CN108444324A - A kind of soaking plate - Google Patents

A kind of soaking plate Download PDF

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Publication number
CN108444324A
CN108444324A CN201810651031.1A CN201810651031A CN108444324A CN 108444324 A CN108444324 A CN 108444324A CN 201810651031 A CN201810651031 A CN 201810651031A CN 108444324 A CN108444324 A CN 108444324A
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CN
China
Prior art keywords
plate
conduit
evaporation
working medium
evaporation plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810651031.1A
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Chinese (zh)
Inventor
王长宏
赵雨亭
黄浩东
田中轩
马瑞鑫
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Guangdong University of Technology
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Guangdong University of Technology
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Application filed by Guangdong University of Technology filed Critical Guangdong University of Technology
Priority to CN201810651031.1A priority Critical patent/CN108444324A/en
Publication of CN108444324A publication Critical patent/CN108444324A/en
Pending legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029Heat sinks

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention discloses a kind of soaking plate, including evaporation plate, cold plate and connecting plate, evaporation plate is arranged with cold plate face, connecting plate with cold plate for connecting evaporation plate to form airtight chamber, and working medium is filled in airtight chamber, the conduit for transferring working medium is provided in evaporation plate, conduit is circumferentially distributed along evaporation plate, and conduit is dissipated from the center of evaporation plate to edge.Soaking plate provided by the invention, bionical vein polygon microchannel structure is arranged in evaporation plate and cold plate, covers lyophily performance liquid-sucking core in evaporation plate conduit wall surface and support column surrounding so that wall surface has lyophily performance, the capillary performance for improving groove liquid sucking core, accelerates the rate of liquid aspiration of groove liquid sucking core;Lyophoby performance material is covered in cold plate conduit wall surface and support column surrounding, to realize the downward circulation rate for accelerating working medium from cold plate edge to the progressive lyophoby in center in main channel, flow back distance so as to shorten working medium, accelerate working medium back-flow velocity, improves heat sinking benefit.

Description

A kind of soaking plate
Technical field
The present invention relates to heat dissipation from microelectronic devices technical field, more particularly to a kind of soaking plate.
Background technology
With the rapid development of Electronic Encapsulating Technology, the integrated level and performance of electronic chip are continuously improved, and lead to chip Power constantly continues to increase.The mean heat flux on current chip surface has been over 100W/cm2, and have and continue growing Trend.Meanwhile " hot spot " problem that chip generally existing amount of localized heat after the completion of chip package is high, chip part temperature will be caused Degree drastically increases, and influences chip stability.
It is increased for temperature in the solution for leading to chip failure, has both included the conventional chillings sides such as air-cooled, liquid cooling, heat pipe Formula also has the heat sinkings modes such as semiconductor cooling, the heat dissipation of micro jet flow technology, liquid metal heat radiation, carbon fibre material. Traditional heat sink conception due to by structure, space, cost, can safeguard, many factors such as noise are restricted, can not meet The requirement of following high heat flux density electronic element radiating, and novel heat dissipation technology cannot still obtain due to technology is immature etc. To large-scale application.
Flat-plate heat pipe is a kind of heat sinking medium designed according to heat pipe operation principle, primary structure have shell, Liquid-sucking core, working medium etc., its working principle is that when heat by heat source by the evaporating area of flat-plate heat pipe when, in the cavity of rough vacuum It is interior, worker quality liquid ebullition, gasification, under the action of pressure difference, gas flow condensing zone, condensation heat to the cold, and in capillary force It is back to evaporating area along liquid-sucking core under effect, and the heat of cryosurface is taken away by other radiating modes outside flat-plate heat pipe.Although Operation principle is similar, but compared with the heat transfer type of heat pipe one-dimensional linear, the heat transfer type of flat-plate heat pipe uploads for two-dimensional surface Heat, therefore there is better heat transfer property and uniform temperature.However existing flat-plate heat pipe working medium reflux relies primarily on liquid-sucking core and carries The capillary force of confession, the capillary limitation and the boiling limit of heat exchange are smaller, additionally, due to the presence of liquid-sucking core, are condensed close to cryosurface Liquid working substance afterwards cannot flow back and at once on the liquid-sucking core that is full of near cryosurface so that heat transfer resistance increases, and burns in addition Knot liquid sucting core structure itself needs to consume mass energy, and sintering quality is difficult control.
