipe which is efficient in heat dissipation and compact in structure.
The technical solution for realizing the purpose of the invention is as follows: an air-cooled plate type pulsating heat pipe comprises a fin bottom plate and a runner cover plate, wherein the fin bottom plate is used as a heat sink of the air-cooled plate type pulsating heat pipe, one side of the fin bottom plate is a bottom plate welding surface, and the other side of the fin bottom plate is provided with a first fin for increasing the convection heat exchange area of an air side; the flow channel cover plate is used as an installation carrier of the electronic device, one surface of the flow channel cover plate is a cover plate welding surface, the cover plate welding surface is provided with a pulsating heat pipe flow channel which is concave inwards, and the other surface of the flow channel cover plate is used for installing the electronic device; the welding surface of the bottom plate and the welding surface of the cover plate are welded into a whole and are processed and molded after heat treatment.
Further, a second rib is added to a non-electronic component mounting area on the side of the flow channel cover plate where the electronic component is mounted.
Furthermore, the air-cooled plate type pulsating heat pipe is made of aluminum alloy, and the fin bottom plate and the flow channel cover plate are connected into a whole through vacuum aluminum brazing or diffusion welding.
Further, the internal pulsating heat pipe flow channel is vacuumized through a reserved liquid injection port, the vacuum degree is less than or equal to 2Pa, then acetone with the liquid filling rate of 40% -60% is injected, and finally sealing treatment is completed.
Furthermore, the flow channel of the pulsating heat pipe is a snake-shaped capillary closed loop, the section of the flow channel is rectangular, triangular or semicircular, and the hydraulic diameter of the flow channel is 1.2-2.9 mm.
Furthermore, the wall thickness from the flow channel of the pulsating heat pipe to the outer surface is not less than 1mm, so that the pressure of not less than 0.8MPa can be borne in the flow channel.
Furthermore, the first fin and the second fin are needle fins, straight fins, sawtooth fins, porous fins or corrugated fins.
Compared with the prior art, the invention has the following remarkable advantages:
1) the heat dissipation limit is improved: the efficient heat transfer performance of the pulsating heat pipe is combined with the air-cooled cold plate with a compact structure, so that local heat generated by an electronic device is quickly expanded to the periphery, the heat flux density at the mounting surface of the electronic device is reduced, the defect that fins at the positions of the conventional air-cooled cold plate far away from the mounting surface are low in utilization efficiency is overcome, and the overall heat exchange efficiency of the fins is fully improved, so that the temperature rise and the temperature uniformity of the electronic device are effectively controlled, the limit heat flux density of the heat dissipation of the air-cooled cold plate is improved by more than ten times, and the application range of the air-cooled cold;
2) the reliability is high: the air-cooled plate type pulsating heat pipe has a compact structure, occupies small space, only needs to provide cooling air with certain temperature and flow, has a simple system, does not have the risk of liquid leakage, is convenient for modular design and is convenient to maintain;
3) the adaptability is strong: the air-cooled plate type pulsating heat pipe has no strict evaporation end and condensation end, has no limit on the positions of a heat source and a heat sink, can flexibly arrange pulsating heat pipe runners according to the positions of the heat source, a mounting hole and a through hole, and has simple manufacturing process, strong expansibility and wide application prospect.
Drawings
Fig. 1 is a heat source distribution and air flow diagram of an air-cooled plate-type pulsating heat pipe in example 1 of the present invention.
Fig. 2 is a schematic structural diagram and a cross-sectional view of an air-cooled plate-type pulsating heat pipe in embodiment 1 of the present invention.
Fig. 3 is a schematic structural diagram and a cross-sectional view of an air-cooled pulsating heat pipe in embodiment 2 of the present invention.
Reference numbers in the figures: 1-a rib bottom plate, 1-1-a bottom plate welding surface, and 1-2-a first rib; 2-flow channel cover plate, 2-1-cover plate welding surface, 2-2-pulsating heat pipe flow channel and 2-3-second fin.
Detailed Description
The invention combines the characteristics of no need of a wick for the pulsating heat pipe, simple structure, good heat transfer performance, small influence of gravity and strong adaptability, flattens the pulsating heat pipe and combines the pulsating heat pipe with the compact heat dissipation form of the air-cooled cold plate, provides a new solution for heat dissipation of electronic devices with high heat consumption and high heat flow density, and particularly has wide application prospect in the field of electronic heat dissipation with limited use environment.
The invention relates to an air-cooled plate type pulsating heat pipe, which comprises a rib bottom plate 1 and a runner cover plate 2, wherein the rib bottom plate 1 is used as a heat sink of the air-cooled plate type pulsating heat pipe, one surface is a bottom plate welding surface 1-1, and the other surface is provided with first ribs 1-2 for increasing the convection heat exchange area of an air side; the flow channel cover plate 2 is used as an installation carrier of an electronic device, one surface is a cover plate welding surface 2-1, the cover plate welding surface 2-1 is provided with a pulsating heat pipe flow channel 2-2 which is concave inwards, and the other surface is used for installing the electronic device; the welding surface 1-1 of the bottom plate and the welding surface 2-1 of the cover plate are welded into a whole, and are processed and molded after heat treatment.
