CN108105734A - LED component soaking plate and LED component - Google Patents
LED component soaking plate and LED component Download PDFInfo
- Publication number
- CN108105734A CN108105734A CN201711367730.5A CN201711367730A CN108105734A CN 108105734 A CN108105734 A CN 108105734A CN 201711367730 A CN201711367730 A CN 201711367730A CN 108105734 A CN108105734 A CN 108105734A
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- China
- Prior art keywords
- liquid
- plate
- sucking core
- led component
- evaporation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Present invention is disclosed a kind of LED component soaking plate and LED components, the soaking plate includes the evaporation plate being equipped with toward each other and cold plate, Packed chamber is formed between evaporation plate and cold plate, working medium is inoculated in chamber, evaporation plate includes evaporation plate body and the first liquid-sucking core being attached on evaporation plate body madial wall, cold plate includes cold plate body and the second liquid-sucking core being attached on cold plate body madial wall, several supporting items are provided between first liquid-sucking core and the second liquid-sucking core, the capillary flow channel of the first liquid-sucking core of at least one connection and the second liquid-sucking core is formed on supporting item.During work, evaporation plate absorbs heat, and by the working medium heating evaporation at a liquid-sucking core, gaseous working medium generates heat exchange with cold plate, it is absorbed so as to be cooled to liquid refrigerant by the second liquid-sucking core, and then the first liquid-sucking core is back to by the capillary fluid flow tube road on supporting item, it so cycles, realizes efficient transmission of the heat of LED component generation from evaporation plate to cold plate.
Description
Technical field
The invention belongs to LED field of luminescent technology, and in particular to a kind of LED component soaking plate and with the soaking plate
LED component.
Background technology
Conventional incandescent energy consumption is high, short life, in today that global resources are in short supply, forbids giving birth to by national governments gradually
Production, substitute products are electronic energy-saving lamps therewith, although electronic energy-saving lamp improves energy-saving effect, but due to the use of many pollutions
The heavy metal element of environment, and run counter to the main trend of environmental protection.With LED technology high speed development LED illumination gradually into
For the only choosing of novel green illumination.LED principle of luminosity, energy-saving and environmental protection level on all be far superior to traditional lighting production
Product.
In current high-power LED light source system, generally use is all the combination of plurality of LEDs device array or multi-chip
The mode of LED integration packagings realizes overall illuminating effect, and each LED component can regard the heat of a concentration as
Source.When the heat for concentrating on LED component needs to be diffused on entire radiator base plate, there are certain diffusion thermal resistance, and drop
Low diffusion thermal resistance is to reduce heat to concentrate to reduce the most effectual way of cooling system overall thermal resistance.Soaking plate is as a kind of spy
The phase transformation heat pipe of different form, has very high thermal conductivity factor, can promote temperature distribution evenness and reduce heat concentration, be real
The effective way of existing this purpose.However in the prior art, the design of soaking plate is mostly complicated, and difficulty of processing is big, manufacture
Cost is higher.
The content of the invention
One embodiment of the application provides a kind of LED component soaking plate, simple in structure, easy to process, which uses
Soaking plate includes：
The evaporation plate and cold plate being equipped with toward each other, form Packed chamber between the evaporation plate and cold plate
Room, working medium is inoculated in the chamber, and the evaporation plate includes evaporation plate body and is attached at the evaporation plate body madial wall
On the first liquid-sucking core, the cold plate include cold plate body and be attached on the cold plate body madial wall second
Liquid-sucking core is provided with several supporting items between first liquid-sucking core and the second liquid-sucking core, be formed on the supporting item to
A few capillary flow channel for connecting first liquid-sucking core and the second liquid-sucking core.
In one embodiment, roughening treatment is passed through on the surface of the supporting item.
In one embodiment, the supporting item is provided at least one capillary along the thickness direction of the soaking plate.
In one embodiment, the capillary is recessed from the side wall of the soaking plate to be formed.
In one embodiment, the caliber of the capillary is less than the depth that the support surface passes through roughening treatment part.
In one embodiment, the thickness of the evaporation plate body is less than the thickness of cold plate body.
In one embodiment, first liquid-sucking core and the second liquid-sucking core are copper powder sintered plate.
In one embodiment, the working medium is deionized water or ethyl alcohol.
In one embodiment, vacuum environment in the chamber.
One embodiment of the invention also provides a kind of LED component, including LED component soaking plate as described above.
Compared with prior art, the technical solution of the application has the advantages that：
By setting the evaporation plate coordinated toward each other and cold plate, Packed chamber is formed between evaporation plate and cold plate
Room, working medium is inoculated in chamber, and evaporation plate includes evaporation plate body and the first imbibition being attached on evaporation plate body madial wall
Core, cold plate include cold plate body and the second liquid-sucking core for being attached on cold plate body madial wall, the first liquid-sucking core and
Several supporting items are provided between second liquid-sucking core, the first liquid-sucking core of at least one connection and second is formed on supporting item and is inhaled
The capillary flow channel of wick-containing, during work, the evaporation plate of soaking plate absorbs the heat of LED component, and by adjacent first
Working medium heating evaporation at liquid-sucking core, gaseous working medium is promptly full of entire chamber, and generates efficient heat with cold plate and hand over
It changes, so as to be cooled to liquid refrigerant, the working medium of liquid is absorbed by the second liquid-sucking core, and then passes through the capillary fluid flow tube on supporting item
Road is back to the first liquid-sucking core, is cycled in cycles, realizes height of the heat of LED component generation from evaporation plate to cold plate
Effect is transferred.