Therefore, how a kind of quickening radiator liquid working medium back-flow velocity is provided, the heat dissipation of electronic chip of heat exchange efficiency is improved Device is those skilled in the art's technical problem urgently to be resolved hurrily.
Invention content
The object of the present invention is to provide a kind of soaking plates, can improve radiator liquid working medium back-flow velocity, are that calorific value is high Integrated chip relatively reliable sinking path and higher radiating efficiency are provided.
In order to solve the above technical problems, the present invention provides a kind of soaking plate, including evaporation plate, cold plate and connecting plate, institute It states evaporation plate with the cold plate face to be arranged, the connecting plate with the cold plate for connecting the evaporation plate to be formed Airtight chamber, and working medium is filled in the airtight chamber, the conduit for conveying the working medium is provided in the evaporation plate, The conduit is circumferentially distributed along the evaporation plate, and the conduit is dissipated from the center of the evaporation plate to edge.
Preferably, the centrally disposed vessel for being useful for accommodating the working medium of the evaporation plate.
Preferably, the condensation part for condensing the working medium after phase transformation, and the condensation are provided on the cold plate Portion is arranged with the vessel face.
Preferably, the conduit includes transport conduit and capillary channel, and the head end of the transport conduit connects with the vessel Logical, the end of the transport conduit is connected to the capillary channel.
Preferably, the conduit further includes the connecting channel for connecting the adjacent capillary channel.
Preferably, be additionally provided with conveying conduit and time capillary channel on the cold plate, the head end of the conveying conduit with The end of the condensation part connection, the conveying conduit is connected to the secondary capillary channel.
Preferably, further include the composite liquid sucking core for being arranged on the transport conduit inner wall and having lyophily performance.
Preferably, the thickness of the composite liquid sucking core is successively decreased from the center of the evaporation plate to edge.
Preferably, further include the composite hydrophobic layer for being arranged on the conveying conduit inner wall and having lyophoby performance.
Preferably, the support column for the center drainage to the evaporation plate is additionally provided in the evaporation plate.
Soaking plate provided by the present invention includes mainly evaporation plate, cold plate and connecting plate, evaporation plate and cold plate face Setting, connecting plate is used to connect evaporation plate with cold plate to form airtight chamber, and working medium is filled in airtight chamber, evaporation The conduit for transferring working medium is provided on plate, conduit is circumferentially distributed along evaporation plate, and conduit is from the center of evaporation plate to edge Diverging.Soaking plate provided by the invention, bionical vein structure polygon microchannel structure is arranged in evaporation plate, in evaporation plate channel wall The copper particle deposition layer that the electrochemical displacement with lyophily performance of face and support column surrounding covering nanostructure is formed constitutes multiple Liquid-sucking core is closed, deposit thickness successively decreases by conduit series increase, due to porous micro- knot of evaporation plate conduit wall surface sedimentary Structure so that wall surface has lyophily performance, improves the capillary performance of groove liquid sucking core, accelerates the rate of liquid aspiration of groove liquid sucking core, into And adopting heat pipes for heat transfer performance is promoted, improve the smooth groove liquid sucking core capillary pressure of tradition, while it is excellent to retain conduit partial straight lines structure Good permeance property accelerates working medium circulation speed;It is covered with the tool of nanostructure in cold plate conduit wall surface and support column surrounding The nickel coating for having lyophoby performance is successively decreased by cold plate center as series increases nickel plating layer thick, step by step to realize by condensing Edges of boards edge strengthens the dropwise condensation of vaporization working medium using lyophobic surface to the progressive lyophoby in center, reduces heat transfer resistance, accelerates working medium In the circulation rate of main channel.On the whole, working medium is evaporated to cold plate projection section, since cold plate support column surrounding is in The progressive lyophoby of condensing zone is entreated, accelerates projection section steam and flows to support column, due to the effect of gravity and capillary attraction so that working medium Liquefaction flows to evaporation plate by support column, since evaporation plate support column surrounding is to the progressive lyophily of boiling section, can accelerate working medium and pass through Boss microchannel flows to boiling section, so as to shorten boss working medium reflux distance, accelerates working medium back-flow velocity, improves heat sinking benefit.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis The attached drawing of offer obtains other attached drawings.
