CN106802095A - A kind of microchannel cooling - Google Patents
A kind of microchannel cooling Download PDFInfo
- Publication number
- CN106802095A CN106802095A CN201710040426.3A CN201710040426A CN106802095A CN 106802095 A CN106802095 A CN 106802095A CN 201710040426 A CN201710040426 A CN 201710040426A CN 106802095 A CN106802095 A CN 106802095A
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- CN
- China
- Prior art keywords
- microchannel
- fluid
- superhydrophobic microstructure
- cooling according
- microstructure layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
- F28D1/0535—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/02—Tubular elements of cross-section which is non-circular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
- F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Micromachines (AREA)
Abstract
The invention discloses a kind of microchannel cooling, including microchannel body, one end of the microchannel body is provided with fluid intake, and the other end is provided with fluid issuing；Some superhydrophobic microstructure layers are there also is provided on the inwall of the microchannel body, superhydrophobic microstructure layer is alternately arranged on each wall of the microchannel inner body wall, on the one hand, the viscosity resistance between fluid and wall can be reduced when fluid is contacted with superhydrophobic microstructure layer；On the other hand, it is that this can strengthen heat convection while flow resistance is reduced because the difference of local wetting characteristics can cause the increase of fluid local flow speed and the disturbance of fluid, strengthens the heat exchange property of microchannel cooling.
Description
Technical field
The present invention relates to technical field of heat exchange, more particularly to a kind of microchannel cooling.
Background technology
With developing rapidly for semiconductor fine design manufacturing technology, as the MEMS of technical foundation
(MEMS) processing technology is also increasingly ripe, and in numerous necks such as military affairs, medical treatment, Aero-Space, chemical-biological engineering, material science
Domain is widely used.In MEMS system, it is widely present microchannel devices related to fluidic heat exchange of fluids or sets
It is standby, the advantage of aspect such as microchannel devices have compact conformation, light weight, efficiency high and also meet equipment refinement will
Ask.
But traditional Thermal Performance of Micro Channels equipment is in order to meet equipment miniaturization, encapsulate integrated requirement, its feature chi
Very little usual in micron to millimeter magnitude, the characteristic size of such microchannel is smaller, due to fluid when fluid flows in microchannel
The specific surface area contacted between microchannel is larger, increased the viscosity resistance between fluid and microchannel interior walls.So as to increase
The work(consumption of the pump of flow of fluid is driven, while also bringing due to driving, the pressure of flow of fluid is excessive to cause microchannel device
The crackly potential safety hazard of part.
Therefore, how to improve the surface property of microchannel interior walls, reduce the resistance of the flow of fluid in microchannel, it has also become
One key technical problem of device miniaturization application.
The content of the invention
It is an object of the invention to provide a kind of microchannel cooling, to solve the problems, such as above-mentioned prior art, can be with
The local wetting characteristics of microchannel inner surface is adjusted, the viscosity resistance between fluid and wall is reduced, and strengthen heat exchange property.
To achieve the above object, the invention provides following scheme：The present invention provides a kind of microchannel cooling, including micro-
Channel body, one end of the microchannel body is provided with fluid intake, and the other end is provided with fluid issuing；The microchannel sheet
Some superhydrophobic microstructure layers are there also is provided on the inwall of body.
Optionally, the microchannel body is made of highly heat-conductive material.
Optionally, the microchannel body is made of silicon, copper, aluminium or steel alloy.
Optionally, superhydrophobic microstructure layer be by carry out on the inwall of the microchannel body Mechanical lithography,
Plasma etching, laser ablation or chemical etching, and by fluorine-containing solution carry out surface it is modified prepared formed with micro-
The rough surface of micro-nano structure.
Optionally, the angle of wetting of the superhydrophobic microstructure layer is 120 ° -160 °.
Optionally, the superhydrophobic microstructure layer is alternately arranged on each wall of the microchannel inner body wall.
Optionally, superhydrophobic microstructure layer in class screw type be alternately arranged at the microchannel inner body wall each
On wall.
Optionally, the superhydrophobic microstructure interlayer is every the inwall bottom surface for being arranged in the microchannel body.