Further, a second rib 2-3 is added to a non-electronic component mounting area on the side of the flow channel cover plate 2 where the electronic component is mounted.
Furthermore, the air-cooled plate type pulsating heat pipe is made of aluminum alloy, and the fin base plate 1 and the runner cover plate 2 are connected into a whole through vacuum aluminum brazing or diffusion welding.
Further, the internal pulsating heat pipe flow channel 2-2 is vacuumized through a reserved liquid injection port, the vacuum degree is less than or equal to 2Pa, then acetone with the liquid filling rate of 40% -60% is injected, and finally sealing treatment is completed.
Furthermore, the flow channel 2-2 of the pulsating heat pipe is a snake-shaped capillary closed loop, the section of the flow channel is rectangular, triangular or semicircular, and the hydraulic diameter of the flow channel is 1.2-2.9 mm.
Furthermore, the wall thickness from the flow channel 2-2 of the pulsating heat pipe to the outer surface is not less than 1mm, so that the pressure of not less than 0.8MPa can be borne in the flow channel.
Further, the first fins 1-2 and the second fins 2-3 are needle fins, straight fins, sawtooth fins, porous fins or corrugated fins.
The invention is described in detail below by way of example with reference to the accompanying drawings.
As shown in figures 1-3, the air-cooled plate type pulsating heat pipe is formed by connecting a fin bottom plate 1 and a flow channel cover plate 2 into a whole through vacuum aluminum brazing or diffusion welding, processing and forming after heat treatment, vacuumizing the pipe through a reserved liquid injection port, injecting acetone, and finally finishing sealing of the liquid injection port. The ribbed bottom plate 1 is used as a heat sink of the air-cooled plate type pulsating heat pipe; before welding, one side is a base plate welding surface 1-1, and the flatness and the roughness of the base plate welding surface are ensured to meet the welding requirement; and a machining allowance with the thickness of 2-3 mm is reserved on the rest surfaces, so that the first fin 1-2 and other shapes can be machined after welding. The runner cover plate 2 is used as an installation carrier of an electronic device of the air cooling plate type pulsating heat pipe; before welding, one surface is a cover plate welding surface 2-1, and the flatness and the roughness of the cover plate welding surface are ensured to meet the welding requirement, wherein a pulsating heat pipe flow channel 2-2 which is sunken towards the inside of the cover plate welding surface 2-1 is arranged; and the rest surfaces are reserved with machining allowance of 2-3 mm in thickness so as to be convenient for machining the installation surface and other shapes after welding and ensure that the electronic device is well attached to the plate-type pulsating heat pipe.
Furthermore, when welding, especially when vacuum aluminum brazing is adopted, the relative placement positions of the fin bottom plate 1 below and the channel cover plate 2 above are ensured, and the situation that the brazing filler metal flows into the pulsating heat pipe channel 2-2 under the influence of gravity after being melted to cause channel blockage and block the phase change flow of acetone is avoided.
Further, the air-cooled plate type pulsating heat pipe is vacuumized, the vacuum degree is less than or equal to 2Pa, acetone with the liquid filling rate of 40% -60% is injected, and sealing treatment is carried out.
Further, as shown in fig. 2 and 3, the flow channel 2-2 of the pulsating heat pipe is a serpentine capillary closed loop, the cross section of the flow channel can be rectangular, triangular, semicircular and the like, and the hydraulic diameter of the flow channel is 1.2-2.9 mm.
Furthermore, the effective wall thickness from the flow channel 2-2 of the pulsating heat pipe to the outer surface is not less than 1mm, so that the pressure of not less than 0.8MPa can be borne in the flow channel.
Further, as shown in fig. 3, in order to enhance the heat dissipation capability of the air-cooled plate-type pulsating heat pipe, second fins 2-3 may be additionally provided on the flow channel cover plate 2 in a region other than the electronic device mounting surface, so as to further increase the convection heat area on the air side.
Further, as shown in fig. 2 and 3, the first fins 1-2 and the second fins 2-3 may be one or more of needle fins, straight fins, sawtooth fins, porous fins, and corrugated fins, and are used to increase the heat exchange area and disturbance and reduce the thermal resistance of convective heat transfer.
The present invention will be further described with reference to the following specific examples.
Example 1
As shown in fig. 1 and 2, a pulsating heat pipe flow channel 2-2 is reasonably arranged according to the installation position and heat consumption of a heating electronic device and considering the influence of installation holes and through holes, and local heat with high heat consumption and high heat flux density is quickly diffused to the periphery by utilizing the efficient phase change heat transfer capacity of the pulsating heat pipe, so that the heat flux density at the installation surface of the electronic device is reduced; the defect that the utilization efficiency of the first fins 1-2 of the conventional air-cooled cold plate far away from the mounting surface is low is overcome, the overall heat exchange efficiency of the cold plate is improved, and finally the heat consumption of the electronic device is transferred to the air through convection heat exchange. Compared with a single air-cooled cold plate, the limit heat flux density of the air-cooled cold plate type pulsating heat pipe under the same condition is improved by more than ten times, and the application range of the air-cooled cold plate is greatly expanded.