Fig. 1 is a kind of integrally-built explosive view of specific implementation mode provided by the present invention;
Fig. 2 is evaporation plate structure schematic diagram shown in FIG. 1;
Fig. 3 is condensation plate structure schematic diagram shown in FIG. 1;
Fig. 4 is the distribution schematic diagram of composite liquid sucking core shown in Fig. 2;
Fig. 5 is the distribution schematic diagram of composite hydrophobic layer shown in Fig. 3.
Wherein, in Fig. 1-Fig. 5:
Evaporation plate -1, cold plate -2, connecting plate -3, composite liquid sucking core -4, composite hydrophobic layer -5, vessel -11, fortune Defeated conduit -12, capillary channel -13, connecting channel -14, support column -15, condensation part -21 convey conduit -22, secondary hair Stria road -23 are connected to conduit -24.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
It please refers to Fig.1, Fig. 2 and Fig. 3, Fig. 1 are a kind of the integrally-built quick-fried of specific implementation mode provided by the present invention Fried view;Fig. 2 is evaporation plate structure schematic diagram shown in FIG. 1;Fig. 3 is condensation plate structure schematic diagram shown in FIG. 1.
In a kind of specific implementation mode provided by the present invention, soaking plate includes mainly evaporation plate 1, cold plate 2 and even Fishplate bar 3, evaporation plate 1 are arranged with 2 face of cold plate, and connecting plate 3 with cold plate 2 for connecting evaporation plate 1 to form closed chamber Room, and working medium is filled in airtight chamber, the conduit for transferring working medium is provided in evaporation plate 1, conduit is circumferential along evaporation plate 1 Distribution, and conduit is dissipated from the center of evaporation plate 1 to edge.
Wherein, in the present embodiment, evaporation plate 1, cold plate 2 and connecting plate 3 use thickness for the copper coin of 0.4mm~1mm Or aluminium sheet, can also be other materials, stable carry out heat radiation working medium cycle can be carried out by being subject to, and not do specific limit herein It is fixed;Evaporation plate 1, cold plate 2 can be circle, can also be other shapes, and concrete shape is determined according to user's technique, such as Square, such as rectangle, are not specifically limited herein;Evaporation plate 1 is connect to form airtight chamber by connecting plate 3 with cold plate 2, close It is filled with heat radiation working medium, such as pure water, such as methanol, such as ethyl alcohol, such as acetone in closed chamber room, can also be other certainly Heat radiation working medium, is subject to the cooling requirements that disclosure satisfy that electronic chip, is not specifically limited herein;It is arranged in evaporation plate 1 useful In the conduit of transferring working medium, and conduit is circumferentially distributed along evaporation plate 1, is set to the diverging of 1 edge of evaporation plate with the center of evaporation plate 1 It sets.
Specifically, in actual heat radiation working medium reflux course, heat radiation working medium is evaporated to 2 boss of cold plate through evaporation plate 1 Accelerate projection section steam since 2 support column of cold plate, 15 surrounding is to the progressive lyophoby of central condensing zone and flow to support column in part 15, due to the effect of gravity and composite liquid sucking core capillary attraction so that working medium liquefaction flows to evaporation plate 1 by support column 15, by In 1 support column of evaporation plate, 15 surrounding to the progressive lyophily of boiling section, working medium can be accelerated, boiling section is flowed to by boss microchannel, to Shorten boss working medium reflux distance, accelerates working medium back-flow velocity, improve heat sinking benefit.This flat-plate heat pipe passes through to evaporation plate 1, cold Solidifying plate 2,15 surrounding boss of support column carry out super close, lyophobic surface and are modified, and enhanced water evaporation condensation rate improves evaporating area and condensation The heat exchange property in area guides and accelerates working medium back-flow velocity to improve overall heat exchange ability, optimizes heat dissipation effect.
It can accelerate heat radiation working medium back-flow velocity to optimize soaking plate in above-described embodiment, improve the excellent of heat exchange efficiency Point is provided with the condensation part 21 for condensing the working medium after phase transformation on cold plate 2, and condensation part 21 is arranged with 11 face of vessel, Condensation part 21 is connect with support column 15, and support column 15 extends to vessel 11.Condensation part 21 is arranged with 11 face of vessel, it is ensured that The liquid that condensation part 21 condenses is arrived at less path right over vessel 11, when shortening heat radiation working medium reflux by support column 15 Between, improve radiating efficiency.