Optionally, the angle of wetting of the superhydrophobic microstructure layer is gradually reduced in gradient along the flow direction of fluid.
Optionally, hydrophilic microstructured layers are also included, the hydrophilic microstructured layers and superhydrophobic microstructure layer are alternately
Arrangement.
The present invention achieves following technique effect relative to prior art：
Superhydrophobic microstructure layer is disposed with the inwall of microchannel body, directly connecing between fluid and inner wall surface is reduced
Touch, be viscosity resistance that this can be reduced between fluid and wall；
Superhydrophobic microstructure layer be alternately arranged on each wall of the microchannel inner body wall, on the one hand, fluid with
The viscosity resistance between fluid and wall can be reduced during superhydrophobic microstructure layer contact；On the other hand, due to local wetting characteristics
Difference can cause the increase of fluid local flow speed and the disturbance of fluid, be this can reduce flow resistance while it is strong
Change heat convection.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to institute in embodiment
The accompanying drawing for needing to use is briefly described, it should be apparent that, drawings in the following description are only some implementations of the invention
Example, for those of ordinary skill in the art, on the premise of not paying creative work, can also obtain according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 is the structural representation of the microchannel cooling of the embodiment of the present invention one；
Fig. 2 is the structural representation that superhydrophobic microstructure layer is alternately arranged in class screw type；
Fig. 3 is the structural representation of the microchannel cooling of embodiment two；
Fig. 4 is the structural representation of the microchannel cooling of embodiment three；
Fig. 5 is the structural representation of example IV microchannel cooling；
Wherein, 1 is microchannel body, and 2 is superhydrophobic microstructure layer, and 3 is hydrophilic microstructured layers, and 11 is fluid intake, 12
It is fluid issuing.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
It is an object of the invention to provide a kind of microchannel cooling, to solve the problems, such as prior art, can adjust
The local wetting characteristics on microchannel inner body wall surface, reduces the viscosity resistance between fluid and wall, and strengthen heat-exchange performance
Energy.
It is below in conjunction with the accompanying drawings and specific real to enable the above objects, features and advantages of the present invention more obvious understandable
The present invention is further detailed explanation to apply mode.
Embodiment one,
The present embodiment provides a kind of microchannel cooling, as shown in figure 1, including microchannel body 1, microchannel body 1
One end is provided with fluid intake 11, and the other end is provided with fluid issuing 12；It is additionally provided with the inwall of microchannel body 1 some super
Hydrophobic microstructured layers 2.
The core technology for forming superhydrophobic microstructure layer 2 is surface super hydrophobic treatment technology, by changing material surface
Shape characteristic and surface can size influence the contact condition and wetting characteristics on surface, and then can effectively reduce micro- logical
The resistance of flow of fluid in road.The formation of superhydrophobic microstructure layer 2 needs to meet two basic conditions：Material surface has micro-
See coarse structure and relatively low surface free energy；Pass through Mechanical lithography, plasma etching, laser ablation, change in the present embodiment
Etching or other etching modes are learned, material is peeled off or removed to the inner wall surface of body 1 in microchannel, being formed has micro-nano
The rough surface of structure；Then again by being equipped with the fluorine-containing solution that the surface of certain proportion and component can be relatively low, such as silicon fluoride
Deng Multi component, the rough surface with micro-nano structure is carried out surface be modified, eventually form with superhydrophobic characteristic
Superhydrophobic microstructure layer 2.Superhydrophobic microstructure layer 2 can capture one layer of other air of micro/nano level, reduce fluid and inwall table
Directly contact between face, is viscosity resistance that this can be reduced between fluid and wall.