Example 2
As shown in FIG. 3, in order to fully utilize the heat exchange capability of the first fin 1-2, the pulsating heat pipe flow channel 2-2 should be distributed over the cover plate welding surface 2-1 of the flow channel cover plate 2 as much as possible. Because the convective heat exchange between the air-cooled plate type pulsating heat pipe and air is a weak link on a heat transfer path, in order to strengthen the heat dissipation capacity of the air-cooled plate type pulsating heat pipe, the second fins 2-3 are additionally arranged in the area, which is not the mounting surface of an electronic device, on the runner cover plate 2, so that the convective heat area on the air side is further enlarged, the total thermal resistance of the heat transfer path is effectively reduced, and the heat dissipation capacity and the ultimate heat flux density of the air-cooled plate type pulsating heat.
In summary, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. An air-cooled plate type pulsating heat pipe is characterized by comprising a rib bottom plate (1) and a runner cover plate (2), wherein the rib bottom plate (1) is used as a heat sink of the air-cooled plate type pulsating heat pipe, one surface is a bottom plate welding surface (1-1), and the other surface is provided with first ribs (1-2) for increasing the convection heat exchange area of an air side; the flow channel cover plate (2) is used as an installation carrier of an electronic device, one surface of the flow channel cover plate is a cover plate welding surface (2-1), the cover plate welding surface (2-1) is provided with a pulsating heat pipe flow channel (2-2) which is sunken inwards, and the other surface of the flow channel cover plate is used for installing the electronic device; the welding surface (1-1) of the bottom plate and the welding surface (2-1) of the cover plate are welded into a whole, and are processed and molded after heat treatment.
2. An air-cooled plate type pulsating heat pipe as claimed in claim 1, wherein a second rib (2-3) is added to a non-electronic component mounting area on a side of the flow path cover plate (2) on which the electronic component is mounted.
3. The air-cooled plate type pulsating heat pipe as claimed in claim 2, wherein the material of the air-cooled plate type pulsating heat pipe is aluminum alloy, and the fin bottom plate (1) and the runner cover plate (2) are integrally connected by vacuum aluminum brazing or diffusion welding.
4. The air-cooled plate type pulsating heat pipe according to claim 2 or 3, wherein the flow channel (2-2) of the internal pulsating heat pipe is evacuated through a reserved liquid injection port, the vacuum degree is less than or equal to 2Pa, acetone with the liquid filling rate of 40-60% is injected, and finally sealing treatment is completed.
5. The air-cooled plate type pulsating heat pipe according to claim 4, wherein the pulsating heat pipe flow channel (2-2) is a serpentine capillary closed loop, the cross section of the flow channel is rectangular, triangular or semicircular, and the hydraulic diameter of the flow channel is 1.2-2.9 mm.
6. An air-cooled plate type pulsating heat pipe as claimed in claim 4, wherein the wall thickness from the flow channel (2-2) of the pulsating heat pipe to the outer surface is not less than 1mm, so that the inside of the flow channel can bear the pressure of not less than 0.8 MPa.
7. The air-cooled plate type pulsating heat pipe as claimed in claim 4, wherein the first fins (1-2) and the second fins (2-3) are needle fins, straight fins, sawtooth fins, porous fins or corrugated fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010837384.8A CN111902032A (en) | 2020-08-19 | 2020-08-19 | Air-cooled plate type pulsating heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010837384.8A CN111902032A (en) | 2020-08-19 | 2020-08-19 | Air-cooled plate type pulsating heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111902032A true CN111902032A (en) | 2020-11-06 |
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ID=73229176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010837384.8A Pending CN111902032A (en) | 2020-08-19 | 2020-08-19 | Air-cooled plate type pulsating heat pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111902032A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201119229Y (en) * | 2007-10-26 | 2008-09-17 | 北京工业大学 | Flat plate thermal tube integrated heat radiation device |
| CN202562341U (en) * | 2012-03-22 | 2012-11-28 | 中国科学院工程热物理研究所 | Impulse heat-pipe expanding heat plate |
| CN104244680A (en) * | 2014-09-25 | 2014-12-24 | 中国北方车辆研究所 | Composite water cooling plate |
| US20150323261A1 (en) * | 2014-05-09 | 2015-11-12 | Industrial Technology Research Institute | Pulsating multi-pipe heat pipe |
-
2020
- 2020-08-19 CN CN202010837384.8A patent/CN111902032A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201119229Y (en) * | 2007-10-26 | 2008-09-17 | 北京工业大学 | Flat plate thermal tube integrated heat radiation device |
| CN202562341U (en) * | 2012-03-22 | 2012-11-28 | 中国科学院工程热物理研究所 | Impulse heat-pipe expanding heat plate |
| US20150323261A1 (en) * | 2014-05-09 | 2015-11-12 | Industrial Technology Research Institute | Pulsating multi-pipe heat pipe |
| CN104244680A (en) * | 2014-09-25 | 2014-12-24 | 中国北方车辆研究所 | Composite water cooling plate |
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Application publication date: 20201106 |