Further, conduit includes transport conduit 12 and capillary channel 13, and the head end of transport conduit 12 is connected to vessel 11, The end of transport conduit 12 is connected to capillary channel 13.Transport the tool of the coated with nanometre structure of conduit 12 and capillary channel 13 There is the copper particle deposition layer that the electrochemical displacement of lyophily performance is formed, thickness presses conduit to this sedimentary from inside to outside in evaporation plate 1 Series increase is successively decreased, and ensure that evaporation plate 1 can be such that liquid is flowed at faster speed to support column 15, accelerates heat dissipation work The back-flow velocity of matter improves radiating efficiency.
Further, conduit further includes the connecting channel 14 for connecting adjacent capillary channel 13.With above-mentioned transport conduit 12 act on simultaneously, and transport conduit 12, capillary channel 13 and connecting channel 14 form the polygon microchannel of bionical vein structure Structure accelerates heat radiation working medium back-flow velocity, improves radiating efficiency.
Further, conveying conduit 22 and time capillary channel 23 are additionally provided on cold plate 2, convey the head end of conduit 22 with Condensation part 21 is connected to, and the end for conveying conduit 22 be connected to time capillary channel 23, conveying conduit 22 and secondary capillary channel 23 and Connection conduit 24 forms the polygon microchannel structure of bionical vein structure, accelerates heat radiation working medium back-flow velocity, improves heat dissipation effect Rate.
Please refer to Fig.4 and Fig. 5, Fig. 4 be composite liquid sucking core shown in Fig. 2 distribution schematic diagram;Fig. 5 is shown in Fig. 3 multiple Close the distribution schematic diagram of hydrophobic layer.
It should be noted that the electrochemical displacement with lyophily performance of 1 coated with nanometre structure of evaporation plate was formed Copper particle deposition layer constitutes composite liquid sucking core 4, the composite hydrophobic layer with lyophoby performance of 2 coated with nanometre structure of cold plate 5, composite hydrophobic layer 5 is preferably nickel coating.
Further, transport on 12 inner wall of conduit and have the composite liquid sucking core 4 of lyophily performance;The thickness of composite liquid sucking core 4 Degree is successively decreased from the center of evaporation plate 1 to edge;Convey on 22 inner wall of conduit and have the composite hydrophobic layer 5 of lyophoby performance.Lyophily The design of the composite liquid sucking core 4 of performance and the composite hydrophobic layer 5 of lyophoby performance can make the liquid evaporated through evaporation plate 1 exist After cold plate 2 condenses, support column 15 is flowed back at faster speed, and similarly, support column 15 is to be become from lyophoby from top to bottom Lyophily, it is ensured that condensed liquid quickly flows back, and the composite liquid sucking core 4 in evaporation plate 1 has lyophily performance, with more Big suction sucks back the coolant liquid of top, is drained in vessel 11, accelerates radiating efficiency.
Further, the centrally disposed vessel 11 for being useful for accommodating working medium of evaporation plate 1.The limited choosing of liquid filled ratio of vessel 11 It is selected as 35%~45%, is best with 40%, there is enough working medium to be evaporated, it may have enough spaces are evaporated, It ensure that heat dissipation effect;It should be noted that the indoor vacuum degree of chamber is 12.33kPa, the speed of evaporation is improved, ensures working medium Rapid evaporation condenses, and carries out heat exchange cycle.