The inner wall surface of microchannel body 1 can be reduced by super-hydrophobic treatment, the resistance of flow of fluid.However, super-hydrophobic
The thin layer of air being detained in the micro-nano structure of microstructured layers 2 can reduce the cooling characteristics of microchannel body 1.Therefore, the present embodiment
Middle superhydrophobic microstructure layer 2 is alternately arranged on each wall of the inwall of microchannel body 1, on the one hand, fluid is micro- with super-hydrophobic
Structure sheaf 2 can reduce the viscosity resistance between fluid and wall when contacting；On the other hand, due to the different meetings of local wetting characteristics
The increase of fluid local flow speed and the disturbance of fluid are caused, is that this can be changed in reinforcing convection current while flow resistance is reduced
Heat；The distance between width of fringe, adjacent stripes of superhydrophobic microstructure layer 2, can be adjusted according to demand, and super thin
Water microstructured layers 2 can also be as shown in Fig. 2 be alternately arranged on each wall of the inwall of microchannel body 1 in class screw type.
The angle of wetting of superhydrophobic microstructure layer 2 is controlled in the range of 120 ° -160 °, such that it is able to ensure its super-hydrophobicity
Energy；And superhydrophobic microstructure layer 2 angle of wetting gradually reduced in gradient along the flow direction of fluid, with realize fluid from
Flowing is driven, the pump work needed for driving flow of fluid is reduced.
Microchannel body 1 is made of highly heat-conductive materials such as silicon, copper, aluminium or steel alloys, can also improve microchannel cooling
Heat exchange property.
Embodiment two,
The present embodiment is the embodiment being improved on the basis of embodiment one, and its difference with embodiment one is only
It is the arrangement of superhydrophobic microstructure layer 2, as shown in figure 3, superhydrophobic microstructure 2 arranged for interval of layer are in microchannel body 1
Inwall bottom surface.
Embodiment three,
The present embodiment is the embodiment being improved on the basis of embodiment one, and its difference with embodiment one is only
It is the arrangement of superhydrophobic microstructure layer 2, as shown in figure 4, superhydrophobic microstructure layer 2 is arranged in the whole of microchannel body 1
Individual inwall bottom surface, angle of wetting is gradually reduced in gradient along the flow direction of fluid, such that it is able to realize the self-driven stream of fluid
It is dynamic, reduce the pump work needed for driving flow of fluid.
Example IV,
The present embodiment is the embodiment being improved on the basis of embodiment one, as shown in figure 5, itself and embodiment one
The difference is that only and also include hydrophilic microstructured layers 3, hydrophilic microstructured layers 3 and superhydrophobic microstructure layer 2 are alternately arranged；Can
The deterioration of the heat exchange property that hydrophobic treatment is brought is passed fully through with the inner wall surface for overcoming microchannel body 1 and is passed through completely
Flow resistance that hydrophilic treated is brought is dramatically increased.
Specific case is applied in the present invention to be set forth principle of the invention and implementation method, above example
Illustrate that being only intended to help understands the method for the present invention and its core concept；Simultaneously for those of ordinary skill in the art, according to
According to thought of the invention, will change in specific embodiments and applications.In sum, this specification content
Should not be construed as limiting the invention.
Claims (10)
1. a kind of microchannel cooling, it is characterised in that：Including microchannel body, one end of the microchannel body is provided with stream
Body entrance, the other end is provided with fluid issuing；Some superhydrophobic microstructure layers are there also is provided on the inwall of the microchannel body.
2. microchannel cooling according to claim 1, it is characterised in that：The microchannel body uses highly heat-conductive material
It is made.
3. microchannel cooling according to claim 2, it is characterised in that：The microchannel body using silicon, copper, aluminium or
Steel alloy is made.
4. microchannel cooling according to claim 1, it is characterised in that：The superhydrophobic microstructure layer is by institute
Stating carries out Mechanical lithography, plasma etching, laser ablation or chemical etching on the inwall of microchannel body, and by fluorine-containing molten
Liquid carries out the modified prepared rough surface with micro-nano structure for being formed in surface.
5. microchannel cooling according to claim 4, it is characterised in that：The angle of wetting of superhydrophobic microstructure layer is
120°-160°。
6. microchannel cooling according to claim 1, it is characterised in that：The superhydrophobic microstructure layer is alternately arranged at
On each wall of the microchannel inner body wall.
7. microchannel cooling according to claim 6, it is characterised in that：The superhydrophobic microstructure layer is in class screw type
It is alternately arranged on each wall of the microchannel inner body wall.