Description of the drawings
Fig. 1 is the structure diagram of LED component soaking plate in one embodiment of the application；
Fig. 2 is the schematic diagram of the supporting item of LED component soaking plate in one embodiment of the application.
Specific embodiment
The application is described in detail below with reference to specific embodiment shown in the drawings.But these embodiments are simultaneously
The application is not limited, structure that those of ordinary skill in the art are made according to these embodiments, method or functionally
Conversion is all contained in the protection domain of the application.
Join Fig. 1 and Fig. 2, introduce a specific embodiment of the LED component of the present invention with soaking plate 100.In present embodiment
In, which includes evaporation plate 10, cold plate 20 and supporting item 30 with soaking plate 100.
Evaporation plate 10 and cold plate 20 are positioned opposite to each other, cooperatively form between the two there are one sealing chamber (not mark
Show), working medium (not shown) is inoculated in chamber.Working medium is the medium of heat exchange in soaking plate 100, by the change of its phase,
Realize transmission of the heat from evaporation plate 10 to cold plate 20.Working medium is preferably the liquid medium with higher specific heat capacity, and one is real
It applies in example, such as can be deionized water or ethyl alcohol.Certainly, in the embodiment of other replacements, working medium can also select it
His suitable material.
Evaporation plate 10 includes evaporation plate body 11 and the first liquid-sucking core 12 being attached on 11 madial wall of evaporation plate body,
Cold plate 20 includes cold plate body 21 and the second liquid-sucking core 22 being attached on 21 madial wall of cold plate body.First imbibition
12 and second liquid-sucking core 22 of core needs have preferable capillary structure, so that working medium can be passed rapidly inside it
It is defeated.In one embodiment, the first liquid-sucking core 12 and the second liquid-sucking core 22 can be copper powder sintered plate.
The quantity of supporting item 30 be preferably set to it is multiple, be arranged at the first liquid-sucking core 12 and the second liquid-sucking core 22 it
Between, at least one capillary flow channel 31 for connecting the first liquid-sucking core 12 and the second liquid-sucking core 22 is formed on supporting item 30.It is logical
It crosses and capillary flow channel 31 is directly formed on supporting item 30, it is possible to reduce the setting of additional capillary pipeline, due in chamber
Thickness it is relatively small, if the additional capillary pipeline of manufacture is, it is necessary to the fixation in face of capillary pipeline and microcapillary simultaneously
Two hang-up of difficulty of processing of pipeline.In the present embodiment, which is the supporting item by roughening treatment
30 surfaces, roughening processing is equivalent on 30 surface of supporting item forms several intensive recess and cavity, these recess and cavity
Between be connected with each other, good capillarity can be played.
In one embodiment, supporting item 30 is provided at least one capillary 32 along the thickness direction of soaking plate 100, preferably
Ground, the capillary 32 is recessed from the side wall of soaking plate 100 to be formed.Capillary 32 can for example be formed by machining, with
Further optimize the capillarity of capillary flow channel 31.
In one embodiment, the caliber of capillary 32 is less than the depth that roughening treatment part is passed through on 30 surface of supporting item.
In one embodiment, the thickness of evaporation plate body 11 is less than the thickness of cold plate body 21.Can so it reduce from heat
Source is transferred to the thermal resistance of working medium, and the heat of LED component can quickly be transferred to the first liquid-sucking core 12, and cold plate 20 can rise
To better condensation effect.
In one embodiment, vacuum environment in chamber.
One embodiment of the application also provides a kind of LED component using above-mentioned soaking plate 100, due to being not related to pair
The improvement of LED component other parts, therefore the concrete structure of LED component is also repeated no more.
The technical solution of the application has the advantages that：
By setting the evaporation plate 10 coordinated toward each other and cold plate 20, it is formed between evaporation plate 10 and cold plate 20
The chamber of sealing, working medium is inoculated in chamber, and evaporation plate 10 includes evaporation plate body 11 and is attached at 11 inside of evaporation plate body
The first liquid-sucking core 12 on wall, cold plate 20 include cold plate body 21 and be attached on 21 madial wall of cold plate body the
Two liquid-sucking cores 22 are provided with several supporting items 30, are formed on supporting item 30 between first liquid-sucking core 12 and the second liquid-sucking core 22
There are the capillary flow channel 31 of the first liquid-sucking core 12 of at least one connection and the second liquid-sucking core 22, during work, the steaming of soaking plate 100
The heat that plate 10 absorbs LED component is sent out, and by the working medium heating evaporation at the first adjacent liquid-sucking core 12, gaseous working medium
Entire chamber is promptly full of, and efficient heat exchange is generated with cold plate 20, so as to be cooled to liquid refrigerant, the working medium of liquid
It is absorbed by the second liquid-sucking core 22, and then the first liquid-sucking core 12, Zhou Erfu is back to by the capillary fluid flow tube road on supporting item 30
Beginning is cycled, and realizes efficient transmission of the heat of LED component generation from evaporation plate 10 to cold plate 20.