In conclusion the soaking plate that is provided of the present embodiment includes mainly evaporation plate, cold plate and connecting plate, evaporation plate with Cold plate face is arranged, and connecting plate is used to connect evaporation plate with cold plate to form airtight chamber, and is filled in airtight chamber There is working medium, the conduit for transferring working medium is provided in evaporation plate, conduit is circumferentially distributed along evaporation plate, and conduit is by evaporation plate Center is dissipated to edge.Soaking plate provided by the invention, evaporation plate are arranged bionical vein structure polygon microchannel structure, are steaming The copper particle for sending out the electrochemical displacement formation with lyophily performance of board slot road wall surface and support column surrounding covering nanostructure is heavy Lamination constitutes composite liquid sucking core, and deposit thickness successively decreases by conduit series increase, due to evaporation plate conduit wall surface sedimentary Porous microstructure so that wall surface have lyophily performance, improve the capillary performance of groove liquid sucking core, accelerate the suction of groove liquid sucking core Liquid speed degree, and then adopting heat pipes for heat transfer performance is promoted, improve the smooth groove liquid sucking core capillary pressure of tradition, while it is straight to retain channel portion The excellent permeance property of cable architecture accelerates working medium circulation speed;It is covered with nanometer in cold plate conduit wall surface and support column surrounding The nickel coating with lyophoby performance of structure is successively decreased by cold plate center as series increases nickel plating layer thick, step by step to real Now from cold plate edge to the progressive lyophoby in center, strengthen the dropwise condensation of vaporization working medium using lyophobic surface, reduce heat transfer resistance, Circulation rate of the quickening working medium in main channel.On the whole, working medium is evaporated to cold plate projection section, due to cold plate support column Around to the progressive lyophoby of central condensing zone, accelerate projection section steam and flow to support column, due to the effect of gravity and capillary attraction, So that working medium liquefaction flows to evaporation plate by support column, since evaporation plate support column surrounding is to the progressive lyophily of boiling section, can accelerate Working medium flows to boiling section by boss microchannel, so as to shorten boss working medium reflux distance, accelerates working medium back-flow velocity, improves and dissipate Thermal benefit.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, as defined herein General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one The widest range caused.

Claims (10)

1. a kind of soaking plate, which is characterized in that including evaporation plate (1), cold plate (2) and connecting plate (3), the evaporation plate (1) Be arranged with the cold plate (2) face, the connecting plate (3) be used to the evaporation plate (1) connecting with the cold plate (2) with Airtight chamber is formed, and is filled with working medium in the airtight chamber, is provided on the evaporation plate (1) for conveying the working medium Conduit, the conduit is circumferentially distributed along the evaporation plate (1), and the conduit is from the center of the evaporation plate (1) to edge Diverging.
2. soaking plate according to claim 1, which is characterized in that the centrally disposed of evaporation plate (1) is useful for accommodating The vessel (11) of the working medium.
3. soaking plate according to claim 2, which is characterized in that be provided on the cold plate (2) for condensing phase transformation The condensation part (21) of the working medium afterwards, and the condensation part (21) are arranged with the vessel (11) face.
4. soaking plate according to claim 3, which is characterized in that the conduit includes transport conduit (12) and capillary channel (13), the head end of the transport conduit (12) is connected to the vessel (11), the end of the transport conduit (12) and the hair Stria road (13) is connected to.
5. soaking plate according to claim 4, which is characterized in that the conduit further includes for connecting the adjacent capillary The connecting channel (14) of conduit (13).
6. soaking plate according to claim 3, which is characterized in that be additionally provided with conveying conduit on the cold plate (2) (22) it is connected to the condensation part (21) with time capillary channel (23), the head end of the conveying conduit (22), the conveying conduit (22) end is connected to the secondary capillary channel (23).
7. soaking plate according to claim 6, which is characterized in that further include being arranged on transport conduit (12) inner wall And the composite liquid sucking core (4) with lyophily performance.
8. soaking plate according to claim 7, which is characterized in that the thickness of the composite liquid sucking core (4) is by the evaporation Successively decrease to edge at the center of plate (1).
9. soaking plate according to claim 8, which is characterized in that further include being arranged on conveying conduit (22) inner wall And the composite hydrophobic layer (5) with lyophoby performance.
10. according to soaking plate described in any one of claim 1-9, which is characterized in that be additionally provided on the evaporation plate (1) Support column (15) for from the center drainage to the evaporation plate (1).
CN201810651031.1A 2018-06-22 2018-06-22 A kind of soaking plate Pending CN108444324A (en)

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CN109579583A (en) * 2018-11-30 2019-04-05 华南理工大学 A kind of ultra-thin imitative blade soaking plate
CN109579584A (en) * 2018-11-30 2019-04-05 华南理工大学 A kind of ultra-thin loop soaking plate
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CN111197942B (en) * 2020-01-08 2021-04-20 厦门大学 Integrated bionic wick for loop heat pipe, preparation method and application
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