8. microchannel cooling according to claim 1, it is characterised in that：The superhydrophobic microstructure interlayer is every being arranged in
The inwall bottom surface of the microchannel body.
9. microchannel cooling according to claim 1, it is characterised in that：The angle of wetting edge of the superhydrophobic microstructure layer
The flow direction for fluid gradually reduces in gradient.
10. microchannel cooling according to claim 1, it is characterised in that：Also include hydrophilic microstructured layers, the parent
Water microstructured layers and superhydrophobic microstructure layer are alternately arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710040426.3A CN106802095A (en) | 2017-01-20 | 2017-01-20 | A kind of microchannel cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710040426.3A CN106802095A (en) | 2017-01-20 | 2017-01-20 | A kind of microchannel cooling |
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| Publication Number | Publication Date |
|---|---|
| CN106802095A true CN106802095A (en) | 2017-06-06 |
Family
ID=58987027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710040426.3A Pending CN106802095A (en) | 2017-01-20 | 2017-01-20 | A kind of microchannel cooling |
Country Status (1)
| Country | Link |
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| CN (1) | CN106802095A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107607580A (en) * | 2017-09-29 | 2018-01-19 | 华南理工大学 | Additional ultrasound-enhanced complicated micro lubricative pores array microchannel boiling heat transfer experiment system |
| CN107643006A (en) * | 2017-09-29 | 2018-01-30 | 华南理工大学 | A kind of micro-channel evaporator and its manufacture method for having complicated micro lubricative pores array |
| CN107843615A (en) * | 2017-09-29 | 2018-03-27 | 华南理工大学 | A kind of ultrasonic field strengthens complicated micro lubricative pores array microchannel boiling heat transfer device |
| CN109256364A (en) * | 2018-10-16 | 2019-01-22 | 厦门大学 | Encapsulating structure based on composite phase-change material radio-frequency front-end miniaturization integrated heat dissipation |
| CN110756133A (en) * | 2019-10-23 | 2020-02-07 | 南京航空航天大学 | Microchannel reactor for strengthening multiphase flow heat transfer in microchannel |
| CN114449871A (en) * | 2022-03-03 | 2022-05-06 | 合肥工业大学 | Micro double-channel spiral boiling heat exchange type uniform-temperature cooling plate |
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| CN205808200U (en) * | 2016-06-17 | 2016-12-14 | 浙江工业大学 | A kind of dropwise condensation and the microcooler certainly catchmented |
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| CN1819165A (en) * | 2004-11-24 | 2006-08-16 | 朗迅科技公司 | Techniques for microchannel cooling |
| CN1818530A (en) * | 2006-03-07 | 2006-08-16 | 天津大学 | Heating tube with nanometer coating on internal surface and evaporator |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107607580A (en) * | 2017-09-29 | 2018-01-19 | 华南理工大学 | Additional ultrasound-enhanced complicated micro lubricative pores array microchannel boiling heat transfer experiment system |
| CN107643006A (en) * | 2017-09-29 | 2018-01-30 | 华南理工大学 | A kind of micro-channel evaporator and its manufacture method for having complicated micro lubricative pores array |
| CN107843615A (en) * | 2017-09-29 | 2018-03-27 | 华南理工大学 | A kind of ultrasonic field strengthens complicated micro lubricative pores array microchannel boiling heat transfer device |
| CN109256364A (en) * | 2018-10-16 | 2019-01-22 | 厦门大学 | Encapsulating structure based on composite phase-change material radio-frequency front-end miniaturization integrated heat dissipation |
| CN110756133A (en) * | 2019-10-23 | 2020-02-07 | 南京航空航天大学 | Microchannel reactor for strengthening multiphase flow heat transfer in microchannel |
| CN114449871A (en) * | 2022-03-03 | 2022-05-06 | 合肥工业大学 | Micro double-channel spiral boiling heat exchange type uniform-temperature cooling plate |
| CN114449871B (en) * | 2022-03-03 | 2024-08-06 | 合肥工业大学 | Micro double-channel spiral boiling heat exchange type uniform temperature cooling plate |
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