It should be appreciated that although this specification is described in terms of embodiments, but not each embodiment only includes one
A independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should will say
For bright book as an entirety, the technical solution in each embodiment may also be suitably combined to form those skilled in the art can
With the other embodiment of understanding.
Those listed above it is a series of be described in detail only for the application feasibility embodiment specifically
Bright, they are not to limit the protection domain of the application, all equivalent implementations made without departing from the application skill spirit
Or change should be included within the protection domain of the application.
Claims (10)
1. a kind of LED component soaking plate, which is characterized in that including the evaporation plate being equipped with toward each other and cold plate, institute
It states and Packed chamber is formed between evaporation plate and cold plate, working medium is inoculated in the chamber, the evaporation plate includes evaporation plate
Body and the first liquid-sucking core being attached on the evaporation plate body madial wall, the cold plate include cold plate body and
The second liquid-sucking core being attached on the cold plate body madial wall is provided between first liquid-sucking core and the second liquid-sucking core
Several supporting items are formed with the capillary solution of at least one connection first liquid-sucking core and the second liquid-sucking core on the supporting item
Logical circulation road.
2. LED component soaking plate according to claim 1, which is characterized in that the surface of the supporting item is by roughening
Processing.
3. LED component soaking plate according to claim 2, which is characterized in that the supporting item is along the soaking plate
At least one capillary is provided on thickness direction.
4. LED component soaking plate according to claim 3, which is characterized in that the capillary is from the soaking plate
It is recessed on side wall to form.
5. LED component soaking plate according to claim 3, which is characterized in that the caliber of the capillary is less than described
Support surface passes through the depth of roughening treatment part.
6. LED component soaking plate according to claim 1, which is characterized in that the thickness of the evaporation plate body is less than
The thickness of cold plate body.
7. LED component soaking plate according to claim 1, which is characterized in that first liquid-sucking core and the second imbibition
Core is copper powder sintered plate.
8. LED component soaking plate according to claim 1, which is characterized in that the working medium is deionized water or ethyl alcohol.
9. LED component soaking plate according to claim 1, which is characterized in that vacuum environment in the chamber.
10. a kind of LED component, which is characterized in that including LED component soaking plate as described in any one of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711367730.5A CN108105734A (en) | 2017-12-18 | 2017-12-18 | LED component soaking plate and LED component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711367730.5A CN108105734A (en) | 2017-12-18 | 2017-12-18 | LED component soaking plate and LED component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108105734A true CN108105734A (en) | 2018-06-01 |
Family
ID=62210025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711367730.5A Withdrawn CN108105734A (en) | 2017-12-18 | 2017-12-18 | LED component soaking plate and LED component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108105734A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108444324A (en) * | 2018-06-22 | 2018-08-24 | 广东工业大学 | A kind of soaking plate |
| CN110398167A (en) * | 2019-07-09 | 2019-11-01 | 广东工业大学 | A kind of trunk type support column soaking plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6650544B1 (en) * | 2002-07-26 | 2003-11-18 | Tai-Sol Electronics, Co., Ltd. | Integrated circuit chip cooling structure with vertical mounting through holes |
| CN202750388U (en) * | 2012-06-19 | 2013-02-20 | 迈萪科技股份有限公司 | Highly-efficient vapor chamber |
| TWM452370U (en) * | 2012-11-16 | 2013-05-01 | Asia Vital Components Co Ltd | Heat dissipation device |
| CN203243668U (en) * | 2013-05-17 | 2013-10-16 | 奇鋐科技股份有限公司 | Supporting structure of heat dissipation unit |
-
2017
- 2017-12-18 CN CN201711367730.5A patent/CN108105734A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6650544B1 (en) * | 2002-07-26 | 2003-11-18 | Tai-Sol Electronics, Co., Ltd. | Integrated circuit chip cooling structure with vertical mounting through holes |
| CN202750388U (en) * | 2012-06-19 | 2013-02-20 | 迈萪科技股份有限公司 | Highly-efficient vapor chamber |
| TWM452370U (en) * | 2012-11-16 | 2013-05-01 | Asia Vital Components Co Ltd | Heat dissipation device |
| CN203243668U (en) * | 2013-05-17 | 2013-10-16 | 奇鋐科技股份有限公司 | Supporting structure of heat dissipation unit |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108444324A (en) * | 2018-06-22 | 2018-08-24 | 广东工业大学 | A kind of soaking plate |
| CN108444324B (en) * | 2018-06-22 | 2024-06-11 | 广东工业大学 | Soaking plate |
| CN110398167A (en) * | 2019-07-09 | 2019-11-01 | 广东工业大学 | A kind of trunk type support column soaking plate |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180601 |
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| WW01 | Invention patent application withdrawn after publication |